TW200825432A - Electronic component testing equipment - Google Patents

Abstract

To provide electronic component testing equipment in which the index time can be shortened. The electronic component testing equipment (1) comprises a test chamber (120) for performing test of an IC device. The test chamber (120) includes a horizontal conveying device (121) having an abutting member (122b) abutting against a test tray (TST) mounting the IC device and conveying the test tray (TST) in a predetermined direction by moving the abutting member (122b), and a Z axis driver (129) for pushing the test tray (TST) and the IC device toward the test head (5) side. When the test tray (TST) and the IC device are pushed, a movable space (S0) of the abutting member (122b) is formed.

Description

[Technical Field] The present invention relates to electronic contact between various electronic components (hereinafter also referred to as IC components) such as a semiconductor integrated circuit and a contact portion of a test head. Test the electronic component test of the I c component. [Prior Art] In the manufacturing process of an electronic component such as a 1C component, in the state where the package is completed, the performance, function, and the like of the component are measured, and the electronic component test apparatus is used. In the Handler t which constitutes the electronic component testing device, a plurality of carriers (hereinafter referred to as customer carriers) for accommodating the 1C component before the test or the IC component after the test is placed (the component is placed) The test tray is transported to the carrier in a tray (hereinafter referred to as a test tray) that is circulated in the electronic component testing device, and the IC component and the test head are placed in the test tray. The contact portion is electrically contacted and tested on the electronic component testing device body (hereinafter referred to as a tester). Then, when the test ends, the test tray that carries each IC component is carried out from the test head, according to the test. The result is placed on the customer's cradle, thereby classifying the so-called good and defective products. Fig. 9 is a view showing the device for carrying the test cradle into the test portion. Further, Fig. 18A shows the conventional electronic component test device. The test unit (hereinafter also referred to as a test chamber) is in a state before the IC component is pushed toward the test head, and FIG. 18B shows that the 丨c component is pushed to the test 2247-92 in the test portion of the conventional electronic component test device. 07-PF 5 200825432 State after the head. § When the test tray TST is moved into the test head 5, as shown in Fig. 9, the engaging member 122 of the carrying melon 121 is connected to the rear end of the test tray TST. The element 122 is moved by the ball screw mechanism 123, ι 24 by the motor ι25, whereby the test tray TST is pushed onto the test head 5. When the Z-axis drive unit 129 (hereinafter also referred to as the push unit) is lowered, the test tray is caused. When tst is depressed, as shown in Fig. 18B, the driving plate 122 and the driving plate 1 297 (hereinafter also referred to as a plate member) of the 2^-axis driving device 129, the pairing, and the plate 1282 interfere with each other. Therefore, from the 1C element When the test is completed until the period before the rise of the 2-axis driving device 129, the conveying device 121 cannot return the originating member 122 to the origin position, and becomes a main factor for extending the index time. [ SUMMARY OF THE INVENTION The object of the present invention is to provide an indicator time shortening Electronic component testing device. In order to achieve the above object, the present invention provides a sub-contact two rows: two = sub-component and the contact portion of the test head for electricity % binding on the electronic component of the component has: handling The device, I # /, the above test and the above (4) contact with the contact element and the "the contact element of the contact of the tow is moved by the bracket, and the device is pushed, and the Jli^ is not carried in the 2 direction. The bracket side of the electronic component to be tested on the bracket; on the overflow device, the test head is dark and the pushing device is

224 7-9207-PF 6 200825432 When the above-mentioned bracket and the above-mentioned device are pressed and set to the above-mentioned predetermined=70, the contact element on the side opposite to the above-mentioned pressing can be moved in the opposite direction to the upper direction ( Refer to item 1 of the patent application scope). In the present invention, the transporting means for transporting the carriage on the carriage and the "pushing means for pushing the sub-clamp to the test head" are provided on the electronic 7L test apparatus. VII. The 丨4 士 external force pushing device has a movable space for moving the contact element T on the test day. In this way, even if the pushing device is lowered during the test, the 70 parts can be directly returned to the origin position by the movable work room without interfering with the device. Therefore, there is no need to wait for the shank between the pressing devices, and the 彳 time is shortened. In the above invention, the pressing device preferably includes a pushing member, and the tested electric H is in contact with 7 pieces; the mating plate supports the above-mentioned pushing member, and the driving device, the -, and the thousand The board 7 is pushed toward the mating board and the mating board is brought close to and/or away from the upper head to the upper test head; the movable space is disposed at least in the pairing board and the second item of the above-mentioned main board. "Between the board and the piece (refer to the patent application model, although the pusher is not specifically included in the above invention, and the upper ... = 疋, but the above pressing device should be in contact with the sub-component; the mating plate, the push-up member; and the driving device芈妃 1 幵 幵 幵 幵 幵 幵 幵 幵 幵 幵 幵 幵 幵 幵 幵 幵 幵 幵 幵 幵 幵 幵 幵 幵 幵 幵 幵 幵 幵 幵 幵 幵 幵 幵 幵 幵 推 推 推 推 推 推 推 推The visibility side 4 has a moving space disposed at least on the outer side in the plane direction of the paired board (refer to the third item of the patent scope of the Japanese Patent Application No. 4, the Japanese Patent Application No. 3). Suitable for mobile space

