KR100429443B1 - 다층배선판의제조방법 - Google Patents

다층배선판의제조방법 Download PDF

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Publication number
KR100429443B1
KR100429443B1 KR1019970006666A KR19970006666A KR100429443B1 KR 100429443 B1 KR100429443 B1 KR 100429443B1 KR 1019970006666 A KR1019970006666 A KR 1019970006666A KR 19970006666 A KR19970006666 A KR 19970006666A KR 100429443 B1 KR100429443 B1 KR 100429443B1
Authority
KR
South Korea
Prior art keywords
insulating layer
interlayer insulating
multilayer wiring
wiring board
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019970006666A
Other languages
English (en)
Korean (ko)
Other versions
KR19980018040A (ko
Inventor
요시까즈 다끼구찌
히로유끼 오비야
도루 다까하시
다이스께 시로야마
겐지 다자와
Original Assignee
도오꾜오까고오교 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP6908396A external-priority patent/JPH09237976A/ja
Priority claimed from JP22076796A external-priority patent/JPH1051142A/ja
Priority claimed from JP24262496A external-priority patent/JPH1070366A/ja
Priority claimed from JP24262596A external-priority patent/JPH1070371A/ja
Priority claimed from JP27747596A external-priority patent/JPH10107446A/ja
Application filed by 도오꾜오까고오교 가부시끼가이샤 filed Critical 도오꾜오까고오교 가부시끼가이샤
Publication of KR19980018040A publication Critical patent/KR19980018040A/ko
Application granted granted Critical
Publication of KR100429443B1 publication Critical patent/KR100429443B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0166—Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/025—Abrading, e.g. grinding or sand blasting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
KR1019970006666A 1996-02-29 1997-02-28 다층배선판의제조방법 Expired - Fee Related KR100429443B1 (ko)

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
JP96-69083 1996-02-29
JP6908396A JPH09237976A (ja) 1996-02-29 1996-02-29 多層配線板の製造方法
JP22076796A JPH1051142A (ja) 1996-08-05 1996-08-05 多層配線板の製造方法
JP96-220767 1996-08-05
JP96-242624 1996-08-26
JP96-242625 1996-08-26
JP24262496A JPH1070366A (ja) 1996-08-26 1996-08-26 多層配線板の製造方法
JP24262596A JPH1070371A (ja) 1996-08-26 1996-08-26 多層配線板の製造方法
JP96-277475 1996-08-27
JP27747596A JPH10107446A (ja) 1996-09-27 1996-09-27 多層配線板の製造方法

Publications (2)

Publication Number Publication Date
KR19980018040A KR19980018040A (ko) 1998-06-05
KR100429443B1 true KR100429443B1 (ko) 2004-06-16

Family

ID=27524158

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019970006666A Expired - Fee Related KR100429443B1 (ko) 1996-02-29 1997-02-28 다층배선판의제조방법

Country Status (5)

Country Link
US (2) US6010956A (enExample)
EP (1) EP0793406B1 (enExample)
KR (1) KR100429443B1 (enExample)
DE (1) DE69734947T2 (enExample)
TW (1) TW322680B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101415400B1 (ko) * 2009-08-20 2014-08-01 씨엠케이 가부시키가이샤 프린트 배선판의 제조방법

