JPWO2016098596A1 - 光及び熱硬化性樹脂組成物、硬化物、並びに積層体 - Google Patents
光及び熱硬化性樹脂組成物、硬化物、並びに積層体 Download PDFInfo
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- JPWO2016098596A1 JPWO2016098596A1 JP2016564779A JP2016564779A JPWO2016098596A1 JP WO2016098596 A1 JPWO2016098596 A1 JP WO2016098596A1 JP 2016564779 A JP2016564779 A JP 2016564779A JP 2016564779 A JP2016564779 A JP 2016564779A JP WO2016098596 A1 JPWO2016098596 A1 JP WO2016098596A1
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- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 description 1
- CSHWQDPOILHKBI-UHFFFAOYSA-N peryrene Natural products C1=CC(C2=CC=CC=3C2=C2C=CC=3)=C3C2=CC=CC3=C1 CSHWQDPOILHKBI-UHFFFAOYSA-N 0.000 description 1
- 229950000688 phenothiazine Drugs 0.000 description 1
- GEJUFTHBORQCNQ-UHFFFAOYSA-N phenylalumane Chemical compound [AlH2]c1ccccc1 GEJUFTHBORQCNQ-UHFFFAOYSA-N 0.000 description 1
- RPGWZZNNEUHDAQ-UHFFFAOYSA-N phenylphosphine Chemical compound PC1=CC=CC=C1 RPGWZZNNEUHDAQ-UHFFFAOYSA-N 0.000 description 1
- 150000003003 phosphines Chemical class 0.000 description 1
- 230000036211 photosensitivity Effects 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 235000010333 potassium nitrate Nutrition 0.000 description 1
- 239000004323 potassium nitrate Substances 0.000 description 1
- 229910001487 potassium perchlorate Inorganic materials 0.000 description 1
- OTYBMLCTZGSZBG-UHFFFAOYSA-L potassium sulfate Chemical compound [K+].[K+].[O-]S([O-])(=O)=O OTYBMLCTZGSZBG-UHFFFAOYSA-L 0.000 description 1
- 229910052939 potassium sulfate Inorganic materials 0.000 description 1
- 235000011151 potassium sulphates Nutrition 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 239000011164 primary particle Substances 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical group C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 1
- 238000011002 quantification Methods 0.000 description 1
- 229910052705 radium Inorganic materials 0.000 description 1
- HCWPIIXVSYCSAN-UHFFFAOYSA-N radium atom Chemical compound [Ra] HCWPIIXVSYCSAN-UHFFFAOYSA-N 0.000 description 1
- GIKWXTHTIQCTIH-UHFFFAOYSA-L radium bromide Chemical compound [Br-].[Br-].[Ra+2] GIKWXTHTIQCTIH-UHFFFAOYSA-L 0.000 description 1
- 229910001624 radium bromide Inorganic materials 0.000 description 1
- 229940075451 radium bromide Drugs 0.000 description 1
- 229910001642 radium iodide Inorganic materials 0.000 description 1
- 230000027756 respiratory electron transport chain Effects 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- RTHYXYOJKHGZJT-UHFFFAOYSA-N rubidium nitrate Inorganic materials [Rb+].[O-][N+]([O-])=O RTHYXYOJKHGZJT-UHFFFAOYSA-N 0.000 description 1
- 229910001489 rubidium perchlorate Inorganic materials 0.000 description 1
- 229910000344 rubidium sulfate Inorganic materials 0.000 description 1
- GANPIEKBSASAOC-UHFFFAOYSA-L rubidium(1+);sulfate Chemical compound [Rb+].[Rb+].[O-]S([O-])(=O)=O GANPIEKBSASAOC-UHFFFAOYSA-L 0.000 description 1
- 239000012266 salt solution Substances 0.000 description 1
- JIYNFFGKZCOPKN-UHFFFAOYSA-N sbb061129 Chemical compound O=C1OC(=O)C2C1C1C=C(C)C2C1 JIYNFFGKZCOPKN-UHFFFAOYSA-N 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000007086 side reaction Methods 0.000 description 1
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 description 1
- 150000004819 silanols Chemical class 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000004317 sodium nitrate Substances 0.000 description 1
- 235000010344 sodium nitrate Nutrition 0.000 description 1
- BAZAXWOYCMUHIX-UHFFFAOYSA-M sodium perchlorate Chemical compound [Na+].[O-]Cl(=O)(=O)=O BAZAXWOYCMUHIX-UHFFFAOYSA-M 0.000 description 1
- 229910001488 sodium perchlorate Inorganic materials 0.000 description 1
- 229910052938 sodium sulfate Inorganic materials 0.000 description 1
- 235000011152 sodium sulphate Nutrition 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007784 solid electrolyte Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 230000001954 sterilising effect Effects 0.000 description 1