2247-9207-PF 7 200825432 is not placed in the above-mentioned mating board. The remaining side of the side wall surface of the bracket is the inner side (refer to item 4 of the patent application). Although not particularly limited in the above invention, the pressing means preferably includes a pushing member that is in contact with the electronic component to be tested; a mating plate that supports the pushing member; and a driving device that pushes the tablet member toward the pairing plate and pairs the pair The board is adjacent to and/or retracted from the test head; the mating plate is shorter than the bracket in the width direction; and the movable space is disposed at least outside the plane direction of the flat plate r (refer to claim 5) . In the above invention, the core is particularly limited to the above, but the movable space is preferably provided at least on the side surface of the flat plate member which is the inner side surface of the bracket (refer to claim 6 of the patent application). In the above invention, the contact member is preferably retracted to a position where the bracket does not interfere with each other (see item 7 of the range). j When carrying a carrier that does not load a 1C component, no test is required, and the push device does not fall at this time. Therefore, the movable space does not fall until the contact element reaches the passing position. In other words, the carriage is moved to the position above the contact portion of the test head while still maintaining the state in which the contact member and the bracket are engaged, and the contact member is not returned to the original position. In contrast, in the present invention t, the contact elements are retracted to a position where they do not interfere with each other, whereby even if the device is not lowered, the contact element can be returned to the origin position by moving the space. action. [Embodiment 8

2247-9207-PF 200825432 The following is a description of the drawings in accordance with an embodiment of the present invention. FIG. 3 is a perspective view showing an electronic component testing apparatus according to an embodiment of the present invention. FIG. 2 is a perspective view showing a test of an electronic component according to an embodiment of the present invention. FIG. 3 is a view showing an embodiment of the present invention. A conceptual diagram of a transfer carriage in an electronic component test device. Further, Fig. 3 is a view for explaining a method of transporting a carriage in the electronic component testing apparatus of the present embodiment, and actually, a portion of the element which is sub-arranged in the vertical direction is shown in plan. Therefore, regarding the mechanical structure (three-dimensional structure), it will be explained with reference to FIG. The function of the electronic component test device of the Bebe target type is to test (detect) whether the IC component is properly operated by using the test head 5 and the tester 6 in a state in which high temperature or low temperature stress is applied to the ic element. Then classify the 1C component based on the test result. Using this electronic component test device, the component test is loaded from a number of test objects (the customer's carrier of the component (refer to Figure 5), and the 1 (: component is placed in the carrier. The test tray TST (refer to Fig. 6) is transported and tested. In addition, 1 (: the component is indicated by the symbol 1C. As shown in Fig. 1, the space below the carrier is provided with a space 8, in The test head 5 is arranged in a replaceable type in this space 8. (4) The head 5 is free of slots 5〇, connected to the tester 6 by the winding 7. In addition, the device base 101 formed on the transport cassette can be passed. The opening portion is made to make electrical contact with the component 1 and the slot 50 on the test head 5, and the component is tested by the electronic signal from the tester 6. In addition, when the component type is more (4), it can be replaced. A slot suitable for the shape and the number of stitches of the 1C component of the type. 2247-9207-PF 9 200825432 The carrier 1 of the present embodiment, as shown in Figs. 2 and 3, includes the structure immediately. The 1C component of the test is classified and the storage unit of the IC component after the test is stored. The IC component sent from the storage unit 2 is sent to the loading unit 300 that operates to the unit 100, the studio unit 1 including the test head 5, and sorted and taken out in the studio unit 1 The release unit 400 of the Ic element that has been tested. Each part of the carrier 1 will be described below. <Storage unit 200> Fig. 4 is an exploded view of the 1C storage case used in the electronic component test apparatus according to the embodiment of the present invention. Fig. 5 is a perspective view showing a customer bracket used in the electronic component testing device according to the embodiment of the present invention. The housing portion 200 includes a pre-test storage box 201 for storing the component (for pre-test storage box 201 and for housing). The post-test storage box 202 of the IC component classified according to the test result. As shown in Fig. 4, these storage boxes 201, 202 include a frame-shaped bracket support frame 203 and enter from the lower portion of the bracket support frame 203 and upward. Elevator for lifting operation 204. On the bracket support frame 2 〇3, a plurality of customer brackets KST are overlapped. Only the overlapping customer brackets KST are moved up and down by the elevators 2〇4. In the customer tray KST in this embodiment As shown in Fig. 5, the concave accommodating portions for accommodating the ic elements are arranged in a 13rx14 column. The pre-test storage box 2 01 and the post-test storage box 2 〇2 have the same configuration, so the pre-test storage box 201 and the test The number of the rear storage boxes 2〇2 can be appropriately set as needed. In the present embodiment, as shown in FIGS. 2 and 3, the pre-test storage 2247-9207-PF 10 200825432 box 201 is provided. There are 2 storage boxes stk-B, next to it, there are 2 vacant