Families Citing this family (66)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0970499A1 (en) * 1997-03-25 2000-01-12 E.I. Du Pont De Nemours And Company Field emitter cathode backplate structures for display panels
US6096635A (en) * 1997-10-21 2000-08-01 Microjet Technology Co., Ltd. Method for creating via hole in chip
US6156221A (en) * 1998-10-02 2000-12-05 International Business Machines Corporation Copper etching compositions, processes and products derived therefrom
US6387736B1 (en) * 1999-04-26 2002-05-14 Agilent Technologies, Inc. Method and structure for bonding layers in a semiconductor device
US6451127B1 (en) 1999-06-01 2002-09-17 Motorola, Inc. Conductive paste and semiconductor component having conductive bumps made from the conductive paste
JP2001007468A (ja) * 1999-06-24 2001-01-12 Nec Kansai Ltd 配線基板，多層配線基板およびその製造方法
US20040034134A1 (en) * 1999-08-26 2004-02-19 Lamb James E. Crosslinkable fill compositions for uniformly protecting via and contact holes
WO2001015211A1 (en) 1999-08-26 2001-03-01 Brewer Science Improved fill material for dual damascene processes
DE19961103C2 (de) * 1999-12-17 2002-03-14 Infineon Technologies Ag Dielektrische Füllung von elektrischen Verdrahtungsebenen und Verfahren zur Herstellung einer elektrischen Verdrahtung
US6340608B1 (en) * 2000-07-07 2002-01-22 Chartered Semiconductor Manufacturing Ltd. Method of fabricating copper metal bumps for flip-chip or chip-on-board IC bonding on terminating copper pads
WO2002049405A2 (en) * 2000-08-15 2002-06-20 World Properties, Inc. Multi-layer circuits and methods of manufacture thereof
ATE307858T1 (de) * 2000-08-15 2005-11-15 Dsm Ip Assets Bv Klebstoffzusammensetzung für optische platten
US6748650B2 (en) * 2001-06-27 2004-06-15 Visteon Global Technologies, Inc. Method for making a circuit assembly having an integral frame
TW584950B (en) 2001-12-31 2004-04-21 Megic Corp Chip packaging structure and process thereof
TW544882B (en) * 2001-12-31 2003-08-01 Megic Corp Chip package structure and process thereof
TW503496B (en) * 2001-12-31 2002-09-21 Megic Corp Chip packaging structure and manufacturing process of the same
US6673698B1 (en) * 2002-01-19 2004-01-06 Megic Corporation Thin film semiconductor package utilizing a glass substrate with composite polymer/metal interconnect layers
WO2003103352A1 (ja) * 2002-06-04 2003-12-11 住友電気工業株式会社 プリント配線用基板、プリント配線板およびこれらの製造方法
JP3941609B2 (ja) * 2002-07-03 2007-07-04 株式会社デンソー 多層基板形成用素板の検査装置及び検査方法
US20040011555A1 (en) * 2002-07-22 2004-01-22 Chiu Tsung Chin Method for manufacturing printed circuit board with stacked wires and printed circuit board manufacturing according to the mehtod
US20040192876A1 (en) * 2002-11-18 2004-09-30 Nigel Hacker Novolac polymer planarization films with high temparature stability
JP4907088B2 (ja) * 2003-02-05 2012-03-28 株式会社半導体エネルギー研究所 表示装置の製造方法
WO2004070810A1 (ja) * 2003-02-05 2004-08-19 Semiconductor Energy Laboratory Co., Ltd. 表示装置の製造方法
WO2004070823A1 (ja) * 2003-02-05 2004-08-19 Semiconductor Energy Laboratory Co., Ltd. 表示装置の作製方法
KR101145350B1 (ko) * 2003-02-06 2012-05-14 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체장치 및 표시장치의 제조 방법
JP3791616B2 (ja) * 2003-02-06 2006-06-28 セイコーエプソン株式会社 配線基板、電気光学装置及びその製造方法並びに電子機器
KR101186919B1 (ko) * 2003-02-06 2012-10-02 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시장치의 제조 방법
WO2004070821A1 (ja) * 2003-02-06 2004-08-19 Semiconductor Energy Laboratory Co., Ltd. 表示装置の作製方法
US20040211979A1 (en) * 2003-04-24 2004-10-28 Konica Minolta Holdings, Inc. Circuit board and method for manufacturing the circuit board
FR2856552B1 (fr) * 2003-06-23 2005-10-21 Imphy Ugine Precision Procede de fabrication de pieces pour composants electroniques passifs et pieces obtenues
EP1649322A4 (en) * 2003-07-17 2007-09-19 Honeywell Int Inc PLANARIZATION FILMS FOR ADVANCED MICRO-ELECTRONIC APPLICATIONS AND EQUIPMENT AND METHOD FOR THE PRODUCTION THEREOF
WO2006073871A1 (en) * 2004-12-30 2006-07-13 Applied Materials, Inc. Line edge roughness reduction compatible with trimming
WO2006095611A1 (ja) * 2005-03-11 2006-09-14 Toyo Ink Mfg. Co., Ltd. 導電性インキ、導電回路、及び非接触型メディア
EP1884992A4 (en) 2005-05-23 2009-10-28 Ibiden Co Ltd CIRCUIT BOARD
KR100735411B1 (ko) * 2005-12-07 2007-07-04 삼성전기주식회사 배선기판의 제조방법 및 배선기판
KR100744244B1 (ko) * 2005-12-28 2007-07-30 동부일렉트로닉스 주식회사 반도체 소자의 구리배선 제조 방법
US20070161255A1 (en) * 2006-01-06 2007-07-12 Wilfred Pau Method for etching with hardmask
US7915527B1 (en) 2006-08-23 2011-03-29 Rockwell Collins, Inc. Hermetic seal and hermetic connector reinforcement and repair with low temperature glass coatings
US8174830B2 (en) * 2008-05-06 2012-05-08 Rockwell Collins, Inc. System and method for a substrate with internal pumped liquid metal for thermal spreading and cooling
US8076185B1 (en) 2006-08-23 2011-12-13 Rockwell Collins, Inc. Integrated circuit protection and ruggedization coatings and methods
US8581108B1 (en) 2006-08-23 2013-11-12 Rockwell Collins, Inc. Method for providing near-hermetically coated integrated circuit assemblies
US8617913B2 (en) 2006-08-23 2013-12-31 Rockwell Collins, Inc. Alkali silicate glass based coating and method for applying
US8084855B2 (en) * 2006-08-23 2011-12-27 Rockwell Collins, Inc. Integrated circuit tampering protection and reverse engineering prevention coatings and methods
US8166645B2 (en) 2006-08-23 2012-05-01 Rockwell Collins, Inc. Method for providing near-hermetically coated, thermally protected integrated circuit assemblies
US8637980B1 (en) 2007-12-18 2014-01-28 Rockwell Collins, Inc. Adhesive applications using alkali silicate glass for electronics
JP2008140886A (ja) * 2006-11-30 2008-06-19 Shinko Electric Ind Co Ltd 配線基板及びその製造方法
US8034718B2 (en) * 2006-12-12 2011-10-11 International Business Machines Corporation Method to recover patterned semiconductor wafers for rework
US8363189B2 (en) * 2007-12-18 2013-01-29 Rockwell Collins, Inc. Alkali silicate glass for displays
SG154342A1 (en) * 2008-01-08 2009-08-28 Opulent Electronics Internat P Insulated metal substrate fabrication
US8221089B2 (en) * 2008-09-12 2012-07-17 Rockwell Collins, Inc. Thin, solid-state mechanism for pumping electrically conductive liquids in a flexible thermal spreader
US8650886B2 (en) * 2008-09-12 2014-02-18 Rockwell Collins, Inc. Thermal spreader assembly with flexible liquid cooling loop having rigid tubing sections and flexible tubing sections
US8616266B2 (en) * 2008-09-12 2013-12-31 Rockwell Collins, Inc. Mechanically compliant thermal spreader with an embedded cooling loop for containing and circulating electrically-conductive liquid
US8017872B2 (en) * 2008-05-06 2011-09-13 Rockwell Collins, Inc. System and method for proportional cooling with liquid metal
US8205337B2 (en) * 2008-09-12 2012-06-26 Rockwell Collins, Inc. Fabrication process for a flexible, thin thermal spreader
US8119040B2 (en) 2008-09-29 2012-02-21 Rockwell Collins, Inc. Glass thick film embedded passive material
TW201031532A (en) * 2009-02-26 2010-09-01 Taiwan Decor Technology Co Heat transfer-printing film and heat transfer-printing method utilizing the same
TW201216801A (en) * 2010-10-01 2012-04-16 Hung-Ming Lin Manufacturing method of circuit board
KR20130050057A (ko) * 2011-11-07 2013-05-15 삼성전기주식회사 코일 부품의 제조 방법
CN102612276A (zh) * 2012-03-13 2012-07-25 惠州中京电子科技股份有限公司 多层 hdi线路板的微孔制作工艺
US9435915B1 (en) 2012-09-28 2016-09-06 Rockwell Collins, Inc. Antiglare treatment for glass
TWI462672B (zh) * 2013-02-08 2014-11-21 Ichia Tech Inc 前驅基板、軟性印刷電路板及其製造方法
JP5649150B1 (ja) * 2014-07-17 2015-01-07 日本エレクトロプレイテイング・エンジニヤース株式会社 無電解メッキ用前処理液および無電解メッキ方法
WO2016077844A1 (en) * 2014-11-16 2016-05-19 Nano-Dimension Technologies, Ltd. Double-sided and multilayered printed circuit board fabrication using inkjet printing
KR20160093403A (ko) * 2015-01-29 2016-08-08 엘지이노텍 주식회사 전자파차폐구조물
JP7210901B2 (ja) * 2017-06-26 2023-01-24 味の素株式会社 樹脂組成物層
CN110416076B (zh) * 2019-06-05 2021-11-12 福建省福联集成电路有限公司 一种改善金属线路断裂的方法及器件

