TWI359273B - - Google Patents

Description

丄 35.9273

IX. OBJECTS OF THE INVENTION: 1. The present invention relates to various electronic components such as semiconductor integrated circuits (hereinafter also referred to as ic components) and contact portions of test heads. An electronic component test device that is in electrical contact to test the 1C component. [Prior Art] % In the manufacturing process of electronic components such as IC components, in the state where the package is completed, an electronic component test device is used in order to test the performance, function, and the like of the Ic component. In the carrier (Handier) constituting the electronic component testing device, a plurality of brackets (hereinafter referred to as customer brackets) for receiving, "incorporating the IC component of the type 5" or accommodating the c component after the test The Jc component is placed on a bracket (hereinafter referred to as a test bracket) that circulates in the electronic component testing device, and the test carrier is transported into the carrier, and the 1C component is placed in the state of being placed in the test tray. Lu Wei = placed in the contact part of the test 4 for electronic contact, and tested on the body of the electronic component test device (hereinafter also referred to as the tester). Then, when the test is completed, the test holders loaded with the respective 1C components are carried out from the test head, and are placed in the macro-k force according to the δ-type result. The customer is on the wood and uses this to classify the so-called good and bad products. The test tray TST is circulated and transported by a loading system that is traversed between the loading unit, the work-to-part (consisting of the hot dip chamber, the test chamber, and the heat removal chamber) and the unloading unit in the electronic component testing device. In addition, the test of the 1C element was carried out under the condition that the element was subjected to thermal stress of low temperature or high temperature, so that the inside of the heat chamber 2247-9261-PF 6 was the .9273 dip chamber and the test chamber was kept at a low temperature or a high temperature. In such hot dip chambers and test chambers, the size and shape of the test tray may change due to thermal expansion 'heat shrinkage. Therefore, sometimes in the transport system, the test tray is caught and cannot be smoothly transported, resulting in the test stand being finally stagnated (so-called jam) in the studio. Thus, after the test tray is stagnated in the working chamber portion, the past practice is to restore the temperature of the working chamber to room temperature and perform the manual operation manually. In other words, the temperature in the working chamber portion is set to the temperature at which the worker can operate and the test tray is restored, and thereafter, the temperature in the working chamber portion is again raised or lowered to a temperature at which the 1c element can be tested (hereinafter also referred to as degree). This type of recovery takes hours, so it takes a huge amount of time to lose. SUMMARY OF THE INVENTION The object of the present invention is to provide an electronic component test and an electronic component test method for reducing the time when the test tray is stagnant. ^ ^ ^ Έ,. This month provides an electronic component testing device that mounts the electronic component under test on the top of the measuring element # i , to make the above-mentioned contact with the element and the head. Testing of the electronic component, wherein the method of transferring the above-mentioned test piece to the predetermined two-way system in the above-mentioned electronic component system is oriented in the whole or part of the above-mentioned electronic component system == said bracket; Bracket (refer to the opposite direction of the direction of the indirect direction of the 'L, the first paragraph of the patent scope of the armor). In the present invention, the transport system that circulates the transport carriage toward the predetermined direction

S

The 2247-9261-PF 135.9273 can also carry the carriage in the direction of extension opposite to the above-mentioned predetermined direction and in the opposite direction of the day β Δ — w. Therefore, when the test bracket is in the transport system, the gentleman can play the τ blockage, and the transport bracket can be moved from the blocked position to the reverse direction of the normal transport direction (hereinafter also referred to as reverse transport). After that, the carrier is transported again (hereinafter referred to as re-handling) toward the main hall. By this, the clogging can be automatically eliminated, so that it is not necessary to perform the recovery operation manually, and the time loss can be greatly reduced. However, the above electronic component test package is not particularly limited in the above invention.

Preferably, the step further comprises: detecting means for detecting an abnormality of the conveyance of the carriage in the conveyance system; and a control means for performing operation control of the conveyance system; wherein the control means detects the conveyance of the carriage by the detecting means Thereafter, the transport system is controlled by transporting the whole or a part of the transport system toward the reverse direction (refer to the second item of the patent application). The detection device detects that the carriage is abnormally conveyed in the conveyance system, and the control device controls the conveyance system based on the information. Therefore, when the conveyance of the carriage is abnormally generated, the reverse conveyance can be automatically performed immediately, and the conveyance state can be restored. In the above invention, although it is not particularly limited, it is preferable to further include an identification device that recognizes whether or not the carriage is returned to a predetermined position after the entire or part of the conveyance system is conveyed toward the reverse side. Item 3 of the scope). In the above-described invention, the control device preferably suppresses the conveyance system by recognizing that the carriage returns to the predetermined position and the conveyance system conveys the bracket in the predetermined direction. Refer to item 4 of the patent application scope). 224 7-9261-PF 8 1359273 The identification device recognizes that the carriage has been correctly returned to the predetermined position due to reverse transport, and the transport system performs reverse transport, whereby the re-handling of the carriage can be started in accordance with the appropriate timing. In the above invention, the electronic component testing device further includes a thermal sub-section that imparts a predetermined thermal stress to the electronic component under test before the test, and a test portion that performs the thermal-stressed electronic component to be tested. The transport system includes a loading device that is disposed in the hot dip unit and carries the bracket into the test unit, and a transport device that is disposed in the test unit and that transports the bracket; the transport device can be transported in the reverse direction The above bracket (refer to item 5 of the patent application scope). The loading device in the hot dip unit can carry the tray back and forth, thereby

When the hot dip portion or the test portion is in the middle, > t is blocked by -±£. d: xL r main v, the blockage can be eliminated. 〃 Although the above-mentioned invention towel is not fixed, the above-mentioned moving device is preferably connected. P, connected to the bracket and conveyed toward the predetermined direction, the carriage 'and the second engagement portion' are conveyed in the reverse direction (4) and convey the bracket in the direction of the feed (refer to, Monthly patent range item 6). In the above invention, the test of the above-mentioned electronic test piece 2 _ from the skin to the thermal stress of the above-mentioned test electron 7L is not particularly limited; and the heat removal 'electronic component', the +, the removal test The above-mentioned thermal stress of the above-mentioned flaws is measured; and the above-mentioned placement is performed in the above-mentioned (4) 、 、 w w w w w w w 且 且 且 且 且 且 且 且 且 且 且 且 且 , , , , , , , , , , , , , , j type out the above bracket, · the above