- 238000004659 sterilization and disinfection Methods 0.000 description 1
- MXRFIUHRIOLIIV-UHFFFAOYSA-L strontium;diperchlorate Chemical compound [Sr+2].[O-]Cl(=O)(=O)=O.[O-]Cl(=O)(=O)=O MXRFIUHRIOLIIV-UHFFFAOYSA-L 0.000 description 1
- 239000004291 sulphur dioxide Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- RBTVSNLYYIMMKS-UHFFFAOYSA-N tert-butyl 3-aminoazetidine-1-carboxylate;hydrochloride Chemical compound Cl.CC(C)(C)OC(=O)N1CC(N)C1 RBTVSNLYYIMMKS-UHFFFAOYSA-N 0.000 description 1
- JRMUNVKIHCOMHV-UHFFFAOYSA-M tetrabutylammonium bromide Chemical compound [Br-].CCCC[N+](CCCC)(CCCC)CCCC JRMUNVKIHCOMHV-UHFFFAOYSA-M 0.000 description 1
- DPKBAXPHAYBPRL-UHFFFAOYSA-M tetrabutylazanium;iodide Chemical compound [I-].CCCC[N+](CCCC)(CCCC)CCCC DPKBAXPHAYBPRL-UHFFFAOYSA-M 0.000 description 1
- KBLZDCFTQSIIOH-UHFFFAOYSA-M tetrabutylazanium;perchlorate Chemical compound [O-]Cl(=O)(=O)=O.CCCC[N+](CCCC)(CCCC)CCCC KBLZDCFTQSIIOH-UHFFFAOYSA-M 0.000 description 1
- ZXUCBXRTRRIBSO-UHFFFAOYSA-L tetrabutylazanium;sulfate Chemical compound [O-]S([O-])(=O)=O.CCCC[N+](CCCC)(CCCC)CCCC.CCCC[N+](CCCC)(CCCC)CCCC ZXUCBXRTRRIBSO-UHFFFAOYSA-L 0.000 description 1
- BJQWBACJIAKDTJ-UHFFFAOYSA-N tetrabutylphosphanium Chemical compound CCCC[P+](CCCC)(CCCC)CCCC BJQWBACJIAKDTJ-UHFFFAOYSA-N 0.000 description 1
- HWCKGOZZJDHMNC-UHFFFAOYSA-M tetraethylammonium bromide Chemical compound [Br-].CC[N+](CC)(CC)CC HWCKGOZZJDHMNC-UHFFFAOYSA-M 0.000 description 1
- YMBCJWGVCUEGHA-UHFFFAOYSA-M tetraethylammonium chloride Chemical compound [Cl-].CC[N+](CC)(CC)CC YMBCJWGVCUEGHA-UHFFFAOYSA-M 0.000 description 1
- UQFSVBXCNGCBBW-UHFFFAOYSA-M tetraethylammonium iodide Chemical compound [I-].CC[N+](CC)(CC)CC UQFSVBXCNGCBBW-UHFFFAOYSA-M 0.000 description 1
- WGHUNMFFLAMBJD-UHFFFAOYSA-M tetraethylazanium;perchlorate Chemical compound [O-]Cl(=O)(=O)=O.CC[N+](CC)(CC)CC WGHUNMFFLAMBJD-UHFFFAOYSA-M 0.000 description 1
- TXBULBYASDPNNC-UHFFFAOYSA-L tetraethylazanium;sulfate Chemical compound [O-]S([O-])(=O)=O.CC[N+](CC)(CC)CC.CC[N+](CC)(CC)CC TXBULBYASDPNNC-UHFFFAOYSA-L 0.000 description 1
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 description 1
- SYZCZDCAEVUSPM-UHFFFAOYSA-M tetrahexylazanium;bromide Chemical compound [Br-].CCCCCC[N+](CCCCCC)(CCCCCC)CCCCCC SYZCZDCAEVUSPM-UHFFFAOYSA-M 0.000 description 1
- ODTSDWCGLRVBHJ-UHFFFAOYSA-M tetrahexylazanium;chloride Chemical compound [Cl-].CCCCCC[N+](CCCCCC)(CCCCCC)CCCCCC ODTSDWCGLRVBHJ-UHFFFAOYSA-M 0.000 description 1
- VRKHAMWCGMJAMI-UHFFFAOYSA-M tetrahexylazanium;iodide Chemical compound [I-].CCCCCC[N+](CCCCCC)(CCCCCC)CCCCCC VRKHAMWCGMJAMI-UHFFFAOYSA-M 0.000 description 1
- LHIGLAVLYYKORA-UHFFFAOYSA-N tetrahexylazanium;nitrate Chemical compound [O-][N+]([O-])=O.CCCCCC[N+](CCCCCC)(CCCCCC)CCCCCC LHIGLAVLYYKORA-UHFFFAOYSA-N 0.000 description 1
- RLCKPGXHGKSGOS-UHFFFAOYSA-M tetrahexylazanium;perchlorate Chemical compound [O-]Cl(=O)(=O)=O.CCCCCC[N+](CCCCCC)(CCCCCC)CCCCCC RLCKPGXHGKSGOS-UHFFFAOYSA-M 0.000 description 1
- KMXYYFRWQNNPDG-UHFFFAOYSA-L tetrahexylazanium;sulfate Chemical compound [O-]S([O-])(=O)=O.CCCCCC[N+](CCCCCC)(CCCCCC)CCCCCC.CCCCCC[N+](CCCCCC)(CCCCCC)CCCCCC KMXYYFRWQNNPDG-UHFFFAOYSA-L 0.000 description 1
- XRRGYHIBRPYSTH-UHFFFAOYSA-L tetramethylazanium dibromide Chemical compound [Br-].[Br-].C[N+](C)(C)C.C[N+](C)(C)C XRRGYHIBRPYSTH-UHFFFAOYSA-L 0.000 description 1
- JEESRCVUCXHTSN-UHFFFAOYSA-L tetramethylazanium diiodide Chemical compound [I-].[I-].C[N+](C)(C)C.C[N+](C)(C)C JEESRCVUCXHTSN-UHFFFAOYSA-L 0.000 description 1
- ZCWKIFAQRXNZCH-UHFFFAOYSA-M tetramethylazanium;perchlorate Chemical compound C[N+](C)(C)C.[O-]Cl(=O)(=O)=O ZCWKIFAQRXNZCH-UHFFFAOYSA-M 0.000 description 1
- KJFVITRRNTVAPC-UHFFFAOYSA-L tetramethylazanium;sulfate Chemical compound C[N+](C)(C)C.C[N+](C)(C)C.[O-]S([O-])(=O)=O KJFVITRRNTVAPC-UHFFFAOYSA-L 0.000 description 1
