KR100942527B1 - 전자부품 시험장치 - Google Patents
전자부품 시험장치 Download PDFInfo
- Publication number
- KR100942527B1 KR100942527B1 KR1020077024582A KR20077024582A KR100942527B1 KR 100942527 B1 KR100942527 B1 KR 100942527B1 KR 1020077024582 A KR1020077024582 A KR 1020077024582A KR 20077024582 A KR20077024582 A KR 20077024582A KR 100942527 B1 KR100942527 B1 KR 100942527B1
- Authority
- KR
- South Korea
- Prior art keywords
- electronic component
- under test
- component under
- test
- pitch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Packaging Frangible Articles (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2006/319870 WO2008041334A1 (fr) | 2006-10-04 | 2006-10-04 | Appareil de test de composant électronique |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020097026216A Division KR20100017827A (ko) | 2006-10-04 | 2006-10-04 | 전자부품 시험장치 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20080057206A KR20080057206A (ko) | 2008-06-24 |
| KR100942527B1 true KR100942527B1 (ko) | 2010-02-12 |
Family
ID=39268202
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020077024582A Active KR100942527B1 (ko) | 2006-10-04 | 2006-10-04 | 전자부품 시험장치 |
| KR1020097026216A Withdrawn KR20100017827A (ko) | 2006-10-04 | 2006-10-04 | 전자부품 시험장치 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020097026216A Withdrawn KR20100017827A (ko) | 2006-10-04 | 2006-10-04 | 전자부품 시험장치 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2008041334A1 (https=) |
| KR (2) | KR100942527B1 (https=) |
| CN (1) | CN101258415B (https=) |
| TW (1) | TW200821599A (https=) |
| WO (1) | WO2008041334A1 (https=) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101499573B1 (ko) * | 2010-06-16 | 2015-03-10 | (주)테크윙 | 테스트핸들러에서의 반도체소자 언로딩방법 |
| JP2013044684A (ja) * | 2011-08-25 | 2013-03-04 | Seiko Epson Corp | ハンドラー、及び部品検査装置 |
| JP2013137285A (ja) | 2011-12-28 | 2013-07-11 | Advantest Corp | ピッチ変更装置、電子部品ハンドリング装置、及び電子部品試験装置 |
| JP2013137284A (ja) | 2011-12-28 | 2013-07-11 | Advantest Corp | 電子部品移載装置、電子部品ハンドリング装置、及び電子部品試験装置 |
| JP2014224785A (ja) * | 2013-05-17 | 2014-12-04 | セイコーエプソン株式会社 | ハンドラーおよび検査装置 |
| JP2014228297A (ja) * | 2013-05-20 | 2014-12-08 | セイコーエプソン株式会社 | ハンドラーおよび検査装置 |
| KR102053081B1 (ko) * | 2013-10-08 | 2019-12-06 | (주)테크윙 | 테스트핸들러 |
| CN104133173B (zh) * | 2014-08-14 | 2017-02-01 | 潍坊路加精工有限公司 | 一种全自动测试装置 |
| KR20160109484A (ko) | 2015-03-11 | 2016-09-21 | 가부시키가이샤 어드밴티스트 | 반송 캐리어, 반송 장치, 및 베이스부 |
| CN106405369A (zh) * | 2015-07-31 | 2017-02-15 | 精工爱普生株式会社 | 电子部件输送装置以及电子部件检查装置 |
| CN106813888B (zh) * | 2015-11-27 | 2019-01-04 | 环维电子(上海)有限公司 | 冲击试验模块及其测试板 |
| KR20170078209A (ko) * | 2015-12-29 | 2017-07-07 | (주)테크윙 | 반도체소자 테스트용 핸들러 |
| JP2020012748A (ja) * | 2018-07-19 | 2020-01-23 | セイコーエプソン株式会社 | 電子部品搬送装置および電子部品検査装置 |
| KR102053091B1 (ko) * | 2019-06-20 | 2019-12-06 | (주)테크윙 | 테스트핸들러 |
| KR102762417B1 (ko) * | 2023-11-21 | 2025-02-05 | 한미반도체 주식회사 | 본딩장치 |
| KR102779986B1 (ko) * | 2023-11-21 | 2025-03-13 | 한미반도체 주식회사 | 본딩장치 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001264387A (ja) * | 2000-03-16 | 2001-09-26 | Nippon Eng Kk | バーンインボード用ローダアンローダ装置における吸着ヘッドおよびその制御システム |
| KR20060019572A (ko) * | 2003-06-06 | 2006-03-03 | 가부시키가이샤 아드반테스트 | 반송장치, 전자부품 핸들링 장치 및 전자부품 핸들링장치에서의 반송방법 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06302670A (ja) * | 1993-04-15 | 1994-10-28 | Hitachi Electron Eng Co Ltd | 小形角型ワーク用非接触吸着ヘッド |
| JP2001004702A (ja) * | 1999-06-22 | 2001-01-12 | Advantest Corp | 半導体試験装置のicハンドラ装置 |
| KR100349942B1 (ko) * | 1999-12-06 | 2002-08-24 | 삼성전자 주식회사 | 램버스 핸들러 |
-
2006
- 2006-10-04 WO PCT/JP2006/319870 patent/WO2008041334A1/ja not_active Ceased
- 2006-10-04 CN CN2006800139501A patent/CN101258415B/zh active Active
- 2006-10-04 JP JP2007540849A patent/JPWO2008041334A1/ja not_active Ceased
- 2006-10-04 KR KR1020077024582A patent/KR100942527B1/ko active Active
- 2006-10-04 KR KR1020097026216A patent/KR20100017827A/ko not_active Withdrawn
-
2007
- 2007-09-04 TW TW096132855A patent/TW200821599A/zh unknown
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001264387A (ja) * | 2000-03-16 | 2001-09-26 | Nippon Eng Kk | バーンインボード用ローダアンローダ装置における吸着ヘッドおよびその制御システム |
| KR20060019572A (ko) * | 2003-06-06 | 2006-03-03 | 가부시키가이샤 아드반테스트 | 반송장치, 전자부품 핸들링 장치 및 전자부품 핸들링장치에서의 반송방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20080057206A (ko) | 2008-06-24 |
| KR20100017827A (ko) | 2010-02-16 |
| TW200821599A (en) | 2008-05-16 |