<Loading Unit 300> Fig. 6 is an exploded perspective view showing a test holder used in the electronic component testing device according to the embodiment of the present invention. The above-described customer tray KST is transported from the apparatus base 1〇1 to the two window portions 370 of the loading unit 30 by the tray transfer arm 205 provided between the storage unit 200 and the apparatus base 101. Then, in the loading unit 300, the 1C component placed in the customer tray KST is once transferred by the component carrier 310 to the positioner 360, where the mutual positional relationship of the π elements is corrected. Then, it is transferred to the positioner 360 (the component is again moved by the transport device 31) and placed in the test tray that is stopped by the loading unit 3, in the test tray TST, as shown in Fig. 6. As shown, the crosspieces 702 are disposed on the square frame 701 at equal intervals in parallel, and the sides 701a of the square frames 701 facing the crossbars 70 2 on both sides of the crosspieces 702 are respectively formed at equal intervals. a plurality of ampoules 703. The slats 702 are formed by the two mounting pieces 703 between the traverses 702 or between the traverses 702 and the sides 701a. Each of the embedded accommodating portions 704 respectively accommodates an insert 710. The insert 2247-9207-PF 11 200825432 piece 71 0 is attached to the two mounting pieces 703 in a floating state using the fastener 705. Thus, at both ends of the insert 71 0, the insert 71 is formed.安装 Mounting holes 7〇6 mounted on the mounting piece 703. Such inserts 710 are mounted on one test tray TST as shown in Fig. 6, and are arranged in 16 rows and 4 columns. The pieces 71 0 have the same shape and the same size, and each of the escutchees 710 accommodates the 1 C element. The insert 71 〇1 (: The accommodating portion is determined according to the shape of the 1C component to be accommodated, and in the example shown in Fig. 6, it is a square recess. The loading unit 300 includes 1 (: component is transmitted from the client tray KST) To the t-piece handling device 310 of the test tray tst. The component handling device 31, as shown in Fig. 2, includes two obstructions 3U mounted on the device base 1〇1, which can be The movable carriage 312 that moves between the test carriage TST and the customer carrier (the direction is γ direction here) and the movable head 32 that is supported by the movable arm 312 and movable in the X-axis direction. The movable head 320 of the component conveying device 310 is provided with a downwardly facing device: an adsorption sheet (not shown), which is adsorbed, and moves to support the Ic component by the customer carrier KST, and then The 1C component is placed on the test tray TST. The adsorption sheet can be imaginary (four) on the moving head device, and eight 1c components can be placed on the test tray TST at a time. <Studio part 100> Fig. 7 An outline of the interior of the studio part of the electronic component testing device of the embodiment of the present invention Shu Shu Li ° and solid 'in FIG. 81 through FIG Ti 8Α graph Mi See FIG. 7 brother VIII from a direction indicated by the capture chamber to heat the mound of times to the vertical transfer means