2247-9261-PF 1359273 The unloading device carries the above item 7 in the reverse direction. τ /f June patent model•• This, the inside of the carrying device can carry out the reverse movement of the test tray, by L•, the second part or the heat removal part at least one of them is blocked by the reverse operation The blockage. In the case of the soil, the above-mentioned two joint portions are connected to the bracket and are oriented in the predetermined direction Si 竿 when the second=two joint portions are conveyed toward the reverse direction (: 1). Second pick up to: coffee ^, / ... A May patent quarters 8). In the above-mentioned object, the present invention provides a method for transporting a bracket, and in the test device, the bracket is transported, and the electronic component test mounting electronic component is mounted on the bracket to make the above-mentioned subject Measuring the contact portion of the test head for electronic contact, and performing the above-mentioned measured electric constant 6 to U' where the inside of the electronic component testing device is directed toward the transport system of the above-mentioned bracket, so that the whole or part of the bracket is L搬运The above-mentioned 芊 芊 ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( :: When the test tray is clogged in the handling system, the jam can be removed after the transport tray is retracted from the blocked position. _ β can automatically reduce the time loss. “To manually restore the work, you can 2247 -9261-pp 10 In the above invention, although it is not particularly limited, it is preferable to include detecting and detecting the abnormality of the conveyance of the bracket in the conveyance system; and inverse (four), according to the above detection step & As a result of the κ loosening test, the whole or part of the transport system is thrown toward the reverse direction in the tenth item.) The carriage is transported in the direction of the transport (see the patent application - the detection step of detecting the abnormality of the transport of the rack in the transport system, In this way, the handling state can be automatically monitored immediately. Further, according to the measurement result in the detecting step, the whole or part of the conveying system is reversed and conveyed in the reverse conveying step, thereby, when the bracket (4) is abnormal The hair can be automatically returned to the recovery operation immediately. Therefore, the time loss between the occurrence of clogging in the transport system and the start of transport can be greatly reduced. Although not particularly limited in the above invention, it is preferable to include an identification step in the above-described transport system. After the bracket is conveyed integrally or partially in the reverse direction, it is recognized whether the bracket returns to a predetermined position; and a re-transporting step is performed according to the identification result of the identification step, wherein the transport system carries the (4) toward the predetermined direction (refer to the patent application) Scope item )). In the identification step, the identification bracket is moved by reverse After returning to the predetermined position correctly, the transport system performs the reverse transport in the re-transporting step, whereby the re-transport of the cradle can be started at an appropriate timing. Although the invention is not particularly limited, the electronic component testing device described above Preferably, the hot dip portion is provided to impart a predetermined thermal stress to the electronic component under test before the test; and the test portion performs the test of the electronic component to be tested which is given thermal stress; in the detecting step, the hot dip portion is detected Or the above test

2247-9261-PF 11 IS59273. [5] The conveyance abnormality of the above-mentioned bracket generated by at least one of the above-mentioned items is transmitted to the heat-dissipating portion from the test portion to the above-mentioned 12 items). - Detecting abnormal handling caused by at least one of the hot dip section or the test section, and returning the bracket to the hot dip section from the test section, whereby the clogging can be automatically eliminated. In the above invention, the electronic component testing device preferably includes a test portion, the immersion portion performs the test of the measured Lu sub-components to which thermal stress is applied, and the heat removal portion, which removes the above-described pre-test test. The predetermined thermal stress of the electronic component to be tested; in the detecting step, detecting an abnormality of the carriage of the carriage generated by at least one of the test unit or the heat removal unit, in the reverse conveyance step, The carrier is transported from the heat removing unit to the test unit (refer to the third aspect of the patent application, the detection of the abnormality caused by at least one of the test unit or the heat removing unit). The bracket is returned to the test unit from the heat removing unit. In this way, the blockage can be automatically eliminated:

[Embodiment] Hereinafter, embodiments of the present invention will be described based on the drawings. 1 is a schematic cross-sectional view showing an electronic component testing apparatus according to an embodiment of the present invention. FIG. 2 is a perspective view showing a mounting of an electronic component according to an embodiment of the present invention. FIG. 3 is a view showing an embodiment of the present invention. The beginning of the electronic components. Conceptual view of a transport carriage in a device.

Further, Fig. 3 is a view for explaining a method of transporting a carriage in the electric device of the present embodiment, and actually, a portion of the component which is shown in a plane at 2247-9261-PF 12 1359273 . Therefore, the mechanical structure (three-degree construction) will be described with reference to Fig. 2. The function $ of the electronic component testing device i of the present embodiment tests (detects) whether the IC component is properly operated by using the test head 5 = 6 in a state where a temperature stress of π 2 is applied to the temperature or the low temperature. According to the Chuanxiong, the 'category 1C component is used. The π-element measurement using this electronic component test device 1 is based on a customer carrier (see Fig. 5) loaded with many chemical components as test objects (1) The component is placed on the test tray TST (refer to Fig. 6) which is cyclically transported in the carrier, and then tested. Further, the Ic component is indicated by the symbol 1C in the figure. As shown in Fig. 1, The lower part of the carrier is provided with a space 8 in which the test head 5 is arranged in a replaceable type. The test head 5 is provided with a slot 5〇, which is connected by a winding 7 and a tester 6. The opening portion of the device base 101 formed on the transfer device is electrically contacted with the slot 50 of the component and the test head 5, and the electronic signal from the tester 6 is used to perform the component. Test. In addition, when changing the type of coffee, the IC suitable for this type can be replaced. The shape of the element and the number of stitches of the element. The carrier 1 of the present embodiment, as shown in Figs. 2 and 3, includes the 1C element including the IC component to be tested and classified and stored for testing. The accommodating unit 20 0 sends the IC component sent from the accommodating unit 2 to the loading unit 300 of the studio unit 100, the studio unit 1 including the test head 5, and sorts and extracts it into the studio unit 100. The release portion 40 of the Ic element that has been tested. In the present embodiment, as shown in FIG. 3, the loading unit 3, the hot dip chamber 110, the test chamber 120, the heat removal chamber 130, and The unloading unit 4〇〇 circulates the 2247-9261-PF 13 13-59273 transport system 9. The series of mechanisms for transporting the test tray TST are collectively referred to as the following description of each part of the transporter 1. <Storage unit 200> Fig. 4 An exploded perspective view of a 1C storage box used in the present invention, the electronic cassette testing device of the present invention is shown in FIG. 13 is a perspective view of a customer carrier used in the electronic component testing device of the present invention. The accommodating portion 200 includes a pre-test collection for storing the pre-test components.

