JPWO2016039299A1 - 多孔質ポリイミド膜の製造方法 - Google Patents
多孔質ポリイミド膜の製造方法 Download PDFInfo
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- JPWO2016039299A1 JPWO2016039299A1 JP2016547435A JP2016547435A JPWO2016039299A1 JP WO2016039299 A1 JPWO2016039299 A1 JP WO2016039299A1 JP 2016547435 A JP2016547435 A JP 2016547435A JP 2016547435 A JP2016547435 A JP 2016547435A JP WO2016039299 A1 JPWO2016039299 A1 JP WO2016039299A1
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- Prior art keywords
- film
- composite film
- polyimide
- unfired composite
- fine particles
- Prior art date
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Abstract
Description
本発明で用いるワニス(以下、「多孔質ポリイミド膜製造用ワニス」ともいう。)は、ポリアミド酸及び/又はポリイミドからなる樹脂と、微粒子と、溶剤とを含有する。多孔質ポリイミド膜製造用ワニスにおいて、上記微粒子の含有量は、多孔質ポリイミド膜の目的とする空孔率に応じて適宜調整すればよく、上記樹脂と上記微粒子との合計に対して、例えば、35体積%以上であり、50体積%以上であることが好ましく、60体積%以上であることがより好ましく、65体積%以上であることが更により好ましい。また、多孔質ポリイミド膜製造用ワニスの25℃における粘度は、550mPa・s以上であることが好ましい。
上記微粒子の含有量の上限は上記樹脂と上記微粒子との合計に対して、例えば、85体積%以下であり、80体積%以下であることが好ましい。上記微粒子の含有量の上限が上記範囲内であると、微粒子同士が凝集しにくく、また、表面にひび割れ等が生じにくいため、安定して電気特性の良好な多孔質ポリイミド膜を形成することができる。
なお、本明細書において、体積%及び体積比は、25℃における値である。
なお、粘度は、E型粘度計により測定される。
本発明で用いるポリアミド酸は、任意のテトラカルボン酸二無水物とジアミンとを重合して得られるものが、特に限定されることなく使用できる。テトラカルボン酸二無水物及びジアミンの使用量は特に限定されないが、テトラカルボン酸二無水物1モルに対して、ジアミンを0.50〜1.50モル用いるのが好ましく、0.60〜1.30モル用いるのがより好ましく、0.70〜1.20モル用いるのが特に好ましい。
ポリアミド酸は、単独で用いてもよく、2種以上を組み合わせて用いてもよい。
本発明で用いるポリイミドは、本発明で用いるワニスに使用する溶剤に溶解可能な可溶性ポリイミドなら、その構造や分子量が限定されることはなく、公知のものが使用できる。ポリイミドについて、側鎖にカルボキシ基等の縮合可能な官能基又は焼成時に架橋反応等を促進させる官能基を有していてもよい。
ポリイミドは、単独で用いてもよく、2種以上を組み合わせて用いてもよい。
