JP2912644B2 - IC handler - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (1) Technical Field of the Invention The present invention relates to an IC for checking the quality of an IC (integrated circuit).
The present invention relates to an IC handler for transporting an IC in a test apparatus.

(2) Conventional technology An IC test apparatus includes a test section for testing the quality of an IC, an IC supply section for sucking and taking out ICs stored in a pallet one by one into the test section, and The ICs judged as good and the defectives as a result of the test in the test section are sorted and stored in separate pallets, respectively.
Generally, it is composed of an IC storage section.

Therefore, when attaching and detaching the IC under test to and from the IC socket of the IC tester, first insert the IC under test into the IC socket using the suction pad on the supply side, and then press the IC lead into the socket with the `` IC lead holder '' to insert the IC. It is completely installed in the socket. After the test, the IC will be removed from the socket by the suction pad on the storage side. Therefore, in order to attach / detach the IC to / from the socket, it is necessary to operate the three members of the supply unit side suction pad, the IC lead presser, and the storage side suction pad.
This was one of the problems in increasing the speed of IC test equipment.

Furthermore, untested ICs may be mixed into ICs that have been tested, which may be a problem in product management.

In a method other than the above-described method, when the IC is pushed into the socket at a stroke, the lead of the IC may be bent.

(3) Object of the Invention The present invention simplifies the drive mechanism to facilitate high-speed operation, prevents bending of the IC lead that is likely to occur during handling, and furthermore, enables untested ICs and test-completed ICs. It is intended to provide an IC handler that can be completely separated.

(4) Configuration and operation of the invention In order to achieve this object, according to the present invention, the IC in the pallet in the supply unit is sucked by the suction pad and supplied to the test unit, and the storage unit is tested in the test unit. In the IC handler, based on the result, each of the non-defective and defective pallets is sorted and stored in the pallet, wherein the test unit positions the IC under test sucked and transferred by the suction pad of the supply unit. A rotary drive unit comprising a rotatable tray, a rotatable drive unit for sucking the IC on the rotatable tray and sequentially rotating at a predetermined angle, and a suction pad of the rotatable drive unit above the IC socket in the test unit. To remove the IC under test in the socket guide of the IC socket, and then further remove the IC under test.
Terminal is pressed by the suction pad of the rotary drive unit to completely mount the IC socket, and after the test performed in the mounted state is completed, the IC under test is suctioned by the suction pad of the rotary drive unit and the IC is sucked. IC extraction means for extracting the IC under test from the socket, and when the empty pallet is taken out of the supply unit and used in the storage unit, the untested IC remains on the pallet. In order to discharge the remaining untested IC from the pallet, the pallet is further provided with pallet reversing means for turning the pallet upside down.

 Hereinafter, the present invention will be described in detail with reference to the drawings.

FIG. 1 is an external view of the device of the present invention showing a part of the internal details, (a) is a perspective view, (b) is a plan view, (c) is a front view, and (d) is a left side view. 2 (a) is a detailed plan view, FIG. 2 (b) is a detailed plan view showing a mechanism of a rotating index for performing measurement, FIG. 3 is a front view showing a sliding mechanism of the device to the rotating index, and FIG. FIG. 5 and FIG. 5 are diagrams for explaining the operation procedure of the device of the present invention.

The configuration of the device of the present invention will be described first with reference to these drawings.

Reference numeral 1 denotes a supply unit for stacking about 10 IC pallets as devices under test at a time, and is configured to be able to freely accommodate devices in m rows and n columns (m and n are arbitrary positive numbers). Have been. The device suction pads 11 and 12 suction ICs on the pallet. The mount 13 of the device suction pads 11 and 12 can be guided by the Y-axis servo motor 91 along the guide (Y-axis) 14 to the position shown by the dotted line in FIG. The guide 14 is screwed to the guide shaft 15,
When the guide shaft 15 is driven by the rotation of the motor 16, the guide shaft 15 is guided and driven along the guide (X axis) 15. 31,32
Is a bearing.

Reference numeral 2 denotes a heater unit, which is configured to keep the temperature of the device constant after a certain time has elapsed after the start of the operation. The device sucked by the supply unit 1 is removed from the pallet one by one by the suction pads 11 and 12 and arranged on the heater unit 2. The device is heated to maintain a constant temperature, and the device is taken out from one end for testing. have.

