KR100581246B1 - 반도체 장치의 실장 방법 - Google Patents

반도체 장치의 실장 방법 Download PDF

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Publication number
KR100581246B1
KR100581246B1 KR1020000054278A KR20000054278A KR100581246B1 KR 100581246 B1 KR100581246 B1 KR 100581246B1 KR 1020000054278 A KR1020000054278 A KR 1020000054278A KR 20000054278 A KR20000054278 A KR 20000054278A KR 100581246 B1 KR100581246 B1 KR 100581246B1
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South Korea
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semiconductor device
mounting
conductive adhesive
adhesive
rigid plate
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KR1020000054278A
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Korean (ko)
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KR20010085224A (ko
Inventor
나까죠신수께
오노데라마사노리
이꾸모마사미쓰
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후지쯔 가부시끼가이샤
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    • H01L2224/92—Specific sequence of method steps
    • H01L2224/921—Connecting a surface with connectors of different types
    • H01L2224/9212—Sequential connecting processes
    • H01L2224/92122—Sequential connecting processes the first connecting process involving a bump connector
    • H01L2224/92125—Sequential connecting processes the first connecting process involving a bump connector the second connecting process involving a layer connector
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  • Engineering & Computer Science (AREA)
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  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
KR1020000054278A 2000-02-23 2000-09-15 반도체 장치의 실장 방법 Expired - Fee Related KR100581246B1 (ko)

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JP2002313841A (ja) * 2000-04-14 2002-10-25 Namics Corp フリップチップ実装方法
US6461881B1 (en) * 2000-06-08 2002-10-08 Micron Technology, Inc. Stereolithographic method and apparatus for fabricating spacers for semiconductor devices and resulting structures
DE10063907A1 (de) * 2000-12-21 2002-07-04 Philips Corp Intellectual Pty Detektor zum Detektieren von elektromagnetischer Strahlung
US6780682B2 (en) * 2001-02-27 2004-08-24 Chippac, Inc. Process for precise encapsulation of flip chip interconnects
JP2002299595A (ja) * 2001-04-03 2002-10-11 Matsushita Electric Ind Co Ltd 固体撮像装置およびその製造方法
JP4663184B2 (ja) * 2001-09-26 2011-03-30 パナソニック株式会社 半導体装置の製造方法
JP3717899B2 (ja) 2002-04-01 2005-11-16 Ｎｅｃエレクトロニクス株式会社 半導体装置及びその製造方法
JP2004079951A (ja) * 2002-08-22 2004-03-11 Seiko Epson Corp 半導体装置及びその製造方法、回路基板並びに電子機器
US20060057763A1 (en) * 2004-09-14 2006-03-16 Agency For Science, Technology And Research Method of forming a surface mountable IC and its assembly
US8291582B2 (en) 2006-02-13 2012-10-23 Panasonic Corporation Circuit board and process for producing the same
JP2008218643A (ja) * 2007-03-02 2008-09-18 Fujitsu Ltd 半導体装置及びその製造方法
US7951648B2 (en) * 2008-07-01 2011-05-31 International Business Machines Corporation Chip-level underfill method of manufacture
TWI478257B (zh) * 2009-08-06 2015-03-21 宏達國際電子股份有限公司 封裝結構及封裝製程
CN101989554B (zh) * 2009-08-06 2012-08-29 宏达国际电子股份有限公司 封装结构及封装工艺
TWI430376B (zh) * 2011-02-25 2014-03-11 聯測科技股份有限公司 The Method of Fabrication of Semiconductor Packaging Structure
CN110854057B (zh) * 2019-11-14 2022-07-12 京东方科技集团股份有限公司 一种转移基板及其制作方法、转移方法
US20230163232A1 (en) * 2020-08-12 2023-05-25 Chongqing Konka Photoelectric Technology Research Insitute Co., Ltd. Chip transfer method and display device
CN117690810A (zh) * 2023-12-11 2024-03-12 安徽丰芯半导体有限公司 一种保证芯片贴合均匀度的芯片覆晶工艺

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US5030308A (en) * 1986-07-14 1991-07-09 National Starch And Chemical Investment Holding Corporation Method of bonding a semiconductor chip to a substrate
US5926694A (en) * 1996-07-11 1999-07-20 Pfu Limited Semiconductor device and a manufacturing method thereof
US6121689A (en) * 1997-07-21 2000-09-19 Miguel Albert Capote Semiconductor flip-chip package and method for the fabrication thereof
JPH10189663A (ja) 1996-12-26 1998-07-21 Shibuya Kogyo Co Ltd ボンディング装置
US6063647A (en) * 1997-12-08 2000-05-16 3M Innovative Properties Company Method for making circuit elements for a z-axis interconnect

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