本発明で用いられる微粒子の材質は、ワニスに使用する溶剤に不溶で、後にポリイミド膜から除去可能なものであれば、特に限定されることなく公知のものが採用可能である。例えば、無機材料としては、シリカ(二酸化珪素)、酸化チタン、アルミナ(Al2O3)等の金属酸化物、有機材料としては、高分子量オレフィン(ポリプロピレン,ポリエチレン等)、ポリスチレン、エポキシ樹脂、セルロース、ポリビニルアルコール、ポリビニルブチラール、ポリエステル、ポリエーテル等の有機高分子微粒子が挙げられる。
微粒子は、単独で用いてもよく、2種以上を組み合わせて用いてもよい。
本発明で用いられる溶剤としては、ポリアミド酸及び/又はポリイミドからなる樹脂を溶解することができ、微粒子を溶解しないものであれば、特に限定されず、テトラカルボン酸二無水物とジアミンとの反応に用いる溶剤として例示したものが挙げられる。溶剤は、単独で用いてもよく、2種以上を組み合わせて用いてもよい。
本発明では、ワニス中の微粒子を均一に分散することを目的に、微粒子とともに更に分散剤を添加してもよい。分散剤を添加することにより、ポリアミド酸及び/又はポリイミドからなる樹脂と微粒子とを一層均一に混合でき、更には、成形又は成膜した前駆体膜中の微粒子を均一に分布させることができる。その結果、最終的に得られる多孔質ポリイミドの表面に稠密な開口を設け、かつ、表裏面を効率よく連通させることが可能となり、フィルムの透気度が向上する。更に、分散剤を添加することにより、多孔質ポリイミド膜製造用ワニスの乾燥性が向上しやすくなり、また、形成された未焼成複合膜の基材等からの剥離性が向上しやすくなる。
本発明に係る多孔質ポリイミド膜の製造方法は、ポリアミド酸及び/又はポリイミドからなる樹脂と、微粒子と、溶剤とを含有するワニスを用いて、未焼成複合膜を成膜する未焼成複合膜成膜工程と、上記未焼成複合膜を水を含む溶剤に浸漬する浸漬工程と、上記未焼成複合膜を焼成してポリイミド−微粒子複合膜を得る焼成工程と、上記ポリイミド−微粒子複合膜から微粒子を取り除く微粒子除去工程と、を上記の順序で含む。
以下、本発明における未焼成複合膜の成膜方法について説明する。未焼成複合膜成膜工程においては、多孔質ポリイミド膜製造用ワニスを用いて、未焼成複合膜を成膜する。その際、未焼成複合膜は、基材上に成膜してもよいし、上記未焼成複合膜とは異なる下層膜上に成膜してもよい。未焼成複合膜は、例えば、基材上又は上記下層膜上に、多孔質ポリイミド膜製造用ワニスを塗布し、常圧又は真空下で0〜100℃、好ましくは常圧10〜100℃で乾燥することにより、形成することができる。
基材としては、例えば、PETフィルム、SUS基材、ガラス基材等が挙げられる。
浸漬工程においては、上記未焼成複合膜を水を含む溶剤に浸漬する。未焼成複合膜中には、通常、その製造に用いた製造用溶剤が残存している。製造用溶剤が残存したままで未焼成複合膜を焼成すると、膜中の製造用溶剤の分布にムラが発生しやすく、結果として、ポリイミド−微粒子複合膜にカールが発生しやすくなる。一方、未焼成複合膜を水を含む溶剤に浸漬すると、未焼成複合膜中に残存する製造用溶剤が上記水を含む溶剤中に溶け出し、未焼成複合膜中に残存する製造用溶剤の量が減少する。その結果、膜中の製造用溶剤の分布にムラが発生しにくくなり、ポリイミド−微粒子複合膜にカールが発生することが抑制されやすくなる。
本発明に係る多孔質ポリイミド膜の製造方法は、更に、上記浸漬工程と上記焼成工程との間に、上記浸漬工程後の未焼成複合膜をプレスするプレス工程を含んでもよい。浸漬工程後の未焼成複合膜をプレスすることにより、この未焼成複合膜を焼成して得たポリイミド−微粒子複合膜においては、シワ(ムラやうねり)の発生が抑制されやすくなる。
本発明に係る多孔質ポリイミド膜の製造方法は、更に、上記浸漬工程と上記焼成工程との間に、上記浸漬工程後の未焼成複合膜を乾燥させる乾燥工程を含んでもよい。浸漬工程後の未焼成複合膜を乾燥させることにより、この未焼成複合膜を焼成して得たポリイミド−微粒子複合膜においては、カールやシワ(ムラやうねり)の発生が抑制されやすくなる。
