JPWO2023048062A5 - - Google Patents
Download PDFInfo
- Publication number
- JPWO2023048062A5 JPWO2023048062A5 JP2022557106A JP2022557106A JPWO2023048062A5 JP WO2023048062 A5 JPWO2023048062 A5 JP WO2023048062A5 JP 2022557106 A JP2022557106 A JP 2022557106A JP 2022557106 A JP2022557106 A JP 2022557106A JP WO2023048062 A5 JPWO2023048062 A5 JP WO2023048062A5
- Authority
- JP
- Japan
- Prior art keywords
- cured film
- resin composition
- group
- acid
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 claims 11
- -1 polysiloxane Polymers 0.000 claims 9
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims 8
- 125000000962 organic group Chemical group 0.000 claims 8
- 150000003839 salts Chemical class 0.000 claims 7
- 125000004432 carbon atom Chemical group C* 0.000 claims 6
- 229920001296 polysiloxane Polymers 0.000 claims 6
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 claims 4
- OISVCGZHLKNMSJ-UHFFFAOYSA-N 2,6-dimethylpyridine Chemical compound CC1=CC=CC(C)=N1 OISVCGZHLKNMSJ-UHFFFAOYSA-N 0.000 claims 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims 3
- 150000001412 amines Chemical class 0.000 claims 3
- 125000003118 aryl group Chemical group 0.000 claims 3
- 150000007524 organic acids Chemical class 0.000 claims 3
- 239000000243 solution Substances 0.000 claims 3
- BWZVCCNYKMEVEX-UHFFFAOYSA-N 2,4,6-Trimethylpyridine Chemical compound CC1=CC(C)=NC(C)=C1 BWZVCCNYKMEVEX-UHFFFAOYSA-N 0.000 claims 2
- JYYNAJVZFGKDEQ-UHFFFAOYSA-N 2,4-Dimethylpyridine Chemical compound CC1=CC=NC(C)=C1 JYYNAJVZFGKDEQ-UHFFFAOYSA-N 0.000 claims 2
- HWWYDZCSSYKIAD-UHFFFAOYSA-N 3,5-dimethylpyridine Chemical compound CC1=CN=CC(C)=C1 HWWYDZCSSYKIAD-UHFFFAOYSA-N 0.000 claims 2
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 claims 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 claims 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 claims 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims 2
- DTQVDTLACAAQTR-UHFFFAOYSA-N Trifluoroacetic acid Chemical compound OC(=O)C(F)(F)F DTQVDTLACAAQTR-UHFFFAOYSA-N 0.000 claims 2
- 239000007864 aqueous solution Substances 0.000 claims 2
- 150000004982 aromatic amines Chemical class 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 claims 2
- JIRHAGAOHOYLNO-UHFFFAOYSA-N (3-cyclopentyloxy-4-methoxyphenyl)methanol Chemical compound COC1=CC=C(CO)C=C1OC1CCCC1 JIRHAGAOHOYLNO-UHFFFAOYSA-N 0.000 claims 1
- XGMDYIYCKWMWLY-UHFFFAOYSA-N 2,2,2-trifluoroethanesulfonic acid Chemical compound OS(=O)(=O)CC(F)(F)F XGMDYIYCKWMWLY-UHFFFAOYSA-N 0.000 claims 1
- XKPFLKWPESVZJF-UHFFFAOYSA-N 3,3,3-trifluoropropane-1-sulfonic acid Chemical compound OS(=O)(=O)CCC(F)(F)F XKPFLKWPESVZJF-UHFFFAOYSA-N 0.000 claims 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims 1
- 125000004450 alkenylene group Chemical group 0.000 claims 1
- 125000000217 alkyl group Chemical group 0.000 claims 1
