JPWO2023100500A1 - - Google Patents
Info
- Publication number
- JPWO2023100500A1 JPWO2023100500A1 JP2023564781A JP2023564781A JPWO2023100500A1 JP WO2023100500 A1 JPWO2023100500 A1 JP WO2023100500A1 JP 2023564781 A JP2023564781 A JP 2023564781A JP 2023564781 A JP2023564781 A JP 2023564781A JP WO2023100500 A1 JPWO2023100500 A1 JP WO2023100500A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
- H10D12/01—Manufacture or treatment
- H10D12/031—Manufacture or treatment of IGBTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/64—Double-diffused metal-oxide semiconductor [DMOS] FETs
- H10D30/66—Vertical DMOS [VDMOS] FETs
- H10D30/668—Vertical DMOS [VDMOS] FETs having trench gate electrodes, e.g. UMOS transistors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/124—Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions
- H10D62/126—Top-view geometrical layouts of the regions or the junctions
- H10D62/127—Top-view geometrical layouts of the regions or the junctions of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/17—Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
- H10D62/393—Body regions of DMOS transistors or IGBTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/40—Crystalline structures
- H10D62/405—Orientations of crystalline planes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/27—Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
- H10D64/311—Gate electrodes for field-effect devices
- H10D64/411—Gate electrodes for field-effect devices for FETs
- H10D64/511—Gate electrodes for field-effect devices for FETs for IGFETs
- H10D64/512—Disposition of the gate electrodes, e.g. buried gates
- H10D64/513—Disposition of the gate electrodes, e.g. buried gates within recesses in the substrate, e.g. trench gates, groove gates or buried gates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/27—Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
- H10D64/311—Gate electrodes for field-effect devices
- H10D64/411—Gate electrodes for field-effect devices for FETs
- H10D64/511—Gate electrodes for field-effect devices for FETs for IGFETs
- H10D64/517—Gate electrodes for field-effect devices for FETs for IGFETs characterised by the conducting layers
- H10D64/518—Gate electrodes for field-effect devices for FETs for IGFETs characterised by the conducting layers characterised by their lengths or sectional shapes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/83—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
- H10D62/832—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge being Group IV materials comprising two or more elements, e.g. SiGe
- H10D62/8325—Silicon carbide
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021193786 | 2021-11-30 | ||
| PCT/JP2022/038403 WO2023100500A1 (ja) | 2021-11-30 | 2022-10-14 | 炭化珪素半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023100500A1 true JPWO2023100500A1 (https=) | 2023-06-08 |
| JPWO2023100500A5 JPWO2023100500A5 (https=) | 2024-08-13 |
Family
ID=86611810
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023564781A Pending JPWO2023100500A1 (https=) | 2021-11-30 | 2022-10-14 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20250133805A1 (https=) |
| JP (1) | JPWO2023100500A1 (https=) |
| WO (1) | WO2023100500A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025187347A1 (ja) * | 2024-03-07 | 2025-09-12 | 住友電気工業株式会社 | 炭化珪素半導体装置 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5920010B2 (ja) * | 2012-05-18 | 2016-05-18 | 住友電気工業株式会社 | 半導体装置 |
| JP2015072944A (ja) * | 2013-10-01 | 2015-04-16 | 住友電気工業株式会社 | 炭化珪素半導体装置およびその製造方法 |
| WO2018088063A1 (ja) * | 2016-11-11 | 2018-05-17 | 住友電気工業株式会社 | 炭化珪素半導体装置 |
| WO2019155783A1 (ja) * | 2018-02-06 | 2019-08-15 | 住友電気工業株式会社 | 炭化珪素半導体装置 |
| JP7196463B2 (ja) * | 2018-08-23 | 2022-12-27 | 富士電機株式会社 | 炭化珪素半導体装置の製造方法および炭化珪素半導体装置 |
| CN114503283B (zh) * | 2019-12-20 | 2025-11-25 | 住友电气工业株式会社 | 碳化硅半导体装置 |
| JP7048659B2 (ja) * | 2020-04-07 | 2022-04-05 | ローム株式会社 | 半導体装置 |
| US12464791B2 (en) * | 2022-03-07 | 2025-11-04 | Denso Corporation | Semiconductor device |
| US12051747B2 (en) * | 2022-03-11 | 2024-07-30 | Nuvoton Technology Corporation Japan | Semiconductor device |
| WO2023188756A1 (ja) * | 2022-03-28 | 2023-10-05 | ローム株式会社 | 半導体装置 |
| CN117242577A (zh) * | 2022-04-14 | 2023-12-15 | 苏州龙驰半导体科技有限公司 | 晶体管器件和制造晶体管器件的方法 |
| CN115394834B (zh) * | 2022-07-29 | 2024-01-09 | 安世半导体科技(上海)有限公司 | 具有控制栅极及载流子存储层的igbt元胞结构及其制造方法 |
| CN115513297B (zh) * | 2022-11-09 | 2023-09-22 | 中芯越州集成电路制造(绍兴)有限公司 | 碳化硅平面mosfet器件及其制造方法 |
| DE102023122081B3 (de) * | 2023-08-17 | 2025-02-20 | Infineon Technologies Ag | Halbleitervorrichtung mit superjunction-struktur |
| JP2025063782A (ja) * | 2023-10-04 | 2025-04-16 | 富士電機株式会社 | 炭化珪素半導体装置および炭化珪素半導体装置の製造方法 |
| DE102023212057A1 (de) * | 2023-12-01 | 2025-06-05 | Robert Bosch Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung eines Halbleiterbauelements und Halbleiterbauelement |
| KR20250109914A (ko) * | 2024-01-11 | 2025-07-18 | 삼성전자주식회사 | 전력 반도체 소자 |
| DE102024204506B3 (de) * | 2024-05-15 | 2025-08-14 | Infineon Technologies Ag | Halbleitervorrichtung mit Stromausbreitungsbereich und Verfahren zum Herstellen |
-
2022
- 2022-10-14 JP JP2023564781A patent/JPWO2023100500A1/ja active Pending
- 2022-10-14 WO PCT/JP2022/038403 patent/WO2023100500A1/ja not_active Ceased
- 2022-10-14 US US18/690,444 patent/US20250133805A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023100500A1 (ja) | 2023-06-08 |
| US20250133805A1 (en) | 2025-04-24 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240312 |