CN111326475A - 晶圆基座安装工具 - Google Patents

晶圆基座安装工具 Download PDF

Info

Publication number
CN111326475A
CN111326475A CN201811525648.5A CN201811525648A CN111326475A CN 111326475 A CN111326475 A CN 111326475A CN 201811525648 A CN201811525648 A CN 201811525648A CN 111326475 A CN111326475 A CN 111326475A
Authority
CN
China
Prior art keywords
base
wafer pedestal
mounting tool
wafer
rod
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201811525648.5A
Other languages
English (en)
Inventor
姚志强
张逸杰
史洪涛
金嵩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zing Semiconductor Corp
Original Assignee
Zing Semiconductor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zing Semiconductor Corp filed Critical Zing Semiconductor Corp
Priority to CN201811525648.5A priority Critical patent/CN111326475A/zh
Publication of CN111326475A publication Critical patent/CN111326475A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

本发明提供的一种晶圆基座安装工具,包括:石英叉和底座,所述石英叉包括承载部和杆部,所述承载部的表面上设有一凸出部,所述承载部、所述凸出部与所述杆部相连并交汇于一支点,所述石英叉的杆部安装在所述底座上,所述石英叉能够相对所述底座进行移动,提高了所述石英叉的灵活性,所述凸出部的设置使得所述支点位置更坚固,不易发生断裂,降低了晶圆基座的受损率,从而提高了该晶圆基座安装工具的可靠性和安全性。

