JPWO2021005789A1 - - Google Patents
Info
- Publication number
- JPWO2021005789A1 JPWO2021005789A1 JP2021530457A JP2021530457A JPWO2021005789A1 JP WO2021005789 A1 JPWO2021005789 A1 JP WO2021005789A1 JP 2021530457 A JP2021530457 A JP 2021530457A JP 2021530457 A JP2021530457 A JP 2021530457A JP WO2021005789 A1 JPWO2021005789 A1 JP WO2021005789A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B10/00—Static random access memory [SRAM] devices
- H10B10/12—Static random access memory [SRAM] devices comprising a MOSFET load element
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B10/00—Static random access memory [SRAM] devices
- H10B10/12—Static random access memory [SRAM] devices comprising a MOSFET load element
- H10B10/125—Static random access memory [SRAM] devices comprising a MOSFET load element the MOSFET being a thin film transistor [TFT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/025—Manufacture or treatment of FETs having insulated gates [IGFET] of vertical IGFETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/63—Vertical IGFETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/69—IGFETs having charge trapping gate insulators, e.g. MNOS transistors
- H10D30/694—IGFETs having charge trapping gate insulators, e.g. MNOS transistors characterised by the shapes, relative sizes or dispositions of the gate electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/01—Manufacture or treatment
- H10W20/071—Manufacture or treatment of dielectric parts thereof
- H10W20/081—Manufacture or treatment of dielectric parts thereof by forming openings in the dielectric parts
- H10W20/089—Manufacture or treatment of dielectric parts thereof by forming openings in the dielectric parts using processes for implementing desired shapes or dispositions of the openings, e.g. double patterning
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
- H10P50/28—Dry etching; Plasma etching; Reactive-ion etching of insulating materials
- H10P50/282—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of inorganic materials
- H10P50/283—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of inorganic materials by chemical means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/73—Etching of wafers, substrates or parts of devices using masks for insulating materials
Landscapes
- Semiconductor Memories (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2019/027541 WO2021005789A1 (ja) | 2019-07-11 | 2019-07-11 | 柱状半導体装置と、その製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2021005789A1 true JPWO2021005789A1 (https=) | 2021-01-14 |
| JPWO2021005789A5 JPWO2021005789A5 (https=) | 2022-05-10 |
| JP7369471B2 JP7369471B2 (ja) | 2023-10-26 |
Family
ID=74114461
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021530457A Active JP7369471B2 (ja) | 2019-07-11 | 2019-07-11 | 柱状半導体装置と、その製造方法 |
| JP2021530488A Active JP7357387B2 (ja) | 2019-07-11 | 2020-03-19 | 柱状半導体装置と、その製造方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021530488A Active JP7357387B2 (ja) | 2019-07-11 | 2020-03-19 | 柱状半導体装置と、その製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US12127385B2 (https=) |
| JP (2) | JP7369471B2 (https=) |
| KR (2) | KR20220034051A (https=) |
| CN (2) | CN114127916A (https=) |
| TW (2) | TWI742750B (https=) |
| WO (2) | WO2021005789A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022234655A1 (ja) | 2021-05-07 | 2022-11-10 | ユニサンティス エレクトロニクス シンガポール プライベート リミテッド | 柱状半導体の製造方法 |
| KR102784170B1 (ko) * | 2021-09-06 | 2025-03-19 | 유니산티스 일렉트로닉스 싱가포르 프라이빗 리미티드 | 반도체 소자를 사용한 메모리 장치 |