Set the view. 2247-9207-PF 12 200825432 After the ic component is placed in the test tray TST by the loading unit 3, it is sent to the studio unit 100, and the 1C component is loaded in the test tray TST. Test each 1C component. As shown in FIGS. 2, 3, and 7 , the studio unit 100 includes a hot dip chamber 110 that imparts a target high temperature or low temperature temperature stress to an IC component placed on the test tray TST. This hot dip chamber 11 is a test chamber 2 that contacts the 1C element and the test head 5 in a state in which thermal stress is applied, and a heat removal chamber 13A that removes thermal stress from the IC element subjected to the test in the test chamber 120. As shown in Fig. 2, the hot dip chamber 110 is arranged to protrude above the test chamber 12A. Further, as shown in Fig. 8, a vertical conveying device is provided inside the hot dip chamber 11A. ^This vertical handling device 111 comprises a first support mechanism 11 2 and a second support mechanism 115' which can be passed between the first support mechanism 112 and the second support mechanism = the test carriage TST is transferred, while the test bracket is made Tst drops. The first support mechanism 112, as shown in FIG. 8A, is composed of four first support members 113 and a starter (not shown) that moves the four support members 113 up and down and rotates, and each of the first support members 113 is formed in a cylindrical shape. The pusher 11 3a is constituted by a plurality of branch portions 11 3 b which are protruded from the pusher u3a in the flat direction to support the test tray TST in the flat direction. The starter moves the first support=3 up and down along the axis of the pusher 113a and is centered on the axis. In addition, in the 8A, the first support member 113 only shows two zeros. A single TST holding element 113 supports the test 辇卩卩 0 0 in two pairs and opposite pairs in the vicinity of each corner. The plurality of branch portions 113b are provided on the pusher 2247-9207-pp 13 200825432 member 112a so as to be spaced apart from each other and protrude in the radial direction of the cleats 11a. The second support mechanism 115 is composed of four second support members 丨i 6 and cylinders (not shown) for moving the second support 70 members 116 in the Y direction. Each of the second support members 116 is a plurality of bases that are positioned adjacent to each other in parallel with the pusher of the first support member 113 and a plurality of protrusions from the base U6a for supporting the test tray TST in the horizontal direction ( In this example, it is composed of three protruding portions 116b. The cylinder moves each of the four second support members 116 in the ¥ direction perpendicular to the conveyance direction of the test tray TST. The plurality of large projections 11 6b are provided at equal intervals to each other and protrude in the radial direction of the base 丨丨 6 &amp; Further, in Fig. 8A, only two of the second supporting members ι 6 are shown. There are no four second supporting members 116 so that the test carrier tst is paired in pairs near the respective corners and the respective protruding portions ii 6 b are opposed to each other. The vertical carrying device 1U receives from the loading portion 3 When the test tray tst is tested, as shown in the _th, first, the dog outlet portion 11 of the second support member 11 of the second support mechanism ι 5 supports the test bracket τςτ. Next, as shown in Fig. 8B, the first support element of the first support mechanism 112 = the branch portion (10) receives the test tray tst from the second support member 116. At the end of the transfer of the u-bay, the rise of the first support member ι ΐ 3 is also followed by the direction of the separation as shown in Fig. 8C. Then, before the position where 116b does not interfere with each other, the movement is ended. To the second support member 116, the test holder TST and the protrusion second support member 116 are separated from each other, that is, 2247-9207-pp 14 200825432. Next, as shown in FIG. 8D, the actuator enables the test tray. The first support member 113 of tst is lowered, whereby the test tray TST is further lowered. As shown in Fig. 8E, the second support member 116 of the month 11' opposite to the test tray TST receiving the drop is again approached again. However, after the first supporting member 11 3 is lowered, when the contact with the test tray TST is released, the first supporting member 113 is subjected to the test tray tst supported by the step-down portion 113b to be located at the engaging member. The manner between the front front joint portion (4) and the rear joint portion 122c is placed in the transport W26 of the horizontal transporting device 121, and then transported to the test chamber 12 (). Other test cartridges are transferred from the first support member 113 to the second support member 116. Next, as shown in Fig. 8G, the first support member 113 is rotated by 90 degrees with the pusher 1133 as an axis, and the opposing branch portions (1) are substantially parallel. Next, as shown in the eighth embodiment, the first support member 113 rises. At this time, the p-th support member 113 rises without coming into contact with the test tray TST. Then, as shown in Fig. 81, the first supporting member 113 is rotated by the same angle in the opposite direction to the rotation direction of the eighth image, whereby the branch portion 113b faces again and becomes a state in which the test tray TST can be supported again. Further, the plurality of test trays TST are placed in the hot dip chamber 11 while waiting for the test tray TST of the test chamber 120 to pass before being supported by the vertical conveyance device 1ST. Mainly in this standby state, high temperature or low temperature thermal stress is applied to the 1C element. Next, in the test tray TST in which the application of the thermal stress is completed, the test tray tst which is transported from the hot dip chamber to the conveyance belt 1 2 j by the conveyance by the vertical conveyance device 111 is conveyed by the horizontal conveyance device 121 to Test room 12〇. 2247-9207-PF 15 200825432 The horizontal conveying device 121 is constituted by the engaging member 122, the ball nut 123, the ball screw shaft 124, the motor 125, and the carrying belt 126 as shown in Fig. 9, so that the test tray TST is along the X direction. The test tray TST carrying the jc element before the test is transported from the hot dip chamber 11 to the test chamber 120. Further, while the test tray TST is transported to the test chamber 1 20 from the above-described heat to 110, the test tray 1 in the load test chamber 120 can be pushed to the heat removal unit. The chamber 130., the connecting member 122 is an approximately n-shaped member connected to the test bracket tst for carrying the test tray TST, and is extended from the base portion 122&amp; to the test tray TST by the base portion 122&amp; The front connecting portion 122b and the rear connecting portion 122c are formed. The base portion 122a is longer than the test bracket TST, and is provided with engaging portions 122b, 122c at both ends thereof so that the test bracket TST can be disposed between the engaging portions 122b, 122c. The front engaging portion 122b is disposed at an end portion of the base portion 122&apos; that is heated to the side of 130. In contrast, the rear engaging portion 丨22c is disposed at the end of the base portion 122a from the heat/text to the side of the 11 。 side. The test tray is transported from the hot dip chamber 110 to the office 12 (4), and the rear read (4) (10) pushes the test tray TST disposed between the engaging portions 122b, 122c from the hot dip chamber 11 to the test chamber 120. At the same time, the front joint The portion 122b pushes the test tray tst from the previous test from the test chamber 120 The heat removal chamber 13A. The ball nut 123, the ball screw shaft 124, and the motor 125 form a driving portion in the horizontal transporting device 121. The driving method is that the ball screw shaft rotates with the motor 125, and its rotational motion is converted into a ball nut. The linear motion of 123 is also called a ball screw type drive. The above-mentioned bearing member 122 is mounted on the ball nut 123, and the engaging (four) 122 moves with the movement of the ball nut 123 by the line 2247-9207-ρρ 16 200825432. In the ball nut The manner of installing the connecting member 122 on the 123 may be a screw connection or the like. Alternatively, the ball nut 123 and the engaging member 122 may be integrally formed. The carrying belt 126 #cross the hot dip chamber 11 and the test chamber 12 A belt conveyor configured in a space. The carrier belt 126 is a drive source that includes a drive source in advance, and follows the movement of the test carriage TST that the engagement member 122 moves. The ball screw shaft 124 described above substantially separates the carrier belt 126. In addition, the carrying belt 126 can move up and down when the z-axis driving device 129 pushes the ic element and the test bracket TST, and can be moved up and down. Supported by a spring element or the like not shown in the drawings. The handling of the horizontal transfer device 丨 21 will be described in detail below. First, the test tray TST that receives the application of thermal stress in the hot dip chamber 1 1 以 is located in front. The manner between the engaging portion 122b and the rear engaging portion 122c is carried by the vertical carrying device 111 on the carrying belt 121 of the horizontal carrying device 121. Then, when the test of the test tray TST previously entering the test chamber j 2 is finished, When the Z-axis driving device 129 described later rises, the horizontal transfer device 122 transports the test tray TST loaded with the ic element before the test to the test chamber 12A. More specifically, the rear engagement portion 122c of the engaging member 122, which operates in conjunction with the action of the ball nut 123, pushes the test tray TST from the hot dip chamber 1 to the test chamber 120. At the same time, the front connecting portion 122b of the engaging member 122 pushes the remaining tested test tray TST to the test chamber, and transmits it to the unloading device 131 of the heat removing chamber 130 (described later). Thus, the test tray TST is transported from the test chamber 12A to the heat removal chamber 130. Receiver's structure of the δ 儿明 test department. The device in the test chamber 12 某 a 2247-9207-PF 17 200825432 bottom Deng has an opening portion not shown. The opening has a size in which the test head 5 can enter the center portion thereof during the test. As shown in Fig. 7, at the upper portion of the test head 5, a plurality of slots 50 are arranged in such a manner that the inserts 71 of the test tray TST face each other. In contrast, in the test chamber 12A, as shown in the same figure, the plurality of pushers 1281 for pushing the IC components to the slots 5〇 during the test are used to face each slot on the test head 5 Way to set. Each of the push members 1281 is supported by the mating plate 1282, which can be moved up and down by the Z-axis driving device 129. As shown in Fig. 7, the Z-axis driving device 129 includes a gantry 1291, a stepping motor 1 292, a screw shaft 1 293, a ball screw adapter 1 294, an upper flat plate 1295, a shaft 1296, a drive plate 1297, and a convex portion 1298. The gantry 1291 is disposed above the test chamber 120, and a motor 1 292 is disposed on the upper plate of the gantry 1291. A screw shaft 1 293 is coupled to the drive shaft of the motor 1292. The screw shaft 1 293 passes through the upper plate of the gantry 1291, and is rotatably supported by the lower plate of the gantry through a rotary bearing (not shown) at its lower end. On the outer peripheral surface of the screw shaft 1 293, a male screw portion is formed across the entire surface. In contrast, a female screw portion is formed on the ball screw adapter 1294, and the screw shaft 1 293 and the ball screw adapter 1 294 are screwed together. . The ball screw adapter 1 294 is fixed to the approximate central portion of the upper plate 1 295.