Description

晶圆基座安装工具
技术领域
本发明涉及半导体制造设备技术领域,特别涉及一种晶圆基座安装工具。
背景技术
在半导体制造各工艺步骤的腔室中均会用到晶圆基座来承载晶片,晶圆基座需要使用一种晶圆基座安装工具将其送入腔室内并在准确的位置安放。目前常用的晶圆基座安装工具是石英叉,如图1所示,石英叉主要分为两个部分:承载部30和石英杆10,安装晶圆基座时,石英叉会将晶圆基座水平放置在承载部30上送入腔室内,再进行角度的微调将基座安放固定,最后将石英叉抽出。当晶圆基座放置在承载部30上时,所述石英叉的受力重心落在承载部30和石英杆10交汇的支点20上,若安装时承载部30没有摆放水平,支点20处就容易发生断裂,导致石英叉损坏,从而有可能造成晶圆基座的磨损和摔坏,甚至对腔室造成损坏。
发明内容
本发明的目的在于提供一种晶圆基座安装工具,以解决晶圆基座安装工具容易发生断裂的问题。
为解决上述技术问题,本发明提供一种晶圆基座安装工具,包括:石英叉和底座,所述石英叉包括承载部和杆部,所述承载部的表面上设有一凸出部,所述承载部、所述凸出部与所述杆部相连并交汇于一支点,所述石英叉的杆部安装在所述底座上,所述石英叉能够相对所述底座进行移动。
可选的,在所述晶圆基座安装工具中,所述承载部为缺月形的片状结构。
可选的,在所述晶圆基座安装工具中,所述凸出部的表面与所述承载部表面平行。
可选的,在所述晶圆基座安装工具中,所述杆部的一端设有第一凹槽,所述承载部、所述凸出部以及所述杆部交汇的支点位于所述第一凹槽中。
可选的,在所述晶圆基座安装工具中,所述杆部侧面标有刻度。
可选的,在所述晶圆基座安装工具中,所述底座为可升降结构。
可选的,在所述晶圆基座安装工具中,所述底座为两节嵌套的钢管,两节钢管的接触面设有第一调节旋钮。
可选的,在所述晶圆基座安装工具中,所述底座的顶部设有第二凹槽,所述杆部水平安装在所述第二凹槽内。
可选的,在所述晶圆基座安装工具中,所述第二凹槽内壁上设有硅胶垫。
可选的,在所述晶圆基座安装工具中,所述底座的侧面靠近所述第二凹槽位置设有第二调节旋钮。
可选的,在所述晶圆基座安装工具中,所述底座的底部还设有支架,所述支架为三角架结构或者框架结构。
可选的,在所述晶圆基座安装工具中,所述支架和所述底座通过铰接或者焊接的方式连接。
综上,本发明提供的一种晶圆基座安装工具,包括:石英叉和底座,所述石英叉包括承载部和杆部,所述承载部的表面上设有一凸出部,所述承载部、所述凸出部与所述杆部相连并交汇于一支点,所述石英叉的杆部安装在所述底座上,所述石英叉能够相对所述底座进行移动,提高了所述石英叉的灵活性,所述凸出部的设置使得所述支点位置更坚固,不易发生断裂,降低了晶圆基座的受损率,从而提高了该晶圆基座安装工具的可靠性和安全性。进一步的,所述杆部侧面标有刻度,可以记录上一次安装的具体位置,使得下次安装时可快速找到安装位置,提高了安装准确性和工作效率。进一步的,所述底座为可升降结构,可带动所述石英杆上下移动,进一步提高了安装的灵活性。
附图说明
图1是现有技术的石英叉示意图;
图2是本发明实施例中的一种晶圆基座安装工具的结构示意图;
图3是本发明实施例中的石英叉的结构示意图;
图4是本发明实施例中的另一种晶圆基座安装工具的结构示意图;
其中,
100-石英叉,101-承载部,102-杆部,103-凸出部,110-底座,120-支架。
具体实施方式
以下结合附图和具体实施例对本发明提出的晶圆基座安装工具作进一步详细说明。根据下面说明和权利要求书,本发明的优点和特征将更清楚。需说明的是,附图均采用非常简化的形式且均使用非精准的比例,仅用以方便、明晰地辅助说明本发明实施例的目的。此外,附图所展示的结构往往是实际结构的一部分。特别的,各附图需要展示的侧重点不同,有时会采用不同的比例。
参考图2-图4,图2是本发明实施例中的一种晶圆基座安装工具的结构示意图,图3是本发明实施例中的石英叉的结构示意图,图4是本发明实施例中的另一种晶圆基座安装工具的结构示意图。本发明提供一种晶圆基座安装工具,包括:石英叉100和底座110,所述石英叉100包括承载部101和杆部102,所述承载部101的表面上设有一凸出部103,所述承载部101、所述凸出部103与所述杆部102相连并交汇于一支点,所述石英叉100的杆部102安装在所述底座110上,所述石英叉100能够相对所述底座110进行移动。
进一步的,所述承载部101为缺月形的片状结构。所述承载部的厚度参考一般的石英叉的厚度,所述承载部的厚度为10±1mm,考虑到腔室中用来放置晶圆基座的三脚架的结构,石英叉的承载部101选择缺月形状比较合适,利于晶圆基座从承载部101表面转移到腔室中的三脚架上。
进一步的,所述凸出部103的表面与所述承载部101表面平行,所述凸出部103设于所述承载部101的一个表面上,所述凸出部103的增设增加了所述承载部101的受力程度,所述凸出部103一般选择对称的三角形,较佳的,所述凸出部103是一厚度均匀的结构,其厚度优选为10mm-20mm。在晶圆基座安装过程中,使用远离设有凸出部103的承载部101表面承载晶圆基座,承载晶圆基座时,承载部101始终保持晶圆基座水平。
进一步的,所述杆部102的一端设有第一凹槽,所述承载部101、所述凸出部103以及所述杆部102交汇的支点位于所述第一凹槽中,所述支点为主要受力点。所述凸出部103与所述承载部101为一体化结构且所述凸出部103和所述承载部101共同分担了支点处的受力,需要安装的晶圆基座的厚度一般为5±1mm,增设了凸出部103的承载部101可轻松承受晶圆基座的重量,从而使得承载部101在支点位置不易发生断裂。
在本实施例中,所述杆部102侧面标有刻度,所述刻度可以记录之前安装晶圆基座的具体位置,使得下一次安装时可以参考之前的安装刻度,提高工作效率和安装的精确性。
进一步的,所述底座110为可升降结构。所述底座110为两节嵌套的钢管,两节钢管的接触面设有第一调节旋钮,所述底座110可以带动所述石英叉100上下移动,可根据需要调节到相应的高度,调节时拧松所述第一调节旋钮,使得上面的那根钢管可以相对下面的钢管上下移动至合适的高度,高度调好后,再拧紧所述第一调节旋钮,可升降的底座提高了安装的灵活性。
进一步的,所述底座110的顶部设有第二凹槽,所述杆部102水平安装在所述第二凹槽内,所述第二凹槽内壁上设有硅胶垫,所述硅胶垫用来保护所述杆部102,使得所述石英叉100在前后移动的过程中不会与钢管凹槽发生摩擦,从而避免受损。所述底座110的侧面靠近所述第二凹槽位置设有第二调节旋钮,用来调节和固定所述石英杆100,前后移动所述石英杆100时,拧松所述第二调节旋钮,固定石英杆时在拧紧所述第二调节旋钮。所述底座110和所述石英杆100可完全分离,可单独使用所述石英杆100安装晶圆基座,也可以利用所述底座110辅助安装晶圆基座并且可以放置所述石英杆100,这提高了所述晶圆基座安装工具的机动性和整体灵活性。
进一步的,所述底座110的底部还设有支架120,所述支架120为三角架结构或者框架结构。参考图3和图4,图3中,所述支架120为三脚架结构,图4中,所述支架120为框架结构。如图3所示,所述三脚架结构的支架120和所述底座110通过铰接方式连接起来,在不使用所述底座110时,可以将所述支架120收拢起来放置,这样可有效的节约空间。如图4所示,所述框架结构的支架120和所述底座110通焊接的方式连接,框架结构的支架120使得底座110更稳定,进一步提高了所述晶圆基座安装工具的稳定性。
综上,本发明提供的一种晶圆基座安装工具,包括:石英叉和底座,所述石英叉包括承载部和杆部,所述承载部的表面上设有一凸出部,所述承载部、所述凸出部与所述杆部相连并交汇于一支点,所述石英叉的杆部安装在所述底座上,所述石英叉能够相对所述底座进行移动,提高了所述石英叉的灵活性,所述凸出部的设置使得所述支点位置更坚固,不易发生断裂,降低了晶圆基座的受损率,从而提高了该晶圆基座安装工具的可靠性和安全性。进一步的,所述杆部侧面标有刻度,可以记录上一次安装的具体位置,使得下次安装时可快速找到安装位置,提高了安装准确性和工作效率。进一步的,所述底座为可升降结构,可带动所述石英杆上下移动,进一步提高了安装的灵活性。
上述描述仅是对本发明较佳实施例的描述,并非对本发明范围的任何限定,本发明领域的普通技术人员根据上述揭示内容做的任何变更、修饰,均属于权利要求书的保护范围。