Reference numeral 3 denotes a slide unit (positioning tray), which controls devices in the heater unit 2 by suction pads 11 and 12 one by one.
One or two pieces are sucked at the same time and mounted on the positioning tray 3.

Reference numeral 4 denotes a rotation index portion, and suction pads 41, 42, 4
The devices transported from the positioning tray 3 are sucked from the positioning tray at the position 45 by the suction pad 42. At the time of measurement, the device lead guide of the measuring socket at the position 46 (for example, on the socket). (At a position 2 to 3 mm apart), and the device is configured to drop into the socket. With the device lead guide of the socket, the positioning is accurate. Next, the suction pad 42 at the position 46 presses the lead of the device from above the terminal, mounts it on the socket, and starts measurement. These operations are performed by the servo motor 49, so that the pressure contact speed can be arbitrarily set as compared with the conventional method of pushing the socket into the socket with air at a stretch, thereby preventing a lead bending accident. At this time, the suction pad 41 is at the position of 45,
The next device is sucked from the positioning tray 3 which has been further slid further back than in the above operation.

Reference numeral 5 denotes a reversing slide portion, which is provided with an air cylinder 51 for pulling out and an air cylinder 52 for rotation. The device is placed on a turntable 53 so that the direction of the device on the pallet is the same as that of the supply portion 1.

6 is a defective product that stores an IC determined to be defective as a result of the measurement.
NG pallet.

Reference numeral 7 denotes a non-defective pallet for accommodating ICs determined as non-defective as a result of the test. Defective pallet from reversing slide section 5
6. The transfer to the non-defective pallet unit 7 is performed in the same manner as in the supply unit 1. That is, the mount 13 'of the device suction pads 11' and 12 'can be guided by a Y-axis servo motor 91' (not shown) along a guide (Y-axis) 14 '. Movement in the X-axis direction is performed by guiding the guide 14 'screwed to the drive shaft 71 along the drive shaft (X-axis) 71 from left to right in the figure by driving the drive shaft 71. Three
3, 34 are bearings.

Reference numeral 8 denotes a pallet reversing unit. When the pallet of the supply unit 1 becomes empty, a posture reversing operation of turning over the pallet is performed, and it is confirmed that the pallet is completely empty. Third
As shown in the figure, it has a two-stage configuration, and a good product pallet
7. Supply an empty pallet to the defective pallet unit 6. Defective
The NG pallet unit 6 and the good pallet unit 7 constitute a storage unit.

 A control unit 9 controls the above operation.

The embodiment of the present invention configured as above operates as follows.

10 pallets are manually or automatically inserted into the loader unit 1. This pallet is full of ICs in m rows and n columns as shown in FIG.

The ICs on the pallet are transferred one by one or two simultaneously to the heater unit 2 by the device suction pads 11 and 12, and
After the temperature reaches a certain level (approximately 1 minute), two ICs (56, 57) are sucked one by one by the suction pad to the slide part 3.
Put IC56,57.

The slide part 3 is slid to the rotary index part 4.

The IC 56 on the slide portion 3 is sucked by the suction pad 42 and the index is moved to the measurement position (46) by 1/4 rotation.

Drop the IC onto the socket at the measurement position (46). IC56
Is placed in the proper position by the lead guide of the socket.

The IC 56 is crimped on the socket by the servo motor 49.

Measure the characteristics of the IC and rotate the rotation index 1/4.

The IC 56 is placed on the reversing slide section 5 by the suction pad 44 as shown in FIG.

 The reversing slide part 5 is rotated by 180 °.

The positioning tray 3 is further slid one step deeper into the rotating index section 4, the IC 57 is moved and measured by the same operation, and then placed on the reversing slide section 5 as shown by B.

If the IC 56 is determined to be a non-defective product, it is placed on the non-defective product pallet unit 7 and the rejected product is placed on the defective product pallet unit 6.

 The reversing slide unit 5 is again rotated by 180 °.

The reversing slide section 5 is moved to the right, and the IC 57 determined to be non-defective is placed in the non-defective pallet section 7 similarly to the IC 56, and the IC 57 is disposed in the defective pallet section 6 when determined to be defective.

The reversing slide unit 5 is moved to the left to recover. Do the same thing again.

When the pallet of the supply unit 1 becomes empty, the empty pallet 72 is transferred to the pallet reversing unit 8 by a transfer mechanism such as four pallet suction pads as shown in the upper part of FIG.

