JP7428269B2 - 硬化膜形成用シロキサン樹脂組成物および硬化膜 - Google Patents

硬化膜形成用シロキサン樹脂組成物および硬化膜 Download PDF

Info

Publication number
JP7428269B2
JP7428269B2 JP2022557106A JP2022557106A JP7428269B2 JP 7428269 B2 JP7428269 B2 JP 7428269B2 JP 2022557106 A JP2022557106 A JP 2022557106A JP 2022557106 A JP2022557106 A JP 2022557106A JP 7428269 B2 JP7428269 B2 JP 7428269B2
Authority
JP
Japan
Prior art keywords
acid
polysiloxane
cured film
mol
resin composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022557106A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023048062A1 (https=
JPWO2023048062A5 (https=
Inventor
英祐 飯塚
充史 諏訪
真実 藤井
政雄 鴨川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Publication of JPWO2023048062A1 publication Critical patent/JPWO2023048062A1/ja
Publication of JPWO2023048062A5 publication Critical patent/JPWO2023048062A5/ja
Priority to JP2024004281A priority Critical patent/JP2024027180A/ja
Application granted granted Critical
Publication of JP7428269B2 publication Critical patent/JP7428269B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/41—Compounds containing sulfur bound to oxygen
    • C08K5/42—Sulfonic acids; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/06—Preparatory processes
    • C08G77/08—Preparatory processes characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/07—Aldehydes; Ketones
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C08K5/19—Quaternary ammonium compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3432—Six-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/52—Phosphorus bound to oxygen only
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C09D183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/20—Diluents or solvents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/63—Additives non-macromolecular organic
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Silicon Polymers (AREA)
  • Epoxy Resins (AREA)
JP2022557106A 2021-09-24 2022-09-15 硬化膜形成用シロキサン樹脂組成物および硬化膜 Active JP7428269B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024004281A JP2024027180A (ja) 2021-09-24 2024-01-16 硬化膜形成用シロキサン樹脂組成物、硬化膜およびポリシロキサンの製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021155227 2021-09-24
JP2021155227 2021-09-24
PCT/JP2022/034553 WO2023048062A1 (ja) 2021-09-24 2022-09-15 硬化膜形成用シロキサン樹脂組成物、硬化膜およびポリシロキサンの製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024004281A Division JP2024027180A (ja) 2021-09-24 2024-01-16 硬化膜形成用シロキサン樹脂組成物、硬化膜およびポリシロキサンの製造方法

Publications (3)

Publication Number Publication Date
JPWO2023048062A1 JPWO2023048062A1 (https=) 2023-03-30
JPWO2023048062A5 JPWO2023048062A5 (https=) 2023-09-20
JP7428269B2 true JP7428269B2 (ja) 2024-02-06

Family

ID=85720689

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2022557106A Active JP7428269B2 (ja) 2021-09-24 2022-09-15 硬化膜形成用シロキサン樹脂組成物および硬化膜
JP2024004281A Pending JP2024027180A (ja) 2021-09-24 2024-01-16 硬化膜形成用シロキサン樹脂組成物、硬化膜およびポリシロキサンの製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2024004281A Pending JP2024027180A (ja) 2021-09-24 2024-01-16 硬化膜形成用シロキサン樹脂組成物、硬化膜およびポリシロキサンの製造方法

Country Status (6)

Country Link
US (1) US20240384065A1 (https=)
JP (2) JP7428269B2 (https=)
KR (1) KR20240065082A (https=)
CN (1) CN117858927A (https=)
TW (1) TW202313789A (https=)
WO (1) WO2023048062A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026018782A1 (ja) * 2024-07-18 2026-01-22 Jsr株式会社 保護膜形成用組成物及び半導体基板の製造方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20250159001A (ko) * 2023-03-07 2025-11-07 도레이 카부시키가이샤 수지 조성물, 경화막, 경화막의 패턴 형성 기판의 제조 방법, 광학 소자, 및 폴리실록산의 제조 방법
WO2025150226A1 (ja) * 2024-01-10 2025-07-17 株式会社レゾナック ハードコート材、ハードコート及び構造体
WO2025150227A1 (ja) * 2024-01-10 2025-07-17 株式会社レゾナック ハードコート材、ハードコート及び構造体
WO2025150225A1 (ja) * 2024-01-10 2025-07-17 株式会社レゾナック ハードコート材、ハードコート及び構造体

