JPWO2008041334A1 - 電子部品試験装置 - Google Patents

電子部品試験装置 Download PDF

Info

Publication number
JPWO2008041334A1
JPWO2008041334A1 JP2007540849A JP2007540849A JPWO2008041334A1 JP WO2008041334 A1 JPWO2008041334 A1 JP WO2008041334A1 JP 2007540849 A JP2007540849 A JP 2007540849A JP 2007540849 A JP2007540849 A JP 2007540849A JP WO2008041334 A1 JPWO2008041334 A1 JP WO2008041334A1
Authority
JP
Japan
Prior art keywords
under test
electronic device
device under
test
tray
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP2007540849A
Other languages
English (en)
Japanese (ja)
Inventor
慎 佐川
慎 佐川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advantest Corp
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of JPWO2008041334A1 publication Critical patent/JPWO2008041334A1/ja
Ceased legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Packaging Frangible Articles (AREA)
JP2007540849A 2006-10-04 2006-10-04 電子部品試験装置 Ceased JPWO2008041334A1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2006/319870 WO2008041334A1 (fr) 2006-10-04 2006-10-04 Appareil de test de composant électronique

Publications (1)

Publication Number Publication Date
JPWO2008041334A1 true JPWO2008041334A1 (ja) 2010-02-04

Family

ID=39268202

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007540849A Ceased JPWO2008041334A1 (ja) 2006-10-04 2006-10-04 電子部品試験装置

Country Status (5)

Country Link
JP (1) JPWO2008041334A1 (https=)
KR (2) KR100942527B1 (https=)
CN (1) CN101258415B (https=)
TW (1) TW200821599A (https=)
WO (1) WO2008041334A1 (https=)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101499573B1 (ko) * 2010-06-16 2015-03-10 (주)테크윙 테스트핸들러에서의 반도체소자 언로딩방법
JP2013044684A (ja) * 2011-08-25 2013-03-04 Seiko Epson Corp ハンドラー、及び部品検査装置
JP2013137285A (ja) 2011-12-28 2013-07-11 Advantest Corp ピッチ変更装置、電子部品ハンドリング装置、及び電子部品試験装置
JP2013137284A (ja) 2011-12-28 2013-07-11 Advantest Corp 電子部品移載装置、電子部品ハンドリング装置、及び電子部品試験装置
JP2014224785A (ja) * 2013-05-17 2014-12-04 セイコーエプソン株式会社 ハンドラーおよび検査装置
JP2014228297A (ja) * 2013-05-20 2014-12-08 セイコーエプソン株式会社 ハンドラーおよび検査装置
KR102053081B1 (ko) * 2013-10-08 2019-12-06 (주)테크윙 테스트핸들러
CN104133173B (zh) * 2014-08-14 2017-02-01 潍坊路加精工有限公司 一种全自动测试装置
KR20160109484A (ko) 2015-03-11 2016-09-21 가부시키가이샤 어드밴티스트 반송 캐리어, 반송 장치, 및 베이스부
CN106405369A (zh) * 2015-07-31 2017-02-15 精工爱普生株式会社 电子部件输送装置以及电子部件检查装置
CN106813888B (zh) * 2015-11-27 2019-01-04 环维电子(上海)有限公司 冲击试验模块及其测试板
KR20170078209A (ko) * 2015-12-29 2017-07-07 (주)테크윙 반도체소자 테스트용 핸들러
JP2020012748A (ja) * 2018-07-19 2020-01-23 セイコーエプソン株式会社 電子部品搬送装置および電子部品検査装置
KR102053091B1 (ko) * 2019-06-20 2019-12-06 (주)테크윙 테스트핸들러
KR102762417B1 (ko) * 2023-11-21 2025-02-05 한미반도체 주식회사 본딩장치
KR102779986B1 (ko) * 2023-11-21 2025-03-13 한미반도체 주식회사 본딩장치