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3681474A (en) * 1969-09-12 1972-08-01 Richardson Co Electrical substrates
JPS55103554A (en) * 1979-02-02 1980-08-07 Sumitomo Chem Co Ltd Photosensitive resin composition for sand blast resist
DE3060913D1 (en) * 1979-05-12 1982-11-11 Fujitsu Ltd Improvement in method of manufacturing electronic device having multilayer wiring structure
JP2881963B2 (ja) * 1990-05-25 1999-04-12 ソニー株式会社 配線基板及びその製造方法
US5851681A (en) * 1993-03-15 1998-12-22 Hitachi, Ltd. Wiring structure with metal wiring layers and polyimide layers, and fabrication process of multilayer wiring board
US5485038A (en) * 1993-07-15 1996-01-16 Hughes Aircraft Company Microelectronic circuit substrate structure including photoimageable epoxy dielectric layers
TW341022B (en) * 1995-11-29 1998-09-21 Nippon Electric Co Interconnection structures and method of making same
JP2830812B2 (ja) * 1995-12-27 1998-12-02 日本電気株式会社 多層プリント配線板の製造方法
US5993945A (en) * 1996-05-30 1999-11-30 International Business Machines Corporation Process for high resolution photoimageable dielectric
US5997997A (en) * 1997-06-13 1999-12-07 International Business Machines Corp. Method for reducing seed deposition in electroless plating

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101415400B1 (ko) * 2009-08-20 2014-08-01 씨엠케이 가부시키가이샤 프린트 배선판의 제조방법

Also Published As

Publication number Publication date
EP0793406A1 (en) 1997-09-03
EP0793406B1 (en) 2005-12-28
DE69734947D1 (de) 2006-02-02
US6228465B1 (en) 2001-05-08
TW322680B (enExample) 1997-12-11
KR19980018040A (ko) 1998-06-05
DE69734947T2 (de) 2006-08-24
US6010956A (en) 2000-01-04

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