- 125000002947 alkylene group Chemical group 0.000 claims 1
- 125000004429 atom Chemical group 0.000 claims 1
- SRSXLGNVWSONIS-UHFFFAOYSA-N benzenesulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC=C1 SRSXLGNVWSONIS-UHFFFAOYSA-N 0.000 claims 1
- 229940092714 benzenesulfonic acid Drugs 0.000 claims 1
- 239000003054 catalyst Substances 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 claims 1
- 230000005494 condensation Effects 0.000 claims 1
- 238000009833 condensation Methods 0.000 claims 1
- 125000006165 cyclic alkyl group Chemical group 0.000 claims 1
- CCIVGXIOQKPBKL-UHFFFAOYSA-M ethanesulfonate Chemical compound CCS([O-])(=O)=O CCIVGXIOQKPBKL-UHFFFAOYSA-M 0.000 claims 1
- 229910052739 hydrogen Inorganic materials 0.000 claims 1
- 239000001257 hydrogen Substances 0.000 claims 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims 1
- 230000007062 hydrolysis Effects 0.000 claims 1
- 238000006460 hydrolysis reaction Methods 0.000 claims 1
- 239000003999 initiator Substances 0.000 claims 1
- 229940098779 methanesulfonic acid Drugs 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 235000005985 organic acids Nutrition 0.000 claims 1
- 125000005010 perfluoroalkyl group Chemical group 0.000 claims 1
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 claims 1
- 239000003504 photosensitizing agent Substances 0.000 claims 1
- KCXFHTAICRTXLI-UHFFFAOYSA-N propane-1-sulfonic acid Chemical compound CCCS(O)(=O)=O KCXFHTAICRTXLI-UHFFFAOYSA-N 0.000 claims 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 claims 1
- 239000002994 raw material Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000000550 scanning electron microscopy energy dispersive X-ray spectroscopy Methods 0.000 claims 1
- 239000002904 solvent Substances 0.000 claims 1
- ITMCEJHCFYSIIV-UHFFFAOYSA-N triflic acid Chemical compound OS(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-N 0.000 claims 1
- 239000008096 xylene Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2024004281A JP2024027180A (ja) | 2021-09-24 | 2024-01-16 | 硬化膜形成用シロキサン樹脂組成物、硬化膜およびポリシロキサンの製造方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021155227 | 2021-09-24 | ||
| JP2021155227 | 2021-09-24 | ||
| PCT/JP2022/034553 WO2023048062A1 (ja) | 2021-09-24 | 2022-09-15 | 硬化膜形成用シロキサン樹脂組成物、硬化膜およびポリシロキサンの製造方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024004281A Division JP2024027180A (ja) | 2021-09-24 | 2024-01-16 | 硬化膜形成用シロキサン樹脂組成物、硬化膜およびポリシロキサンの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023048062A1 JPWO2023048062A1 (https=) | 2023-03-30 |
| JPWO2023048062A5 true JPWO2023048062A5 (https=) | 2023-09-20 |
| JP7428269B2 JP7428269B2 (ja) | 2024-02-06 |
Family
ID=85720689
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022557106A Active JP7428269B2 (ja) | 2021-09-24 | 2022-09-15 | 硬化膜形成用シロキサン樹脂組成物および硬化膜 |
| JP2024004281A Pending JP2024027180A (ja) | 2021-09-24 | 2024-01-16 | 硬化膜形成用シロキサン樹脂組成物、硬化膜およびポリシロキサンの製造方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024004281A Pending JP2024027180A (ja) | 2021-09-24 | 2024-01-16 | 硬化膜形成用シロキサン樹脂組成物、硬化膜およびポリシロキサンの製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20240384065A1 (https=) |
| JP (2) | JP7428269B2 (https=) |
| KR (1) | KR20240065082A (https=) |
| CN (1) | CN117858927A (https=) |
| TW (1) | TW202313789A (https=) |
| WO (1) | WO2023048062A1 (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20250159001A (ko) * | 2023-03-07 | 2025-11-07 | 도레이 카부시키가이샤 | 수지 조성물, 경화막, 경화막의 패턴 형성 기판의 제조 방법, 광학 소자, 및 폴리실록산의 제조 방법 |
| WO2025150226A1 (ja) * | 2024-01-10 | 2025-07-17 | 株式会社レゾナック | ハードコート材、ハードコート及び構造体 |
| WO2025150227A1 (ja) * | 2024-01-10 | 2025-07-17 | 株式会社レゾナック | ハードコート材、ハードコート及び構造体 |
| WO2025150225A1 (ja) * | 2024-01-10 | 2025-07-17 | 株式会社レゾナック | ハードコート材、ハードコート及び構造体 |
| WO2026018782A1 (ja) * | 2024-07-18 | 2026-01-22 | Jsr株式会社 | 保護膜形成用組成物及び半導体基板の製造方法 |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4508887A (en) * | 1983-08-01 | 1985-04-02 | Dow Corning Corporation | Method and novel catalyst compositions for preparing polyorganosiloxanes |
| JPH0645892A (ja) | 1992-08-24 | 1994-02-18 | Yamaha Corp | 信号遅延回路 |
| JP3474007B2 (ja) | 1993-11-05 | 2003-12-08 | 信越化学工業株式会社 | 有機官能基含有オルガノポリシロキサンの製造方法 |
| JP2000212376A (ja) | 1999-01-21 | 2000-08-02 | Nof Corp | 生体適合性重合体／シリカゲルハイブリッド体およびその製造方法 |
| JP3797468B2 (ja) | 2000-08-24 | 2006-07-19 | Ｂａｓｆコーティングスジャパン株式会社 | 耐汚染性塗料組成物、塗装仕上げ方法及び塗装物品 |
| JP2002069442A (ja) * | 2000-09-01 | 2002-03-08 | Showa Denko Kk | シリカ被膜発光体粒子 |
| JP2002129103A (ja) * | 2000-10-23 | 2002-05-09 | Jsr Corp | 膜形成用組成物および絶縁膜形成用材料 |
| US20050032357A1 (en) * | 2002-01-17 | 2005-02-10 | Rantala Juha T. | Dielectric materials and methods for integrated circuit applications |
| JP2004107562A (ja) | 2002-09-20 | 2004-04-08 | Jsr Corp | 液晶表示素子の層間絶縁膜を形成するための感放射線性組成物、それから形成された層間絶縁膜、および液晶表示素子 |
| JP2006106311A (ja) | 2004-10-05 | 2006-04-20 | Shin Etsu Chem Co Ltd | ケイ素含有レジスト組成物並びにこれを用いたパターン形成方法 |
| JP4556639B2 (ja) | 2004-11-26 | 2010-10-06 | 東レ株式会社 | ネガ型感光性樹脂組成物、それから形成された透明硬化膜、および硬化膜を有する素子 |
| KR100910542B1 (ko) | 2007-05-04 | 2009-08-05 | 제일모직주식회사 | 반도체 미세 갭 필용 화합물 및 이를 이용한 반도체 미세갭 필용 조성물 |
| KR100901759B1 (ko) | 2007-09-12 | 2009-06-11 | 제일모직주식회사 | 레지스트 하층막용 하드마스크 조성물， 이를 이용한반도체 집적회로 디바이스의 제조방법 및 반도체 집적회로디바이스 |
| KR100930672B1 (ko) * | 2008-01-11 | 2009-12-09 | 제일모직주식회사 | 실리콘계 하드마스크 조성물 및 이를 이용한 반도체집적회로 디바이스의 제조방법 |
| US8864894B2 (en) * | 2008-08-18 | 2014-10-21 | Nissan Chemical Industries, Ltd. | Resist underlayer film forming composition containing silicone having onium group |
| KR101288572B1 (ko) * | 2008-12-17 | 2013-07-22 | 제일모직주식회사 | 보관안정성이 우수한 레지스트 하층막용 하드마스크 조성물 |
| KR101344795B1 (ko) * | 2009-12-31 | 2013-12-26 | 제일모직주식회사 | 레지스트 하층막용 조성물 및 이를 이용한 반도체 집적회로 디바이스의 제조방법 |
| JP5704076B2 (ja) | 2010-01-26 | 2015-04-22 | 日立化成株式会社 | （メタ）アクリロイル基含有ポリシロキサン樹脂の製造方法及び該方法により得られた（メタ）アクリロイル基含有ポリシロキサン樹脂を用いた調光フィルム |
| JP5255612B2 (ja) | 2010-09-24 | 2013-08-07 | 株式会社神戸製鋼所 | プレコートアルミニウム板およびその製造方法 |
| JP6853668B2 (ja) | 2014-12-16 | 2021-03-31 | 株式会社カネカ | 光及び熱硬化性樹脂組成物、硬化物、並びに積層体 |
| FI126130B (en) | 2015-03-20 | 2016-07-15 | Inkron Oy | Siloxane monomers with high refractive index, polymerization thereof and their use |
| TWI801473B (zh) | 2017-12-20 | 2023-05-11 | 日商日產化學股份有限公司 | 光硬化性含矽被覆膜形成組成物 |
| JP7080732B2 (ja) * | 2018-06-01 | 2022-06-06 | 三菱マテリアル電子化成株式会社 | 含フッ素スルホニルイミド塩基含有シリコーン化合物とそれを含有する導電性シリコーン組成物 |
| JPWO2021166701A1 (https=) * | 2020-02-17 | 2021-08-26 | ||
| CN112375087A (zh) * | 2020-11-27 | 2021-02-19 | 浙江天宇药业股份有限公司 | 一种脯氨酸恒格列净的合成方法 |
-
2022
- 2022-09-15 CN CN202280057280.2A patent/CN117858927A/zh active Pending
- 2022-09-15 JP JP2022557106A patent/JP7428269B2/ja active Active
- 2022-09-15 US US18/691,307 patent/US20240384065A1/en active Pending
- 2022-09-15 WO PCT/JP2022/034553 patent/WO2023048062A1/ja not_active Ceased
- 2022-09-15 KR KR1020247008751A patent/KR20240065082A/ko active Pending
- 2022-09-20 TW TW111135537A patent/TW202313789A/zh unknown
-
2024
- 2024-01-16 JP JP2024004281A patent/JP2024027180A/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPWO2023048062A5 (https=) | ||
| JP5206977B2 (ja) | 新規ポリイミドシリコーン及びこれを含有する感光性樹脂組成物並びにパターン形成方法 | |
| AU2016232011B2 (en) | Novel siloxane polymer compositions and their use | |
| CN106554483B (zh) | 一种磷杂菲结构反应型阻燃剂及其应用 | |
| CN102134254B (zh) | 含硅苯并噁嗪树脂及其制备方法与应用 | |
| TWI485186B (zh) | Novel Silicone Oxygen Macromolecular Compound Containing Silicone Bentonite and Its Manufacturing Method | |
| KR910007008B1 (ko) | 액체 오가노실록산 수지조성물 | |
| TWI229091B (en) | Organosiloxane polymer, photo-curable resin composition, patterning process, and substrate-protecting coat | |
| KR102605591B1 (ko) | 실리콘 골격 함유 고분자 화합물, 감광성 수지 조성물, 감광성 수지 피막, 감광성 드라이 필름, 적층체, 및 패턴 형성 방법 | |
| JPWO2020031958A5 (https=) | ||
| JP2017500420A (ja) | シリケート樹脂及びその製造方法 | |
| TWI570186B (zh) | A composition for an organic semiconductor insulating film, and an organic semiconductor insulating film | |
| JP2008107529A5 (https=) | ||
| JP2019168680A (ja) | 感光性樹脂組成物、感光性樹脂積層体、及びパターン形成方法 | |
| TWI786245B (zh) | 感光性樹脂組成物、圖型形成方法及光半導體元件之製造方法 | |
| DE60213521T2 (de) | Bei Raumtemperatur vernetzbare Organopolysiloxan-Zusammensetzungen | |
| CN112795015A (zh) | 一种四官能度丁香酚环氧功能化的笼型倍半硅氧烷及其制备方法和应用 | |
| KR100839553B1 (ko) | 고점성 오가노폴리실록산 유제의 제조 방법 | |
| JPS5869229A (ja) | 光架橋性ポリシロキサン | |
| JP6882368B2 (ja) | アルコキシシリル基を有するエポキシ化合物の製造方法 | |
| JP2005146176A5 (https=) | ||
| CN113166424A (zh) | 非晶硅牺牲膜的制备方法和用于形成非晶硅的组合物 | |
| JP2009517360A (ja) | β−ケトカルボニル官能性有機ケイ素化合物の製造方法 | |
| WO2018199247A1 (ja) | 感光性樹脂組成物及びレジストパターンの形成方法 | |
| JP3369344B2 (ja) | 感光性樹脂組成物 |