JPWO2013030943A1 - 半導体装置 - Google Patents
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Abstract
Description
図1,2に示す半導体装置1は、IGBTとダイオードが同一の半導体基板100に形成されたRC−IGBTである。なお、図1に示す平面図は、半導体基板100の表面に形成された表面電極101の図示を省略しており、半導体基板100の表面を図示している。また、半導体装置1は、複数のIGBT領域と複数のダイオード領域が交互に配置されており、IGBT領域とダイオード領域の境界を複数有している。図1,2は、複数のIGBT領域とダイオード領域の境界のうちの1つを図示しており、半導体装置1の複数の境界は、いずれも図1,2と同様の構成を有している。
<IGBT動作時>
裏面電極102の電位Vaを表面電極101の電位Vbよりも高電位とし(Va>Vb)、ゲート電極133,143に正電圧(正バイアス)を印加すると、IGBTボディ層134において、絶縁ゲート140の近傍にチャネルが形成される。このチャネルを通って、多数キャリアである電子がエミッタ層136からドリフト層113に注入される。また、コレクタ層117からドリフト層113へ正孔が注入される。少数キャリアである正孔がドリフト層113に注入されると、ドリフト層113において伝導率変調が起こり、ドリフト層113の抵抗が低くなる。このように電子と正孔が移動することによって、半導体基板100の裏面側(コレクタ層117側)から表面側(エミッタ層136側)に向かうIGBT電流が流れる。
次に、裏面電極102の電位Vaを表面電極101の電位Vbよりも低くすると(Va<Vb)、図3の実線に示すように、ダイオード領域11では、第1アノード層116および第2アノード層115から、ダイオードボディ層114を介して、ドリフト層113に正孔が注入される。これによって、第1アノード層116および第2アノード層115側からカソード層111側へダイオード電流(還流電流)が流れる。このとき、ダイオード領域11の近傍のIGBT領域13においても、図3の破線に示すように、ボディコンタクト層135から、ダイオードボディ層114を介して、ドリフト層113に正孔が注入される。ボディコンタクト層から注入された正孔は、ダイオード領域11のカソード層111に向かって移動する。ボディコンタクト層から注入された正孔によって、ダイオード領域11の順方向電圧が低減される。
上記の実施例では、ダイオード領域のうち、IGBT領域に近接する部分に位置する第1アノード層のみ幅が大きい場合を例示して説明したが、これに限定されない。例えば、ダイオード領域の全体において、アノード層の幅がボディコンタクト層の幅よりも大きくてもよい。すなわち、図4に示す半導体装置2のように、図1に示す第1アノード層116と同じ幅D2を有するアノード層216が全体に形成されているダイオード領域21を備えていてもよい。図1と同様に、アノード層216のx方向の幅D2は、ボディコンタクト層135の幅D1よりも大きく、アノード層216の半導体基板平面方向の面積は、ボディコンタクト層135の半導体基板平面方向の面積よりも大きい。その他の構成は、図1に示す半導体装置1と同様であるため、重複説明を省略する。ダイオード領域21の全体において、アノード層216の半導体基板平面方向の面積は、ボディコンタクト層135の半導体基板平面方向の面積よりも大きいため、ボディコンタクト層135からダイオード領域21側に移動する正孔の影響をより小さくすることができる。これによって、ボディコンタクト層135から注入された正孔に起因する順方向電圧の上昇幅を減らし、熱損失を低減する効果をより顕著に得ることができる。
Claims (3)
- ダイオード領域とIGBT領域が同一半導体基板に形成されている半導体装置であって、
ダイオード領域は、
半導体基板の表面に露出しており、互いに隔離されている複数の第1導電型のアノード層と、
アノード層の裏面側に形成されており、アノード層よりも第1導電型の不純物濃度が低い、第1導電型のダイオードボディ層と、
ダイオードボディ層の裏面側に形成されている第2導電型のダイオードドリフト層と、
ダイオードドリフト層の裏面側に形成されており、ダイオードドリフト層より第2導電型の不純物濃度が高い、第2導電型のカソード層と、
を備えており、
IGBT領域は、
半導体基板の表面に露出している第2導電型のエミッタ層と、
半導体基板の表面に露出しており、互いに隔離されている複数の第1導電型のボディコンタクト層と、
エミッタ層およびボディコンタクト層の裏面側に形成されており、ボディコンタクト層よりも第1導電型の不純物濃度が低い、第1導電型のIGBTボディ層と、
IGBTボディ層の裏面側に形成されている第2導電型のIGBTドリフト層と、
IGBTドリフト層の裏面側に形成されている第1導電型のコレクタ層と、
エミッタ層とIGBTドリフト層を分離している範囲のIGBTボディ層に絶縁膜を介して対向しているIGBTゲート電極と、
を備えており、
アノード層は、少なくとも1以上の第1アノード層を備えており、
第1アノード層は、少なくともIGBT領域に近接する位置に形成されており、
第1アノード層のそれぞれの半導体基板平面方向の面積は、ダイオード領域に最も近接するボディコンタクト層の半導体基板平面方向の面積よりも大きい、半導体装置。 - アノード層は、第1アノード層よりもIGBT領域から遠い位置に形成された少なくとも1以上の第2アノード層をさらに備えており、第2アノード層のそれぞれの半導体基板平面方向の面積は、第1アノード層のそれぞれの半導体基板平面方向の面積よりも小さい、請求項1に記載の半導体装置。