| JP2023128046A (ja) * | 2022-03-02 | 2023-09-14 | キオクシア株式会社 | 半導体装置およびその製造方法 |
| WO2024116244A1 (ja) * | 2022-11-28 | 2024-06-06 | ユニサンティス エレクトロニクス シンガポール プライベート リミテッド | メモリ素子を有した半導体装置 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009096465A1 (ja) * | 2008-01-29 | 2009-08-06 | Unisantis Electronics (Japan) Ltd. | 半導体記憶装置 |
| JP2013069770A (ja) * | 2011-09-21 | 2013-04-18 | Elpida Memory Inc | 半導体装置及びその製造方法 |
| JP2016021590A (ja) * | 1998-05-01 | 2016-02-04 | ソニー株式会社 | 半導体記憶装置 |
| WO2017208486A1 (ja) * | 2015-04-06 | 2017-12-07 | ユニサンティス エレクトロニクス シンガポール プライベート リミテッド | 柱状半導体装置の製造方法 |
Family Cites Families (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2703970B2 (ja) | 1989-01-17 | 1998-01-26 | 株式会社東芝 | Ｍｏｓ型半導体装置 |
| JP4077951B2 (ja) | 1998-01-14 | 2008-04-23 | 株式会社ルネサステクノロジ | 欠陥解析方法、記録媒体及び工程管理方法 |
| JP3148745B2 (ja) * | 1999-08-20 | 2001-03-26 | 昭幸 木村 | オープンショーケース用シャッタ装置 |
| US7098502B2 (en) * | 2003-11-10 | 2006-08-29 | Freescale Semiconductor, Inc. | Transistor having three electrically isolated electrodes and method of formation |
| US7241655B2 (en) * | 2004-08-30 | 2007-07-10 | Micron Technology, Inc. | Method of fabricating a vertical wrap-around-gate field-effect-transistor for high density, low voltage logic and memory array |
| US7425491B2 (en) * | 2006-04-04 | 2008-09-16 | Micron Technology, Inc. | Nanowire transistor with surrounding gate |
| WO2009096001A1 (ja) * | 2008-01-29 | 2009-08-06 | Unisantis Electronics (Japan) Ltd. | 半導体記憶装置およびメモリ混載半導体装置、並びにそれらの製造方法 |
| US8598650B2 (en) * | 2008-01-29 | 2013-12-03 | Unisantis Electronics Singapore Pte Ltd. | Semiconductor device and production method therefor |
| US8378425B2 (en) | 2008-01-29 | 2013-02-19 | Unisantis Electronics Singapore Pte Ltd. | Semiconductor storage device |
| WO2009095999A1 (ja) * | 2008-01-29 | 2009-08-06 | Unisantis Electronics (Japan) Ltd. | 半導体記憶装置 |
| WO2009095997A1 (ja) * | 2008-01-29 | 2009-08-06 | Unisantis Electronics (Japan) Ltd. | 半導体装置およびその製造方法 |
| KR100949265B1 (ko) * | 2008-04-01 | 2010-03-25 | 주식회사 하이닉스반도체 | 반도체 소자 제조 방법 |
| WO2009153880A1 (ja) * | 2008-06-20 | 2009-12-23 | 日本ユニサンティスエレクトロニクス株式会社 | 半導体記憶装置 |
| US8530960B2 (en) | 2010-12-07 | 2013-09-10 | Unisantis Electronics Singapore Pte. Ltd. | Semiconductor device |
| KR20140009509A (ko) * | 2012-05-18 | 2014-01-22 | 유니산티스 일렉트로닉스 싱가포르 프라이빗 리미티드 | 반도체 장치의 제조 방법 및 반도체 장치 |
| JP5973665B2 (ja) * | 2013-06-13 | 2016-08-23 | ユニサンティス エレクトロニクス シンガポール プライベート リミテッドＵｎｉｓａｎｔｉｓ Ｅｌｅｃｔｒｏｎｉｃｓ Ｓｉｎｇａｐｏｒｅ Ｐｔｅ Ｌｔｄ． | Ｓｇｔを有する半導体装置とその製造方法 |
| WO2015022744A1 (ja) * | 2013-08-15 | 2015-02-19 | ユニサンティス エレクトロニクス シンガポール プライベート リミテッド | Ｓｇｔを有する半導体装置の製造方法 |
| JP2015061038A (ja) * | 2013-09-20 | 2015-03-30 | マイクロン テクノロジー， インク． | 半導体装置 |
| KR20150101726A (ko) * | 2014-02-27 | 2015-09-04 | 에스케이하이닉스 주식회사 | 터널링 트랜지스터, 그를 포함하는 저항 변화 메모리 장치 및 그 제조방법 |
| WO2015162682A1 (ja) * | 2014-04-22 | 2015-10-29 | ユニサンティス エレクトロニクス シンガポール プライベート リミテッド | 半導体装置 |
| KR20150139255A (ko) * | 2014-06-03 | 2015-12-11 | 에스케이하이닉스 주식회사 | 반도체 장치 및 그 제조방법 |
| JP6297430B2 (ja) * | 2014-06-30 | 2018-03-20 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
| JP5692884B1 (ja) * | 2014-08-19 | 2015-04-01 | ユニサンティス エレクトロニクス シンガポール プライベート リミテッドUnisantis Electronics Singapore Pte Ltd. | Ｓｇｔを有する半導体装置の製造方法 |
| JP6104477B2 (ja) * | 2015-04-06 | 2017-03-29 | ユニサンティス エレクトロニクス シンガポール プライベート リミテッドＵｎｉｓａｎｔｉｓ Ｅｌｅｃｔｒｏｎｉｃｓ Ｓｉｎｇａｐｏｒｅ Ｐｔｅ Ｌｔｄ． | 柱状半導体メモリ装置と、その製造方法 |
| KR20180095836A (ko) * | 2015-12-18 | 2018-08-28 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 상기 반도체 장치를 포함한 표시 장치 |