The empty pallet 72 is rotated by an air cylinder (not shown) around the rotation shaft 81, and the posture of the empty pallet 72 is turned upside down. If any IC remains on the pallet, the IC is discharged, thereby preventing the leakage of the inspection leakage IC. be able to.

The next empty pallet 73 is transferred to the pallet reversing section 8 by the transfer mechanism such as four pallet suction pads,
The air cylinder (not shown) makes a half turn around 81. The empty pallet 72 enters a standby state in preparation for the operation described in the next section.

When the pallet of the non-defective pallet unit 7 or the defective pallet unit 6 is full, the pallet is lowered by one step by a motor (not shown), so that the empty pallet 72 of the pallet reversing unit 8 is replenished in the space.

Effects of the Invention As is clear from the above description, the IC handler of the present invention has the following effects.

When inserting the input / output pins of the device under test into the IC socket to electrically connect the device under test to the test circuit, the pressure contact speed can be set arbitrarily with a servo motor.
Since the IC can be inserted into the socket at an appropriate position with an appropriate pressure, the lead of the IC is hardly bent. Also, the speed at which the IC is inserted into the socket is higher than before.

When the supply unit sends out all the ICs to be tested to the test unit and moves the empty pallet to the storage unit, the pallet is turned upside down, and if there is any IC remaining on the pallet, it is removed. Since the completely empty pallet is moved to the storage section, there is no possibility that the IC which has not been inspected will be mixed into the inspected IC.

The direction of the device (IC) in the supply unit and the storage unit is the same, which is convenient for product management.

[Brief description of the drawings]

FIG. 1 is an external view of the device of the present invention showing part of the internal details, (a) is a perspective view, (b) is a plan view, (c) is a front view, (d) is a left side view, FIG. 2 (a) is a detailed plan view of the apparatus of the present invention, FIG. 2 (b) is a detailed plan view showing a mechanism of an index for performing measurement in the apparatus of the present invention, and FIG. 3 is a slide of the device to the index of the present apparatus. FIGS. 4 and 5 are views for explaining the operation procedure of the apparatus of the present invention. Reference Signs List 1... Supply section 2... Heater section 3... Positioning tray 4... Rotating index section 5... Reversing slide section 6.
8 ... Pallet reversing unit, 9 ... Control unit, 11,12 ... Device suction pad, 13 ... Mount, 14 ... Guide, 15 ...
... Guide shaft, 16 ... Motor, 41,42,43,44 ... Suction pad, 45,46,47,48 ... Position, 49 ... Servo motor, 51,52
…… Air cylinder, 53… Turntable, 56,57 …… IC, 71…
… Drive shaft, 72… empty pallet, 73… empty pallet.

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-63-128727 (JP, A) JP-A-1-172774 (JP, A) JP-A-61-270052 (JP, A) JP-A-53-127 284478 (JP, A) JP-A-62-104130 (JP, A) JP-A-1-172773 (JP, A) JP-A-60-154636 (JP, A) JP-A-48-77330 (JP, A) JP-A-63-138746 (JP, A) JP-A-61-104549 (JP, U) JP-A-51-2524 (JP, Y1) (58) Fields investigated (Int. Cl. ⁶ , DB name) H01L 21/66 G01R 31/26

Claims (1)

(57) [Claims] 1. An IC in a pallet in a supply unit is suctioned by a suction pad and supplied to a test unit. In a storage unit, based on a result of the test in the test unit, the pallets are sorted into good and defective pallets. In the IC handler configured to store therein, the test unit may further include a positioning tray for positioning the IC under test sucked and transferred by the suction pad of the supply unit, and a suction tray for the IC on the positioning tray. A rotation drive unit having a rotation drive unit that sequentially rotates at a predetermined angle; and a suction pad of the rotation drive unit is lowered above the IC socket in the test unit, and the IC under test is placed in the socket of the IC socket. After the suction is stopped in the guide, the terminal of the IC under test is further pressed by the suction pad of the rotary drive unit to completely mount the IC under test, and after the test performed in the mounted state is completed, the IC under test is terminated. IC pulling means for sucking the IC under test by the suction pad of the rotation drive unit and pulling out the IC socket from the IC socket, wherein the supply unit takes out the IC under test and uses the empty pallet in the storage unit. When the uninspected IC remains on the pallet, the apparatus further comprises pallet reversing means for turning over the pallet to discharge the remaining uninspected IC from the pallet. The IC handler that features it.