TW455966B - Method for fixing a semiconductor device having stud bumps to a substrate by an electrically non-conductive adhesive - Google Patents

Method for fixing a semiconductor device having stud bumps to a substrate by an electrically non-conductive adhesive Download PDF

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Publication number
TW455966B
TW455966B TW089118006A TW89118006A TW455966B TW 455966 B TW455966 B TW 455966B TW 089118006 A TW089118006 A TW 089118006A TW 89118006 A TW89118006 A TW 89118006A TW 455966 B TW455966 B TW 455966B
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TW
Taiwan
Prior art keywords
semiconductor element
conductive adhesive
mounting
hard material
semiconductor
Prior art date
Application number
TW089118006A
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English (en)
Chinese (zh)
Inventor
Shinsuke Nakashiro
Masanori Onodera
Masamitsu Ikumo
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Fujitsu Ltd
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Publication date
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Publication of TW455966B publication Critical patent/TW455966B/zh

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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
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    • H01—ELECTRIC ELEMENTS
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/0665—Epoxy resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor

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  • Engineering & Computer Science (AREA)
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  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW089118006A 2000-02-23 2000-09-02 Method for fixing a semiconductor device having stud bumps to a substrate by an electrically non-conductive adhesive TW455966B (en)

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JP2000046621A JP3625268B2 (ja) 2000-02-23 2000-02-23 半導体装置の実装方法

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CN102651323A (zh) * 2011-02-25 2012-08-29 联测科技股份有限公司 半导体封装结构的制法
CN117690810A (zh) * 2023-12-11 2024-03-12 安徽丰芯半导体有限公司 一种保证芯片贴合均匀度的芯片覆晶工艺

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US6461881B1 (en) * 2000-06-08 2002-10-08 Micron Technology, Inc. Stereolithographic method and apparatus for fabricating spacers for semiconductor devices and resulting structures
DE10063907A1 (de) * 2000-12-21 2002-07-04 Philips Corp Intellectual Pty Detektor zum Detektieren von elektromagnetischer Strahlung
US6780682B2 (en) * 2001-02-27 2004-08-24 Chippac, Inc. Process for precise encapsulation of flip chip interconnects
JP2002299595A (ja) * 2001-04-03 2002-10-11 Matsushita Electric Ind Co Ltd 固体撮像装置およびその製造方法
JP4663184B2 (ja) * 2001-09-26 2011-03-30 パナソニック株式会社 半導体装置の製造方法
JP3717899B2 (ja) 2002-04-01 2005-11-16 Ｎｅｃエレクトロニクス株式会社 半導体装置及びその製造方法
JP2004079951A (ja) * 2002-08-22 2004-03-11 Seiko Epson Corp 半導体装置及びその製造方法、回路基板並びに電子機器
US20060057763A1 (en) * 2004-09-14 2006-03-16 Agency For Science, Technology And Research Method of forming a surface mountable IC and its assembly
US8291582B2 (en) 2006-02-13 2012-10-23 Panasonic Corporation Circuit board and process for producing the same
JP2008218643A (ja) * 2007-03-02 2008-09-18 Fujitsu Ltd 半導体装置及びその製造方法
US7951648B2 (en) * 2008-07-01 2011-05-31 International Business Machines Corporation Chip-level underfill method of manufacture
TWI478257B (zh) * 2009-08-06 2015-03-21 宏達國際電子股份有限公司 封裝結構及封裝製程
CN101989554B (zh) * 2009-08-06 2012-08-29 宏达国际电子股份有限公司 封装结构及封装工艺
CN110854057B (zh) * 2019-11-14 2022-07-12 京东方科技集团股份有限公司 一种转移基板及其制作方法、转移方法
US20230163232A1 (en) * 2020-08-12 2023-05-25 Chongqing Konka Photoelectric Technology Research Insitute Co., Ltd. Chip transfer method and display device

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US5030308A (en) * 1986-07-14 1991-07-09 National Starch And Chemical Investment Holding Corporation Method of bonding a semiconductor chip to a substrate
US5926694A (en) * 1996-07-11 1999-07-20 Pfu Limited Semiconductor device and a manufacturing method thereof
US6121689A (en) * 1997-07-21 2000-09-19 Miguel Albert Capote Semiconductor flip-chip package and method for the fabrication thereof
JPH10189663A (ja) 1996-12-26 1998-07-21 Shibuya Kogyo Co Ltd ボンディング装置
US6063647A (en) * 1997-12-08 2000-05-16 3M Innovative Properties Company Method for making circuit elements for a z-axis interconnect

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CN102651323A (zh) * 2011-02-25 2012-08-29 联测科技股份有限公司 半导体封装结构的制法
CN102651323B (zh) * 2011-02-25 2015-09-02 联测科技股份有限公司 半导体封装结构的制法
CN117690810A (zh) * 2023-12-11 2024-03-12 安徽丰芯半导体有限公司 一种保证芯片贴合均匀度的芯片覆晶工艺

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KR100581246B1 (ko) 2006-05-22
KR20010085224A (ko) 2001-09-07

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