| US9530863B1 (en) * | 2016-04-13 | 2016-12-27 | Globalfoundries Inc. | Methods of forming vertical transistor devices with self-aligned replacement gate structures |
| US10312229B2 (en) * | 2016-10-28 | 2019-06-04 | Synopsys, Inc. | Memory cells including vertical nanowire transistors |
| JP6850659B2 (ja) * | 2017-03-31 | 2021-03-31 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
| US10236379B2 (en) * | 2017-05-12 | 2019-03-19 | Globalfoundries Inc. | Vertical FET with self-aligned source/drain regions and gate length based on channel epitaxial growth process |
| JP2019009382A (ja) * | 2017-06-28 | 2019-01-17 | 東芝メモリ株式会社 | 半導体装置 |
| US10388766B2 (en) * | 2017-10-23 | 2019-08-20 | International Business Machines Corporation | Vertical transport FET (VFET) with dual top spacer |
| US10319833B1 (en) * | 2017-12-04 | 2019-06-11 | International Business Machines Corporation | Vertical transport field-effect transistor including air-gap top spacer |
| US10777658B2 (en) * | 2018-04-17 | 2020-09-15 | International Business Machines Corporation | Method and structure of fabricating I-shaped silicon vertical field-effect transistors |
| US10439044B1 (en) * | 2018-04-17 | 2019-10-08 | International Business Machines Corporation | Method and structure of fabricating I-shaped silicon germanium vertical field-effect transistors |
-
2019
- 2019-07-11 CN CN201980098346.0A patent/CN114127916A/zh active Pending
- 2019-07-11 WO PCT/JP2019/027541 patent/WO2021005789A1/ja not_active Ceased
- 2019-07-11 KR KR1020217042116A patent/KR20220034051A/ko active Pending
- 2019-07-11 JP JP2021530457A patent/JP7369471B2/ja active Active
-
2020
- 2020-03-19 CN CN202080050298.0A patent/CN114127917A/zh active Pending
- 2020-03-19 JP JP2021530488A patent/JP7357387B2/ja active Active
- 2020-03-19 WO PCT/JP2020/012471 patent/WO2021005842A1/ja not_active Ceased
- 2020-03-19 KR KR1020217042121A patent/KR102689607B1/ko active Active
- 2020-07-07 TW TW109122895A patent/TWI742750B/zh active
- 2020-07-10 TW TW109123404A patent/TWI750729B/zh active
-
2021
- 2021-12-30 US US17/565,738 patent/US12127385B2/en active Active
-
2022
- 2022-01-03 US US17/567,696 patent/US12127386B2/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016021590A (ja) * | 1998-05-01 | 2016-02-04 | ソニー株式会社 | 半導体記憶装置 |
| WO2009096465A1 (ja) * | 2008-01-29 | 2009-08-06 | Unisantis Electronics (Japan) Ltd. | 半導体記憶装置 |
| JP2013069770A (ja) * | 2011-09-21 | 2013-04-18 | Elpida Memory Inc | 半導体装置及びその製造方法 |
| WO2017208486A1 (ja) * | 2015-04-06 | 2017-12-07 | ユニサンティス エレクトロニクス シンガポール プライベート リミテッド | 柱状半導体装置の製造方法 |
| WO2018123823A1 (ja) * | 2015-04-06 | 2018-07-05 | ユニサンティス エレクトロニクス シンガポール プライベート リミテッド | 柱状半導体装置の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US12127386B2 (en) | 2024-10-22 |
| KR102689607B1 (ko) | 2024-07-29 |
| WO2021005842A1 (ja) | 2021-01-14 |
| US20220130842A1 (en) | 2022-04-28 |
| TW202121655A (zh) | 2021-06-01 |
| US12127385B2 (en) | 2024-10-22 |
| CN114127916A (zh) | 2022-03-01 |
| JPWO2021005842A1 (https=) | 2021-01-14 |
| WO2021005789A8 (ja) | 2021-06-10 |
| CN114127917A (zh) | 2022-03-01 |
| TWI742750B (zh) | 2021-10-11 |
| US20220139928A1 (en) | 2022-05-05 |
| TW202121654A (zh) | 2021-06-01 |
| KR20220034051A (ko) | 2022-03-17 |
| JP7357387B2 (ja) | 2023-10-06 |
| KR20220012325A (ko) | 2022-02-03 |
| TWI750729B (zh) | 2021-12-21 |
| WO2021005789A1 (ja) | 2021-01-14 |
| JP7369471B2 (ja) | 2023-10-26 |
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