The cassette 201 and the rear storage box 202 for storing the ic elements classified according to the test results. As shown in Fig. 4, these storage boxes 2〇1, 202 include a frame-shaped bracket supporting frame 203 and an elevator 204 which enters from the lower portion of the bracket supporting frame 2〇3 and moves up and down. On the cradle support frame 2〇3, a plurality of client trays kst are overlapped. Only the overlapping client trays KST are moved up and down by the elevators 2〇4. Further, in the customer tray KST in the present embodiment, as shown in Fig. 5, the concave accommodating portions for accommodating the 1C elements are arranged in a row of the parent "column. δ 刖 type 刖 storage box 2 〇 1 and After the test, the storage box 2 〇 2 has the same structure, so the number of the pre-test storage box 201 and the post-test storage box 202 can be appropriately set as needed. In the present embodiment, as shown in Figs. 2 and 3 As shown in the figure, the pre-test storage box 201 is provided with two storage boxes STK-B, and next to it, there are two vacant tray storage boxes STK-E. Each vacant tray storage box STK- A customer tray KST that is transported to the unloading unit 400 and vacated is superposed on E. Next to the vacated tray storage case STK-E, eight storage boxes STK-1, STK are provided on the storage box 202 after the test. -2,...,STK-8, which can be classified according to the test results of 2247-9261-ρρ 14 and stored into up to 8 categories. In addition to defective products, A can be divided among the good products; The category of the buckle and the low speed or the defective product is divided into h <Loading unit 3〇〇> The category to be tested again. Fig. 6 is a diagram showing the implementation of the present invention it ^ ^ s ^ An exploded perspective view of a test bracket for use in an electronic component testing device of 1 to 1. The above-described customer tray KST is provided by a carriage transfer arm 205 disposed between the housing portion 2A and the skirting base 101. The two window portions 370 are transported from the apparatus base 1 to the loading unit 300. Then, in the loading unit 300, the IC components placed in the holder KST are carried by the component handling device 3W- The second transfer is made to the positioning Γ P C1Ser) 36G, where the mutual positional relationship of the 1C components is corrected. The 1c component transferred to the positioner 360 is again moved by the transport device 31 0 to the loading unit 30 0 to stop. The test tray tst. In the test tray TST, as shown in Fig. 6, 'the square frame 70丨 is arranged in parallel at equal intervals, the crossbar 7〇2, in the two of the crossbars 7〇2 The side and the side of the square frame 7〇1 facing the horizontal 702 are 7〇1a, respectively forming a plurality of mounting pieces 703 which are equally spaced apart. The between the horizontal blocks 7〇2 or between the horizontal wood 702 and the side 701a The two insertion pieces 7〇3 constitute an insertion receiving portion 7 (H. Each of the insertion receiving portions 704 respectively accommodates an insert 71 0, which allows the insert 710 to The fasteners 7〇5 are mounted on the two mounting pieces 703 in a floating state. Therefore, at both ends of the insert 710, mounting holes 706 for mounting the inserts 710 on the mounting pieces 703 are formed. The inserts Π0 are as shown in Fig. 6 '64 are mounted on one test tray tst, arranged in 16 rows and 4 columns. In addition, each of the inserts 71 has the same shape and the same size, each 2247-9261 -PF 15 1359273 嚓. The 1C receiving portion of the insert 710 is adapted to accommodate the recessed portion in the example shown in Fig. 6, which is a square insert 71 0 which accommodates the shape of the IC component. Further, in the back surface of the frame 70A of the test tray TST in the present embodiment, a concave portion 72 is formed for engaging the bracket carrying device 119 and the rising portions 119c and 131c of the tray carrying device 131 (refer to 7)). The loading unit 300 includes a component handling device 310 that transfers the ic element from the customer carrier KST to the test tray TST. The component handling device 31, as shown in Fig. 2, includes two rails 311 that are mounted on the apparatus base 1〇1 and can be moved back and forth between the test truss TST and the customer tray KST by the two rails. The movable arm 312 (in this direction, the Y direction) is a movable arm 32 that is supported by the movable arm 312 and movable in the X-axis direction. On the movable head 320 of the component conveying device 31, an adsorption sheet (not shown) is placed downward, and the adsorption sheet moves while being sucked, thereby supporting the IC component from the customer tray KST. The IC component is then placed on the / test tray TST. The adsorption sheet can be mounted on one of the movable heads 320, and eight IC elements can be placed on the test tray tst at a time. <Studio part 1>&gt; Fig. 7 is a view showing a studio of an electronic component testing apparatus according to an embodiment of the present invention. A schematic cross-sectional view of the inside of the crucible, and Figs. 8A to 8B are views showing the vertical conveying device in the hot dip chamber of the studio portion shown in Fig. 7 from the width of the v-direction. After the Ic component is placed on the test tray TST by the manned portion 3, it is sent to the studio portion, and the 丨c component is loaded on the test tray tst. 2247-9261-pp 16 In the Π59273 state, the test of each ic component is performed. As shown in FIGS. 2, 3, and 7 , the studio unit 100 includes a hot dip chamber 110 that imparts a target high temperature or low temperature temperature stress to an IC component placed on the test tray TST. The test chamber 12 in which the 1C element and the test head 5 are in contact with each other in the state in which the hot dip chamber 11 is given thermal stress is tested. Equation to 1 2 0 again: to the tested I c element to remove thermal stress in the heat removal chamber 丨 3 〇. As shown in Fig. 2, the hot dip chamber 110 is arranged to protrude above the test chamber i 2〇. Further, as shown in Fig. 7, inside the hot dip chamber 110, a vertical conveying device 1U, a carriage carrying device 119, a protruding piece 118, and a sensor 1191 are provided. The vertical carrying device 111 includes a first support mechanism 112 and a second support mechanism 115' which can alternately transport the test carriage TST while the first support mechanism 112 and the second support mechanism are lowered.

As shown in FIG. 8A, the first support member 112, by means of the four first support members 3#, causes the support member to move up and down and rotates (not shown) \ each of the first support 7 pieces 11 3 The cylindrical pusher 113a and the plurality of branches (10) protruding from the pusher 113a for the two-way support test tray TST constitute a heart two::, =. The 4th - // 8A diagrams of the 'th-cut component' diagram show two m-type mode members 113 to support the test trays at equal intervals around the corners: :::: two pieces 112a. a half of the melon direction is highlighted in the way of pushing

2247-9261-PF 17 1359273 The second supporting mechanism 115 is composed of four second supporting members ι 6 and a steam rainbow (not shown) for moving the second and second members 116 in the Y direction. Each of the second supporting members 6 is composed of a base U6a positioned adjacent to the pusher U3a of the first and second supporting members H3 and a plurality of protrusions from the base 116a for the bracket 2 in the horizontal direction 2 ( In this example, it is composed of three) - Μ (4). The steam red causes each of the four second support members 16 to move in the ¥ direction perpendicular to the conveyance direction of the test tray TST. The plurality of projections (10) are provided at equal intervals to each other and protrude in the radial direction of the base portion (10). Further, in Fig. 8A, only two of the second supporting members ι 6 are shown. The four second support members j! 6 are arranged such that the test brackets tst are paired in pairs near the respective corners and the respective projecting ribs are opposed to each other. When the vertical carrier device 1 receives the test tray tst from the loading portion 3, as shown in FIG. 8A, first, the protruding portion 116b of the second supporting member 116 of the second supporting mechanism 115 supports the test tray tst. . Next, as shown in Fig. 8B, the first supporting member Π3 of the first supporting mechanism 112 rises, and the branch portion 113b receives the test tray TST from the second supporting member ι6. When the transfer of the test carriage ends, the rise of the first support member 113 also ends. Next, as shown in Fig. 8C, the opposing second supporting members 116 are moved in directions separating from each other. Then, the movement is terminated after the second support member 116 is separated before the lowered test tray TST and the projection 116b do not interfere with each other. Next, as shown in Figure 8D, the initiator enables the support test tray TST

2247-9261-PF 18 U59273 The support member 113 is lowered, whereby the test tray TST is further lowered.

Next, as shown in Fig. 8E, the second supporting members 丨丨6 facing each other at the receiving test tray tst are again approached again. Then, as in the case of 8F, the first support member 113 is lowered, and when the contact with the test tray TST is released, the test tray TST supported by the branch portion 113b whose first support member 113 is further lowered is placed and carried. The roller 117 is then transported to the other test carrier tst from the first support member 113 to the first support member 116. Further, the placement position on the conveyance roller 117 that conveys the test tray tst from the indicator member 丨丨3 is referred to as a start position. Next, as shown in Fig. 8G, the first support member 113 is rotated by 90 degrees about the push member 丨丨%, and the opposing branch portions 113b are substantially parallel. First, as shown in the eighth example, the first support member 113 rises. At this time, the first support member 113 rises without coming into contact with the test tray m. Then, as shown in Fig. 81, the first supporting member 113 is rotated by the same angle in the opposite direction to the rotation direction of the %th image, whereby the *branch (4) is again opposed to each other and becomes a state in which the test tray TST can be supported again. In addition, the plurality of test trays TST are subjected to a test pair of the test carrier TST of the vertical transfer device prior to entering the test chamber 120; mainly in this standby state, or a thermal stress at a low temperature. The opposite vertical conveying device 111 raises the test tray TST on the principle of lowering the above-described test tray TST. The test tray m descending from the vertical transport device U1 to the transport roller is provided by (iv) the initial position and the carrying belt in the test chamber r r^&gt;

2247-9261-PF 19 1359273 I 26 ‘Sent to the test room! 20 inside. The bracket loading device 119 is constituted by the engaging member II 9a, the rising portion 11 9c, the rail 11 9g, the carrying roller 11 7 and the cylinder 114 as shown in Figs. 9 and 10 . Further, the carriage carrying device 11 9 transports the test tray TST on which the IC element before the test is mounted from the side of the hot dip chamber 11 to the side of the test chamber 120. Further, as will be described later, when the reverse conveyance is performed, the test tray TST moving to the test chamber 1 2 side can be returned to the start position. Engagement element • 11 9a can slide on the track 11 9g by the driving force of the cylinder Π 4 . The engaging member 11 9a has a engaging portion 119b that is engaged with the test bracket TST in a normal conveyance state, and stoppers U9d, 119e that restrict the operation of the rising portion 119c to be described later. On the upper right side of the engaging elements 119 &amp; in Fig. 9, an engaging portion 119b' engaging portion 119b is provided to protrude upward. In the normal handling state, the end portion of the hot dip chamber 11 on the side of the end of the test tray TST is pushed to push the type 5 bracket TST toward the side of the test chamber 120. The stoppers 119d and 119e are provided so as to surround the rising portion 119c in the X direction, and the rotation operation of the rising portion 11 9C is limited to a predetermined range. Specifically, when the stopper 119d is transported to the side of the test chamber 120 on the side of the test tray TST&amp; hot dip chamber, the tabs 118 are limited to not interfere with the test tray tst. The action of the falling upright 119c. Further, the stopper U9e restricts the rotation of the rising portion 119c so that the rising of the rising portion U9c is at most about the χ direction. The rising portion 119c is attached to the transmission shaft 119h so as to be rotatable from the engaging member n9a to the upper side, and is biased to the side of the stopper 1196 by the spring li9f. Therefore, the standing part ii9c: flat

2247-9261-PF 20 f *v Λ .Ο / 1359273 The normal state is connected to the stopper 119e, and it is in a state of standing up in the Z direction. As will be described later, when the transport test tray TST is reversed, the standing portion 丨9c is sprinkled to the recess 720' of the test tray TST to push the test tray TST toward the start position. Further, under the standing portion 119c and the engaging member 119a, a rail 119 § extends in the X direction. The track 119g forms a so-called linear guide rail and the engaging member 11 9a. This obey 11 Og has the ability to carry the bracket into the device! 〗 9 Perform the test described later. The length of the normal transport and reverse transport of the bracket TST. Specifically, as will be described later, the length of the engaging member 119b can be allowed to move from the starting position to a position where the rising portion 119c can be stopped in a state in which it is engaged with the protruding piece 118. Further, a transport roller 11 7 is provided in a direction parallel to the extending direction of the rail 丨丨 9g. The transport roller 117 does not include the drive source, but follows the action of the test carriage TST that is moved by the carriage transport device 119. Further, a cylinder 114 is provided in the vicinity of the end portion of the conveyance roller 117 on the side of the hot dip chamber 110. The cylinder 114 is a driving device that allows the engaging member 1193 to advance and retreat in the χ direction. Further, although the cylinder U4 is used in the present embodiment, the driving device is not limited thereto, and for example, a motor including a ball screw mechanism or the like may be used. Returning to Fig. 7, the protruding piece 118 is located between the two carrying rollers ι7, and is disposed near the end of the carrying path of the test tray m in the hot dip chamber UG, and is not connected to the transported test tray TST and the moving connecting component. Interference with each other is placed at a position where it can only be in contact with the rising portion 119c. The projecting piece ιΐ8, "when the carrying member 11 9 carries the test tray TST, which will be described later," comes into contact with the standing portion ll9c, causing the standing 邛1〗 9c to turn to the stopper 丨丨9 (1

2247-9261-PF 21 9273 Side The position of the test tray TST at the start position can be detected near the start position in the hot dip chamber 110, and the sensor 1丨9 j is provided. The sensor 1191 is configured to detect whether the vertical carrier device has correctly placed the test tray TST on the start position of the roller 11 7 and the reverse conveyance when the jam occurs, whether the test tray TST is correctly returned to the start position, and The detection result is transmitted to the control device 1 287. The state of the reverse conveyance of the test tray TST at the time of occurrence of the clogging will be described later. 10A to 10E are schematic cross-sectional views showing a state in which the carriage is transported by the carriage carrying device. Here, first, the normal conveyance of the carriage loading device 119 will be described in detail with reference to Figs. 10A to 10E, and the reverse conveyance performed when the jam of the test tray TST is generated will be described later. First, the test holder after the thermal stress is applied to the hot dip chamber 11 is placed by the vertical conveyance device 111 at the start position on the conveyance roller 1 of the carriage carrying device 119. Then, when the test of the test tray tst entering the test chamber 12 is completed and the z-axis drive unit 后 29 described later is raised, the test tray of the specific component before the test is loaded by the tray loading unit 11 9 To the side of the test room 120. More specifically, as shown in Fig. 10A, when the test tray TST is lowered onto the carrying roller 117, the recess 720 formed on the side opposite to the loading surface of the test (four)... component is inserted into the truss Move into the device ιΐ9 (4) 9c. Then, as shown in Fig. 10B and Fig. 1c, when the loading device ι 9 is moved toward the X direction by the cylinder 114, the engaging portion (10) will test the test.

2247-9261-PF 22 1359273 The rear end is pushed to the side of the test chamber 1 2 0. When the center of gravity of the test tray tst pushed in this manner is moved from the conveyance roller 117 on the side of the hot dip chamber uo to the conveyance belt 12 6 on the side of the β-to-1 2 side described later, as in the first 〇 The drawing and the erecting portion 119a of the connecting member 119a and the connecting member 119a are connected to the protruding piece 11 8 and are turned to the side of the stopper 11 9d. Thus, when the standing portion 9c is retracted from the conveyance path of the test tray TST, interference between the test tray TST and the standing portion 11 9 carried to the side of the test chamber 2 is avoided.

As described above, in the normal conveyance, the center of gravity of the test tray tst is moved from the conveyance roller [17 on the side of the hot dip chamber 110 to the conveyance belt 126 on the side of the test chamber 12 to be described later by the tray conveyance device 119. Thereby, the test tray TST is carried from the side of the hot dip chamber 11 to the side of the test chamber 120. In the test chamber 120, as shown in Fig. 7, a conveyance belt 126 carrying the test tray TST, a sensory unit connected to the control device 1287 and monitoring the conveyance state, and being connected to being conveyed =:= and making the test are provided. The carriage stopper 122 of the carriage m that is stopped on the test head 5, the Z-axis drive device that is engaged with the π element loaded by the stopped test carriage TST and pushes the π element toward the slot 5 12 . The conveyance belt 126 is a component that extends in the X direction and is rotationally driven by a drive device (not shown), so that the test carriage m can be oriented in the X direction during normal conveyance and reversed in the direction opposite to the reverse conveyance. Handling. Further, the conveyance belt 126 can be moved up and down when the component 1 and the test tray are pressed, and can be moved up and down so as to be placed on the bracket in the X direction by the elastic crystal sensor 125 not shown in the figure. Between the actuator 122 and the slot 50 2247-9261-PF 23 Λ 592 13.59273, it is determined whether the test tray TST is transported to a position where the test of the 1C component loaded by the test tray TST can be properly performed. The result of the monitoring is transmitted to the control device 丨 287 connected to the sensor i 2 5. The cradle stopper 122 is located near the sensor 125 and is disposed not to be transported with the test tray tst. The position of the interference. In addition, the bracket stopper is an element for stopping the test truss TST at the test position, which can be

The starter such as the cylinder that comes out is moving forward and backward toward the ¥ direction. When testing the coffee piece, it is sometimes necessary to stop the test tray TST. At this time, the actuator is protruded to the position where the bracket stopper 122 and the test tray TST are engaged, so that the test tray tst is stopped at the test position. . Then, when the test is completed and the test tray is spun to the time of heat removal or when a clogging occurs between the test chamber and the heat removal chamber to be described later, the starter is retracted to the carriage stopper 122 and Test the position where the bracket TST is not connected. Further, an opening portion (not shown) is provided at the bottom of the apparatus base in the test chamber 120. The opening has a size in which the test head 5 can enter its central portion during testing. As shown in Fig. 7, in the upper portion of the test head 5, a plurality of slots 5 配置 are arranged to face the splicing member 710 of the s-type rack TST. In contrast, in the test chamber 120, as shown in the same figure, a plurality of push members 1281 for pushing the κ member toward the slot 50 during testing are respectively opposed to the respective slots 5 on the test head 5. The way to set it up. Each of the push members 1281 is supported by the mating board 1 282, and the mating board 1282 can be moved up and down by the Z-axis driving device 129. As shown in Fig. 7, the Z-axis driving device 129 includes a driving plate 12 97 and a convex portion 1298' which can be moved up and down by an actuator (not shown). 2247-9261

- PF 24 / **, · Λ Ο〆 1359273 Axis 1 296 penetrates the upper surface of the test chamber 12 , and is fixed to the drive plate 1297 at its lower end. The drive plate 1297 is disposed to face the mating plate 1282, and has a plurality of convex portions 1 298 projecting in a convex shape on the lower surface thereof. These projections 1 298 are respectively opposed to the pusher 1281 supported by the mating plate 1282 and are disposed below the drive plate 1297. These projections 1 298 can push the pusher 1281 during testing. When the test tray tst 攸 hot dip chamber 11 〇 is transported into the test chamber 12 by the cradle loading device 119 and the transport belt 126, the test tray tst is transported onto the test head 5, and each push member 1281 The 1 (: component is pushed to the slot 50, respectively, so that the input and output terminals of the 1C component and the contact pins of the slot 5 are electrically contacted, whereby the test of the IC component can be performed. 忒 The test result can be stored in the position Address, which can be determined by the identification number added to the test tray TST and the chirp of the 1C component allocated inside the test tray TST. When the test of the IC component supported by the test tray TST is completed, the measurement is completed. The tray m is transported from the test chamber 120 to the heat removal chamber 13A. The transport from the test chamber 12 to the heat removal chamber 130 is carried out by the transport belt 126 and the carry-out device. * Specifically, first, after the load test Test of the ic element: the frame m is pushed from the test chamber 120 to the heat removal chamber 13 by the carrier tape 126. Then, the test tray m is transferred to the tray carry-out device 131 of the heat removal chamber 130. The unloading device 31 transports the test tray TST to a predetermined position of the heat removal chamber. The hot dip chamber U0 is the same. As shown in FIG. 2, the arrangement is 'extended above the test chamber 120. As shown in FIGS. 3 and 7, the bracket carry-out device 131 and the vertical transport device 132' are provided. 138 and sensing 2247-9261-PF 25 1359273 device 133. • · bracket carrying device 131 as shown in Figures 9 and 10A, by the connecting member 1313, the rising portion 131C, the rail 131S, the carrying roller 137 and; The gas rainbow 139 is configured to carry the test tray TST in the x direction. The tray carrying device 31 has the same structure as the tray loading device 119, and faces the X direction in the opposite direction to the tray loading device 119. The vertical transfer device 132 is the same as the vertical transfer device 111 in the above-described hot dip chamber, and therefore detailed description thereof will be omitted. Further, the protruding piece 138 is located in two conveyances. Between the rollers 137, the vicinity of the end of the transport path of the test tray TST in the heat removal chamber 130 is provided, and the test carriage TST and the moving engagement elements 131& which are transported are not interfered with each other, and are arranged to stand up only The position where the portion 131c contacts. This The protruding piece 138 is the same member as the protruding piece 1 of the hot dip 110, and therefore detailed descriptions regarding the structure and operation thereof are omitted here. Further, the frame carrying-out device 131 is transported toward the x-direction by the test tray tst φ A sensor 133 is provided at a position near the end point where the transport of the test tray TST can be monitored. The sensor 133 is used to detect whether the test tray TST is transported from the test chamber i 2 to the heat removal chamber 130 and backwards described later. Whether or not the transport carriage TST is returned from the vertical transport device 132 to the carriage carry-out device 131 / the test result is transmitted from the sensor 13 3 to the control device 128 7 . In the heat removal chamber 130, if a high temperature is applied to the hot dip chamber 110, the IC element is cooled by air blowing to return to room temperature. On the other hand, if a low temperature is applied to the hot dip 110, the IC element is heated by a warm air, a heater, or the like to return to a temperature at which condensation does not occur, and then the Ic element after the heat removal is moved to the unloading crucible. Ο 2247-9261-PF 26 1359273 Section 400. As described above, when the test tray TST is transported from the test chamber 120 to the heat removal chamber 130 by the carrier belt 126, the carrier carries out the rising portion mc of the split 131, stands up, and engages to the test tray TST. The recess 72 () where the back side is located. Then, in this state, the tray carrying-out device 丨 31 is moved in the z-direction on the linear guide, whereby the test tray TST is moved to the predetermined position of the heat-removing chamber 130 while sliding on the conveyance belt 137. Thus, when the test truss TST is moved to a predetermined position, the tray carry-out unit 131 is stopped. Then, the vertical conveyance device 132 raises the test tray tst on the principle of lowering the test tray tst as opposed to the above-described vertical conveyance device ln. At the upper portion of the hot dip chamber 110, an inlet for carrying the test tray TST from the apparatus base is formed. Similarly, an output for moving the test tray TST to the apparatus base 101 is formed on the upper portion of the heat removal chamber 13A. Further, on the apparatus base 101, test trays are provided for passing these inlets and outlets. Rack • The tray transport device 102 that the TST carries in and out from the studio unit 100. This carrier handling device 102 can be constituted by a rotating roller or the like. The test tray TST carried out from the heat removal chamber 32 by the tray transporting device 2 is loaded after the test, and the IC component is placed on the customer tray KST by the component handling device 41 as will be described later. After being emptied, it is sent back to the hot dip chamber 11 through the unloading unit 4〇〇 and the loading unit 30 〇. <Unloading Unit 400> In the present embodiment, the unloading unit 400 is also provided with the same conveying device 2247-9261-PF 27 1359273 4i, which is provided in the component conveying device 31 of the loading unit 300. By the component carrier device 41(), the IC component after the test is carried out from the test tray TST of the unloading unit 400 to the customer tray KST classified according to the test result. As shown in Fig. 2, on the apparatus base 101 in the unloading unit 400, two pairs of ® portions 470 are formed in such a manner that the customer tray KST that is carried into the unloading portion from the storage unit 2 is facing the device. Above the base 1〇1. Further, although not shown, a lifting table for lifting and lowering the customer's bracket KST is provided on the lower side of each of the window portions 47, and here, the 10 components that are placed and lowered and placed after the full load test are placed. The customer carrier KST, this full load carrier is transferred to the carriage transfer arm 205. Next, the step of releasing the clogging by using the reverse conveyance and the re-transportation when the test tray TST is clogged occurs, so that the seventh diagram and the drawings to the drawings are conveyed from the hot dip chamber 11 to the test chamber 12 in the example. When there is a blockage. a FIGS. 11A to 11E are schematic cross-sectional views showing the reverse conveyance test tray TST using the tray loading device φ 11 9 of the present invention. As shown in Fig. 11, when the test tray TST is lowered onto the carrying roller 117, the recess 20 formed on the side opposite to the loading surface of the test tray TST2IC component is inserted into the rising portion U9c of the tray carrying device 119. . Then, as shown in Fig. 11B, when the carriage carrying device 119 is moved toward the X direction by the cylinder 114, the engaging portion i 丨 9 b pushes the rear end of the test tray T s τ toward the side of the test chamber 丨 2 。. When carrying this, as shown in the figure lie, in the hot dip chamber 11〇, although the test tray TST is clogged, the test tray TST cannot be transported to the test 2247-9261-PF 28 ¢.3 1359273 In the diverting chamber 120, the sensor 125 disposed in the test chamber 120 cannot confirm the handling of the test tray TST. Therefore, the information when the test tray TST arrives cannot be transmitted to the control unit 287. As described above, if the state in which the information of the test tray tst cannot be obtained from the sensor 125 is continued for a predetermined period of time after the tray loading device 119 starts normal transportation, the control device 1287 recognizes that a jam has occurred in the hot dip chamber 110. Further, the detection of occurrence of clogging may be detected by a sensor for detecting the amount of elongation of the cylinder 丨j 4 based on the amount of elongation not detected within a predetermined time. When it is recognized that the test tray TST is clogged, the control unit 287 issues an instruction to reverse the carriage loading unit 119. At this time, the recess 720 of the test tray TST is still inserted into the upright portion 119. Further, when necessary, the control unit 1287 stops the driving of the parts other than the studio unit 1 in the transport system 9 until the jam is eliminated. Then, the tray loading device 9j 9 φ that has received the command to perform the reverse conveyance drives the cylinder 114 to move the test tray TST from the blocked position in the -X direction. When the reverse conveyance is performed, as shown in the UD diagram, the engagement between the test bracket and the engaging portion 119b is released, and instead, the rising portion ii9c of the insertion recess 720 is engaged with the inner wall of the recess 720 and pushed. , the test tray TST is returned to the starting position. Then, as shown in Fig. 11E, when the test tray TST returns to the start position, the sensor 1191 senses this point and transmits the information to the control device 1287. When the control device 1287 receives the information from the sensor 1191 to return to the start position, the carriage loading device 119 issues an instruction to re-handle the 2247-9261-PF 29 1359273 test tray TST. Upon receipt of the command, the carriage carrying device 11 9 again transports the test tray TST from the hot dip chamber 11 to the side of the test chamber 1 2 . Thereby, the δ-type carriage TST is first transported to the test chamber 12 通过 through the clogging portion. Further, the control unit 1287 restarts the driving of the portion other than the working chamber portion 1 0 0 in which the transport system 9 is stopped first. In this way, when the test tray is transported backwards from the position where the clogging occurs, and the transport is performed again, the clogging is released. In addition, since the clogging is automatically performed, it is not necessary to perform the recovery operation manually, and the time loss can be greatly reduced. The embodiments described above are described in order to facilitate the understanding of the present invention and are not intended to limit the invention. Therefore, the various elements disclosed in the above embodiments include all design changes or equivalents belonging to the technical scope of the present invention. It has been described in the above embodiment from the hot dip chamber 11 0, for example, in the above embodiment.

The reverse conveyance performed when the test tray m is transported to the test chamber 12G is clogged. However, when the jam occurs between the test chamber 120 and the heat removal chamber 130, the heat removal chamber 130 can also be reversed and transported. . In this case, even if the predetermined time elapses after the transport of the test tray TST is started in the heat removal chamber 130, when the information arriving at the test tray TST cannot be transmitted from the sensor 1 33 to the control device 287, the control device] 287 can also recognize that a blockage has occurred in the heat removal chamber 130. In the reverse conveyance in this case, the rack removing device 131 of the heat removing chamber 13 is used. When the reverse conveyance is performed, the tray carrying-out device (3) receives a command to perform the reverse conveyance from the control device 1187. Then, the carriage is moved 30 2247-9261-PF. (.5 1359273 the engagement portion 1311 of the device 131) can be pushed in the opposite direction to the 乂 direction. In this case, when the center of gravity of the test tray TST is moved to the side of the test chamber 12•••, the standing portion 131c is engaged to the protruding piece 138, whereby the engaging portion is reversed to the position where the test tray TST interferes with each other. Then, the test tray - the handling is carried out smoothly. In addition, when it is necessary to reverse the plurality of test trays m in the studio unit 1 due to the clogging, the tray carrying device ιΐ9 # and the tray carrying out the rack 131 can be used. The vertical conveyance device m 132 and the carriage conveyance device 1G2 are conveyed throughout the entire transportation machine. In this case, the vertical transporting devices m, 132 and the carrier transporting device 1〇2 reverse the transport of the test carriage on the principle opposite to the normal transport. In the above embodiment, the backward of the test bracket tst has been described. Handling and re-handling have been carried out once, but when it is impossible to solve the problem, it can be reversed and transported repeatedly several times. In addition, the field cannot be solved even after repeated reversing and re-transporting multiple times. Φ An alarm can be issued in addition to the blockage. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic cross-sectional view showing an electronic component testing apparatus according to an embodiment of the present invention. Fig. 2 is a perspective view showing an electronic component testing apparatus according to an embodiment of the present invention. Fig. 3 is a conceptual diagram showing a transfer carriage which is not in the electronic component test apparatus of the embodiment of the present invention. Λ .Ο

2247-9261-PF 31 Π 59273 Fig. 4 is an exploded perspective view showing the 1C storage case used in the electronic component testing device of the present invention. Fig. 5 is a perspective view showing a customer bracket used in the electronic parts test apparatus of the present invention. The δth diagram is an exploded perspective view showing a test tray used in the electronic component test apparatus of the present invention. Fig. 7 is a conceptual cross-sectional view showing a studio portion of an electronic component testing device according to an embodiment of the present invention. Figure 8 is a view of the vertical handling device in the dip chamber (the first part) from the VIII direction. ..., Figure 8 is a view (see the second) of the vertical handling device in the work &quot;Μ dip room shown in Figure 7 from the direction of VIII. '', Fig. 8C is a view (third) of the vertical conveying device in the hot dip chamber of the studio portion shown in Fig. VIII from the direction of VIII. . . . 8D is a view from the VIII direction to Fig. 7 A view of the vertical conveying device in the hot dip chamber of the studio section (fourth). Fig. 8E is a view of the vertical conveying device of the hot dip chamber of the studio portion shown in Fig. 7 viewed from the VIII direction (5, 8F is a view of the vertical conveying device in the hot dip chamber of the studio portion shown in Fig. 7 from the direction of VIII (the sixth)." Fig. 8G is a view of Fig. 7 viewed from the VIII direction. A view of a vertical conveying device in a hot dip chamber of the studio portion (the seventh of which is a view of the vertical conveying device in the hot dip chamber of the working chamber portion shown in Fig. 7 from the direction of the VIII) VIII). 2247-9261-PF 32 U59273 * - The "Picture" is a view of the vertical handling device in the work shown in Figure 7 from the ηπ direction (the nine). Figure 9 is Bracket loading device and supporting device.. m map a a magnified view of the attack. • 0 is the usual use of the bracket FIG. 10B is a schematic cross-sectional view showing the state in which the carriage is normally used (the second). The racking test carriage is 10C. The figure shows a schematic cross-sectional view (the third) of the normal use of the carrier. The device transport test carriage 10D is a schematic cross-sectional view showing the transport state of the normal use of the carriage, and the transport test carriage is the usual A schematic cross-sectional view of the transport state of the support unit (5). A device transport test carriage 11A is a schematic cross-sectional view showing the state of use (the reverse operation guide bracket is shown in Fig. 11B) A schematic cross-sectional view of the state (Part 2) ^ Device retraction transport test carriage 1 lc is a schematic view to the state in which the carriage is carried in. (Part 2). \彳彳u Handling test bracket 11D The figure shows a schematic cross-sectional view (fourth) of the state in which the carrier is moved. The second embodiment of the reverse transport test tray is shown as using the carrier.

