KR100603970B1 - 반도체 공정장비용 기판 이송시스템 - Google Patents

반도체 공정장비용 기판 이송시스템 Download PDF

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Publication number
KR100603970B1
KR100603970B1 KR1020007005579A KR20007005579A KR100603970B1 KR 100603970 B1 KR100603970 B1 KR 100603970B1 KR 1020007005579 A KR1020007005579 A KR 1020007005579A KR 20007005579 A KR20007005579 A KR 20007005579A KR 100603970 B1 KR100603970 B1 KR 100603970B1
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South Korea
Prior art keywords
substrate
section
susceptor
support
delete delete
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Expired - Lifetime
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KR1020007005579A
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English (en)
Korean (ko)
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KR20010032348A (ko
Inventor
아이보 라아이즈마커스
로렌 알. 야콥스
마이클 더블유. 할핀
제임스 에이. 알렉산더
켄 오닐
데니스 엘. 굿윈
Original Assignee
에이에스엠 아메리카, 인코포레이티드
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Priority claimed from US08/976,537 external-priority patent/US6068441A/en
Application filed by 에이에스엠 아메리카, 인코포레이티드 filed Critical 에이에스엠 아메리카, 인코포레이티드
Publication of KR20010032348A publication Critical patent/KR20010032348A/ko
Application granted granted Critical
Publication of KR100603970B1 publication Critical patent/KR100603970B1/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S294/00—Handling: hand and hoist-line implements
    • Y10S294/902—Gripping element
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020007005579A 1997-11-21 1998-11-20 반도체 공정장비용 기판 이송시스템 Expired - Lifetime KR100603970B1 (ko)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US08/976,537 1997-11-21
US8/976,537 1997-11-21
US08/976,537 US6068441A (en) 1997-11-21 1997-11-21 Substrate transfer system for semiconductor processing equipment
US9/193,991 1998-11-17
US09/193,991 US6293749B1 (en) 1997-11-21 1998-11-17 Substrate transfer system for semiconductor processing equipment
US09/193,991 1998-11-17
PCT/US1998/024951 WO1999027577A1 (en) 1997-11-21 1998-11-20 Substrate transfer system for semiconductor processing equipment

Publications (2)

Publication Number Publication Date
KR20010032348A KR20010032348A (ko) 2001-04-16
KR100603970B1 true KR100603970B1 (ko) 2006-07-25

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020007005579A Expired - Lifetime KR100603970B1 (ko) 1997-11-21 1998-11-20 반도체 공정장비용 기판 이송시스템

Country Status (5)

Country Link
US (1) US6293749B1 (https=)
EP (1) EP1038314A4 (https=)
JP (1) JP4362224B2 (https=)
KR (1) KR100603970B1 (https=)
WO (1) WO1999027577A1 (https=)

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US20050036855A1 (en) * 2003-08-13 2005-02-17 Texas Instruments Incorporated Robot blade for handling of semiconductor waffers
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USD920936S1 (en) 2019-01-17 2021-06-01 Asm Ip Holding B.V. Higher temperature vented susceptor
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US11961756B2 (en) 2019-01-17 2024-04-16 Asm Ip Holding B.V. Vented susceptor
TWI845682B (zh) 2019-05-22 2024-06-21 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 工件基座主體
CN112713117B (zh) * 2019-10-24 2026-01-20 Asmip控股有限公司 用于半导体衬底处理的基座
US11764101B2 (en) * 2019-10-24 2023-09-19 ASM IP Holding, B.V. Susceptor for semiconductor substrate processing
JP1665227S (https=) * 2019-11-28 2020-08-03
CN110931410A (zh) * 2019-12-02 2020-03-27 浙江求是半导体设备有限公司 一种用于反应室的晶片传动装置和传动方法
CN110943029A (zh) * 2019-12-30 2020-03-31 浙江求是半导体设备有限公司 一种用于半导体外延系统的双环式基座
FR3110948B1 (fr) 2020-05-29 2022-08-12 Commissariat Energie Atomique Système de positionnement d’une plaque.
TWI746014B (zh) 2020-06-16 2021-11-11 大立鈺科技有限公司 晶圓存取總成及其晶圓存取裝置與晶圓載具
TWI888578B (zh) 2020-06-23 2025-07-01 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 基座及反應腔室
CN112018024B (zh) 2020-09-11 2024-12-24 北京北方华创微电子装备有限公司 机械手
CN114378751B (zh) * 2020-10-20 2022-11-01 长鑫存储技术有限公司 晶圆用承载环的安装夹具
USD1031676S1 (en) 2020-12-04 2024-06-18 Asm Ip Holding B.V. Combined susceptor, support, and lift system
CN116031184B (zh) 2021-10-25 2026-02-10 大立钰科技有限公司 晶圆存取总成及其晶圆存取装置与晶圆载具

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Also Published As

Publication number Publication date
JP2001524751A (ja) 2001-12-04
JP4362224B2 (ja) 2009-11-11
WO1999027577A1 (en) 1999-06-03
KR20010032348A (ko) 2001-04-16
EP1038314A4 (en) 2009-01-21
US6293749B1 (en) 2001-09-25
EP1038314A1 (en) 2000-09-27

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