上記未焼成複合膜に加熱による後処理(焼成)を行ってポリイミドと微粒子とからなる複合膜(ポリイミド−微粒子複合膜)とする。上記未焼成複合膜成膜工程において、上記未焼成複合膜とは異なる下層膜上に上記未焼成複合膜を成膜した場合には、焼成工程において、上記未焼成複合膜とともに上記下層膜も焼成する。焼成工程における焼成温度は、未焼成複合膜及び下層膜の構造や縮合剤の有無によっても異なるが、例えば、120〜450℃であり、120〜400℃であることが好ましく、120〜375℃であることがより好ましく、更に好ましくは150〜350℃である。また、微粒子に、有機材料を使用するときは、その熱分解温度よりも低い温度に設定する必要がある。焼成工程においてはイミド化を完結させることが好ましい。
ポリイミド−微粒子複合膜から、微粒子を適切な方法を選択して除去することにより、多孔質ポリイミド膜を再現性よく製造することができる。
本発明に係る多孔質ポリイミド膜の製造方法は、微粒子除去工程前に、ポリイミド−微粒子複合膜のポリイミド部分の少なくとも一部を除去するか、又は、微粒子除去工程後に多孔質ポリイミド膜の少なくとも一部を除去するポリイミド除去工程を含んでもよい。微粒子除去工程前に、ポリイミド−微粒子複合膜のポリイミド部分の少なくとも一部を除去することにより、続く微粒子除去工程で微粒子が取り除かれ空孔が形成された場合に、上記ポリイミド部分の少なくとも一部を除去しないものに比べて、最終製品の多孔質ポリイミド膜の開孔率を向上させることが可能となる。また、微粒子除去工程後に多孔質ポリイミド膜の少なくとも一部を除去することにより、上記多孔質ポリイミド膜の少なくとも一部を除去しないものに比べて、最終製品の多孔質ポリイミド膜の開孔率を向上させることが可能となる。
本発明に係る製造方法で作製した多孔質ポリイミド膜は、リチウムイオン電池のセパレータや燃料電池電解質膜、ガス又は液体の分離用膜、低誘電率材料として使用することが可能である。上記多孔質ポリイミド膜は、ニッケルカドミウム、ニッケル水素電池、リチウムイオン二次電池等の二次電池用セパレータとして使用することが可能であるが、リチウムイオン二次電池用多孔質セパレータとして使用することが特に好ましい。特に、リチウムイオン電池のセパレータとして使用する場合、上記未焼成複合膜成膜工程において、上記未焼成複合膜とは異なる下層膜上に上記未焼成複合膜を成膜し、上記下層膜として、上記下層膜製造用ワニスを用いて成膜したものを用い、上記下層膜側の面をリチウムイオン電池の負極面側とすることにより、電池性能を向上させることができる。
本発明における二次電池は、負極と正極との間に、電解液と本発明に係る製造方法で作製した多孔質ポリイミド膜からなるセパレータとが配置されることを特徴とする。
・ポリアミド酸溶液:テトラカルボン酸二無水物(ピロメリット酸二無水物)とジアミン(4,4’−ジアミノジフェニルエーテル)との反応物(反応溶媒:N,N−ジメチルアセトアミド)
・分散剤:ポリオキシエチレン二級アルキルエーテル系分散剤
・微粒子
シリカ1:平均粒径300nmのシリカ
シリカ2:平均粒径700nmのシリカ
(1)第一のワニス(下層膜用ワニス)
ポリアミド酸溶液(ポリアミド酸換算:15質量部)に対し、シリカ1(85質量部)と、N,N−ジメチルアセトアミド及びγ−ブチロラクトンの各有機溶剤とを添加し(その際、ワニス中の有機溶剤比(N,N−ジメチルアセトアミド:γ−ブチロラクトン)が90:10(質量比)となるように、有機溶剤の添加量を調整した。)、各成分を混合、撹拌して、ポリアミド酸と微粒子との体積比を22:78(質量比は15:85)とした第一のワニスを調製した。
