KR100571314B1 - 포지티브 전자빔 또는 x선 레지스트 조성물 - Google Patents

포지티브 전자빔 또는 x선 레지스트 조성물 Download PDF

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Publication number
KR100571314B1
KR100571314B1 KR1019990044865A KR19990044865A KR100571314B1 KR 100571314 B1 KR100571314 B1 KR 100571314B1 KR 1019990044865 A KR1019990044865 A KR 1019990044865A KR 19990044865 A KR19990044865 A KR 19990044865A KR 100571314 B1 KR100571314 B1 KR 100571314B1
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KR
South Korea
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group
acid
fluorine atoms
substituted
compound
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Expired - Lifetime
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KR1019990044865A
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English (en)
Korean (ko)
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KR20000029118A (ko
Inventor
코다마쿠니히코
아오아이토시아키
우에니시카주야
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후지 샤신 필름 가부시기가이샤
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Publication of KR20000029118A publication Critical patent/KR20000029118A/ko
Application granted granted Critical
Publication of KR100571314B1 publication Critical patent/KR100571314B1/ko
Assigned to 후지필름 가부시키가이샤 reassignment 후지필름 가부시키가이샤 권리의 전부이전등록 Assignors: 후지필름 홀딩스 가부시끼가이샤
Anticipated expiration legal-status Critical
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F12/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F12/02—Monomers containing only one unsaturated aliphatic radical
    • C08F12/04—Monomers containing only one unsaturated aliphatic radical containing one ring
    • C08F12/14—Monomers containing only one unsaturated aliphatic radical containing one ring substituted by hetero atoms or groups containing heteroatoms
    • C08F12/22—Oxygen
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/143—Electron beam
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/167—X-ray

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  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Emergency Medicine (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
KR1019990044865A 1998-10-16 1999-10-16 포지티브 전자빔 또는 x선 레지스트 조성물 Expired - Lifetime KR100571314B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP29560998 1998-10-16
JP98-295609 1998-10-16
JP99-275334 1999-09-28
JP27533499A JP4007570B2 (ja) 1998-10-16 1999-09-28 ポジ型レジスト組成物

Publications (2)

Publication Number Publication Date
KR20000029118A KR20000029118A (ko) 2000-05-25
KR100571314B1 true KR100571314B1 (ko) 2006-04-17

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019990044865A Expired - Lifetime KR100571314B1 (ko) 1998-10-16 1999-10-16 포지티브 전자빔 또는 x선 레지스트 조성물

Country Status (3)

Country Link
US (1) US6265135B1 (https=)
JP (1) JP4007570B2 (https=)
KR (1) KR100571314B1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100788808B1 (ko) * 2000-02-18 2007-12-31 후지필름 가부시키가이샤 포지티브 전자선 또는 엑스선 레지스트 조성물

Families Citing this family (41)

