JPWO2023100500A1 - - Google Patents

Info

Publication number
JPWO2023100500A1
JPWO2023100500A1 JP2023564781A JP2023564781A JPWO2023100500A1 JP WO2023100500 A1 JPWO2023100500 A1 JP WO2023100500A1 JP 2023564781 A JP2023564781 A JP 2023564781A JP 2023564781 A JP2023564781 A JP 2023564781A JP WO2023100500 A1 JPWO2023100500 A1 JP WO2023100500A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023564781A
Other languages
Japanese (ja)
Other versions
JPWO2023100500A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023100500A1 publication Critical patent/JPWO2023100500A1/ja
Publication of JPWO2023100500A5 publication Critical patent/JPWO2023100500A5/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/01Manufacture or treatment
    • H10D12/031Manufacture or treatment of IGBTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/01Manufacture or treatment
    • H10D30/021Manufacture or treatment of FETs having insulated gates [IGFET]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/64Double-diffused metal-oxide semiconductor [DMOS] FETs
    • H10D30/66Vertical DMOS [VDMOS] FETs
    • H10D30/668Vertical DMOS [VDMOS] FETs having trench gate electrodes, e.g. UMOS transistors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/124Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions
    • H10D62/126Top-view geometrical layouts of the regions or the junctions
    • H10D62/127Top-view geometrical layouts of the regions or the junctions of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/17Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
    • H10D62/393Body regions of DMOS transistors or IGBTs 
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/40Crystalline structures
    • H10D62/405Orientations of crystalline planes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/20Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/27Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
    • H10D64/311Gate electrodes for field-effect devices
    • H10D64/411Gate electrodes for field-effect devices for FETs
    • H10D64/511Gate electrodes for field-effect devices for FETs for IGFETs
    • H10D64/512Disposition of the gate electrodes, e.g. buried gates
    • H10D64/513Disposition of the gate electrodes, e.g. buried gates within recesses in the substrate, e.g. trench gates, groove gates or buried gates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/20Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/27Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
    • H10D64/311Gate electrodes for field-effect devices
    • H10D64/411Gate electrodes for field-effect devices for FETs
    • H10D64/511Gate electrodes for field-effect devices for FETs for IGFETs
    • H10D64/517Gate electrodes for field-effect devices for FETs for IGFETs characterised by the conducting layers
    • H10D64/518Gate electrodes for field-effect devices for FETs for IGFETs characterised by the conducting layers characterised by their lengths or sectional shapes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/83Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
    • H10D62/832Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge being Group IV materials comprising two or more elements, e.g. SiGe
    • H10D62/8325Silicon carbide
JP2023564781A 2021-11-30 2022-10-14 Pending JPWO2023100500A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021193786 2021-11-30
PCT/JP2022/038403 WO2023100500A1 (ja) 2021-11-30 2022-10-14 炭化珪素半導体装置

Publications (2)

Publication Number Publication Date
JPWO2023100500A1 true JPWO2023100500A1 (https=) 2023-06-08
JPWO2023100500A5 JPWO2023100500A5 (https=) 2024-08-13

Family

ID=86611810

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023564781A Pending JPWO2023100500A1 (https=) 2021-11-30 2022-10-14

Country Status (3)

Country Link
US (1) US20250133805A1 (https=)
JP (1) JPWO2023100500A1 (https=)
WO (1) WO2023100500A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025187347A1 (ja) * 2024-03-07 2025-09-12 住友電気工業株式会社 炭化珪素半導体装置

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5920010B2 (ja) * 2012-05-18 2016-05-18 住友電気工業株式会社 半導体装置
JP2015072944A (ja) * 2013-10-01 2015-04-16 住友電気工業株式会社 炭化珪素半導体装置およびその製造方法
WO2018088063A1 (ja) * 2016-11-11 2018-05-17 住友電気工業株式会社 炭化珪素半導体装置
WO2019155783A1 (ja) * 2018-02-06 2019-08-15 住友電気工業株式会社 炭化珪素半導体装置
JP7196463B2 (ja) * 2018-08-23 2022-12-27 富士電機株式会社 炭化珪素半導体装置の製造方法および炭化珪素半導体装置
CN114503283B (zh) * 2019-12-20 2025-11-25 住友电气工业株式会社 碳化硅半导体装置
JP7048659B2 (ja) * 2020-04-07 2022-04-05 ローム株式会社 半導体装置
US12464791B2 (en) * 2022-03-07 2025-11-04 Denso Corporation Semiconductor device
US12051747B2 (en) * 2022-03-11 2024-07-30 Nuvoton Technology Corporation Japan Semiconductor device
WO2023188756A1 (ja) * 2022-03-28 2023-10-05 ローム株式会社 半導体装置
CN117242577A (zh) * 2022-04-14 2023-12-15 苏州龙驰半导体科技有限公司 晶体管器件和制造晶体管器件的方法
CN115394834B (zh) * 2022-07-29 2024-01-09 安世半导体科技(上海)有限公司 具有控制栅极及载流子存储层的igbt元胞结构及其制造方法
CN115513297B (zh) * 2022-11-09 2023-09-22 中芯越州集成电路制造(绍兴)有限公司 碳化硅平面mosfet器件及其制造方法
DE102023122081B3 (de) * 2023-08-17 2025-02-20 Infineon Technologies Ag Halbleitervorrichtung mit superjunction-struktur
JP2025063782A (ja) * 2023-10-04 2025-04-16 富士電機株式会社 炭化珪素半導体装置および炭化珪素半導体装置の製造方法
DE102023212057A1 (de) * 2023-12-01 2025-06-05 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung eines Halbleiterbauelements und Halbleiterbauelement
KR20250109914A (ko) * 2024-01-11 2025-07-18 삼성전자주식회사 전력 반도체 소자
DE102024204506B3 (de) * 2024-05-15 2025-08-14 Infineon Technologies Ag Halbleitervorrichtung mit Stromausbreitungsbereich und Verfahren zum Herstellen

Also Published As

Publication number Publication date
WO2023100500A1 (ja) 2023-06-08
US20250133805A1 (en) 2025-04-24

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Legal Events

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Effective date: 20240312