Claims (12)

1.一种晶圆基座安装工具,其特征在于,包括:石英叉和底座,所述石英叉包括承载部和杆部,所述承载部的表面上设有一凸出部,所述承载部、所述凸出部与所述杆部相连并交汇于一支点,所述石英叉的杆部安装在所述底座上,所述石英叉能够相对所述底座进行移动。
2.根据权利要求1所述的晶圆基座安装工具,其特征在于,所述承载部为缺月形的片状结构。
3.根据权利要求2所述的晶圆基座安装工具,其特征在于,所述凸出部的表面与所述承载部表面平行。
4.根据权利要求1所述的晶圆基座安装工具,其特征在于,所述杆部的一端设有第一凹槽,所述承载部、所述凸出部以及所述杆部交汇的支点位于所述第一凹槽中。
5.根据权利要求4所述的晶圆基座安装工具,其特征在于,所述杆部侧面标有刻度。
6.根据权利要求1所述的晶圆基座安装工具,其特征在于,所述底座为可升降结构。
7.根据权利要求6所述的晶圆基座安装工具,其特征在于,所述底座为两节嵌套的钢管,两节钢管的接触面设有第一调节旋钮。
8.根据权利要求7所述的晶圆基座安装工具,其特征在于,所述底座的顶部设有第二凹槽,所述杆部水平安装在所述第二凹槽内。
9.根据权利要求8所述的晶圆基座安装工具,其特征在于,所述第二凹槽内壁上设有硅胶垫。
10.根据权利要求9所述的晶圆基座安装工具,其特征在于,所述底座的侧面靠近所述第二凹槽位置设有第二调节旋钮。
11.根据权利要求10所述的晶圆基座安装工具,其特征在于,所述底座的底部还设有支架,所述支架为三角架结构或者框架结构。
12.根据权利要求11所述的晶圆基座安装工具,其特征在于,所述支架和所述底座通过铰接或者焊接的方式连接。
CN201811525648.5A 2018-12-13 2018-12-13 晶圆基座安装工具 Pending CN111326475A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201811525648.5A CN111326475A (zh) 2018-12-13 2018-12-13 晶圆基座安装工具

