JPWO2012137439A1 - 封止型半導体装置及びその製造方法 - Google Patents
封止型半導体装置及びその製造方法 Download PDFInfo
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Abstract
Description
図1は、本発明の一実施形態に係る樹脂封止型半導体装置の断面構成を示している。なお、以下の説明において、第2導電路形成板5、ワイヤ9及び制御素子15は、この断面に存在していないが、理解を容易にするために、適宜図示して説明している。
図2(a)及び図2(b)は、本実施形態の一変形例に係る樹脂封止型半導体装置を示している。
以下、本実施形態の一変形例に係る樹脂封止型半導体装置の製造方法を、図3〜図8を参照しながら説明する。
1a 第1接続部
1b 隙間
3 貫通孔
3a 空間
5 第2導電路形成板
5a 第2接続部
6 ニッケルメッキ膜
7 突入部
8 傾斜接合面
9 ワイヤ
10 下金型
11 上金型
12 パワー素子
13 絶縁性放熱シート
14 放熱板
15 制御素子
16,17,18 押さえピン
16a ピン突入部
16b ピン押圧部
19 封止樹脂体
19a シート溝
19b 封止樹脂
20 弾性樹脂シート
20a シートじわ
Claims (16)
- 第1導電路形成板と、
前記第1導電路形成板に接合された第2導電路形成板と、
前記第1導電路形成板に接着された半導体素子と、
前記第1導電路形成板に絶縁シートを介して保持された放熱板と、
前記第1導電路形成板及び前記第2導電路形成板を封止する封止樹脂体と、を備え、
前記第1導電路形成板の前記絶縁シートと接する領域に貫通孔又はリードの隙間が形成され、
前記貫通孔又は前記リードの隙間に前記絶縁シートが圧入された、封止型半導体装置。 - 請求項1において、
前記貫通孔又は前記リードの隙間に圧入された前記絶縁シートは、前記貫通孔又は前記リードの隙間の内面と接する、封止型半導体装置。 - 請求項1又は2において、
前記第2導電路形成板は、前記第1導電路形成板に形成された前記貫通孔に突入した突入部によって前記第1導電路形成板に接合されており、
前記絶縁シートは、前記貫通孔内において前記突入部と接する、封止型半導体装置。 - 請求項1から3のいずれか1項において、
前記貫通孔は、前記絶縁シートと対向する側の開口径が、前記絶縁シートと反対側の開口径よりも大きい、封止型半導体装置。 - 請求項4において、
前記貫通孔の前記絶縁シートと反対側の開口部にバリが形成された、封止型半導体装置。 - 請求項1から5のいずれか1項において、
前記リードの隙間の体積の30%以上の体積の前記絶縁シートが、前記リードの隙間に充填された、封止型半導体装置。 - 請求項1から6のいずれか1項において、
前記絶縁シートは、ガラス転移点温度が160℃以上且つ200℃以下で、且つ、加熱状態の弾性率が10GPa以上の材料である、封止型半導体装置。 - 請求項1から7のいずれか1項において、
前記絶縁シートは、ポリイミド樹脂により構成された、封止型半導体装置。 - 請求項1から8のいずれか1項において、
前記第1導電路形成板に接着された前記半導体素子は、パワー素子である、封止型半導体装置。 - 請求項1から9のいずれか1項において、
前記放熱板の周囲において、前記封止樹脂体に溝部が形成されている、封止型半導体装置。 - 貫通孔又はリードの隙間を有する第1導電路形成板、及び第2導電路形成板を準備した後、前記第1導電路形成板に絶縁シートを介して放熱板を保持し、
前記第1導電路形成板及び前記第2導電路形成板を前記放熱板側に押圧することにより、前記絶縁シートの一部を前記貫通孔又は前記リードの隙間に圧入させ、
前記第1導電路形成板、前記第2導電路形成板、前記絶縁シート及び前記放熱板の一部を封止する、封止型半導体装置の製造方法。 - 請求項11において、
前記絶縁シートの一部を前記貫通孔又は前記リードの隙間に圧入させることにより、前記貫通孔又は前記リードの隙間の内面と前記絶縁シートとを接触させる、封止型樹脂半導体装置の製造方法。 - 請求項11又は12において、
前記第1導電路形成板に前記放熱板を保持した後で、且つ、前記絶縁シートの一部を前記貫通孔に圧入させる前に、
前記貫通孔と対向する前記第2導電路形成板の一部を突入工具により押圧することにより、前記第2導電路形成板の一部が前記貫通孔内に突入した突入部を形成する、封止型半導体装置の製造方法。 - 請求項13において、
前記絶縁シートの一部が前記突入部と接するように、前記第1導電路形成板及び前記第2導電路形成板を押圧する、封止型半導体装置の製造方法。 - 請求項11から14のいずれか1項において、
前記絶縁シートの一部を前記貫通孔又は前記リードの隙間に圧入させる前に、
前記放熱板の前記絶縁シートと反対側の面に弾性シートを配置する、封止型半導体装置の製造方法。 - 請求項11から14のいずれか1項において、
前記貫通孔は、前記第1導電路形成板における前記絶縁シートと対向する側から反対側に向けて貫通させることにより形成された、封止型半導体装置の製造方法。
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EP2597675A4 (en) | 2013-07-31 |
CN102986025A (zh) | 2013-03-20 |
WO2012137439A1 (ja) | 2012-10-11 |
US9030003B2 (en) | 2015-05-12 |
EP2597675A1 (en) | 2013-05-29 |
CN102986025B (zh) | 2015-04-22 |
EP2597675B1 (en) | 2015-10-21 |
US20130056885A1 (en) | 2013-03-07 |
US9240369B2 (en) | 2016-01-19 |
US20150235928A1 (en) | 2015-08-20 |
JP5649142B2 (ja) | 2015-01-07 |
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