JPWO2023100500A5 - - Google Patents

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Publication number
JPWO2023100500A5
JPWO2023100500A5 JP2023564781A JP2023564781A JPWO2023100500A5 JP WO2023100500 A5 JPWO2023100500 A5 JP WO2023100500A5 JP 2023564781 A JP2023564781 A JP 2023564781A JP 2023564781 A JP2023564781 A JP 2023564781A JP WO2023100500 A5 JPWO2023100500 A5 JP WO2023100500A5
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JP
Japan
Prior art keywords
silicon carbide
plane
semiconductor device
region
curvature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023564781A
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English (en)
Japanese (ja)
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JPWO2023100500A1 (https=
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Application filed filed Critical
Priority claimed from PCT/JP2022/038403 external-priority patent/WO2023100500A1/ja
Publication of JPWO2023100500A1 publication Critical patent/JPWO2023100500A1/ja
Publication of JPWO2023100500A5 publication Critical patent/JPWO2023100500A5/ja
Pending legal-status Critical Current

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JP2023564781A 2021-11-30 2022-10-14 Pending JPWO2023100500A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021193786 2021-11-30
PCT/JP2022/038403 WO2023100500A1 (ja) 2021-11-30 2022-10-14 炭化珪素半導体装置

Publications (2)

Publication Number Publication Date
JPWO2023100500A1 JPWO2023100500A1 (https=) 2023-06-08
JPWO2023100500A5 true JPWO2023100500A5 (https=) 2024-08-13

Family

ID=86611810

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023564781A Pending JPWO2023100500A1 (https=) 2021-11-30 2022-10-14

Country Status (3)

Country Link
US (1) US20250133805A1 (https=)
JP (1) JPWO2023100500A1 (https=)
WO (1) WO2023100500A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025187347A1 (ja) * 2024-03-07 2025-09-12 住友電気工業株式会社 炭化珪素半導体装置

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5920010B2 (ja) * 2012-05-18 2016-05-18 住友電気工業株式会社 半導体装置
JP2015072944A (ja) * 2013-10-01 2015-04-16 住友電気工業株式会社 炭化珪素半導体装置およびその製造方法
WO2018088063A1 (ja) * 2016-11-11 2018-05-17 住友電気工業株式会社 炭化珪素半導体装置
WO2019155783A1 (ja) * 2018-02-06 2019-08-15 住友電気工業株式会社 炭化珪素半導体装置
JP7196463B2 (ja) * 2018-08-23 2022-12-27 富士電機株式会社 炭化珪素半導体装置の製造方法および炭化珪素半導体装置
CN114503283B (zh) * 2019-12-20 2025-11-25 住友电气工业株式会社 碳化硅半导体装置
JP7048659B2 (ja) * 2020-04-07 2022-04-05 ローム株式会社 半導体装置
US12464791B2 (en) * 2022-03-07 2025-11-04 Denso Corporation Semiconductor device
US12051747B2 (en) * 2022-03-11 2024-07-30 Nuvoton Technology Corporation Japan Semiconductor device
WO2023188756A1 (ja) * 2022-03-28 2023-10-05 ローム株式会社 半導体装置
CN117242577A (zh) * 2022-04-14 2023-12-15 苏州龙驰半导体科技有限公司 晶体管器件和制造晶体管器件的方法
CN115394834B (zh) * 2022-07-29 2024-01-09 安世半导体科技(上海)有限公司 具有控制栅极及载流子存储层的igbt元胞结构及其制造方法
CN115513297B (zh) * 2022-11-09 2023-09-22 中芯越州集成电路制造(绍兴)有限公司 碳化硅平面mosfet器件及其制造方法
DE102023122081B3 (de) * 2023-08-17 2025-02-20 Infineon Technologies Ag Halbleitervorrichtung mit superjunction-struktur
JP2025063782A (ja) * 2023-10-04 2025-04-16 富士電機株式会社 炭化珪素半導体装置および炭化珪素半導体装置の製造方法
DE102023212057A1 (de) * 2023-12-01 2025-06-05 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung eines Halbleiterbauelements und Halbleiterbauelement
KR20250109914A (ko) * 2024-01-11 2025-07-18 삼성전자주식회사 전력 반도체 소자
DE102024204506B3 (de) * 2024-05-15 2025-08-14 Infineon Technologies Ag Halbleitervorrichtung mit Stromausbreitungsbereich und Verfahren zum Herstellen

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