The pusher members 1281 supported by the board 1 282 face each other and are fixed to the drive board 1 2 9 7 . The driving plate is arranged to have a protrusion on the lower surface thereof. The convex portions 1 298 are respectively aligned and arranged, and are disposed under the driving plate 1 2 9 7 2247-9207-PF 18 200825432. These projections 1 298 can push the pusher 1281 during testing. When the test tray TST is transported from the hot dip chamber 11 to the test chamber 120 by the horizontal transport device 121, the test tray TST is transported onto the test head 5, and each push member 1281 pushes the ic element To the slot, the input and output terminals of the 1C component and the contact pins of the slot 5 are electrically contacted, whereby the test of the K component is performed. The test result can be stored at the address, which can be determined by the identification number attached to the test tray TST and the number of the Ic component assigned inside the test tray TST. The test tray TST is transported from the test chamber 120 to the heat removal chamber 130 at the end of the test of the Ic element supported by the beta type tray tst. The conveyance from the test chamber 120 to the heat removal chamber 130 is performed by the horizontal conveyance device 121 and the unloading device 131. Specifically, first, when the test tray TST loaded with the untested 1C component is carried into the test chamber by the horizontal transport device 121, the front transfer portion 122b of the horizontal transport device 1 will load the test 1C component on the test head 5. The TST is pushed to the heat removal chamber 13〇. Next, the test tray TST is transferred to the carry-out device 131 of the heat removal chamber 130. The unloading device 131 transports the test tray TST to a predetermined position of the dip. The heat removal chamber 130 is also the same as the hot dip chamber 110. As shown in FIG. 2, the arrangement is larger than / above the test chamber 120, and conceptually as shown in FIGS. 3 and 7 The unloading device 13 includes a vertical conveying device 132 and a conveying belt 137. As shown in Fig. 9, the unloading device 131 has an engaging portion 133 which can be operated by a driving device which is not shown at its tip end, and the engaging portion 133 is in the X direction.

2247-9207-PF 19 200825432 Moving linear guide 136. The engaging portion 133 has a size at which the leading end portion is above the carrying belt 137 when standing up, and when the test tray is transported at 7 o'clock, the nip is engaged at the front end thereof to the bottom of the test tray TST. The linear guide 136 is composed of a platform 134 to which the engaging portion 133 is attached and a rail 135 that movably moves the platform 134 in the χ direction. When the engaging portion 133 is moved in the χ direction by a cylinder or the like not specifically illustrated, The platform 134 slides on the road 135, and the engaging portion 133 smoothly moves the test tray TST. The vertical conveying device 132 is the same as the vertical conveying device ill in the above-described hot dip chamber 110, and thus detailed description thereof will be omitted. Further, the conveyance belt 137 is the same as the conveyance belt 126 used in the hot dip chamber 110 and the test chamber 120, and thus detailed description thereof will be omitted. In the heat removal chamber 130, if a high temperature is applied to the hot dip chamber, the 1C element is cooled by air supply to return to room temperature. On the other hand, when a low temperature is applied to the hot dip chamber 110, the element is heated by a warm air, a heater, or the like to return to a temperature at which no condensation occurs, and then the IC element after the heat removal is transferred to the release. The portion 400. As described above, when the test tray TST is pushed from the test chamber 12 to the heat removal chamber 130 by the horizontal transport device 121, the engaging portion 133 where the leading end of the transport arm 131 is located stands up and is engaged to the test bracket. Then, in this state, the unloading device 131 moves in the X direction on the linear guide 136, whereby the test tray TST slides on the conveyance belt 137 and moves to the heat removal chamber 1 300. The position is then set. Then, when the test carriage TST is moved to the predetermined position, the vertical transport device 13 2 lowers the test tray TST with the vertical transport device i 1 described above. 2247-9207-PF 20 200825432 The test tray TST rises. At the upper portion of the hot dip chamber 110, an inlet for carrying the test tray TST from the apparatus base 1〇1 is formed. Similarly, above the heat removal chamber 130, a test tray is also formed. The TST is moved to the output of the unit base 1〇1. A tray transporting device 1A2 for loading and unloading the test tray TST from the studio portion 100 through the inlet and the outlet is provided on the apparatus base 101. The bracket transporting device 102 can be constituted by a rotating roller or the like. By the carrier handling device 102, the test forcing the TST from the heat removal chamber 13 is changed after the test of the I carrier, and the component Ic is placed on the customer tray KST by the component handling device 410 as will be described later. After being emptied, the delivery unit 4〇〇 and the loading unit 300 are returned to the hot dip chamber 11〇. <Release unit 400> In the present embodiment, the same is provided on the release unit 4 The two transfer devices 410, which are the same as the component transfer device 31 provided in the loading unit 300, carry the tested IC components from the test tray TST that is carried out to the discharge unit 400 by the transfer device 41〇. The customer tray KST classified according to the test result is shown in Fig. 2, in the apparatus base I" in the release portion 4", a pair of bakes 470 are formed, and the arrangement is made from the accommodating portion 2客户The customer carrier kst moved into the release section faces the top of the device base 1〇1. In the illustration, on the lower side of each window portion 470, there is a material table for lifting and lowering the customer tray KST. Here, (4) the customer tray KST of the IC/G piece after being placed and fully loaded and tested 4 This full load carrier is transferred to the carriage transfer arm 205.