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001004702A (ja) * 1999-06-22 2001-01-12 Advantest Corp 半導体試験装置のｉｃハンドラ装置
JP2001264387A (ja) * 2000-03-16 2001-09-26 Nippon Eng Kk バーンインボード用ローダアンローダ装置における吸着ヘッドおよびその制御システム
WO2004109305A1 (ja) * 2003-06-06 2004-12-16 Advantest Corporation 搬送装置、電子部品ハンドリング装置および電子部品ハンドリング装置における搬送方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06302670A (ja) * 1993-04-15 1994-10-28 Hitachi Electron Eng Co Ltd 小形角型ワーク用非接触吸着ヘッド
KR100349942B1 (ko) * 1999-12-06 2002-08-24 삼성전자 주식회사 램버스 핸들러

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001004702A (ja) * 1999-06-22 2001-01-12 Advantest Corp 半導体試験装置のｉｃハンドラ装置
JP2001264387A (ja) * 2000-03-16 2001-09-26 Nippon Eng Kk バーンインボード用ローダアンローダ装置における吸着ヘッドおよびその制御システム
WO2004109305A1 (ja) * 2003-06-06 2004-12-16 Advantest Corporation 搬送装置、電子部品ハンドリング装置および電子部品ハンドリング装置における搬送方法

Also Published As

Publication number Publication date
KR20080057206A (ko) 2008-06-24
KR20100017827A (ko) 2010-02-16
TW200821599A (en) 2008-05-16
CN101258415A (zh) 2008-09-03
CN101258415B (zh) 2011-01-19
KR100942527B1 (ko) 2010-02-12
WO2008041334A1 (fr) 2008-04-10
TWI345063B (https=) 2011-07-11

Similar Documents

Publication Publication Date Title
KR100810380B1 (ko) 집적회로 시험장치
JPWO2008041334A1 (ja) 電子部品試験装置
US20060181265A1 (en) Electronic device test system
JP5291632B2 (ja) インサート、トレイ及び電子部品試験装置
CN108802436B (zh) 电子零件试验装置用的载体
JP7390934B2 (ja) 検査装置
WO2006054765A1 (ja) 電子部品ハンドリング装置用のインサート、プッシャ、テストヘッド用のソケットガイドおよび電子部品ハンドリング装置
JP4222442B2 (ja) 電子部品試験装置用インサート
JP2010202392A (ja) Ｉｃオートハンドラ
JPWO2009069190A1 (ja) インサート、トレイ及び電子部品試験装置
JPH09152466A (ja) Ｉｃ試験方法及び装置
JP4928470B2 (ja) 電子部品ハンドリング装置、電子部品試験装置、及び電子部品の試験方法
US12130327B2 (en) Electronic component testing apparatus, socket, and carrier
KR100824128B1 (ko) 전자 부품 핸들링 장치용 인서트 및 전자 부품 핸들링 장치
US7676908B2 (en) Pressing member and electronic device handling apparatus
WO2008050443A1 (fr) Plateau client et appareil de test de composant électronique
JP4180163B2 (ja) 電子部品試験装置用吸着装置
JP2001116800A (ja) 電子部品試験装置
KR20050009066A (ko) 반도체 소자 테스트 핸들러용 캐리어 모듈
WO2002067000A1 (en) Insert for electronic component test device
CN115586418A (zh) 电子部件处理装置用的载体的芯、载体及芯的拆卸方法
JP2002207065A (ja) 部品保持装置
JP2014016258A (ja) 電子部品試験装置、チェンジキット、電子部品押圧装置、及び電子部品の試験方法
WO2007083357A1 (ja) 電子部品試験装置及び電子部品の試験方法
JP2000111612A (ja) トレイ収納用ホルダ

Legal Events

Date Code Title Description
A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120214

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120413

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130402

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130523

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20130903

A045 Written measure of dismissal of application [lapsed due to lack of payment]

Free format text: JAPANESE INTERMEDIATE CODE: A045

Effective date: 20140128