| JPWO2008041334A1 (ja) | 2010-02-04 |
| CN101258415A (zh) | 2008-09-03 |
| CN101258415B (zh) | 2011-01-19 |
| WO2008041334A1 (fr) | 2008-04-10 |
| TWI345063B (https=) | 2011-07-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100942527B1 (ko) | 전자부품 시험장치 | |
| KR100810380B1 (ko) | 집적회로 시험장치 | |
| KR100722643B1 (ko) | 집적회로 시험장치 | |
| US20060181265A1 (en) | Electronic device test system | |
| KR19990083190A (ko) | 트레이 이송 암 및 이를 사용한 트레이의 이재(移載) 장치, 집적 회로 시험 장치 및 트레이의 처리 방법 | |
| CN108802436B (zh) | 电子零件试验装置用的载体 | |
| US6636060B1 (en) | Insert for electric devices testing apparatus | |
| TWI898216B (zh) | 測試設備、測試系統以及在預燒板(bib)上測試dut之方法 | |
| KR20110093456A (ko) | 반도체 패키지의 인서트 수납장치 | |
| KR100510501B1 (ko) | 반도체 패키지 검사 장치 및 이를 이용한 검사 방법 | |
| EP1145612B1 (en) | Method for mounting an electronic component | |
| CN101842712B (zh) | 插入件、托盘及电子元件测试装置 | |
| JP4222442B2 (ja) | 電子部品試験装置用インサート | |
| JP2010202392A (ja) | Icオートハンドラ | |
| US20080252317A1 (en) | Apparatus for testing system-in-package devices | |
| US12130327B2 (en) | Electronic component testing apparatus, socket, and carrier | |
| US7676908B2 (en) | Pressing member and electronic device handling apparatus | |
| CN108802595B (zh) | 电子部件试验装置用的载体 | |
| KR100305683B1 (ko) | 번인테스터용번인보드 | |
| US7489155B2 (en) | Method for testing plurality of system-in-package devices using plurality of test circuits | |
| WO2008050443A1 (fr) | Plateau client et appareil de test de composant électronique | |
| US7443190B1 (en) | Method for testing micro SD devices using each test circuits | |
| US20080252321A1 (en) | Apparatus for testing micro SD devices | |
| CN108957285B (zh) | 电子部件试验装置用的载体 | |
| KR100980210B1 (ko) | 테스트 트레이 이송장치 및 그를 적용한 테스트 핸들러 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| AMND | Amendment | ||
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
| AMND | Amendment | ||
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| E601 | Decision to refuse application | ||
| PE0601 | Decision on rejection of patent |
St.27 status event code: N-2-6-B10-B15-exm-PE0601 |
|
| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
| J201 | Request for trial against refusal decision | ||
| PJ0201 | Trial against decision of rejection |
St.27 status event code: A-3-3-V10-V11-apl-PJ0201 |
|
| A107 | Divisional application of patent | ||
| AMND | Amendment | ||
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| PA0104 | Divisional application for international application |
St.27 status event code: A-0-1-A10-A18-div-PA0104 St.27 status event code: A-0-1-A10-A16-div-PA0104 |
|
| PB0901 | Examination by re-examination before a trial |
St.27 status event code: A-6-3-E10-E12-rex-PB0901 |
|
| B701 | Decision to grant | ||
| PB0701 | Decision of registration after re-examination before a trial |
St.27 status event code: A-3-4-F10-F13-rex-PB0701 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U12-oth-PR1002 Fee payment year number: 1 |
|
| PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
|
| FPAY | Annual fee payment |
Payment date: 20130118 Year of fee payment: 4 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 4 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |
|
| FPAY | Annual fee payment |
Payment date: 20140117 Year of fee payment: 5 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 5 |
|
| FPAY | Annual fee payment |
Payment date: 20150119 Year of fee payment: 6 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 6 |
|
| FPAY | Annual fee payment |
Payment date: 20160129 Year of fee payment: 7 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 7 |
|
| FPAY | Annual fee payment |
Payment date: 20170126 Year of fee payment: 8 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 8 |
|
| FPAY | Annual fee payment |
Payment date: 20180124 Year of fee payment: 9 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 9 |
|
| FPAY | Annual fee payment |
Payment date: 20190123 Year of fee payment: 10 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 10 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 11 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 12 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 13 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 14 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 15 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 16 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |