JPWO2023223881A5 - - Google Patents

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Publication number
JPWO2023223881A5
JPWO2023223881A5 JP2024521683A JP2024521683A JPWO2023223881A5 JP WO2023223881 A5 JPWO2023223881 A5 JP WO2023223881A5 JP 2024521683 A JP2024521683 A JP 2024521683A JP 2024521683 A JP2024521683 A JP 2024521683A JP WO2023223881 A5 JPWO2023223881 A5 JP WO2023223881A5
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JP
Japan
Prior art keywords
electronic component
thickness direction
electronic device
mounting portion
viewed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024521683A
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English (en)
Japanese (ja)
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JPWO2023223881A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/017376 external-priority patent/WO2023223881A1/ja
Publication of JPWO2023223881A1 publication Critical patent/JPWO2023223881A1/ja
Publication of JPWO2023223881A5 publication Critical patent/JPWO2023223881A5/ja
Pending legal-status Critical Current

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JP2024521683A 2022-05-18 2023-05-09 Pending JPWO2023223881A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022081582 2022-05-18
PCT/JP2023/017376 WO2023223881A1 (ja) 2022-05-18 2023-05-09 電子装置

Publications (2)

Publication Number Publication Date
JPWO2023223881A1 JPWO2023223881A1 (https=) 2023-11-23
JPWO2023223881A5 true JPWO2023223881A5 (https=) 2025-01-29

Family

ID=88835220

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024521683A Pending JPWO2023223881A1 (https=) 2022-05-18 2023-05-09

Country Status (2)

Country Link
JP (1) JPWO2023223881A1 (https=)
WO (1) WO2023223881A1 (https=)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5427745B2 (ja) * 2010-09-30 2014-02-26 日立オートモティブシステムズ株式会社 パワー半導体モジュール及びその製造方法
WO2015080161A1 (ja) * 2013-11-29 2015-06-04 株式会社神戸製鋼所 ベース板及びベース板を備えた半導体装置
JP7412998B2 (ja) * 2019-12-12 2024-01-15 ローム株式会社 半導体装置および半導体装置の製造方法

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