- 第2アノード層のそれぞれの半導体基板平面方向の面積は、ダイオード領域に最も近接するボディコンタクト層の半導体基板平面方向の面積よりも大きい、請求項1または2に記載の半導体装置。
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DE112012007249B4 (de) | 2012-12-20 | 2021-02-04 | Denso Corporation | Halbleitervorrichtung |
JP6144510B2 (ja) * | 2013-03-11 | 2017-06-07 | 三菱電機株式会社 | 半導体装置の製造方法 |
JP5918288B2 (ja) | 2014-03-03 | 2016-05-18 | トヨタ自動車株式会社 | 半導体装置 |
JP6221974B2 (ja) * | 2014-07-14 | 2017-11-01 | トヨタ自動車株式会社 | 半導体装置 |
DE102014110681B4 (de) * | 2014-07-29 | 2019-06-06 | Infineon Technologies Ag | Rückwärts leitender igbt und herstellungsverfahren dafür |
JP6222702B2 (ja) * | 2014-09-11 | 2017-11-01 | 株式会社東芝 | 半導体装置 |
JP6003961B2 (ja) * | 2014-11-04 | 2016-10-05 | トヨタ自動車株式会社 | 半導体装置 |
JP6261494B2 (ja) * | 2014-12-03 | 2018-01-17 | 三菱電機株式会社 | 電力用半導体装置 |
US9876011B2 (en) * | 2015-11-20 | 2018-01-23 | Kabushiki Kaisha Toshiba | Semiconductor device |
WO2017155122A1 (ja) * | 2016-03-10 | 2017-09-14 | 富士電機株式会社 | 半導体装置 |
DE102016219020B4 (de) * | 2016-09-30 | 2019-11-07 | Infineon Technologies Ag | Leistungshalbleitervorrichtung und Verfahren zum Bearbeiten einer Leistungshalbleitervorrichtung |
JP6666292B2 (ja) * | 2017-03-22 | 2020-03-13 | トヨタ自動車株式会社 | 半導体装置 |
JP7067041B2 (ja) * | 2017-12-11 | 2022-05-16 | 株式会社デンソー | 半導体装置 |
JP7095303B2 (ja) * | 2018-02-14 | 2022-07-05 | 富士電機株式会社 | 半導体装置 |
US10608122B2 (en) * | 2018-03-13 | 2020-03-31 | Semicondutor Components Industries, Llc | Schottky device and method of manufacture |
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JP7475251B2 (ja) | 2020-10-01 | 2024-04-26 | 三菱電機株式会社 | 半導体装置 |
JP2023139979A (ja) | 2022-03-22 | 2023-10-04 | 株式会社東芝 | 半導体装置及び半導体回路 |
CN116153992B (zh) * | 2023-04-21 | 2023-06-23 | 上海陆芯电子科技有限公司 | 一种逆导型绝缘栅双极型晶体管 |
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BR112014002246A2 (pt) | 2017-02-21 |
KR101544332B1 (ko) | 2015-08-12 |
RU2562934C1 (ru) | 2015-09-10 |
BR112014002246B1 (pt) | 2020-11-10 |
EP2752875B1 (en) | 2017-11-29 |
US9379224B2 (en) | 2016-06-28 |
MX2014002269A (es) | 2014-04-25 |
US20140217465A1 (en) | 2014-08-07 |
CN103765582B (zh) | 2016-08-24 |
CN103765582A (zh) | 2014-04-30 |
JP5630582B2 (ja) | 2014-11-26 |
EP2752875A1 (en) | 2014-07-09 |
AU2011375931B2 (en) | 2014-07-24 |
KR20140048282A (ko) | 2014-04-23 |
WO2013030943A1 (ja) | 2013-03-07 |
EP2752875A4 (en) | 2015-11-18 |
AU2011375931A1 (en) | 2014-03-13 |
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