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201811525648.5A CN111326475A (zh) 2018-12-13 2018-12-13 晶圆基座安装工具

Publications (1)

Publication Number Publication Date
CN111326475A true CN111326475A (zh) 2020-06-23

Family

ID=71172285

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201811525648.5A Pending CN111326475A (zh) 2018-12-13 2018-12-13 晶圆基座安装工具

Country Status (1)

Country Link
CN (1) CN111326475A (zh)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6276731B1 (en) * 1997-07-15 2001-08-21 Kabushiki Kaisha Yaskawa Denki Wafer carrying fork
US6293749B1 (en) * 1997-11-21 2001-09-25 Asm America, Inc. Substrate transfer system for semiconductor processing equipment
CN1774607A (zh) * 2004-03-25 2006-05-17 东京毅力科创株式会社 立式热处理装置和被处理体移送方法
US20120064734A1 (en) * 2010-09-14 2012-03-15 Hitachi Kokusai Electric Inc. Substrate carrying mechanism, substrate processing apparatus, and semiconductor device manufacturing method
CN104806754A (zh) * 2015-04-28 2015-07-29 浙江龙虎锻造有限公司 汽车用非滑动叉

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6276731B1 (en) * 1997-07-15 2001-08-21 Kabushiki Kaisha Yaskawa Denki Wafer carrying fork
US6293749B1 (en) * 1997-11-21 2001-09-25 Asm America, Inc. Substrate transfer system for semiconductor processing equipment
CN1774607A (zh) * 2004-03-25 2006-05-17 东京毅力科创株式会社 立式热处理装置和被处理体移送方法
US20120064734A1 (en) * 2010-09-14 2012-03-15 Hitachi Kokusai Electric Inc. Substrate carrying mechanism, substrate processing apparatus, and semiconductor device manufacturing method
CN104806754A (zh) * 2015-04-28 2015-07-29 浙江龙虎锻造有限公司 汽车用非滑动叉

Similar Documents

Publication Publication Date Title
CN209298708U (zh) 一种隔离开关操作机构安装辅助装置
CN111326475A (zh) 晶圆基座安装工具
CN212644244U (zh) 一种计量精确的气瓶放置架
CN101256847A (zh) 显示装置的墙式安装系统
CN210451525U (zh) 一种钢板激光切割用定位支撑台
CN206108843U (zh) 液压千斤顶的固定装置
CN207735833U (zh) 一种石英带孔平板的管焊接治具
CN103466412B (zh) 一种空心电梯导轨的接导件
CN213089182U (zh) 一种防错位工业泵垫铁
CN206593650U (zh) 一种用于精密测量仪器的强制对中基座
CN207993691U (zh) 一种超级电容器用可拆分的便携式底座
CN208377812U (zh) 一种可调节位置的导向轮系统
CN112079289A (zh) 一种带有找平装置的起重机械
CN109366449A (zh) 一种大型弧形锻件径向中心基准划线工装
CN211759864U (zh) 一种弹性浮动支承机构
CN218700305U (zh) 一种工件浮动支撑
CN215510815U (zh) 一种更换托辊器
CN209665219U (zh) 一种适于不同高度铰臂的铰链承托治具
JP3239615U (ja) インゴット校正装置
CN205130143U (zh) 一种坩埚端面铣削装置
CN220658807U (zh) 一种镶角的校正装置
CN212648724U (zh) 一种直线激光器
CN208239490U (zh) 一种小型化的电测测试架
CN208365077U (zh) 一种铁基金属陶瓷耐磨机架
CN216728884U (zh) 一种模具钢材平面度矫正装置

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20200623