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000212376A (ja) 1999-01-21 2000-08-02 Nof Corp 生体適合性重合体／シリカゲルハイブリッド体およびその製造方法
JP2002069374A (ja) 2000-08-24 2002-03-08 Nippon Yushi Basf Coatings Kk 耐汚染性塗料組成物、塗装仕上げ方法及び塗装物品
JP2002069442A (ja) 2000-09-01 2002-03-08 Showa Denko Kk シリカ被膜発光体粒子
JP2002129103A (ja) 2000-10-23 2002-05-09 Jsr Corp 膜形成用組成物および絶縁膜形成用材料
KR100901759B1 (ko) 2007-09-12 2009-06-11 제일모직주식회사 레지스트 하층막용 하드마스크 조성물， 이를 이용한반도체 집적회로 디바이스의 제조방법 및 반도체 집적회로디바이스
JP2010528453A (ja) 2007-05-04 2010-08-19 チェイル インダストリーズ インコーポレイテッド 半導体素子のギャップ充填用化合物及び前記化合物を用いたコーティング組成物
WO2011093323A1 (ja) 2010-01-26 2011-08-04 日立化成工業株式会社 調光材料用（メタ）アクロイル基含有ポリシロキサン樹脂の製造方法、それにより得られる調光材料用（メタ）アクロイル基含有ポリシロキサン樹脂、それを用いた調光材料並びに調光フィルム
JP2012066478A (ja) 2010-09-24 2012-04-05 Kobe Steel Ltd プレコートアルミニウム板およびその製造方法
JP2018512487A (ja) 2015-03-20 2018-05-17 インクロン オサケユキチュアＩｎｋｒｏｎ Ｏｙ 高屈折率シロキサンモノマー、それらの重合及び用途
WO2019124514A1 (ja) 2017-12-20 2019-06-27 日産化学株式会社 光硬化性シリコン含有被覆膜形成組成物

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4508887A (en) * 1983-08-01 1985-04-02 Dow Corning Corporation Method and novel catalyst compositions for preparing polyorganosiloxanes
JPH0645892A (ja) 1992-08-24 1994-02-18 Yamaha Corp 信号遅延回路
JP3474007B2 (ja) 1993-11-05 2003-12-08 信越化学工業株式会社 有機官能基含有オルガノポリシロキサンの製造方法
US20050032357A1 (en) * 2002-01-17 2005-02-10 Rantala Juha T. Dielectric materials and methods for integrated circuit applications
JP2004107562A (ja) 2002-09-20 2004-04-08 Jsr Corp 液晶表示素子の層間絶縁膜を形成するための感放射線性組成物、それから形成された層間絶縁膜、および液晶表示素子
JP2006106311A (ja) 2004-10-05 2006-04-20 Shin Etsu Chem Co Ltd ケイ素含有レジスト組成物並びにこれを用いたパターン形成方法
JP4556639B2 (ja) 2004-11-26 2010-10-06 東レ株式会社 ネガ型感光性樹脂組成物、それから形成された透明硬化膜、および硬化膜を有する素子
KR100930672B1 (ko) * 2008-01-11 2009-12-09 제일모직주식회사 실리콘계 하드마스크 조성물 및 이를 이용한 반도체집적회로 디바이스의 제조방법
US8864894B2 (en) * 2008-08-18 2014-10-21 Nissan Chemical Industries, Ltd. Resist underlayer film forming composition containing silicone having onium group
KR101288572B1 (ko) * 2008-12-17 2013-07-22 제일모직주식회사 보관안정성이 우수한 레지스트 하층막용 하드마스크 조성물
KR101344795B1 (ko) * 2009-12-31 2013-12-26 제일모직주식회사 레지스트 하층막용 조성물 및 이를 이용한 반도체 집적회로 디바이스의 제조방법
JP6853668B2 (ja) 2014-12-16 2021-03-31 株式会社カネカ 光及び熱硬化性樹脂組成物、硬化物、並びに積層体
JP7080732B2 (ja) * 2018-06-01 2022-06-06 三菱マテリアル電子化成株式会社 含フッ素スルホニルイミド塩基含有シリコーン化合物とそれを含有する導電性シリコーン組成物
JPWO2021166701A1 (https=) * 2020-02-17 2021-08-26
CN112375087A (zh) * 2020-11-27 2021-02-19 浙江天宇药业股份有限公司 一种脯氨酸恒格列净的合成方法

