CN117858927A - 固化膜形成用硅氧烷树脂组合物、固化膜和聚硅氧烷的制造方法 - Google Patents

固化膜形成用硅氧烷树脂组合物、固化膜和聚硅氧烷的制造方法 Download PDF

Info

Publication number
CN117858927A
CN117858927A CN202280057280.2A CN202280057280A CN117858927A CN 117858927 A CN117858927 A CN 117858927A CN 202280057280 A CN202280057280 A CN 202280057280A CN 117858927 A CN117858927 A CN 117858927A
Authority
CN
China
Prior art keywords
cured film
polysiloxane
acid
resin composition
silicone resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280057280.2A
Other languages
English (en)
Chinese (zh)
Inventor
饭冢英祐
诹访充史
藤井真实
鸭川政雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Publication of CN117858927A publication Critical patent/CN117858927A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/41—Compounds containing sulfur bound to oxygen
    • C08K5/42—Sulfonic acids; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/06—Preparatory processes
    • C08G77/08—Preparatory processes characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/07—Aldehydes; Ketones
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C08K5/19—Quaternary ammonium compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3432—Six-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/52—Phosphorus bound to oxygen only
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C09D183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/20—Diluents or solvents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/63—Additives non-macromolecular organic
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Silicon Polymers (AREA)
  • Epoxy Resins (AREA)
CN202280057280.2A 2021-09-24 2022-09-15 固化膜形成用硅氧烷树脂组合物、固化膜和聚硅氧烷的制造方法 Pending CN117858927A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021155227 2021-09-24
JP2021-155227 2021-09-24
PCT/JP2022/034553 WO2023048062A1 (ja) 2021-09-24 2022-09-15 硬化膜形成用シロキサン樹脂組成物、硬化膜およびポリシロキサンの製造方法

Publications (1)

Publication Number Publication Date
CN117858927A true CN117858927A (zh) 2024-04-09

Family

ID=85720689

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280057280.2A Pending CN117858927A (zh) 2021-09-24 2022-09-15 固化膜形成用硅氧烷树脂组合物、固化膜和聚硅氧烷的制造方法

Country Status (6)

Country Link
US (1) US20240384065A1 (https=)
JP (2) JP7428269B2 (https=)
KR (1) KR20240065082A (https=)
CN (1) CN117858927A (https=)
TW (1) TW202313789A (https=)
WO (1) WO2023048062A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20250159001A (ko) * 2023-03-07 2025-11-07 도레이 카부시키가이샤 수지 조성물, 경화막, 경화막의 패턴 형성 기판의 제조 방법, 광학 소자, 및 폴리실록산의 제조 방법
WO2025150226A1 (ja) * 2024-01-10 2025-07-17 株式会社レゾナック ハードコート材、ハードコート及び構造体
WO2025150227A1 (ja) * 2024-01-10 2025-07-17 株式会社レゾナック ハードコート材、ハードコート及び構造体
WO2025150225A1 (ja) * 2024-01-10 2025-07-17 株式会社レゾナック ハードコート材、ハードコート及び構造体
WO2026018782A1 (ja) * 2024-07-18 2026-01-22 Jsr株式会社 保護膜形成用組成物及び半導体基板の製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102246096A (zh) * 2008-12-17 2011-11-16 第一毛织株式会社 用于形成蚀刻剂下层膜且具有改善的储存稳定性的硬掩模组合物