- SPALIFXDWQTXKS-UHFFFAOYSA-M tetrapentylazanium;bromide Chemical compound [Br-].CCCCC[N+](CCCCC)(CCCCC)CCCCC SPALIFXDWQTXKS-UHFFFAOYSA-M 0.000 description 1
- SXAWRMKQZKPHNJ-UHFFFAOYSA-M tetrapentylazanium;chloride Chemical compound [Cl-].CCCCC[N+](CCCCC)(CCCCC)CCCCC SXAWRMKQZKPHNJ-UHFFFAOYSA-M 0.000 description 1
- FBLZDUAOBOMSNZ-UHFFFAOYSA-M tetrapentylazanium;iodide Chemical compound [I-].CCCCC[N+](CCCCC)(CCCCC)CCCCC FBLZDUAOBOMSNZ-UHFFFAOYSA-M 0.000 description 1
- SQKOTLOEFIAXAU-UHFFFAOYSA-N tetrapentylazanium;nitrate Chemical compound [O-][N+]([O-])=O.CCCCC[N+](CCCCC)(CCCCC)CCCCC SQKOTLOEFIAXAU-UHFFFAOYSA-N 0.000 description 1
- DSBPYRNQAGOJAI-UHFFFAOYSA-M tetrapentylazanium;perchlorate Chemical compound [O-]Cl(=O)(=O)=O.CCCCC[N+](CCCCC)(CCCCC)CCCCC DSBPYRNQAGOJAI-UHFFFAOYSA-M 0.000 description 1
- AGPBJRPGXLLDDM-UHFFFAOYSA-L tetrapentylazanium;sulfate Chemical compound [O-]S([O-])(=O)=O.CCCCC[N+](CCCCC)(CCCCC)CCCCC.CCCCC[N+](CCCCC)(CCCCC)CCCCC AGPBJRPGXLLDDM-UHFFFAOYSA-L 0.000 description 1
- BGQMOFGZRJUORO-UHFFFAOYSA-M tetrapropylammonium bromide Chemical compound [Br-].CCC[N+](CCC)(CCC)CCC BGQMOFGZRJUORO-UHFFFAOYSA-M 0.000 description 1
- FBEVECUEMUUFKM-UHFFFAOYSA-M tetrapropylazanium;chloride Chemical compound [Cl-].CCC[N+](CCC)(CCC)CCC FBEVECUEMUUFKM-UHFFFAOYSA-M 0.000 description 1
- GKXDJYKZFZVASJ-UHFFFAOYSA-M tetrapropylazanium;iodide Chemical compound [I-].CCC[N+](CCC)(CCC)CCC GKXDJYKZFZVASJ-UHFFFAOYSA-M 0.000 description 1
- HZPNJVXVIFRTRF-UHFFFAOYSA-N tetrapropylazanium;nitrate Chemical compound [O-][N+]([O-])=O.CCC[N+](CCC)(CCC)CCC HZPNJVXVIFRTRF-UHFFFAOYSA-N 0.000 description 1
- JYFAUFFZEHJXIM-UHFFFAOYSA-L tetrapropylazanium;sulfate Chemical compound [O-]S([O-])(=O)=O.CCC[N+](CCC)(CCC)CCC.CCC[N+](CCC)(CCC)CCC JYFAUFFZEHJXIM-UHFFFAOYSA-L 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 1
- VBSUMMHIJNZMRM-UHFFFAOYSA-N triethoxy(2-phenylethyl)silane Chemical compound CCO[Si](OCC)(OCC)CCC1=CC=CC=C1 VBSUMMHIJNZMRM-UHFFFAOYSA-N 0.000 description 1
- ASUUSZXVXTVKDD-UHFFFAOYSA-N triethoxy(4-isocyanatobutyl)silane Chemical compound CCO[Si](OCC)(OCC)CCCCN=C=O ASUUSZXVXTVKDD-UHFFFAOYSA-N 0.000 description 1
- XLNRATCYWYJUOR-UHFFFAOYSA-N triethoxy(4-phenylbutyl)silane Chemical compound CCO[Si](OCC)(OCC)CCCCC1=CC=CC=C1 XLNRATCYWYJUOR-UHFFFAOYSA-N 0.000 description 1
- VQFQVYFUZUTIMU-UHFFFAOYSA-N triethoxy(7-oxabicyclo[4.1.0]heptan-4-ylmethyl)silane Chemical compound C1C(C[Si](OCC)(OCC)OCC)CCC2OC21 VQFQVYFUZUTIMU-UHFFFAOYSA-N 0.000 description 1
- UNKMHLWJZHLPPM-UHFFFAOYSA-N triethoxy(oxiran-2-ylmethoxymethyl)silane Chemical compound CCO[Si](OCC)(OCC)COCC1CO1 UNKMHLWJZHLPPM-UHFFFAOYSA-N 0.000 description 1
- UMFJXASDGBJDEB-UHFFFAOYSA-N triethoxy(prop-2-enyl)silane Chemical compound CCO[Si](CC=C)(OCC)OCC UMFJXASDGBJDEB-UHFFFAOYSA-N 0.000 description 1
- RWJUTPORTOUFDY-UHFFFAOYSA-N triethoxy-[2-(oxiran-2-ylmethoxy)ethyl]silane Chemical compound CCO[Si](OCC)(OCC)CCOCC1CO1 RWJUTPORTOUFDY-UHFFFAOYSA-N 0.000 description 1
- JYOCXGAUUQQOSY-UHFFFAOYSA-N triethoxy-[3-(oxetan-2-yloxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOC1CCO1 JYOCXGAUUQQOSY-UHFFFAOYSA-N 0.000 description 1
- PSUKBUSXHYKMLU-UHFFFAOYSA-N triethoxy-[4-(7-oxabicyclo[4.1.0]heptan-4-yl)butyl]silane Chemical compound C1C(CCCC[Si](OCC)(OCC)OCC)CCC2OC21 PSUKBUSXHYKMLU-UHFFFAOYSA-N 0.000 description 1
- GSUGNQKJVLXBHC-UHFFFAOYSA-N triethoxy-[4-(oxiran-2-ylmethoxy)butyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCCOCC1CO1 GSUGNQKJVLXBHC-UHFFFAOYSA-N 0.000 description 1
- DNOKYIVCEOPUSL-UHFFFAOYSA-N triethoxy-[6-(oxiran-2-ylmethoxy)hexyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCCCCOCC1CO1 DNOKYIVCEOPUSL-UHFFFAOYSA-N 0.000 description 1
- WBTPGJPZNDJHFG-UHFFFAOYSA-N triethoxy-[8-(oxiran-2-ylmethoxy)octyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCCCCCCOCC1CO1 WBTPGJPZNDJHFG-UHFFFAOYSA-N 0.000 description 1
