HK1026507A1 - Axially-lead type electronic parts and circuit substrate device for mounting the same. - Google Patents
Axially-lead type electronic parts and circuit substrate device for mounting the same.Info
- Publication number
- HK1026507A1 HK1026507A1 HK00105719A HK00105719A HK1026507A1 HK 1026507 A1 HK1026507 A1 HK 1026507A1 HK 00105719 A HK00105719 A HK 00105719A HK 00105719 A HK00105719 A HK 00105719A HK 1026507 A1 HK1026507 A1 HK 1026507A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- axially
- mounting
- same
- circuit substrate
- electronic parts
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24400498A JP3836263B2 (en) | 1998-08-28 | 1998-08-28 | Axial lead type electronic component and circuit board device mounted with axial lead type electronic component |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1026507A1 true HK1026507A1 (en) | 2000-12-15 |
Family
ID=17112291
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK00105719A HK1026507A1 (en) | 1998-08-28 | 2000-09-11 | Axially-lead type electronic parts and circuit substrate device for mounting the same. |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP3836263B2 (en) |
KR (1) | KR100657112B1 (en) |
CN (1) | CN1158681C (en) |
HK (1) | HK1026507A1 (en) |
TW (1) | TW442804B (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6535105B2 (en) * | 2000-03-30 | 2003-03-18 | Avx Corporation | Electronic device and process of making electronic device |
KR100822987B1 (en) * | 2001-09-11 | 2008-04-16 | 주식회사 포스코 | Sludge cake supply apparatus on belt conveyer for coke transferring |
JP4453915B2 (en) * | 2005-03-18 | 2010-04-21 | 富士通株式会社 | Crossbar device, control method and program |
WO2009011096A1 (en) * | 2007-07-19 | 2009-01-22 | Panasonic Corporation | Electronic component, lead wire and their production methods |
JP5040715B2 (en) * | 2007-07-19 | 2012-10-03 | パナソニック株式会社 | Electronic parts and lead wires, and methods for producing them |
JP2010199171A (en) | 2009-02-24 | 2010-09-09 | Shinko Electric Ind Co Ltd | Chip component mounted wiring board |
CN111922474B (en) * | 2020-07-08 | 2022-01-11 | 安徽工程大学 | Metal and ceramic welding device |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH027410A (en) * | 1987-12-30 | 1990-01-11 | Tdk Corp | Chip-shaped electronic component and its manufacture |
JPH03157909A (en) * | 1989-11-16 | 1991-07-05 | Taiyo Yuden Co Ltd | Cylindrical ceramic capacitor |
-
1998
- 1998-08-28 JP JP24400498A patent/JP3836263B2/en not_active Expired - Fee Related
-
1999
- 1999-08-10 TW TW088113670A patent/TW442804B/en not_active IP Right Cessation
- 1999-08-25 KR KR1019990035346A patent/KR100657112B1/en not_active IP Right Cessation
- 1999-08-28 CN CNB991184106A patent/CN1158681C/en not_active Expired - Fee Related
-
2000
- 2000-09-11 HK HK00105719A patent/HK1026507A1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN1158681C (en) | 2004-07-21 |
KR100657112B1 (en) | 2006-12-15 |
JP2000077257A (en) | 2000-03-14 |
CN1248778A (en) | 2000-03-29 |
TW442804B (en) | 2001-06-23 |
KR20000017518A (en) | 2000-03-25 |
JP3836263B2 (en) | 2006-10-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20090828 |