ポリアミド酸溶液(ポリアミド酸換算:19.6質量部)とシリカ2(80質量部)と分散剤(0.4質量部)とを混合し、必要に応じてN,N−ジメチルアセトアミド及びγ−ブチロラクトンの各有機溶剤を追加で添加し(その際、ワニス中の有機溶剤比(N,N−ジメチルアセトアミド:γ−ブチロラクトン)が90:10(質量比)となるように、有機溶剤の添加量を調整した。)、35質量%の固形分濃度を有する第二のワニスを調製した。
上記の第二のワニスをPETフィルム上にアプリケーターを用いて塗布し、70℃で5分間プリベークして、膜厚約25μmの未焼成複合膜(単層)を形成した。
上記の第一のワニスをPETフィルム上にアプリケーターを用いて塗布し、70℃で1分間プリベークして、膜厚約3μmの下層未焼成複合膜を成膜した。続いて、そのうえに第二のワニスを、アプリケーターを用い成膜した。70℃で5分間プリベークして、膜厚25μmの未焼成複合膜を形成した。
上記PETフィルムから上記(二層)の未焼成複合膜を剥離した後、500gの水に3分間浸漬した。その後、2本のロール間に未焼成複合膜を通して、未焼成複合膜をプレスした。その際、ロール抑え圧は3.0kg/cm2、ロール温度は室温、未焼成複合膜の移動速度は0.5m/minであった。プレス後の未焼成複合膜に対し320℃で15分間熱処理(焼成)を施し、イミド化を完結させて、ポリイミド−微粒子複合膜を得た。このポリイミド−微粒子複合膜を10質量%HF溶液中に10分間浸漬することで、膜中に含まれる微粒子を除去して、多孔質ポリイミド膜を得た。アルカリ性のエッチング液に、この多孔質ポリイミド膜を20秒間浸漬してポリイミド表面の一部を除去することで、ケミカルエッチング(以下、「CE」という場合がある。)を行った。なお、上記エッチング液の作製は、TMAHの2.38質量%水溶液をメタノール50質量%水溶液で1.04%となるように希釈することで行った。
実施例1において、500gの水に3分間浸漬後に、未焼成複合膜をプレスせず、約1時間自然乾燥させた未焼成複合膜を直接イミド化させた以外は、実施例1と同様にして、ポリイミド−微粒子複合膜及び多孔質ポリイミド膜の取得、並びにケミカルエッチングを行った。
実施例1において、ロール温度を80℃に設定した以外は、実施例1と同様にして、ポリイミド−微粒子複合膜及び多孔質ポリイミド膜の取得、並びにケミカルエッチングを行った。なお、実施例3では、(単層)の未焼成複合膜の評価も同様に行った。
実施例1において、PETフィルムから剥離した未焼成複合膜に対し、水に3分間浸漬させる工程及びプレス工程を行うことなく、直接イミド化させ、ケミカルエッチングの時間を20秒から80秒に変更した以外は、実施例1と同様にして、ポリイミド−微粒子複合膜及び多孔質ポリイミド膜の取得、並びにケミカルエッチングを行った。
実施例1において、PETフィルムから剥離した未焼成複合膜に対し、水に3分間浸漬させる工程を行うことなく、直接2本のロール間に通して未焼成複合膜をプレスし、ケミカルエッチングの時間を20秒から80秒に変更した以外は、実施例1と同様にして、ポリイミド−微粒子複合膜及び多孔質ポリイミド膜の取得、並びにケミカルエッチングを行った。
実施例1において、PETフィルムから剥離した未焼成複合膜に対し、水に3分間浸漬させる工程及びプレス工程を行うことなく、直接24時間自然乾燥させ、自然乾燥させた未焼成複合膜を直接イミド化させ、ケミカルエッチングの時間を20秒から80秒に変更した以外は、実施例1と同様にして、ポリイミド−微粒子複合膜及び多孔質ポリイミド膜の取得、並びにケミカルエッチングを行った。
上記PETフィルムから上記(二層)の未焼成複合膜を剥離した後、500gの水を含む溶剤(質量比がイソプロパノール:水=10:90)に3分間浸漬した。その後、2本のロール間に未焼成複合膜を通して、未焼成複合膜をプレスした。その際、ロール抑え圧は3.0kg/cm2、ロール温度は80℃、未焼成複合膜の移動速度は0.5m/minであった。プレス後の未焼成複合膜に対し320℃で15分間熱処理(焼成)を施し、イミド化を完結させて、ポリイミド−微粒子複合膜を得た。このポリイミド−微粒子複合膜を10質量%HF溶液中に10分間浸漬することで、膜中に含まれる微粒子を除去して、多孔質ポリイミド膜を得た。実施例1と同様に、ケミカルエッチングを行った。