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4508887A (en) * 1983-08-01 1985-04-02 Dow Corning Corporation Method and novel catalyst compositions for preparing polyorganosiloxanes
JPH0645892A (ja) 1992-08-24 1994-02-18 Yamaha Corp 信号遅延回路
JP3474007B2 (ja) 1993-11-05 2003-12-08 信越化学工業株式会社 有機官能基含有オルガノポリシロキサンの製造方法
JP2000212376A (ja) 1999-01-21 2000-08-02 Nof Corp 生体適合性重合体／シリカゲルハイブリッド体およびその製造方法
JP3797468B2 (ja) 2000-08-24 2006-07-19 Ｂａｓｆコーティングスジャパン株式会社 耐汚染性塗料組成物、塗装仕上げ方法及び塗装物品
JP2002069442A (ja) * 2000-09-01 2002-03-08 Showa Denko Kk シリカ被膜発光体粒子
JP2002129103A (ja) * 2000-10-23 2002-05-09 Jsr Corp 膜形成用組成物および絶縁膜形成用材料
US20050032357A1 (en) * 2002-01-17 2005-02-10 Rantala Juha T. Dielectric materials and methods for integrated circuit applications
JP2004107562A (ja) 2002-09-20 2004-04-08 Jsr Corp 液晶表示素子の層間絶縁膜を形成するための感放射線性組成物、それから形成された層間絶縁膜、および液晶表示素子
JP2006106311A (ja) 2004-10-05 2006-04-20 Shin Etsu Chem Co Ltd ケイ素含有レジスト組成物並びにこれを用いたパターン形成方法
JP4556639B2 (ja) 2004-11-26 2010-10-06 東レ株式会社 ネガ型感光性樹脂組成物、それから形成された透明硬化膜、および硬化膜を有する素子
KR100910542B1 (ko) 2007-05-04 2009-08-05 제일모직주식회사 반도체 미세 갭 필용 화합물 및 이를 이용한 반도체 미세갭 필용 조성물
KR100901759B1 (ko) 2007-09-12 2009-06-11 제일모직주식회사 레지스트 하층막용 하드마스크 조성물， 이를 이용한반도체 집적회로 디바이스의 제조방법 및 반도체 집적회로디바이스
KR100930672B1 (ko) * 2008-01-11 2009-12-09 제일모직주식회사 실리콘계 하드마스크 조성물 및 이를 이용한 반도체집적회로 디바이스의 제조방법
US8864894B2 (en) * 2008-08-18 2014-10-21 Nissan Chemical Industries, Ltd. Resist underlayer film forming composition containing silicone having onium group
KR101344795B1 (ko) * 2009-12-31 2013-12-26 제일모직주식회사 레지스트 하층막용 조성물 및 이를 이용한 반도체 집적회로 디바이스의 제조방법
JP5704076B2 (ja) 2010-01-26 2015-04-22 日立化成株式会社 （メタ）アクリロイル基含有ポリシロキサン樹脂の製造方法及び該方法により得られた（メタ）アクリロイル基含有ポリシロキサン樹脂を用いた調光フィルム
JP5255612B2 (ja) 2010-09-24 2013-08-07 株式会社神戸製鋼所 プレコートアルミニウム板およびその製造方法
JP6853668B2 (ja) 2014-12-16 2021-03-31 株式会社カネカ 光及び熱硬化性樹脂組成物、硬化物、並びに積層体
FI126130B (en) 2015-03-20 2016-07-15 Inkron Oy Siloxane monomers with high refractive index, polymerization thereof and their use
TWI801473B (zh) 2017-12-20 2023-05-11 日商日產化學股份有限公司 光硬化性含矽被覆膜形成組成物
JP7080732B2 (ja) * 2018-06-01 2022-06-06 三菱マテリアル電子化成株式会社 含フッ素スルホニルイミド塩基含有シリコーン化合物とそれを含有する導電性シリコーン組成物
JPWO2021166701A1 (https=) * 2020-02-17 2021-08-26
CN112375087A (zh) * 2020-11-27 2021-02-19 浙江天宇药业股份有限公司 一种脯氨酸恒格列净的合成方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102246096A (zh) * 2008-12-17 2011-11-16 第一毛织株式会社 用于形成蚀刻剂下层膜且具有改善的储存稳定性的硬掩模组合物

Also Published As

Publication number Publication date
JP2024027180A (ja) 2024-02-29
KR20240065082A (ko) 2024-05-14
TW202313789A (zh) 2023-04-01
JPWO2023048062A1 (https=) 2023-03-30
WO2023048062A1 (ja) 2023-03-30
US20240384065A1 (en) 2024-11-21
JP7428269B2 (ja) 2024-02-06

Similar Documents

Publication Publication Date Title
KR101643262B1 (ko) 실록산 수지 조성물 및 그것을 사용한 터치 패널용 보호막
JP6417669B2 (ja) 感光性樹脂組成物、保護膜及び絶縁膜並びにタッチパネルの製造方法
JP7428269B2 (ja) 硬化膜形成用シロキサン樹脂組成物および硬化膜
JP5212571B2 (ja) タッチパネル部材
KR102266587B1 (ko) 수지 조성물, 그 경화막과 그 제조방법, 및 고체촬상소자
JPWO2014156520A1 (ja) 感光性樹脂組成物、保護膜又は絶縁膜、タッチパネル及びその製造方法
JP5886420B2 (ja) ラジカル架橋性基を有するポリシロキサン組成物
JP2008208342A (ja) 樹脂組成物、硬化膜、および硬化膜を有するカラーフィルタ
KR102002761B1 (ko) 네거티브형 감광성 실록산 조성물
KR20140144274A (ko) 네거티브형 감광성 실록산 조성물
KR101992594B1 (ko) 네거티브형 감광성 실록산 조성물
JP2008020898A (ja) 感光性シロキサン組成物、それから形成された硬化膜、および硬化膜を有する素子
CN110719942A (zh) 感光性硅氧烷组合物以及使用其而形成的固化膜
WO2019102655A1 (ja) シロキサン樹脂組成物、硬化膜および表示装置
CN105359037B (zh) 正型感光性树脂组合物、使其固化而成的固化膜及具有其的光学设备
KR102490287B1 (ko) 감광성 실록산 수지 조성물, 경화막 및 터치패널용 부재
JP2020100819A (ja) 樹脂組成物、硬化膜およびその製造方法
JP7484710B2 (ja) ポジ型感光性樹脂組成物、その硬化膜およびそれを具備する光学デバイス
JP6022870B2 (ja) 感光性樹脂組成物
WO2024185458A1 (ja) 樹脂組成物、硬化膜、硬化膜のパターン付き基板の製造方法、光学素子、およびポリシロキサンの製造方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination