TW200821599A - Electronic component testing apparatus - Google Patents

Electronic component testing apparatus Download PDF

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Publication number
TW200821599A
TW200821599A TW096132855A TW96132855A TW200821599A TW 200821599 A TW200821599 A TW 200821599A TW 096132855 A TW096132855 A TW 096132855A TW 96132855 A TW96132855 A TW 96132855A TW 200821599 A TW200821599 A TW 200821599A
Authority
TW
Taiwan
Prior art keywords
electronic component
tested
test
tray
component
Prior art date
Application number
TW096132855A
Other languages
English (en)
Chinese (zh)
Other versions
TWI345063B (https=
Inventor
Makoto Sagawa
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of TW200821599A publication Critical patent/TW200821599A/zh
Application granted granted Critical
Publication of TWI345063B publication Critical patent/TWI345063B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Packaging Frangible Articles (AREA)
TW096132855A 2006-10-04 2007-09-04 Electronic component testing apparatus TW200821599A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2006/319870 WO2008041334A1 (fr) 2006-10-04 2006-10-04 Appareil de test de composant électronique

Publications (2)

Publication Number Publication Date
TW200821599A true TW200821599A (en) 2008-05-16
TWI345063B TWI345063B (https=) 2011-07-11

Family

ID=39268202

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096132855A TW200821599A (en) 2006-10-04 2007-09-04 Electronic component testing apparatus

Country Status (5)

Country Link
JP (1) JPWO2008041334A1 (https=)
KR (2) KR100942527B1 (https=)
CN (1) CN101258415B (https=)
TW (1) TW200821599A (https=)
WO (1) WO2008041334A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI621858B (zh) * 2013-05-17 2018-04-21 Seiko Epson Corp Processor and inspection device
TWI641847B (zh) * 2013-05-20 2018-11-21 日商精工愛普生股份有限公司 Processor and inspection device

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101499573B1 (ko) * 2010-06-16 2015-03-10 (주)테크윙 테스트핸들러에서의 반도체소자 언로딩방법
JP2013044684A (ja) * 2011-08-25 2013-03-04 Seiko Epson Corp ハンドラー、及び部品検査装置
JP2013137285A (ja) 2011-12-28 2013-07-11 Advantest Corp ピッチ変更装置、電子部品ハンドリング装置、及び電子部品試験装置
JP2013137284A (ja) 2011-12-28 2013-07-11 Advantest Corp 電子部品移載装置、電子部品ハンドリング装置、及び電子部品試験装置
KR102053081B1 (ko) * 2013-10-08 2019-12-06 (주)테크윙 테스트핸들러
CN104133173B (zh) * 2014-08-14 2017-02-01 潍坊路加精工有限公司 一种全自动测试装置
KR20160109484A (ko) 2015-03-11 2016-09-21 가부시키가이샤 어드밴티스트 반송 캐리어, 반송 장치, 및 베이스부
CN106405369A (zh) * 2015-07-31 2017-02-15 精工爱普生株式会社 电子部件输送装置以及电子部件检查装置
CN106813888B (zh) * 2015-11-27 2019-01-04 环维电子(上海)有限公司 冲击试验模块及其测试板
KR20170078209A (ko) * 2015-12-29 2017-07-07 (주)테크윙 반도체소자 테스트용 핸들러
JP2020012748A (ja) * 2018-07-19 2020-01-23 セイコーエプソン株式会社 電子部品搬送装置および電子部品検査装置
KR102053091B1 (ko) * 2019-06-20 2019-12-06 (주)테크윙 테스트핸들러
KR102762417B1 (ko) * 2023-11-21 2025-02-05 한미반도체 주식회사 본딩장치
KR102779986B1 (ko) * 2023-11-21 2025-03-13 한미반도체 주식회사 본딩장치

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06302670A (ja) * 1993-04-15 1994-10-28 Hitachi Electron Eng Co Ltd 小形角型ワーク用非接触吸着ヘッド
JP2001004702A (ja) * 1999-06-22 2001-01-12 Advantest Corp 半導体試験装置のｉｃハンドラ装置
KR100349942B1 (ko) * 1999-12-06 2002-08-24 삼성전자 주식회사 램버스 핸들러
JP2001264387A (ja) * 2000-03-16 2001-09-26 Nippon Eng Kk バーンインボード用ローダアンローダ装置における吸着ヘッドおよびその制御システム
WO2004108366A1 (ja) * 2003-06-06 2004-12-16 Advantest Corporation 搬送装置、電子部品ハンドリング装置および電子部品ハンドリング装置における搬送方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI621858B (zh) * 2013-05-17 2018-04-21 Seiko Epson Corp Processor and inspection device
TWI641847B (zh) * 2013-05-20 2018-11-21 日商精工愛普生股份有限公司 Processor and inspection device

Also Published As

Publication number Publication date
KR20080057206A (ko) 2008-06-24
KR20100017827A (ko) 2010-02-16
JPWO2008041334A1 (ja) 2010-02-04
CN101258415A (zh) 2008-09-03
CN101258415B (zh) 2011-01-19
KR100942527B1 (ko) 2010-02-12
WO2008041334A1 (fr) 2008-04-10
TWI345063B (https=) 2011-07-11

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