KR100657112B1 - 축 리드형 전자 부품 및 축 리드형 전자 부품 실장 회로 기판장치 - Google Patents

축 리드형 전자 부품 및 축 리드형 전자 부품 실장 회로 기판장치 Download PDF

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Publication number
KR100657112B1
KR100657112B1 KR1019990035346A KR19990035346A KR100657112B1 KR 100657112 B1 KR100657112 B1 KR 100657112B1 KR 1019990035346 A KR1019990035346 A KR 1019990035346A KR 19990035346 A KR19990035346 A KR 19990035346A KR 100657112 B1 KR100657112 B1 KR 100657112B1
Authority
KR
South Korea
Prior art keywords
electronic component
metal cap
solder
resin
terminal
Prior art date
Application number
KR1019990035346A
Other languages
English (en)
Korean (ko)
Other versions
KR20000017518A (ko
Inventor
네기시마코토
Original Assignee
다이요 유덴 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다이요 유덴 가부시키가이샤 filed Critical 다이요 유덴 가부시키가이샤
Publication of KR20000017518A publication Critical patent/KR20000017518A/ko
Application granted granted Critical
Publication of KR100657112B1 publication Critical patent/KR100657112B1/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
KR1019990035346A 1998-08-28 1999-08-25 축 리드형 전자 부품 및 축 리드형 전자 부품 실장 회로 기판장치 KR100657112B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP98-244004 1998-08-28
JP24400498A JP3836263B2 (ja) 1998-08-28 1998-08-28 アキシャルリード型電子部品及びアキシャルリード型電子部品実装回路基板装置

Publications (2)

Publication Number Publication Date
KR20000017518A KR20000017518A (ko) 2000-03-25
KR100657112B1 true KR100657112B1 (ko) 2006-12-15

Family

ID=17112291

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019990035346A KR100657112B1 (ko) 1998-08-28 1999-08-25 축 리드형 전자 부품 및 축 리드형 전자 부품 실장 회로 기판장치

Country Status (5)

Country Link
JP (1) JP3836263B2 (ja)
KR (1) KR100657112B1 (ja)
CN (1) CN1158681C (ja)
HK (1) HK1026507A1 (ja)
TW (1) TW442804B (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6535105B2 (en) * 2000-03-30 2003-03-18 Avx Corporation Electronic device and process of making electronic device
KR100822987B1 (ko) * 2001-09-11 2008-04-16 주식회사 포스코 코크스 이송용 밸트 컨베이어 상의 슬러지 케이크 공급장치
JP4453915B2 (ja) * 2005-03-18 2010-04-21 富士通株式会社 クロスバー装置、制御方法及びプログラム
JP5040715B2 (ja) 2007-07-19 2012-10-03 パナソニック株式会社 電子部品及びリード線、それらの製造方法
WO2009011096A1 (ja) * 2007-07-19 2009-01-22 Panasonic Corporation 電子部品とそのリード線、およびそれらの製造方法
JP2010199171A (ja) 2009-02-24 2010-09-09 Shinko Electric Ind Co Ltd チップ部品実装配線基板
CN111922474B (zh) * 2020-07-08 2022-01-11 安徽工程大学 一种金属与陶瓷焊接装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH027410A (ja) * 1987-12-30 1990-01-11 Tdk Corp チップ状電子部品及びその製造方法
JPH03157909A (ja) * 1989-11-16 1991-07-05 Taiyo Yuden Co Ltd 筒型セラミックコンデンサ

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH027410A (ja) * 1987-12-30 1990-01-11 Tdk Corp チップ状電子部品及びその製造方法
JPH03157909A (ja) * 1989-11-16 1991-07-05 Taiyo Yuden Co Ltd 筒型セラミックコンデンサ

Also Published As

Publication number Publication date
JP2000077257A (ja) 2000-03-14
JP3836263B2 (ja) 2006-10-25
HK1026507A1 (en) 2000-12-15
KR20000017518A (ko) 2000-03-25
CN1248778A (zh) 2000-03-29
TW442804B (en) 2001-06-23
CN1158681C (zh) 2004-07-21

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