JPWO2020031958A5 - - Google Patents
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- Publication number
- JPWO2020031958A5 JPWO2020031958A5 JP2019543402A JP2019543402A JPWO2020031958A5 JP WO2020031958 A5 JPWO2020031958 A5 JP WO2020031958A5 JP 2019543402 A JP2019543402 A JP 2019543402A JP 2019543402 A JP2019543402 A JP 2019543402A JP WO2020031958 A5 JPWO2020031958 A5 JP WO2020031958A5
- Authority
- JP
- Japan
- Prior art keywords
- group
- carbon atoms
- photosensitive resin
- resin composition
- composition according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 125000004432 carbon atom Chemical group C* 0.000 claims 25
- 239000011342 resin composition Substances 0.000 claims 16
- 229920005989 resin Polymers 0.000 claims 14
- 239000011347 resin Substances 0.000 claims 14
- -1 polysiloxane Polymers 0.000 claims 9
- 239000004642 Polyimide Substances 0.000 claims 7
- 229920001721 polyimide Polymers 0.000 claims 7
- 239000002243 precursor Substances 0.000 claims 7
- 125000000217 alkyl group Chemical group 0.000 claims 5
- 125000003710 aryl alkyl group Chemical group 0.000 claims 5
- 125000003118 aryl group Chemical group 0.000 claims 5
- 239000003795 chemical substances by application Substances 0.000 claims 5
- 125000003545 alkoxy group Chemical group 0.000 claims 4
- 150000004283 biguanides Chemical class 0.000 claims 4
- 150000001875 compounds Chemical class 0.000 claims 4
- 150000002357 guanidines Chemical class 0.000 claims 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 4
- 229920002577 polybenzoxazole Polymers 0.000 claims 4
- 229920001296 polysiloxane Polymers 0.000 claims 4
- 125000003342 alkenyl group Chemical group 0.000 claims 3
- 125000005843 halogen group Chemical group 0.000 claims 3
- 125000000304 alkynyl group Chemical group 0.000 claims 2
- 125000005015 aryl alkynyl group Chemical group 0.000 claims 2
- DBDNZCBRIPTLJF-UHFFFAOYSA-N boron(1-) monohydride Chemical group [BH-] DBDNZCBRIPTLJF-UHFFFAOYSA-N 0.000 claims 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical group C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims 2
- 125000002541 furyl group Chemical group 0.000 claims 2
- 239000003999 initiator Substances 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 claims 2
- 239000003505 polymerization initiator Substances 0.000 claims 2
- 125000000168 pyrrolyl group Chemical group 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 125000001544 thienyl group Chemical group 0.000 claims 2
- 239000005711 Benzoic acid Substances 0.000 claims 1
- WPYMKLBDIGXBTP-UHFFFAOYSA-N Benzoic acid Natural products OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 claims 1
- 235000010233 benzoic acid Nutrition 0.000 claims 1
- 235000010290 biphenyl Nutrition 0.000 claims 1
- 239000004305 biphenyl Substances 0.000 claims 1
- 150000007942 carboxylates Chemical class 0.000 claims 1
- URSLCTBXQMKCFE-UHFFFAOYSA-N dihydrogenborate Chemical compound OB(O)[O-] URSLCTBXQMKCFE-UHFFFAOYSA-N 0.000 claims 1
- 238000001035 drying Methods 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 claims 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- AUONHKJOIZSQGR-UHFFFAOYSA-N oxophosphane Chemical compound P=O AUONHKJOIZSQGR-UHFFFAOYSA-N 0.000 claims 1
- 125000004430 oxygen atom Chemical group O* 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- 229910052717 sulfur Inorganic materials 0.000 claims 1
- 125000004434 sulfur atom Chemical group 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018150108 | 2018-08-09 | ||
| JP2018150108 | 2018-08-09 | ||
| PCT/JP2019/030727 WO2020031958A1 (ja) | 2018-08-09 | 2019-08-05 | 感光性樹脂組成物、感光性シート、ならびにそれらの硬化膜およびその製造方法、電子部品 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2020031958A1 JPWO2020031958A1 (ja) | 2021-08-10 |