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US6806022B1 (en) * 1998-04-22 2004-10-19 Fuji Photo Film Co., Ltd. Positive photosensitive resin composition
JP3963625B2 (ja) * 1999-02-24 2007-08-22 富士フイルム株式会社 ポジ型フォトレジスト組成物
JP3281612B2 (ja) * 1999-03-05 2002-05-13 松下電器産業株式会社 パターン形成方法
KR100538501B1 (ko) * 1999-08-16 2005-12-23 신에쓰 가가꾸 고교 가부시끼가이샤 신규한 오늄염, 레지스트 재료용 광산발생제, 레지스트재료 및 패턴 형성 방법
JP4135276B2 (ja) * 1999-10-12 2008-08-20 Ｊｓｒ株式会社 感放射線性樹脂組成物
US6727036B2 (en) * 1999-12-27 2004-04-27 Fuji Photo Film Co., Ltd. Positive-working radiation-sensitive composition
US6692883B2 (en) * 2000-04-21 2004-02-17 Fuji Photo Film Co., Ltd. Positive photoresist composition
JP2002006483A (ja) * 2000-06-20 2002-01-09 Sumitomo Chem Co Ltd フォトレジスト組成物
JP4150491B2 (ja) * 2000-07-13 2008-09-17 富士フイルム株式会社 ポジ型感光性組成物
JP3956088B2 (ja) * 2000-07-19 2007-08-08 信越化学工業株式会社 化学増幅ポジ型レジスト材料
JP3712047B2 (ja) * 2000-08-14 2005-11-02 信越化学工業株式会社 レジスト材料及びパターン形成方法
US6482567B1 (en) * 2000-08-25 2002-11-19 Shipley Company, L.L.C. Oxime sulfonate and N-oxyimidosulfonate photoacid generators and photoresists comprising same
TWI226509B (en) * 2000-09-12 2005-01-11 Fuji Photo Film Co Ltd Positive resist composition
US6727039B2 (en) * 2000-09-25 2004-04-27 Fuji Photo Film Co., Ltd. Positive photoresist composition
JP4190167B2 (ja) * 2000-09-26 2008-12-03 富士フイルム株式会社 ポジ型レジスト組成物
JP4438218B2 (ja) * 2000-11-16 2010-03-24 Ｊｓｒ株式会社 感放射線性樹脂組成物
JP4190146B2 (ja) * 2000-12-28 2008-12-03 富士フイルム株式会社 電子線またはｘ線用ポジ型レジスト組成物
TW594383B (en) * 2001-02-21 2004-06-21 Fuji Photo Film Co Ltd Positive resist composition for electron beam
TW562999B (en) * 2001-05-09 2003-11-21 Fuji Photo Film Co Ltd Positive resist composition for electronic or X-rays
EP1406123A4 (en) * 2001-06-22 2006-06-07 Wako Pure Chem Ind Ltd RESIST COMPOSITIONS
US6949329B2 (en) 2001-06-22 2005-09-27 Matsushita Electric Industrial Co., Ltd. Pattern formation method
JP2003186197A (ja) * 2001-12-19 2003-07-03 Sony Corp レジスト材料及び露光方法
JP2003186198A (ja) * 2001-12-19 2003-07-03 Sony Corp レジスト材料及び露光方法
US7214465B2 (en) 2002-01-10 2007-05-08 Fujifilm Corporation Positive photosensitive composition
JP4025075B2 (ja) * 2002-01-10 2007-12-19 富士フイルム株式会社 ポジ型感光性組成物
US7521168B2 (en) * 2002-02-13 2009-04-21 Fujifilm Corporation Resist composition for electron beam, EUV or X-ray
JP2004004561A (ja) * 2002-02-19 2004-01-08 Sumitomo Chem Co Ltd ポジ型レジスト組成物
US6806026B2 (en) * 2002-05-31 2004-10-19 International Business Machines Corporation Photoresist composition
KR100973799B1 (ko) * 2003-01-03 2010-08-03 삼성전자주식회사 Ｍｍｎ 헤드 코터용 포토레지스트 조성물
US7193023B2 (en) * 2003-12-04 2007-03-20 International Business Machines Corporation Low activation energy photoresists
US7820369B2 (en) 2003-12-04 2010-10-26 International Business Machines Corporation Method for patterning a low activation energy photoresist
US7217496B2 (en) 2004-11-12 2007-05-15 International Business Machines Corporation Fluorinated photoresist materials with improved etch resistant properties
JP4562537B2 (ja) 2005-01-28 2010-10-13 富士フイルム株式会社 感光性組成物、該感光性組成物に用いる化合物及び該感光性組成物を用いたパターン形成方法
JPWO2008001679A1 (ja) 2006-06-27 2009-11-26 Jsr株式会社 パターン形成方法及びそれに用いる有機薄膜形成用組成物
KR101429309B1 (ko) 2006-08-04 2014-08-11 제이에스알 가부시끼가이샤 패턴 형성 방법, 상층막 형성용 조성물, 및 하층막 형성용 조성물
JP5522906B2 (ja) * 2008-05-23 2014-06-18 日本カーバイド工業株式会社 新規な光酸発生剤及びそれを含むレジスト材料
JP5544098B2 (ja) 2008-09-26 2014-07-09 富士フイルム株式会社 感活性光線性または感放射線性樹脂組成物、及び該感光性組成物を用いたパターン形成方法
JP5514583B2 (ja) * 2009-03-13 2014-06-04 富士フイルム株式会社 感活性光線性または感放射線性樹脂組成物及び該組成物を用いたパターン形成方法
JP5740322B2 (ja) 2012-02-06 2015-06-24 富士フイルム株式会社 感活性光線性又は感放射線性樹脂組成物、それを用いた感活性光線性又は感放射線性膜及びパターン形成方法、半導体デバイスの製造方法及び半導体デバイス、並びに、化合物
JP6637676B2 (ja) * 2015-05-11 2020-01-29 住友化学株式会社 塩、酸発生剤、レジスト組成物及びレジストパターンの製造方法
KR102134381B1 (ko) * 2017-07-31 2020-07-15 주식회사 엘지화학 포지티브형 포토레지스트 조성물, 이로부터 제조되는 패턴, 및 패턴 제조방법

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DE4112971A1 (de) * 1991-04-20 1992-10-22 Hoechst Ag Sulfonsaeureester von 2,4,6-tris-(2-hydroxy-ethoxy)-(1,3,5)triazin, ein damit hergestelltes positiv arbeitendes strahlungsempfindliches gemisch und aufzeichnungsmaterial
JPH08110635A (ja) * 1994-10-07 1996-04-30 Shin Etsu Chem Co Ltd 化学増幅ポジ型レジスト材料
TW530192B (en) * 1997-01-27 2003-05-01 Shinetsu Chemical Co Partially hydrogenated polymer compound and chemically sensitized positive resist material
TW574629B (en) * 1997-02-28 2004-02-01 Shinetsu Chemical Co Polystyrene derivative chemically amplified positive resist compositions, and patterning method
KR100571313B1 (ko) * 1998-03-17 2006-04-17 후지 샤신 필름 가부시기가이샤 포지티브 감광성 조성물

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100788808B1 (ko) * 2000-02-18 2007-12-31 후지필름 가부시키가이샤 포지티브 전자선 또는 엑스선 레지스트 조성물

Also Published As

Publication number Publication date
JP2000187330A (ja) 2000-07-04
US6265135B1 (en) 2001-07-24
JP4007570B2 (ja) 2007-11-14
KR20000029118A (ko) 2000-05-25

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