上記PETフィルムから上記(二層)の未焼成複合膜を剥離した後、500gの水を含む溶剤(質量比がN,N−ジメチルアセトアミド:水=10:90)に3分間浸漬した。その後、2本のロール間に未焼成複合膜を通して、未焼成複合膜をプレスした。その際、ロール抑え圧は3.0kg/cm2、ロール温度は80℃、未焼成複合膜の移動速度は0.5m/minであった。プレス後の未焼成複合膜に対し320℃で15分間熱処理(焼成)を施し、イミド化を完結させて、ポリイミド−微粒子複合膜を得た。このポリイミド−微粒子複合膜を10質量%HF溶液中に10分間浸漬することで、膜中に含まれる微粒子を除去して、多孔質ポリイミド膜を得た。実施例1と同様に、ケミカルエッチングを行った。
上記で得られたポリイミド−微粒子複合膜及び多孔質ポリイミド膜の膜特性を評価した。結果を表1に示す。表中、「単層」は、「未焼成複合膜(単層)の成膜」で得た未焼成複合膜(単層)を出発材料として膜特性を評価した結果を示し、「二層」は、「未焼成複合膜(二層)の成膜」で得た積層膜を出発材料として膜特性を評価した結果を示す。
得られたポリイミド−微粒子複合膜を目視で観察して、焼成後におけるカール発生の有無を評価した。評価基準は以下の通りである。
◎:カールの発生が全く観察されなかった。
○:膜の端部が部分的にカールしていた。
×:膜の端部の全体がカールしていた。
得られたポリイミド−微粒子複合膜を目視で観察して、焼成後におけるシワ(ムラ、うねり)発生の有無を評価した。評価基準は以下の通りである。
◎:シワ(ムラ、うねり)が全く観察されなかった。
○:シワ(ムラ、うねり)が部分的に観察された。
×:シワ(ムラ、うねり)が全面で観察された。
ケミカルエッチング前の多孔質ポリイミド膜及びケミカルエッチング後の多孔質ポリイミド膜の各々を5cm角に切り出して、透気度測定用のサンプルとした。ガーレー式デンソメーター(東洋精機製)を用いて、JIS P 8117に準じて、100mlの空気が上記サンプルを通過する時間を測定した。各例ともケミカルエッチング後は透気度が改善した。ケミカルエッチング後の値を表1に示す。
ケミカルエッチング後の多孔質ポリイミド膜の引張強度を測定した。即ち、多孔質ポリイミド膜を1cm×5cmの大きさに切り出して短冊状のサンプルを得た。このサンプルの破断時の応力(MPa)を、RTC−1210A TENSILON(ORIENTEC社製)を用いて測定した。
実施例3と実施例4〜5との対比から明らかな通り、水を含む溶剤として、水に水溶性の有機溶剤を混合させた場合、多孔質ポリイミド膜の透気度が改善することが確認できた。
Claims (3)
- ポリアミド酸及び/又はポリイミドからなる樹脂と、微粒子と、溶剤とを含有するワニスを用いて、未焼成複合膜を成膜する未焼成複合膜成膜工程と、
前記未焼成複合膜を水を含む溶剤に浸漬する浸漬工程と、
前記未焼成複合膜を焼成してポリイミド−微粒子複合膜を得る焼成工程と、
前記ポリイミド−微粒子複合膜から微粒子を取り除く微粒子除去工程と、
を前記の順序で含む多孔質ポリイミド膜の製造方法。 - 更に、前記浸漬工程と前記焼成工程との間に、前記浸漬工程後の未焼成複合膜をプレスするプレス工程を含む請求項1に記載の多孔質ポリイミド膜の製造方法。
- 更に、前記浸漬工程と前記焼成工程との間に、前記浸漬工程後の未焼成複合膜を乾燥させる乾燥工程を含む請求項1又は2に記載の多孔質ポリイミド膜の製造方法。
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