JPWO2023223881A1 - - Google Patents
Info
- Publication number
- JPWO2023223881A1 JPWO2023223881A1 JP2024521683A JP2024521683A JPWO2023223881A1 JP WO2023223881 A1 JPWO2023223881 A1 JP WO2023223881A1 JP 2024521683 A JP2024521683 A JP 2024521683A JP 2024521683 A JP2024521683 A JP 2024521683A JP WO2023223881 A1 JPWO2023223881 A1 JP WO2023223881A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022081582 | 2022-05-18 | ||
| PCT/JP2023/017376 WO2023223881A1 (ja) | 2022-05-18 | 2023-05-09 | 電子装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023223881A1 true JPWO2023223881A1 (https=) | 2023-11-23 |
| JPWO2023223881A5 JPWO2023223881A5 (https=) | 2025-01-29 |
Family
ID=88835220
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024521683A Pending JPWO2023223881A1 (https=) | 2022-05-18 | 2023-05-09 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2023223881A1 (https=) |
| WO (1) | WO2023223881A1 (https=) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5427745B2 (ja) * | 2010-09-30 | 2014-02-26 | 日立オートモティブシステムズ株式会社 | パワー半導体モジュール及びその製造方法 |
| WO2015080161A1 (ja) * | 2013-11-29 | 2015-06-04 | 株式会社神戸製鋼所 | ベース板及びベース板を備えた半導体装置 |
| JP7412998B2 (ja) * | 2019-12-12 | 2024-01-15 | ローム株式会社 | 半導体装置および半導体装置の製造方法 |
-
2023
- 2023-05-09 JP JP2024521683A patent/JPWO2023223881A1/ja active Pending
- 2023-05-09 WO PCT/JP2023/017376 patent/WO2023223881A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023223881A1 (ja) | 2023-11-23 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20241113 |