- XSIGLRIVXRKQRA-UHFFFAOYSA-N triethoxysilylmethanethiol Chemical compound CCO[Si](CS)(OCC)OCC XSIGLRIVXRKQRA-UHFFFAOYSA-N 0.000 description 1
- UZIAQVMNAXPCJQ-UHFFFAOYSA-N triethoxysilylmethyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)COC(=O)C(C)=C UZIAQVMNAXPCJQ-UHFFFAOYSA-N 0.000 description 1
- 125000005591 trimellitate group Chemical group 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- UBMUZYGBAGFCDF-UHFFFAOYSA-N trimethoxy(2-phenylethyl)silane Chemical compound CO[Si](OC)(OC)CCC1=CC=CC=C1 UBMUZYGBAGFCDF-UHFFFAOYSA-N 0.000 description 1
- UVHQNHAPYJVORK-UHFFFAOYSA-N trimethoxy(3-phenylpropyl)silane Chemical compound CO[Si](OC)(OC)CCCC1=CC=CC=C1 UVHQNHAPYJVORK-UHFFFAOYSA-N 0.000 description 1
- DFZGBLVHGSETPS-UHFFFAOYSA-N trimethoxy(4-phenylbutyl)silane Chemical compound CO[Si](OC)(OC)CCCCC1=CC=CC=C1 DFZGBLVHGSETPS-UHFFFAOYSA-N 0.000 description 1
- JJJRLZZUTIHZQO-UHFFFAOYSA-N trimethoxy(5-phenylpentyl)silane Chemical compound CO[Si](OC)(OC)CCCCCC1=CC=CC=C1 JJJRLZZUTIHZQO-UHFFFAOYSA-N 0.000 description 1
- HGWMJSPUTHTZPN-UHFFFAOYSA-N trimethoxy(6-phenylhexyl)silane Chemical compound C1(=CC=CC=C1)CCCCCC[Si](OC)(OC)OC HGWMJSPUTHTZPN-UHFFFAOYSA-N 0.000 description 1
- HGCVEHIYVPDFMS-UHFFFAOYSA-N trimethoxy(7-oxabicyclo[4.1.0]heptan-4-ylmethyl)silane Chemical compound C1C(C[Si](OC)(OC)OC)CCC2OC21 HGCVEHIYVPDFMS-UHFFFAOYSA-N 0.000 description 1
- LFBULLRGNLZJAF-UHFFFAOYSA-N trimethoxy(oxiran-2-ylmethoxymethyl)silane Chemical compound CO[Si](OC)(OC)COCC1CO1 LFBULLRGNLZJAF-UHFFFAOYSA-N 0.000 description 1
- LFRDHGNFBLIJIY-UHFFFAOYSA-N trimethoxy(prop-2-enyl)silane Chemical compound CO[Si](OC)(OC)CC=C LFRDHGNFBLIJIY-UHFFFAOYSA-N 0.000 description 1
- NCLFWRGBSGFNNA-UHFFFAOYSA-N trimethoxy-(3-methyloxiran-2-yl)silane Chemical compound CO[Si](OC)(OC)C1OC1C NCLFWRGBSGFNNA-UHFFFAOYSA-N 0.000 description 1
- BLRFXCBXDFTKKO-UHFFFAOYSA-N trimethoxy-[3-(oxetan-2-yloxy)propyl]silane Chemical compound O1CCC1OCCC[Si](OC)(OC)OC BLRFXCBXDFTKKO-UHFFFAOYSA-N 0.000 description 1
- ZOWVSEMGATXETK-UHFFFAOYSA-N trimethoxy-[4-(7-oxabicyclo[4.1.0]heptan-4-yl)butyl]silane Chemical compound C1C(CCCC[Si](OC)(OC)OC)CCC2OC21 ZOWVSEMGATXETK-UHFFFAOYSA-N 0.000 description 1
- VRHBBGAASHNPHT-UHFFFAOYSA-N trimethoxy-[6-(oxiran-2-ylmethoxy)hexyl]silane Chemical compound CO[Si](OC)(OC)CCCCCCOCC1CO1 VRHBBGAASHNPHT-UHFFFAOYSA-N 0.000 description 1
- QYJYJTDXBIYRHH-UHFFFAOYSA-N trimethoxy-[8-(oxiran-2-ylmethoxy)octyl]silane Chemical compound C(C1CO1)OCCCCCCCC[Si](OC)(OC)OC QYJYJTDXBIYRHH-UHFFFAOYSA-N 0.000 description 1
- QJOOZNCPHALTKK-UHFFFAOYSA-N trimethoxysilylmethanethiol Chemical compound CO[Si](CS)(OC)OC QJOOZNCPHALTKK-UHFFFAOYSA-N 0.000 description 1
- UOKUUKOEIMCYAI-UHFFFAOYSA-N trimethoxysilylmethyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)COC(=O)C(C)=C UOKUUKOEIMCYAI-UHFFFAOYSA-N 0.000 description 1
- 238000006227 trimethylsilylation reaction Methods 0.000 description 1
- MDCWDBMBZLORER-UHFFFAOYSA-N triphenyl borate Chemical compound C=1C=CC=CC=1OB(OC=1C=CC=CC=1)OC1=CC=CC=C1 MDCWDBMBZLORER-UHFFFAOYSA-N 0.000 description 1
- KHAUBYTYGDOYRU-IRXASZMISA-N trospectomycin Chemical compound CN[C@H]([C@H]1O2)[C@@H](O)[C@@H](NC)[C@H](O)[C@H]1O[C@H]1[C@]2(O)C(=O)C[C@@H](CCCC)O1 KHAUBYTYGDOYRU-IRXASZMISA-N 0.000 description 1
- 238000007666 vacuum forming Methods 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 125000005023 xylyl group Chemical group 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
-
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Abstract
Description
〔1〕下記一般式(I):
R1−(SiR2 a(OR3)3−a) (I)
(式中、R1は末端がエポキシ構造含有基で置換された炭素数1〜10のアルキル基であり、R2はそれぞれ独立して水素原子又は炭素数1〜10のアルキル基、炭素数6〜25のアリール基及び炭素数7〜12のアラルキル基から選ばれる1価の炭化水素基であり、R3はそれぞれ独立して水素原子又は炭素数1〜10のアルキル基である。aは0〜2の整数である。)で表される、加水分解性シリル基を有するシラン化合物(I)、及び、
下記一般式(II):
R4−(SiR2 a(OR3)3−a) (II)
