JPWO2019013163A1 - 銅銀合金を用いた導電性部材、コンタクトピン及び装置 - Google Patents

銅銀合金を用いた導電性部材、コンタクトピン及び装置 Download PDF

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Publication number
JPWO2019013163A1
JPWO2019013163A1 JP2018554604A JP2018554604A JPWO2019013163A1 JP WO2019013163 A1 JPWO2019013163 A1 JP WO2019013163A1 JP 2018554604 A JP2018554604 A JP 2018554604A JP 2018554604 A JP2018554604 A JP 2018554604A JP WO2019013163 A1 JPWO2019013163 A1 JP WO2019013163A1
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JP
Japan
Prior art keywords
copper
contact pin
silver alloy
silver
pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2018554604A
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English (en)
Japanese (ja)
Inventor
佐藤　勉
勉 佐藤
坂井　義和
義和 坂井
章弘 菊池
章弘 菊池
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Institute for Materials Science
Kyosei Corp
Original Assignee
National Institute for Materials Science
Kyosei Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National Institute for Materials Science, Kyosei Corp filed Critical National Institute for Materials Science
Publication of JPWO2019013163A1 publication Critical patent/JPWO2019013163A1/ja
Priority to JP2021015535A priority Critical patent/JP2021099346A/ja
Priority to JP2021206120A priority patent/JP2022050442A/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21B—ROLLING OF METAL
    • B21B1/00—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations
    • B21B1/16—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations for rolling wire rods, bars, merchant bars, rounds wire or material of like small cross-section
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21B—ROLLING OF METAL
    • B21B3/00—Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/02—Making non-ferrous alloys by melting
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
    • F16F1/00—Springs
    • F16F1/02—Springs made of steel or other material having low internal friction; Wound, torsion, leaf, cup, ring or the like springs, the material of the spring not being relevant
    • F16F1/021—Springs made of steel or other material having low internal friction; Wound, torsion, leaf, cup, ring or the like springs, the material of the spring not being relevant characterised by their composition, e.g. comprising materials providing for particular spring properties
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21B—ROLLING OF METAL
    • B21B3/00—Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
    • B21B2003/005—Copper or its alloys
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Measuring Leads Or Probes (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Conductive Materials (AREA)
  • Connecting Device With Holders (AREA)
  • Contacts (AREA)
JP2018554604A 2017-07-10 2018-07-09 銅銀合金を用いた導電性部材、コンタクトピン及び装置 Pending JPWO2019013163A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2021015535A JP2021099346A (ja) 2017-07-10 2021-02-03 銅銀合金を用いた導電性部材、コンタクトピン及び装置
JP2021206120A JP2022050442A (ja) 2017-07-10 2021-12-20 銅銀合金を用いた導電性部材、コンタクトピン及び装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017135081 2017-07-10
JP2017135081 2017-07-10
PCT/JP2018/025884 WO2019013163A1 (ja) 2017-07-10 2018-07-09 銅銀合金を用いた導電性部材、コンタクトピン及び装置

Related Child Applications (1)

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JP2021015535A Division JP2021099346A (ja) 2017-07-10 2021-02-03 銅銀合金を用いた導電性部材、コンタクトピン及び装置

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Publication Number Publication Date
JPWO2019013163A1 true JPWO2019013163A1 (ja) 2020-02-06

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JP2018554604A Pending JPWO2019013163A1 (ja) 2017-07-10 2018-07-09 銅銀合金を用いた導電性部材、コンタクトピン及び装置
JP2021015535A Pending JP2021099346A (ja) 2017-07-10 2021-02-03 銅銀合金を用いた導電性部材、コンタクトピン及び装置
JP2021206120A Pending JP2022050442A (ja) 2017-07-10 2021-12-20 銅銀合金を用いた導電性部材、コンタクトピン及び装置

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JP2021015535A Pending JP2021099346A (ja) 2017-07-10 2021-02-03 銅銀合金を用いた導電性部材、コンタクトピン及び装置
JP2021206120A Pending JP2022050442A (ja) 2017-07-10 2021-12-20 銅銀合金を用いた導電性部材、コンタクトピン及び装置

Country Status (6)

Country Link
US (1) US20210088552A1 (https=)
JP (3) JPWO2019013163A1 (https=)
KR (1) KR102350158B1 (https=)
CN (2) CN110809805B (https=)
TW (1) TWI787302B (https=)
WO (1) WO2019013163A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2019013163A1 (ja) * 2017-07-10 2020-02-06 株式会社協成 銅銀合金を用いた導電性部材、コンタクトピン及び装置
JP7350307B2 (ja) * 2019-10-30 2023-09-26 国立大学法人 名古屋工業大学 Ａｇ－グラフェン複合めっき膜金属製端子とその製造方法
CN113555750A (zh) * 2021-01-18 2021-10-26 陈彦 一种采用铜银合金制作0．782pin耳机插针的方法
JP7322247B1 (ja) * 2022-06-07 2023-08-07 Ｓｗｃｃ株式会社 Ｃｕ－Ａｇ合金線およびその製造方法
WO2025094259A1 (ja) * 2023-10-31 2025-05-08 Ｓｗｃｃ株式会社 Ｃｕ－Ａｇ合金線の製造方法

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US20170160311A1 (en) * 2015-12-04 2017-06-08 Renesas Electronics Corporation Method of manufacturing semiconductor device

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JP2001326046A (ja) * 2000-05-17 2001-11-22 Enplas Corp コンタクトピン集合体、コンタクトピン組立体及び電気部品用ソケット
JP2006283146A (ja) * 2005-04-01 2006-10-19 Nikko Kinzoku Kk 圧延銅箔及びその製造方法
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JP2015125095A (ja) * 2013-12-27 2015-07-06 富士電機株式会社 接触子及び半導体試験装置
JP2016142644A (ja) * 2015-02-03 2016-08-08 株式会社日本マイクロニクス 電気的接続装置およびポゴピン
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US20170160311A1 (en) * 2015-12-04 2017-06-08 Renesas Electronics Corporation Method of manufacturing semiconductor device

Also Published As

Publication number Publication date
US20210088552A1 (en) 2021-03-25
JP2022050442A (ja) 2022-03-30
CN113690656A (zh) 2021-11-23
WO2019013163A1 (ja) 2019-01-17
KR102350158B1 (ko) 2022-01-12
CN110809805A (zh) 2020-02-18
TWI787302B (zh) 2022-12-21
JP2021099346A (ja) 2021-07-01
KR20200018576A (ko) 2020-02-19
CN110809805B (zh) 2021-10-26
TW201909196A (zh) 2019-03-01

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