| JPWO2020031958A5 true JPWO2020031958A5 (https=) | 2022-08-01 |
| JP7409087B2 JP7409087B2 (ja) | 2024-01-09 |
Family
ID=69414677
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019543402A Active JP7409087B2 (ja) | 2018-08-09 | 2019-08-05 | 感光性樹脂組成物、感光性シート、ならびにそれらの硬化膜およびその製造方法、電子部品 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7409087B2 (https=) |
| KR (1) | KR102683127B1 (https=) |
| CN (1) | CN112368641B (https=) |
| TW (1) | TWI820180B (https=) |
| WO (1) | WO2020031958A1 (https=) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115335771B (zh) * | 2020-03-30 | 2025-03-25 | 富士胶片株式会社 | 感光性转印材料、树脂图案的制造方法及电路配线的制造方法 |
| KR102848086B1 (ko) * | 2020-09-29 | 2025-08-22 | 후지필름 가부시키가이샤 | 경화물의 제조 방법, 적층체의 제조 방법, 및, 반도체 디바이스의 제조 방법 |
| JP7787641B2 (ja) * | 2020-12-09 | 2025-12-17 | 旭化成株式会社 | ネガ型感光性樹脂組成物及びこれを用いた硬化レリーフパターンの製造方法 |
| JP7639354B2 (ja) * | 2021-01-19 | 2025-03-05 | Ｈｄマイクロシステムズ株式会社 | 感光性樹脂組成物、パターン硬化物の製造方法、硬化物、層間絶縁膜、カバーコート層、表面保護膜及び電子部品 |
| CN115678005B (zh) * | 2021-07-13 | 2024-10-01 | 上海邃铸科技有限公司 | 聚合物、树脂组合物、树脂膜以及半导体器件和发光器件 |
| KR20240058111A (ko) * | 2021-09-24 | 2024-05-03 | 도레이 카부시키가이샤 | 수지 조성물, 차광막 및 격벽 구비 기판 |
| WO2023163209A1 (ja) * | 2022-02-28 | 2023-08-31 | 太陽インキ製造株式会社 | 硬化性樹脂組成物、ドライフィルム、硬化物、および、プリント配線板 |
| US20250199401A1 (en) * | 2022-03-23 | 2025-06-19 | Toray Industries, Inc. | Resin composition, cured product, electronic component, and display device |
| CN116731063A (zh) * | 2022-06-14 | 2023-09-12 | 北京鼎材科技有限公司 | 一种硅烷偶联剂及其应用、包含其的光敏树脂组合物 |
| JPWO2024162116A1 (https=) * | 2023-02-01 | 2024-08-08 | ||
| CN116552074B (zh) * | 2023-05-05 | 2023-12-19 | 江门建滔电子发展有限公司 | 一种高散热低介电覆铜板及其制备方法 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07134414A (ja) * | 1993-05-07 | 1995-05-23 | Nitto Denko Corp | 耐熱性ポジ型フォトレジスト組成物 |
| CN100555078C (zh) | 2003-06-02 | 2009-10-28 | 东丽株式会社 | 感光树脂组合物及用其制备的电子元件和显示装置 |
| JP5223633B2 (ja) | 2008-12-02 | 2013-06-26 | 大日本印刷株式会社 | 感光性樹脂組成物、およびこれを用いた物品、及びネガ型パターン形成方法 |
| TWI430024B (zh) * | 2010-08-05 | 2014-03-11 | 旭化成電子材料股份有限公司 | A photosensitive resin composition, a method for manufacturing a hardened bump pattern, and a semiconductor device |
| US8808969B2 (en) * | 2011-04-12 | 2014-08-19 | Brewer Science Inc. | Method of making radiation-sensitive sol-gel materials |
| WO2015083331A1 (ja) * | 2013-12-04 | 2015-06-11 | サンアプロ株式会社 | 光塩基発生剤 |
| JP2015184325A (ja) * | 2014-03-20 | 2015-10-22 | 住友ベークライト株式会社 | 感光性樹脂組成物および電子装置 |
| CN105739239B (zh) * | 2014-12-10 | 2020-04-03 | 太阳油墨（苏州）有限公司 | 光固化性热固化性树脂组合物、干膜、固化物、及印刷电路板 |
| CN107430335B (zh) * | 2015-04-01 | 2021-04-02 | 东丽株式会社 | 感光性着色树脂组合物 |
| JP6785538B2 (ja) | 2015-06-17 | 2020-11-18 | 株式会社ダイセル | ポリオルガノシルセスキオキサン、硬化性組成物、接着シート、積層物及び装置 |
| TW201710390A (zh) * | 2015-08-31 | 2017-03-16 | Fujifilm Corp | 組成物、硬化膜、硬化膜的製造方法、半導體元件的製造方法及半導體元件 |
| JPWO2018003808A1 (ja) * | 2016-06-30 | 2019-04-18 | 東レ株式会社 | ネガ型感光性樹脂組成物、硬化膜、硬化膜を具備する素子、素子を具備する表示装置、及び有機ｅｌディスプレイ |
| US10101654B2 (en) * | 2016-09-20 | 2018-10-16 | Shin-Etsu Chemical Co., Ltd. | Resist composition and patterning process |
| WO2018123836A1 (ja) | 2016-12-28 | 2018-07-05 | 富士フイルム株式会社 | 感光性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、積層体の製造方法および半導体デバイス |
| KR102517695B1 (ko) * | 2017-01-20 | 2023-04-03 | 제이에스알 가부시끼가이샤 | 감광성 조성물, 경화막 및 그의 제조 방법, 그리고 표시 소자, 발광 소자 및 수광 소자 |
-
2019
- 2019-08-05 CN CN201980044700.1A patent/CN112368641B/zh active Active
- 2019-08-05 JP JP2019543402A patent/JP7409087B2/ja active Active
- 2019-08-05 WO PCT/JP2019/030727 patent/WO2020031958A1/ja not_active Ceased
- 2019-08-05 KR KR1020217000458A patent/KR102683127B1/ko active Active
- 2019-08-08 TW TW108128213A patent/TWI820180B/zh active
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