(式中、R4は炭素数1〜10の置換若しくは非置換のアルキル基、アルケニル基、並びに、置換アリール基から選ばれ、エポキシ構造含有基を有さない基である。R2はそれぞれ独立して水素原子又は炭素数1〜10のアルキル基、炭素数6〜25のアリール基及び炭素数7〜12のアラルキル基から選ばれる1価の炭化水素基であり、R3はそれぞれ独立して水素原子又は炭素数1〜10のアルキル基である。aは0〜2の整数である。)で表される、加水分解性シリル基を有するシラン化合物(II)を、
シラン化合物(I)に対するシラン化合物(II)のモル比を9以下として中性塩触媒の存在下で加水分解及び縮合させて得られる重量平均分子量30,000以下の縮合物(A)および、
エポキシ基を硬化せしめる硬化剤(B)を含有し、
縮合物(A)の原料であるシラン化合物(I)および(II)が有するケイ素原子に直接結合したOR3基のモル数Xに対する、縮合物(A)が有するケイ素原子に直接結合したOR3基のモル数Yの比Y/Xが0.2以下であることを特徴とする、硬化性組成物。
上記硬化剤(B)がエポキシ基に対して付加することでエポキシ基を硬化せしめる硬化剤の場合には、上記縮合物(A)100重量部に対して上記硬化剤(B)を10〜150重量部含有し、
金属酸化物微粒子(C)を上記縮合物(A)100重量部に対して0〜150重量部含有することを特徴とする、〔1〕〜〔7〕のいずれかに記載の硬化性組成物。
一般式(I):
R1−(SiR2 a(OR3)3−a) (I)
(式中、R1は末端がエポキシ構造含有基で置換された炭素数1〜10のアルキル基であり、R2はそれぞれ独立して水素原子又は炭素数1〜10のアルキル基、炭素数6〜25のアリール基及び炭素数7〜12のアラルキル基から選ばれる1価の炭化水素基であり、R3はそれぞれ独立して水素原子又は炭素数1〜10のアルキル基である。aは0〜2の整数である。)
一般式(II):
R4−(SiR2 a(OR3)3−a) (II)
(式中、R4は炭素数1〜10の置換若しくは非置換のアルキル基、アルケニル基、並びに、置換アリール基から選ばれ、エポキシ構造含有基を有さない基である。R2はそれぞれ独立して水素原子又は炭素数1〜10のアルキル基、炭素数6〜25のアリール基及び炭素数7〜12のアラルキル基から選ばれる1価の炭化水素基であり、R3はそれぞれ独立して水素原子又は炭素数1〜10のアルキル基である。aは0〜2の整数である。)
縮合物(A)は、シラン化合物(I)に対するシラン化合物(II)のモル比を9以下として中性塩触媒の存在下で加水分解及び縮合させて得られる、重量平均分子量30,000以下の縮合物であり、シラン化合物(I)およびシラン化合物(II)が有するケイ素原子に直接結合したOR3基のモル数Xに対する、縮合物(A)が有するケイ素原子に直接結合したOR3基のモル数Yの比Y/Xが0.2以下であることを特徴とする。
加水分解性シリル基を有するシラン化合物(I)は、下記一般式(I):
R1−(SiR2 a(OR3)3−a) (I)
(式中、R1は末端がエポキシ構造含有基で置換された炭素数1〜10のアルキル基であり、R2はそれぞれ独立して水素原子又は炭素数1〜10のアルキル基、炭素数6〜25のアリール基及び炭素数7〜12のアラルキル基から選ばれる1価の炭化水素基であり、R3はそれぞれ独立して水素原子又は炭素数1〜10のアルキル基である。aは0〜2の整数である。)で表される。
R4−(SiR2 a(OR3)3−a) (II)
(式中、R4は炭素数1〜10の置換若しくは非置換のアルキル基、アルケニル基、並びに、置換アリール基から選ばれ、エポキシ構造含有基を有さない基である。R2はそれぞれ独立して水素原子又は炭素数1〜10のアルキル基、炭素数6〜25のアリール基及び炭素数7〜12のアラルキル基から選ばれる1価の炭化水素基であり、R3はそれぞれ独立して水素原子又は炭素数1〜10のアルキル基である。aは0〜2の整数である。)で表される。
1−(3,4−エポキシシクロヘキシル)メチルトリメトキシシラン、1−(3,4−エポキシシクロヘキシル)メチルメチルジメトキシシラン、1−(3,4−エポキシシクロヘキシル)メチルトリエトキシシラン、1−(3,4−エポキシシクロヘキシル)メチルメチルジエトキシシラン、2−(3,4−エポキシシクロヘキシル)エチルトリメトキシシラン、2−(3,4−エポキシシクロヘキシル)エチルメチルジメトキシシラン、2−(3,4−エポキシシクロヘキシル)エチルトリエトキシシラン、2−(3,4−エポキシシクロヘキシル)エチルメチルジエトキシシラン、3−(3,4−エポキシシクロヘキシル)プロピルトリメトキシシラン、3−(3,4−エポキシシクロヘキシル)プロピルメチルジメトキシシラン、3−(3,4−エポキシシクロヘキシル)プロピルトリエトキシシラン、3−(3,4−エポキシシクロヘキシル)プロピルメチルジエトキシシラン、4−(3,4−エポキシシクロヘキシル)ブチルトリメトキシシラン、4−(3,4−エポキシシクロヘキシル)ブチルメチルジメトキシシラン、4−(3,4−エポキシシクロヘキシル)ブチルトリエトキシシラン、4−(3,4−エポキシシクロヘキシル)ブチルメチルジエトキシシラン、6−(3,4−エポキシシクロヘキシル)ヘキシルトリメトキシシラン、6−(3,4−エポキシシクロヘキシル)ヘキシルメチルジメトキシシラン、6−(3,4−エポキシシクロヘキシル)ヘキシルトリエトキシシラン、6−(3,4−エポキシシクロヘキシル)ヘキシルメチルジエトキシシラン、8−(3,4−エポキシシクロヘキシル)オクチルトリメトキシシラン、8−(3,4−エポキシシクロヘキシル)オクチルメチルジメトキシシラン、8−(3,4−エポキシシクロヘキシル)オクチルトリエトキシシラン、8−(3,4−エポキシシクロヘキシル)オクチルメチルジエトキシシラン、等の脂環エポキシ基含有シラン;
エポキシトリメトキシシラン、エポキシメチルジメトキシシラン、エポキシトリエトキシシラン、エポキシメチルジエトキシシラン、1−エポキシメチルトリメトキシシラン、1−エポキシメチルメチルジメトキシシラン、1−エポキシメチルトリエトキシシラン、1−エポキシメチルメチルジエトキシシラン、2−エポキシエチルトリメトキシシラン、2−エポキシエチルメチルジメトキシシラン、2−エポキシエチルトリエトキシシラン、2−エポキシエチルメチルジエトキシシラン、3−エポキシプロピルトリメトキシシラン、3−エポキシプロピルメチルジメトキシシラン、3−エポキシプロピルトリエトキシシラン、3−エポキシプロピルメチルジエトキシシラン、4−エポキシブチルトリメトキシシラン、4−エポキシブチルメチルジメトキシシラン、4−エポキシブチルトリエトキシシラン、4−エポキシブチルメチルジエトキシシラン、6−エポキシヘキシルトリメトキシシラン、6−エポキシヘキシルメチルジメトキシシラン、6−エポキシヘキシルトリエトキシシラン、6−エポキシヘキシルメチルジエトキシシラン、8−エポキシオクチルトリメトキシシラン、8−エポキシオクチルメチルジメトキシシラン、8−エポキシオクチルトリエトキシシラン、8−エポキシオクチルメチルジエトキシシラン、等のエポキシ基含有シラン、等が挙げられる。
臭化リチウム、臭化ナトリウム、臭化カリウム、臭化ルビジウム、臭化セシウム、臭化フランシウム、臭化ベリリウム、臭化マグネシウム、臭化カルシウム、臭化ストロンチウム、臭化バリウム、臭化ラジウム、臭化テトラメチルアンモニウム、臭化テトラエチルアンモニウム、臭化テトラプロピルアンモニウム、臭化テトラブチルアンモニウム、臭化テトラペンチルアンモニウム、臭化テトラヘキシルアンモニウム、臭化グアニジウム;
ヨウ化リチウム、ヨウ化ナトリウム、ヨウ化カリウム、ヨウ化ルビジウム、ヨウ化セシウム、ヨウ化フランシウム、ヨウ化ベリリウム、ヨウ化マグネシウム、ヨウ化カルシウム、ヨウ化ストロンチウム、ヨウ化バリウム、ヨウ化ラジウム、ヨウ化テトラメチルアンモニウム、ヨウ化テトラエチルアンモニウム、ヨウ化テトラプロピルアンモニウム、ヨウ化テトラブチルアンモニウム、ヨウ化テトラペンチルアンモニウム、ヨウ化テトラヘキシルアンモニウム、ヨウ化グアニジウム;
硫酸リチウム、硫酸ナトリウム、硫酸カリウム、硫酸ルビジウム、硫酸セシウム、硫酸フランシウム、硫酸ベリリウム、硫酸マグネシウム、硫酸カルシウム、硫酸ストロンチウム、硫酸バリウム、硫酸ラジウム、硫酸テトラメチルアンモニウム、硫酸テトラエチルアンモニウム、硫酸テトラプロピルアンモニウム、硫酸テトラブチルアンモニウム、硫酸テトラペンチルアンモニウム、硫酸テトラヘキシルアンモニウム、硫酸グアニジウム;
硝酸リチウム、硝酸ナトリウム、硝酸カリウム、硝酸ルビジウム、硝酸セシウム、硝酸フランシウム、硝酸ベリリウム、硝酸マグネシウム、硝酸カルシウム、硝酸ストロンチウム、硝酸バリウム、硝酸ラジウム、硝酸テトラメチルアンモニウム、硝酸テトラエチルアンモニウム、硝酸テトラプロピルアンモニウム、硝酸テトラブチルアンモニウム、硝酸テトラペンチルアンモニウム、硝酸テトラヘキシルアンモニウム、硝酸グアニジウム;
過塩素酸リチウム、過塩素酸ナトリウム、過塩素酸カリウム、過塩素酸ルビジウム、過塩素酸セシウム、過塩素酸フランシウム、過塩素酸ベリリウム、過塩素酸マグネシウム、過塩素酸カルシウム、過塩素酸ストロンチウム、過塩素酸バリウム、過塩素酸ラジウム、過塩素酸テトラメチルアンモニウム、過塩素酸テトラエチルアンモニウム、過塩素酸テトラプロピルアンモニウム、過塩素酸テトラブチルアンモニウム、過塩素酸テトラペンチルアンモニウム、過塩素酸テトラヘキシルアンモニウム、過塩素酸グアニジウム、等が挙げられる。これら中性塩は、単独でも使用することができるし、2種以上を組合せ使用することもできる。
本発明のエポキシ樹脂組成物に用いる硬化剤、すなわち、本発明に係る硬化性組成物が含有する硬化剤(B)としては、特に制限はなく、一般的にエポキシ樹脂硬化剤として知られているものはすべて使用できる。
好ましい硬化剤としては、例えば、酸無水物系硬化剤、カチオン重合開始剤、有機リン化合物、アミン系硬化剤、第3級アミン等が挙げられる。
本発明におけるエポキシ基を硬化せしめる硬化剤としては、耐熱性の観点から、酸無水物系硬化剤が好ましい。なお、酸無水物系硬化剤は、重合型及び付加型の複合型硬化剤に分類される。
本発明におけるエポキシ基を硬化せしめる硬化剤としては、得られる硬化物の耐摩耗性、耐薬品性等の物性の観点から、カチオン重合開始剤が好ましい。なお、カチオン重合開始剤は、重合型硬化剤に分類される。
本発明におけるエポキシ基を硬化せしめる硬化剤としては、硬化反応の促進の観点から、有機リン化合物が好ましい。なお、有機リン化合物は、重合型硬化剤に分類される。
本発明におけるエポキシ基を硬化せしめる硬化剤としては、入手しやすさとコストの観点から、アミン系硬化剤(ただし、第3級アミンを除く)が好ましい。なお、アミン系硬化剤は、付加型硬化剤に分類される。
本発明におけるエポキシ基を硬化せしめる硬化剤としては、入手しやすさとコストの観点から、第3級アミンが好ましい。なお、3級アミンは、重合型硬化剤に分類される。
本発明におけるエポキシ基を硬化せしめる硬化剤として、酸無水物系硬化剤、カチオン重合開始剤、有機リン化合物、アミン系硬化剤(ただし、第3級アミンを除く。)、第3級アミン等を挙げることができる。それら以外の硬化剤としては、例えば、アミド系硬化剤、フェノール系硬化剤、イミダゾール類、テトラフェニルボロン塩、有機酸ジヒドラジド、ハロゲン化ホウ素アミン錯体、ポリメルカプタン系硬化剤、イソシアネート系硬化剤、ブロックイソシアネート系硬化剤、等が挙げられる。
本発明のエポキシシラン縮合物を用いた硬化性組成物には、必要に応じて、金属酸化物微粒子(C)を使用することができる。金属酸化物粒子(C)を配合することにより、塗膜の耐摩耗性がさらに向上する場合がある。
本発明の硬化性組成物において、硬化剤(B)が光酸発生剤である場合には、光酸発生剤の感光性を向上させる目的で、必要に応じて、光増感剤(D)を用いることができる。光増感剤(D)は、使用する光酸発生剤では吸収できない波長域の光を吸収できるものがより効率的である為、光酸発生剤の吸収波長域との重なりが少ないものがよい。
本発明の硬化性組成物は、上記(A)、(B)成分を含有し、必要により(C)、(D)成分を含有するが、物性を調整する為に、さらに各種の添加剤を適宜配合してもよい。例えば、無機フィラー、無機顔料・有機顔料、可塑剤、分散剤、湿潤剤、増粘剤、消泡剤などの通常塗料に用いられる添加剤を添加することができる。
本発明の硬化物には、活性エネルギー線硬化性組成物を硬化させて得られるものが含まれる。つまり、本発明に係る硬化物は、本発明に係る硬化性組成物を硬化した物である。
活性エネルギー線の照射量が50mJ/cm2未満の場合、光量が少ないために硬化に時間がかかり、生産性が悪くなる場合がある。一方、活性エネルギー線の照射量が10,000mJ/cm2を超える場合、綺麗に硬化しなかったり、基材を傷める場合がある。
本発明の硬化性組成物を用いて、積層体を製造することができる。
R1−(SiR2a(OR3)3−a) (I)
(式中、R1は末端がエポキシ構造含有基で置換された炭素数1〜10のアルキル基であり、R2はそれぞれ独立して水素原子又は炭素数1〜10のアルキル基、炭素数6〜25のアリール基及び炭素数7〜12のアラルキル基から選ばれる1価の炭化水素基であり、R3はそれぞれ独立して水素原子又は炭素数1〜10のアルキル基である。aは0〜2の整数である。)で表される、加水分解性シリル基を有するシラン化合物(I)、及び、
下記一般式(II):
R4−(SiR2a(OR3)3−a) (II)
(式中、R4は炭素数1〜10の置換若しくは非置換のアルキル基、アルケニル基、並びに、置換アリール基から選ばれ、エポキシ構造含有基を有さない基である。R2はそれぞれ独立して水素原子又は炭素数1〜10のアルキル基、炭素数6〜25のアリール基及び炭素数7〜12のアラルキル基から選ばれる1価の炭化水素基であり、R3はそれぞれ独立して水素原子又は炭素数1〜10のアルキル基である。aは0〜2の整数である。)で表される、加水分解性シリル基を有するシラン化合物(II)を、
シラン化合物(I)に対するシラン化合物(II)のモル比を9以下として中性塩触媒下で加水分解・縮合させて得られる重量平均分子量30,000以下の縮合物(A)および、
エポキシ基を硬化せしめる硬化剤(B)を含有し、
縮合物(A)の原料であるシラン化合物(I)および(II)が有するケイ素原子に直接結合したOR3基のモル数Xに対する、縮合物(A)が有するケイ素原子に直接結合したOR3基のモル数Yの比Y/Xが0.2以下であることを特徴とする硬化性組成物。
○加水分解性シリル基を有するシラン化合物(I)
A−186:モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社製、2−(3,4−エポキシシクロヘキシル)エチルトリメトキシシラン、分子量246.3
A−187:モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社製、3−グリシドキシプロピルトリメトキシシラン、分子量236.3
○加水分解性シリル基を有するシラン化合物(II)
A−174:モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社製、3−メタクリロキシプロピルトリメトキシシラン、分子量248.4
A−171:モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社製、ビニルトリメトキシシラン、分子量148.2
A−1630:モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社製、メチルトリメトキシシラン、分子量136.2
A−189:モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社製、3−メルカプトプロピルトリメトキシシラン、分子量196.3
KBM−5103:信越化学工業株式会社製、3−アクリロイルオキシプロピルトリメトキシシラン、分子量234.3
○中性塩
塩化マグネシウム(和光純薬工業株式会社製、特級、分子量95.2)
塩化ナトリウム(和光純薬工業株式会社製、特級、分子量58.4)
○エポキシ硬化剤(B)(エポキシ基を硬化せしめる硬化剤(B))
ピロリメット酸無水物:東京化成工業株式会社製、分子量218.2
CPI−101A:サンアプロ株式会社製、トリアリールスルホニウム・SbF6塩
ヘキサメチレンジアミン:東京化成工業株式会社製、分子量116.2
ベンジルジメチルアミン:東京化成工業株式会社製、分子量135.1
○希釈溶剤
PGME:1−メトキシ−2−プロパノール(株式会社ダイセル製、分子量90)
メタノール:三菱ガス化学株式会社製、分子量32
○その他
HCl:塩酸(和光純薬工業株式会社製、0.01モル/L)
ギ酸:和光純薬工業株式会社製、0.01モル/L
TEA:トリエチルアミン(和光純薬工業株式会社製、分子量101.2)
2−ヒドロキシ−2−メチルプロピオフェノン:東京化成工業株式会社製、分子量164.2
DPHA:ジペンタエリスリトールヘキサアクリレート(新中村化学工業株式会社製、分子量578)
V−8804:オルガノシリカゾルのPGME分散液(日揮触媒化成株式会社製、不揮発分40%)
合成例で得られた縮合物に対する評価は、以下のとおりである。
以下の方法により、反応前後のシラン化合物中のケイ素に直接結合したOR基を測定して、Y/X比を算出した。日本電子製JNM−LA400を用いて、重アセトンを溶媒として1H−NMRおよび29Si−NMR測定を行った。
重量平均分子量は、GPCで測定した。すなわち、送液システムとして東ソー(株)製HLC−8220GPCを用い、カラムとして東ソー(株)製TSK−GEL Hタイプを用い、溶媒としてTHFを用い、ポリスチレン換算で算出した。
得られた縮合物に対して、日本電子製JNM−LA400を用いて、重アセトンを溶媒として1H−NMR測定を行った。結果は「残存エポキシ率」として表1に示した。
硬化塗膜上に1mm間隔のクロスカット10×10の100マスとなるようにカッターで切り込みを入れ、切り込み上にニチバン製セロハンテープ(登録商標)を貼り付け、90度上方に勢い良く剥離させ、基材から硬化塗膜が剥がれないか目視にて観察した。完全に密着している場合を100点、完全に剥離した場合を0点とし、1マス当り1点で点数評価した。
マイズ試験機製テーバー式アブレーションテスター(磨耗輪CS−10F使用)を用いて硬化皮膜の磨耗試験(500gf荷重500回転)を行い、磨耗試験前後の硬化皮膜の濁度を、ヘーズメーターを用いて測定し、〔磨耗試験後の濁度−磨耗試験前の濁度〕の値をΔHazeとした(ΔHazeは15以下の場合に耐磨耗性は良好である)。
JIS K5600に準拠して、鉛筆硬度を評価した。鉛筆硬度試験は、6B〜9Hまでの硬さの異なる鉛筆を使って750g加重で塗膜上に線を引くように動かして、傷が付いた際に用いていた鉛筆のランク(例えば3Hなど)を記載するというものである。硬度がHB以上であれば、製造上問題となることがないため、結果は良好であると言える。
硬化塗膜上に0.05Nの水酸化ナトリウム水溶液0.5mLをスポットし、水分が揮発しないようにキャップし、55℃で4時間加熱した後、水酸化ナトリウム水溶液を拭き取り、スポット痕の有無を○×で評価した。
熱風乾燥機を用いて110℃で24時間加熱した後に、塗膜にクラックが入っていないか目視にて観察し、○×で評価した。
得られた積層体の塗膜面が上面となるように、積層体を水平な台の上に設置した。積層体の上面の4つの頂点のそれぞれについて、台の上面から垂直方向の距離を測定し、その平均値を算出した。積層体が塗装した面側に反る(積層体の下面の角が台の面から浮く)場合には正の値、その逆の場合には負の値とした。なお、基材のPCシートを単独、同条件で評価した反りの結果は、0mmであった。
表1に記載の配合物(配合量の単位は重量部)を、攪拌機、温度計、還流冷却器を備えた反応器に仕込み、表1に記載の反応温度、反応時間で撹拌させて、縮合物を得た。得られた縮合物は、エバポレータを用いて減圧脱揮及び濃縮し、PGMEを用いて50%溶液に調整した。得られた縮合物に対する評価結果を、表1に示す。
[塗工液の作製]
縮合物として合成例1[A−187(3−グリシジルオキシプロピルトリメトキシシラン)の縮合物(50%溶液)]100重量部に対して、硬化剤としてピロメリット酸無水物32.6重量部を配合し、塗工液を調製した。なお、塗工液は、不揮発分が40%になるように、希釈溶剤としてPGME(1−メトキシ−2−プロパノール)73.9重量部を用いて希釈したものを使用した。
得られた塗工液を、住友ベークライト製ポリカーボネート(EC−100、1.0mm厚)上に、バーコータ#20を用いて、乾燥膜厚が約12μmとなるように塗布した。次いで、熱風乾燥機を用いて120℃で1時間かけて、希釈溶剤の除去と硬化反応を同時に完了させ(以下、「熱硬化」と称する。)、試験片とした。得られた試験片に対する物性評価結果を、表2に示す。
[塗工液の作製]
硬化剤の種類および量をCPI−101A(トリアリールスルホニウム 6フッ化アンチモン酸塩)2.5重量部に、PGMEの量を28.8重量部に変更した以外は、実施例1と同様の操作により、塗工液を得た。
得られた塗工液を、住友ベークライト製ポリカーボネート(EC−100、1.0mm厚)上に、バーコータ#20を用いて、乾燥膜厚が約12μmとなるように塗布した。次いで、希釈溶剤を除去する為に熱風乾燥機を用いて120℃で2分間加熱した後、空気中で高圧水銀ランプを用い、240mWで、波長310〜390nmの積算光量が1000mJ/cm2となるように紫外線を照射することで硬化させ(以下、「紫外線硬化」と称する。)、試験片とした。得られた試験片に対する物性評価結果を、表2に示す。
[塗工液の作製]において、硬化剤の種類および量をヘキサメチレンジアミン6.9重量部に、PGMEの量を35.4重量部に変更して、塗工液を得た以外は、実施例1と同様の操作により、熱硬化により試験片を得た。得られた試験片に対する物性評価結果を、表2に示す。
[塗工液の作製]において、硬化剤の種類および量をベンジルジメチルアミン32.3重量部、PGMEの量を73.5重量部に変更して、塗工液を得た以外は、実施例1と同様の操作により、熱硬化により試験片を得た。得られた試験片に対する物性評価結果を、表2に示す。
[塗工液の作製]において、縮合物を合成例2[A−187(80モル%)/A−1630メチルトリメトキシシラン(20モル%)]に変更して、塗工液を得た以外は、実施例2と同様の操作により、紫外線硬化により試験片を得た。得られた試験片に対する物性評価結果を、表2に示す。
[塗工液の作製]において、縮合物を合成例3[A−187(20モル%)/A−1630(80モル%)]に変更して、塗工液を得た以外は、実施例2と同様の操作により、紫外線硬化により試験片を得た。得られた試験片に対する物性評価結果を、表2に示す。
[塗工液の作製]において、縮合物を合成例4[A−187(10モル%)/A−1630(90モル%)]に変更して、塗工液を得た以外は、実施例2と同様の操作により、紫外線硬化により試験片を得た。得られた試験片に対する物性評価結果を、表2に示す。
[塗工液の作製]において、縮合物を合成例5[A−187(80モル%)/A−171(ビニルトリメトキシシラン(20モル%))]に変更して、塗工液を得た以外は、実施例2と同様の操作により、紫外線硬化により試験片を得た。得られた試験片に対する物性評価結果を、表2に示す。
[塗工液の作製]において、縮合物を合成例6[A−187(80モル%)/A−174(3−メタクリロイルオキシトリメトキシシラン(20モル%))に、PGMEの量を30.3重量部に、硬化剤の種類および量を、CPI−101A(トリアリールスルホニウム 6フッ化アンチモン酸塩)2.5重量部および2−ヒドロキシ−2−プロピオフェノン1.0重量部に変更して、塗工液を得た以外は、実施例2と同様の操作により、紫外線硬化により試験片を得た。得られた試験片に対する物性評価結果を、表2に示す。
[塗工液の作製]において、縮合物を合成例7[A−187(80モル%)/KBM5103(20モル%)]に変更して、塗工液を得た以外は、実施例9と同様の操作により、紫外線硬化により試験片を得た。得られた試験片に対する物性評価結果を、表2に示す。
[塗工液の作製]において、縮合物を合成例8[A−186(2−(3,4−エポキシシクロヘキシル)エチルトリメトキシシラン)]に変更して、塗工液を得た以外は、実施例2と同様の操作により、紫外線硬化により試験片を得た。得られた試験片に対する物性評価結果を、表2に示す。
[塗工液の作製]において、縮合物を合成例9[A−187(50モル%)/A−186(50モル%)]に変更して、塗工液を得た以外は、実施例2と同様の操作により、紫外線硬化により試験片を得た。得られた試験片に対する物性評価結果を、表2に示す。
[塗工液の作製]において、縮合物を合成例10[A−186(80モル%)/A−189(3−メルカプトプロピルトリメトキシシラン(20モル%)]に変更して、塗工液を得た以外は、実施例2と同様の操作により、紫外線硬化により試験片を得た。得られた試験片に対する物性評価結果を、表2に示す。
[塗工液の作製]において、縮合物を合成例11[合成触媒を塩化マグネシウムから塩化ナトリウムに変更]に変更して、塗工液を得た以外は、実施例2と同様の操作により、紫外線硬化により試験片を得た。得られた試験片に対する物性評価結果を、表2に示す。
[塗工液の作製]において、合成例1の縮合物70重量部にV−8804(日揮触媒化成株式会社製シリカゾル)30重量部を配合して、塗工液を得た以外は、実施例2と同様の操作により、紫外線硬化により試験片を得た。得られた試験片に対する物性評価結果を、表2に示す。
[塗工液の作製]において、縮合物を合成例12[A−187を縮合触媒としてHClを用いた縮合物]100重量部に、硬化剤の量を27.0重量部に、PGMEの量を65.5重量部に変更して、塗工液を得た以外は、実施例1と同様の操作により、熱硬化により試験片を得た。得られた試験片に対する物性評価結果を、表3に示す。
[塗工液の作製]において、縮合物を合成例12に変更して、塗工液を得た以外は、実施例2と同様の操作により、紫外線硬化により試験片を得た。得られた試験片に対する物性評価結果を、表3に示す。
[塗工液の作製]において、縮合物を合成例12に変更して、塗工液を得た以外は、実施例3と同様の操作により、熱硬化により試験片を得た。得られた試験片に対する物性評価結果を、表3に示す。
[塗工液の作製]において、縮合物を合成例12に、硬化剤ベンジルジメチルアミンの量を26.8重量部に変更して、塗工液を得た以外は、実施例4と同様の操作により、熱硬化により試験片を得た。得られた試験片に対する物性評価結果を、表3に示す。