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000212376A (ja) 1999-01-21 2000-08-02 Nof Corp 生体適合性重合体／シリカゲルハイブリッド体およびその製造方法
JP2002069374A (ja) 2000-08-24 2002-03-08 Nippon Yushi Basf Coatings Kk 耐汚染性塗料組成物、塗装仕上げ方法及び塗装物品
JP2002069442A (ja) 2000-09-01 2002-03-08 Showa Denko Kk シリカ被膜発光体粒子
JP2002129103A (ja) 2000-10-23 2002-05-09 Jsr Corp 膜形成用組成物および絶縁膜形成用材料
JP2010528453A (ja) 2007-05-04 2010-08-19 チェイル インダストリーズ インコーポレイテッド 半導体素子のギャップ充填用化合物及び前記化合物を用いたコーティング組成物
KR100901759B1 (ko) 2007-09-12 2009-06-11 제일모직주식회사 레지스트 하층막용 하드마스크 조성물， 이를 이용한반도체 집적회로 디바이스의 제조방법 및 반도체 집적회로디바이스
WO2011093323A1 (ja) 2010-01-26 2011-08-04 日立化成工業株式会社 調光材料用（メタ）アクロイル基含有ポリシロキサン樹脂の製造方法、それにより得られる調光材料用（メタ）アクロイル基含有ポリシロキサン樹脂、それを用いた調光材料並びに調光フィルム
JP2012066478A (ja) 2010-09-24 2012-04-05 Kobe Steel Ltd プレコートアルミニウム板およびその製造方法
JP2018512487A (ja) 2015-03-20 2018-05-17 インクロン オサケユキチュアＩｎｋｒｏｎ Ｏｙ 高屈折率シロキサンモノマー、それらの重合及び用途
WO2019124514A1 (ja) 2017-12-20 2019-06-27 日産化学株式会社 光硬化性シリコン含有被覆膜形成組成物

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026018782A1 (ja) * 2024-07-18 2026-01-22 Jsr株式会社 保護膜形成用組成物及び半導体基板の製造方法

Also Published As

Publication number Publication date
JP2024027180A (ja) 2024-02-29
KR20240065082A (ko) 2024-05-14
CN117858927A (zh) 2024-04-09
TW202313789A (zh) 2023-04-01
JPWO2023048062A1 (https=) 2023-03-30
WO2023048062A1 (ja) 2023-03-30
US20240384065A1 (en) 2024-11-21

Similar Documents

Publication Publication Date Title
JP7428269B2 (ja) 硬化膜形成用シロキサン樹脂組成物および硬化膜
JP5212571B2 (ja) タッチパネル部材
TWI597265B (zh) A photosensitive resin composition, a protective film or an insulating film, a touch panel, and a method of manufacturing the same
JP7027886B2 (ja) 樹脂組成物、その硬化膜およびその製造方法ならびに固体撮像素子
JP5886420B2 (ja) ラジカル架橋性基を有するポリシロキサン組成物
CN102472964A (zh) 正型感光性树脂组合物、使用其的固化膜及光学设备
TWI769334B (zh) 矽氧烷樹脂組成物、硬化膜及顯示裝置
KR102002761B1 (ko) 네거티브형 감광성 실록산 조성물
KR20140144274A (ko) 네거티브형 감광성 실록산 조성물
KR101992594B1 (ko) 네거티브형 감광성 실록산 조성물
CN105359037B (zh) 正型感光性树脂组合物、使其固化而成的固化膜及具有其的光学设备
CN110419000B (zh) 感光性硅氧烷树脂组合物、固化膜及触摸面板用构件
JP2020100819A (ja) 樹脂組成物、硬化膜およびその製造方法
JP7484710B2 (ja) ポジ型感光性樹脂組成物、その硬化膜およびそれを具備する光学デバイス
JP2009263507A (ja) シロキサン系樹脂組成物およびその製造方法
JP2025141005A (ja) シロキサン樹脂組成物、硬化膜および硬化膜基材
WO2024185458A1 (ja) 樹脂組成物、硬化膜、硬化膜のパターン付き基板の製造方法、光学素子、およびポリシロキサンの製造方法
CN118679429A (zh) 正型感光性树脂组合物、其硬化物及包括其的显示装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230901

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230901

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20230901

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20231121

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20231205

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20231226

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20240108

R151 Written notification of patent or utility model registration

Ref document number: 7428269

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151