2247-9207-PF 200825432 The function of this embodiment will be described below. The 10A map and the 10β graph are conceptual cross-sectional views showing the operation of pushing the IC component in the first embodiment of the present invention to the test head. By the vertical transport device 111 of the '10', the test carriage TST is placed on the transport belt 126 of the horizontal transport device 121 in a manner between the front joint portion 1221) and the rear joint portion (2) c of the transport device 121. When the motor 125 is driven, the rear engaging portion mc of the engaging member 122 is engaged to the rear end of the test bracket tst, and the test bracket TST is pushed to slide on the side of the carrying belt 126 toward the test chamber 120. Then, as shown in Fig. 1A, the test tray TST is located above the hoe 5. At the same time, the front engagement portion 1 will load the test tray TST that has been placed above the test head 5 and the end of the test (the component is pushed to the heat removal chamber 130. When the test tray TST is located on the test head 5, such as As shown in Fig. 1B, the z-axis drive is set to drop 1 2 9 , the convex portion 1 2 9 8 is connected to the pusher 1281 supported by the mating board 1 2 8 2, and the pusher 1281 is pushed to the test bracket. The IC component on the TST. Then, the Ic component pushed by the pusher 12 81 and the slot 50 disposed on the test head 5 are connected to each other for testing. At this time, in this embodiment, Z can be made. The thickness of the convex portion 1 298 of the shaft driving device ι 29 is increased, whereby a movable space s is formed between the driving plate 1297 of the z-axis driving device 129 and the mating plate 1282. This movable space &amp; has the engaging portion 122b The size of the space passed through. In addition, in the present embodiment, when the Z-axis driving device 129 is lowered to cause the pusher 1281 to push the 1C component toward the slot 50, it is formed between the mating board 1282 and the driving board 1 297. The moving space s has the connection portion 122b passed, by 2247-9207-PF 22 200825432 The member 122 returns to the origin position in the test of the component (in terms of force). In other words, in the present embodiment, the horizontal carrying device 121 transports the test tray TST to the test chamber 120, and the z-axis drive device 129 descends for measurement. Even if the space formed between the z-axis driving device 129, the mating board 1 282, the test tray TST, and the slot 50 becomes the narrowest, the connection a|^22b passes through the movable space 〜, The element 122 can return to the origin position without waiting for the z-axis drive, and if the set 129 is raised. In addition, during the period when the drive device 129 is lowered to perform the test of the IC component, the next ic component to be tested is loaded. The test tray TST is placed on the conveyance belt 126 of the conveyance device 121 by the vertical conveyance break 111' of the hot dip chamber 11 so as to be positioned between the front engagement portion 22b and the rear engagement portion 22c. During the test of loading on the previous test tray TST2IC component, the carrier preparation routine of the next test tray TST ends. In other words, when the interface component 122 of the horizontal handling device 121 returns to the origin, there is no need to wait. The z-axis driving device 1 2 9 rises time, and the standard time can be shortened. In the above embodiment, the movable space Sq is formed between the mating board 1 282 and the driving board 1 297, however, in the present invention The present invention is also not limited to the second embodiment to the seventh embodiment described below. The drawings 11A and 苐iiB are conceptual cross-sectional views showing the second embodiment of the present invention. The action of the IC component to the test head. In the second embodiment of the present invention, as shown in the UA diagram and the 11th diagram, the pairing plate 1282 is made shorter in the width direction (here, the gamma direction) than the test tray TST. The shaft driving device 129 is lowered, and in the state where the 1C component of the test tray TST is pushed toward the slot 50, a movable space can be formed between the driving board 1297 and the test tray TST. So. This movable space S is disposed on the side of the mating panel 1 282 which is the inner side wall surface 1 2 8 2 a with respect to the test tray TST. Fig. 1A and Fig. 2B are conceptual cross-sectional views showing the operation of pushing the IC element in the third embodiment of the present invention to the test head. In the third embodiment of the present invention, as shown in Figs. 12A and 12B, the convex portion 1298 of the driving plate 1297 is thickened, and the counterpart plate 1282 is placed in the I degree direction (Y direction). The frame TST is short. Thereby, when the test is performed, the Z-axis driving device 129 is lowered, and in a state where the 1C element of the test tray TST is pushed toward the slot 50, a movable space S can be formed between the driving board 1297 and the test tray TST. . . This movable space s is disposed on the side of the pair of plates 282 which is the inner side wall surface 1 282a with respect to the test tray TST. Figs. 13A and 13B are conceptual cross-sectional views showing the operation of pushing the IC component of the fourth embodiment of the present invention to the test head. In the fourth embodiment of the present invention, as shown in Figs. 13A and 13B, the driving plate 1 297 is made shorter in the width direction (Y direction) than the test tray TST. Thereby, when the test is performed, the Z-axis driving device 129 is lowered, and in the state where the ICtc member of the test tray TST is pushed toward the slot 50, the movable space S can be formed on the upper side of the mating board 1 282. . The movable space center is disposed on the side of the driving plate 1297 with respect to the inner side wall surface 129 of the test bracket tst. Figs. 14A and 14B are conceptual cross-sectional views showing the operation of pushing the 1C element of the fifth embodiment of the present invention to the test head. In the fifth embodiment of the present invention, as shown in the UA diagram and the HB diagram 2247-9207-PF 24 200825432, the convex portion 1298 of the driving board 1 297 is thickened, and the driving board 1 297 is oriented in the width direction. (Y direction) is shorter than the test tray TST. Thereby, when the test is performed, the Z-axis driving device 129 is lowered, and in the state where the test tray TST 1 (the element is pushed toward the slot 50, the movable space core can be formed on the upper side of the mating board 1 282. The movable space S is disposed on the side of the driving plate 1297 which is the inner side wall surface 1 297a with respect to the test bracket tst. FIGS. 15A and 15B are conceptual cross-sectional views showing the sixth embodiment of the present invention. In the sixth embodiment of the present invention, as shown in Figs. 15A and 15B, the mating plate 1 282 is made shorter in the width direction (γ direction) than the test tray TST. Further, the driving board 1 297 is also shorter in the width direction (γ direction) than the test tray TST. Thereby, the movable space 〜 can be formed on the upper side of the test tray TST. This movable space S 〇 is set on the matching board 丨282 and the side surface of the driving plate 1 297 which is the inner side wall surface 1 282a, 1 297a with respect to the test bracket TST. FIGS. 1 6A and 16B are conceptual cross-sectional views showing the γth embodiment of the present invention. The operation of pushing the IC component toward the test head. In the seventh embodiment of the present invention The thickened portion 1 298 of the driving plate 1 297 is thickened as shown in Figs. 16A and ι6Β, and the mating plate 1 282 is made shorter in the width direction (Y direction) than the test tray TST, and further driven The plate 1 297 is also shorter in the width direction (Y direction) than the test tray TST. Thereby, a movable space s 〇 can be formed on the upper side of the test tray TST. This movable space g is provided on the mating board 12 8 2 And the drive plate 1 2 9 7 is the side surface of the inner side wall surface 1 282a, 1 297a with respect to the test bracket τ s T. Further, in the first to seventh embodiments described above, as shown in Fig. 17, The first 2247_92〇7-PF 25 200825432 can be raised and retracted by 90 degrees around the X direction by a driving bow (not shown).

The J 1 history square weighing portion 122b is retracted to the rear of the base portion 122a in the Y direction, or the square joint portion 1221) is rotated by 9 degrees on the side of the heat removing chamber 130 centering on the z direction. When the front engagement portion 122b is retracted, when the test reference for vacating the unloaded element is carried, the movable space s is not formed even if the z-axis drive unit 129 does not descend. The engaging member 122 can also return to the home position when the front engaging portion mb does not interfere with the components such as the driving plate 1297 and the mating plate 1282 and the test tray TST. Further, the embodiments described above are described in order to facilitate the understanding of the present invention and are not intended to limit the present invention. Therefore, the various elements disclosed in the above embodiments include all design changes or equivalents falling within the technical scope of the present invention. A &quot; For example, in the above-described third to seventh embodiments, the description of the conveyance of the test tray TST by the engaging member 122 is described. However, the holding device of the holding bracket can also be used for carrying the handling. . BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic cross-sectional view showing the test of an electronic component according to an embodiment of the present invention. x Fig. 2 is a perspective view showing an electronic component testing apparatus according to an embodiment of the present invention. Fig. 3 is a conceptual view showing a transfer carriage in an electronic component testing device according to an embodiment of the present invention.

2247-9207-PF 26 200825432 Fig. 4 is an exploded perspective view showing the 1C storage case used in the electronic component testing device according to the embodiment of the present invention. Fig. 5 is a perspective view showing a customer tray used in the electronic component testing device according to the embodiment of the present invention. Fig. 6 is an exploded perspective view showing a test holder used in the electronic component testing device according to the embodiment of the present invention. Fig. 7 is a conceptual cross-sectional view showing a studio portion of an electronic component testing device according to an embodiment of the present invention. Fig. 8 is a view (1) of the vertical conveying device in the hot dip chamber of the working chamber portion shown in Fig. 7 as seen from the direction of νΐ 。. Fig. 8 is a view (second) of the vertical conveying device in the hot dip chamber of the studio portion shown in Fig. 7 as seen from the direction of VIII. Fig. 8C is a view (No. 3) of the vertical conveying device in the hot dip chamber of the working chamber portion shown in Fig. 7 as seen from the VIII direction. Fig. 8D is a view (fourth) of the vertical conveying device in the hot dip chamber of the working chamber portion shown in Fig. 7 as seen from the direction of νΐ η. Fig. 8 is a view (fifth) of the vertical conveying device in the hot dip chamber of the studio portion shown in Fig. 7 as seen from the direction of VIII. Fig. 8F is a view of the vertical conveying device in the hot dip chamber of the studio portion shown in Fig. 7 viewed from the VIII direction (the sixth 8G view is the heat of the studio portion shown in Fig. 7 from the yin direction) View of the vertical transport device in the dip chamber (seventh). Fig. 8H is a view (8) of the vertical transport device in the hot dip chamber of the studio portion shown in Fig. 7 viewed from the direction VIII. 2247-9207 -PF 2Ί 200825432 Fig. 81 is a view (ninth) of the vertical conveying device in the hot dip chamber of the studio portion shown in Fig. 7 viewed from the VIII direction. Fig. 9 is a view from the IX direction as shown in Fig. 7. The test portion is a plan view showing the carrying device of the test tray in the test chamber of the embodiment of the present invention. Fig. 10A is a conceptual cross-sectional view showing the 1C component of the i-th embodiment of the present invention before being pushed toward the test head. Fig. 10B is a conceptual cross-sectional view showing a state in which the IC component of the jth embodiment of the present invention is pushed toward the test head. Fig. 11A is a conceptual cross-sectional view showing the second embodiment of the present invention. The state before the IC component is pushed to the test head. Figure 11B is an overview The cross-sectional view shows a state in which the 1C element in the second embodiment of the present invention is pushed to the test head. Fig. 1 2A is a conceptual cross-sectional view showing the 1C element in the third embodiment of the present invention being pushed to the test. Fig. 12B is a conceptual cross-sectional view showing a state in which the ICtg member in the third embodiment of the present invention is pushed toward the test head. Fig. 13A is a conceptual cross-sectional view showing the first embodiment of the present invention. The state of the ICtg member in the state is pushed to the state before the test head. The brother 1 3B is a conceptual cross-sectional view showing the state after the 1C member in the fifth embodiment of the present invention is pushed toward the test head. The cross-sectional view shows a state before the IC τ of the fifth embodiment of the present invention is pushed toward the test head. Fig. 1 is a conceptual cross-sectional view showing the 1C element of the fifth embodiment of the present invention being pushed toward the test head. After the state.

2247-9207-PF 28 200825432 Fig. 15A is a conceptual cross-sectional view showing the state before the IC element in the sixth embodiment of the present invention is pushed toward the test head. Fig. 15B is a view showing a state in which the 1C element of the sixth embodiment of the present invention is pushed toward the test head. Fig. 16A is a conceptual cross-sectional view showing a state before the IC element in the seventh embodiment of the present invention is pushed to the test head. Fig. 16B is a conceptual cross-sectional view showing the state after the IC element in the seventh embodiment of the present invention is pushed toward the test head. Fig. 17 is a conceptual diagram showing a state in which the engaging member in the embodiment of the present invention is rotated by 90 degrees around the X direction. Figure 18A is a conceptual cross-sectional view showing the state before the IC component is pushed toward the test head in the conventional test section. Fig. 18B is a conceptual cross-sectional view showing a state after the IC element is pushed toward the test head in the conventional test portion. [Description of main component symbols] 1 Electronic component testing device 6 Tester 7 Thin wire 8 Space 1 0 0 Studio section 101 Device base 102 Carrier handling device 110 Hot dip chamber 2247-9207-PF 29 200825432 111 Vertical handling device 11 2 first support mechanism 113 first support member 113a pusher 113b branch portion 11 5 second support mechanism 11 6 second support member 11 6 a base portion 116b protrusion portion 1 2 0 test chamber 1 21 horizontal transport device 122 joint member 122a base 122b front connecting part 1 2 2 c rear connecting part 123, 124 ball screw mechanism 1 2 5 motor 126 carrying belt 1281 pusher 1 2 8 2 mating board 1 282a side wall surface 129 Z-axis driving device 1291 gantry 1 292 stepping motor 2247 -9207-PF 30 200825432 1293 Screw shaft 1294 Ball screw adapter 1295 Upper plate 1296 Axis 1297 Drive plate 1 297a Side wall surface 1298 Projection 130 Heat removal chamber 131 Carry-out device 132 Vertical handling device 133 Engagement 134 Platform 135 Track 136 Linear Guide rail 137 conveyance belt 200 storage portion 201, 2 0 2 storage box 203 bracket support frame 204 lift 205 carriage moving arm 300 loading portion 310 component Handling device 311 Road 312 movable arm 2247-9207-PF 31 200825432 320 movable head 360 positioner 370 window 400 release part 410 component handling device 470 window 5 test head 50 slot 701 square frame 701a side 702 cross 703 Mounting piece 704 Housing 705 Fastener 706 Mounting hole 710 For incoming KST Customer bracket TST Test bracket So Movable space

2247-9207-PF 32

Claims (1)

200825432 X. Patent application scope: 1. An electronic component testing device, including a testing department, which loads the electronic components to be tested in the 芊Λ 芊Λ 口 口 口 口 口 口 口 口 口 口 口 口 口 口 口 口 口 口The contact portion of the test piece and the test head are electrically contacted to perform the test of the above-mentioned lightning device, wherein the test portion has a transport device having a contact element in contact with the bracket and the bracket is in contact with The contact element moves the upper bracket; and the 兀 member moves to transport the pusher in a predetermined direction, and the bracket that carries the transport device and the electronic component to be tested mounted on the bracket are pushed toward On the side of the test head; the pushing device is provided with a movable I r and a J moving space, and when the pushing device, the bracket and the electronic component to be tested are pushed, the light is lighter than The contact element on the side of the (4) direction may be moved in a direction opposite to the above-described enthalpy direction. 2. The electronic component testing device according to the scope of the patent application, the above-mentioned pressing device package The device includes: 〃 T pusher member, in contact with the electronic component to be tested; a mating plate supporting the pusher; and a driving device, the tablet is disposed in the &, to the pairing plate, and the pairing is reversed and/or returned The above-mentioned test head; the movable space is at least placed between the paired board and the above-mentioned flat panel element. 3 · As claimed in the patent scope 第g the electronic component testing device of the first member, wherein 2247-9207 -PF 33 200825432 The above pressing device comprises: · the pushing member' is in contact with the electronic component under test; the mating plate supports the pushing member; and the driving device pushes the plate member toward the mating plate and brings the pairing plate close to and/or Or away from the test head; the mating plate is shorter than the bracket in the width direction; the movable space is disposed at least outside the plane direction of the mating plate. 4. The electronic component testing device according to claim 3, Wherein, the movable space is disposed on a side surface of the pair of plates that is inside the side wall surface of the bracket. The electronic component testing device of the first aspect, wherein the pressing device comprises: a pushing member that is in contact with the electronic component to be tested; a mating plate that supports the pushing member; and a driving device that pushes the tablet member toward the pairing plate And the pairing plate is adjacent to and/or away from the test head; the mating plate is shorter than the bracket in the width direction; and the movable space is disposed at least outside the plane direction of the flat plate member. In a fifth aspect of the electronic component testing apparatus, the movable space is provided at least on a side surface of the flat plate element that is inside the side wall surface of the bracket. The apparatus of claim 2, wherein the contact element is retractable to a position where the bracket does not interfere with each other as described in the electronic component test 2247-9207-PF 34 200825432. 2247-9207-PF 35