[塗工液の作製]において、縮合物を合成例13[縮合触媒がギ酸]に変更して、塗工液を得た以外は、実施例2と同様の操作により、紫外線硬化により試験片を得た。得られた試験片に対する物性評価結果を、表3に示す。
[塗工液の作製]において、縮合物を合成例15[縮合触媒無し]に変更して、塗工液を得た以外は、実施例2と同様の操作により、紫外線硬化により試験片を得た。得られた試験片に対する物性評価結果を、表3に示す。
[塗工液の作製]において、縮合物を合成例17[A187(5モル%)/A−1630(95モル%)]に変更して、塗工液を得た以外は、実施例2と同様の操作により、紫外線硬化により試験片を得た。得られた試験片に対する物性評価結果を、表3に示す。
[塗工液の作製]において、縮合物を合成例18[A187(5モル%)/KBM−5103(95モル%)]に変更して、塗工液を得た以外は、実施例2と同様の操作により、紫外線硬化により試験片を得た。得られた試験片に対する物性評価結果を、表3に示す。
[塗工液の作製]において、多官能アクリレートとしてDPHA(ジペンタエリスリトールヘキサアクリレート)100重量部を用いて、硬化剤として2−ヒドロキシ−2−プロピオフェノン3.0重量部、希釈剤としてPGME154.5重量部を配合して、塗工液を得た以外は、実施例2と同様の操作により、紫外線硬化により試験片を得た。
得られた試験片に対する物性評価結果を、表3に示す。
本発明のエポキシシラン縮合物を用いた硬化性組成物には、必要に応じて、金属酸化物微粒子(C)を使用することができる。金属酸化物微粒子(C)を配合することにより、塗膜の耐摩耗性がさらに向上する場合がある。
○加水分解性シリル基を有するシラン化合物(I)
A−186:モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社製、2−(3,4−エポキシシクロヘキシル)エチルトリメトキシシラン、分子量246.3
A−187:モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社製、3−グリシドキシプロピルトリメトキシシラン、分子量236.3
○加水分解性シリル基を有するシラン化合物(II)
A−174:モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社製、3−メタクリロキシプロピルトリメトキシシラン、分子量248.4
A−171:モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社製、ビニルトリメトキシシラン、分子量148.2
A−1630:モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社製、メチルトリメトキシシラン、分子量136.2
A−189:モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社製、3−メルカプトプロピルトリメトキシシラン、分子量196.3
KBM−5103:信越化学工業株式会社製、3−アクリロイルオキシプロピルトリメトキシシラン、分子量234.3
○中性塩
塩化マグネシウム(和光純薬工業株式会社製、特級、分子量95.2)
塩化ナトリウム(和光純薬工業株式会社製、特級、分子量58.4)
○エポキシ硬化剤(B)(エポキシ基を硬化せしめる硬化剤(B))
ピロメリット酸無水物:東京化成工業株式会社製、分子量218.2
CPI−101A:サンアプロ株式会社製、トリアリールスルホニウム・SbF6塩
ヘキサメチレンジアミン:東京化成工業株式会社製、分子量116.2
ベンジルジメチルアミン:東京化成工業株式会社製、分子量135.1
○希釈溶剤
PGME:1−メトキシ−2−プロパノール(株式会社ダイセル製、分子量90)
メタノール:三菱ガス化学株式会社製、分子量32
○その他
HCl:塩酸(和光純薬工業株式会社製、0.01モル/L)
ギ酸:和光純薬工業株式会社製、0.01モル/L
TEA:トリエチルアミン(和光純薬工業株式会社製、分子量101.2)
2−ヒドロキシ−2−メチルプロピオフェノン:東京化成工業株式会社製、分子量164.2
DPHA:ジペンタエリスリトールヘキサアクリレート(新中村化学工業株式会社製、分子量578)
V−8804:オルガノシリカゾルのPGME分散液(日揮触媒化成株式会社製、不揮発分40%)
合成例で得られた縮合物に対する評価は、以下のとおりである。
Claims (13)
- 下記一般式(I):
R1−(SiR2 a(OR3)3−a) (I)
(式中、R1は末端がエポキシ構造含有基で置換された炭素数1〜10のアルキル基であり、R2はそれぞれ独立して水素原子又は炭素数1〜10のアルキル基、炭素数6〜25のアリール基及び炭素数7〜12のアラルキル基から選ばれる1価の炭化水素基であり、R3はそれぞれ独立して水素原子又は炭素数1〜10のアルキル基である。aは0〜2の整数である。)で表される、加水分解性シリル基を有するシラン化合物(I)、及び、
下記一般式(II):
R4−(SiR2 a(OR3)3−a) (II)
(式中、R4は炭素数1〜10の置換若しくは非置換のアルキル基、アルケニル基、並びに、置換アリール基から選ばれ、エポキシ構造含有基を有さない基である。R2はそれぞれ独立して水素原子又は炭素数1〜10のアルキル基、炭素数6〜25のアリール基及び炭素数7〜12のアラルキル基から選ばれる1価の炭化水素基であり、R3はそれぞれ独立して水素原子又は炭素数1〜10のアルキル基である。aは0〜2の整数である。)で表される、加水分解性シリル基を有するシラン化合物(II)を、
シラン化合物(I)に対するシラン化合物(II)のモル比を9以下として中性塩触媒の存在下で加水分解及び縮合させて得られる重量平均分子量30,000以下の縮合物(A)および、
エポキシ基を硬化せしめる硬化剤(B)を含有し、
縮合物(A)の原料であるシラン化合物(I)および(II)が有するケイ素原子に直接結合したOR3基のモル数Xに対する、縮合物(A)が有するケイ素原子に直接結合したOR3基のモル数Yの比Y/Xが0.2以下であることを特徴とする、硬化性組成物。 - 上記中性塩触媒が、第一族元素イオン、第二族元素イオン、テトラアルキルアンモニウムイオン、及びグアニジウムイオンよりなる群から選ばれるいずれかのカチオンと、
フッ化物イオンを除く第十七族元素イオン、硫酸イオン、硝酸イオン、及び過塩素酸イオンよりなる群から選ばれるいずれかのアニオンとの組合せからなる塩である、請求項1に記載の硬化性組成物。 - 上記中性塩触媒が、第一族元素イオン及び第二族元素イオンよりなる群から選ばれるいずれかのカチオンと、塩化物イオン、臭化物イオン、及びヨウ化物イオンよりなる群から選ばれるいずれかのアニオンとの組合せからなる塩である、請求項1または2に記載の硬化性組成物。
- 上記硬化剤(B)がエポキシ基をカチオン重合せしめる酸発生剤であることを特徴とする、請求項1〜3のいずれか1項に記載の硬化性組成物。
- 上記硬化剤(B)が、フルオロフォスフェート基、フルオロアンチモネート基、または、フルオロボレート基を含む化合物であることを特徴とする、請求項1〜4のいずれか1項に記載の硬化性組成物。
- 更に、平均粒子径が100nm以下の金属酸化物微粒子(C)を含有することを特徴とする、請求項1〜5のいずれか1項に記載の硬化性組成物。
- 上記金属酸化物微粒子(C)がシリカ微粒子であることを特徴とする、請求項6に記載の硬化性組成物。
- 上記硬化剤(B)がエポキシ基を重合せしめる硬化剤の場合には、上記縮合物(A)100重量部に対して上記硬化剤(B)を0.5〜10重量部、
上記硬化剤(B)がエポキシ基に対して付加することでエポキシ基を硬化せしめる硬化剤の場合には、上記縮合物(A)100重量部に対して上記硬化剤(B)を10〜150重量部含有し、
金属酸化物微粒子(C)を上記縮合物(A)100重量部に対して0〜150重量部含有することを特徴とする、請求項1〜7のいずれか1項に記載の硬化性組成物。 - 上記硬化剤(B)が、トリフェニルスルホニウム基、ジフェニルスルホニウム基、及びジフェニルヨードニウム基よりなる群から選ばれる少なくとも1種を含有する化合物であることを特徴とする、請求項1〜8のいずれか1項に記載の硬化性組成物。
- 上記硬化剤(B)が、活性エネルギー線が照射された上記硬化性組成物のエポキシ基を硬化せしめる硬化剤であることを特徴とする、請求項1〜9のいずれか1項に記載の硬化性組成物。
- 請求項1〜10のいずれか1項に記載の硬化性組成物を硬化させて得られることを特徴とする、硬化物。
- 請求項1〜10のいずれか1項に記載の硬化性組成物を基材に塗布する工程と、当該硬化性組成物を硬化させ、硬化被膜を形成する工程と、を含むことを特徴とする、積層体の製造方法。
- 請求項12に記載の製造方法により得られることを特徴とする、積層体。
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