A schematic cross-sectional view of the state (the fifth) ^ \ reversed transport test bracket 2247-9261-PF 33 13.59273 [Main component symbol description] 1 electronic component test device 6 tester '7 cable' 8 space 100 studio 101 device base 102 carrier handling device® 11 0 hot dip chamber 111 vertical handling device 11 2 first support mechanism 11 3 first support member 113a push member 113b branch portion 114 cylinder 11 5 second support mechanism ® 11 6 second Supporting member 116a base portion 116b protruding portion 117 carrying roller 118 protruding piece 11 9 carrier carrying device 119a engaging member 119b engaging portion Λ 'Ο 2247-9261-PF 34 1359273 119c standing portion 119d, 119e stopper 119f spring 11 9g track 11 9h Axis 12 0 test chamber 1 21 horizontal transfer device 122 engagement element 122a base 122b front engagement portion 122c rear engagement portion 123, 124 ball screw mechanism 125 motor 126 carrier belt 1281 pusher 1 2 8 2 pairing plate 1 282a side wall surface 1 287 Control unit 129 Z-axis drive unit 1291 Stand 1 292 Stepper motor 1 293 Screw shaft 1294 Ball screw adapter 1 295 Upper plate 2247-9261-PF 35 1359273 1 296 Axis 1 297 drive plate 1 297a side wall surface '1298 convex part' 130 heat removal chamber 131 carrying-out device 131a engaging element 131b engaging portion • 1 31 c rising portion 131d, 131e stopper 131f spring 131g way 131h shaft 132 vertical carrying device 1 3 3 engaging portion 134 Platform® 135 Road 136 Linear Guide 137 Handling Belt 138 Projection Sheet 13 9 Cylinder 200 Storage Unit 201, 202 Storage Box 2 0 3 Bracket Support Box

2247-9261-PF 36 1359273 204 Elevator 205 Bracket Moving Arm 300 Loading Unit 31 0 Component Handling Device 311 Track 312 Movable Arm 320 Movable Head 3 0 0 Positioner 370 Window Section 400 Unloading Section 410 Component Handling Device 470 Window Section 5 test head 50 slot 701 square frame 7 01 a side 702 cross 703 mounting piece 704 accommodating portion 705 fastener 706 mounting hole 710 insert 720 recess 9 handling system

2247-9261-PF 2Ί / ar> Λ 1359273 KST customer bracket TST test bracket

2247-9261-PF 38

Claims (1)

X. The scope of application for patents: The test device for electronic components shall be mounted on the electronic π-piece in the state of being on the pallet. For electronic contact, enter... The contact part of the electronic component and the test head is directly 3^ The test of the electronic component is carried out, ', and the transport system is configured to cyclically transport the bracket in the predetermined direction; and the bracket is transported in the cow test device toward the entire reverse direction of the transport system. The electronic component test apparatus of the first item of the patent range is described in the direction of the U. The electronic component test apparatus further includes: wherein the carrier is in the transport system described above, and the transport system is The operation control; the abnormality trr is set in the detection device to detect the conveyance path of the carriage. The whole or a part of the conveyance system is oriented toward the above. The above-described conveyance system is controlled by means of transporting the above-described brackets. The electronic component testing device of claim 2, wherein the έ/匕 identifying device is configured to recognize whether the carrier returns to a predetermined position after the whole or a portion of the conveying system transports the bracket toward the reverse direction . 4. The electronic component testing device according to claim 3, wherein the defect control device recognizes that the tray returns to the predetermined position after the tray is set, and the transporting system carries the tray in the predetermined direction. The way of the rack is to control the above handling system. 2247-9261-PF 39 1359273 Apparatus 5. In the electronic component test according to any one of Items 1 to 4 of the patent scope, the above electronic component testing apparatus includes: ..., k 'given to be tested before the test The electronically-opened ton-and the electronically-determined thermal stress; the test; the test unit performs the measurement of the electronic component to be tested that is given thermal stress. The transport system has: the loading device is disposed in the hot dip portion and The carriage is carried into the test unit; and the transport device is placed in the test unit and the carriage is transported; and the loading device can transport the bracket in the reverse direction. 6. The electronic component testing device according to claim 5, wherein the loading device has: ” a child splicing. p, engaging the bracket and transporting the bracket toward the predetermined direction; and _ first When the bracket is transported toward the reverse direction, the engaging portion is coupled to the bracket and transports the bracket in the reverse direction. 7 Clearing the electronic component test of any of items ii to 4 of the patent scope, The electronic component testing device includes: a test portion that performs a test of the component subjected to thermal stress in the hot dip portion; and a predetermined thermal stress of the electron to be tested after the heat removal portion is removed; The transport system includes: 2247-9261-PF 40: disposed in the test unit and transporting the bracket; and the bracket; and being disposed in the heat removing unit and being carried out from the test unit to move out of the loading device toward the reverse Carrying the above-mentioned tray in the direction. The above-mentioned loading = _ the electronic component testing device of item 7, ", the first-engagement portion is connected to the bracket and facing the bracket; and (4) When the carriage is transported in the reverse direction, the bracket 4 is transported in the reverse direction. 9. a method of transporting a bracket, wherein the electronic component test device is mounted on the carrier, and the electronic component is tested and placed on the carrier for the electronic contact In the test of the electronic component to be tested, the contact portion is moved toward the predetermined position in the electronic component testing device, and the carrier is transported in the carrier system so that the whole or a portion thereof is moved in the reverse direction opposite to the upper direction and the predetermined direction. frame. 〃 10. If the method of handling the bracket of the ninth application patent scope includes: , ··, the detecting step, detecting that the bracket is in the above-mentioned handling system; and “reverse carrying step” according to the above detecting step The carrier is transported in a manner that the whole or part of the handling system is moved toward the reverse direction. 0 2247-9261-PF 41 1359273 11. The method for carrying the carrier according to claim 10 of the patent application includes: 〃 an identification step, When the whole or part of the transport system conveys the bracket in the reverse direction, it is recognized whether the bracket returns to a predetermined position; and a re-transporting step, the transport system is oriented toward the predetermined direction according to the identification result of the identification step The method of transporting the above-mentioned brackets, wherein the electronic component testing device comprises: a hot dip portion, which imparts a predetermined heat to the electronic component under test before the test. And the testing unit performs the test of the above-mentioned electronic component to be tested which is given thermal stress; in the above detecting step And detecting a conveyance abnormality of the bracket generated by at least one of the hot dip portion or the test portion, and in the reverse conveyance step, 'transporting the bracket from the test portion to the hot dip 13.咕 咕 | & & & & & & & & & & & & & & & & & & & & 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中The electronic heat removal part 'removes the predetermined thermal stress given to the test; the above-mentioned party-measured electronic component is detected in the above-mentioned detecting step by at least one of the above-mentioned test part or the above-mentioned heat-removing part 2247-9261-PP 42 1359273 In the reverse conveyance step, the carrier is transported from the heat removal unit to the test unit. .·· +JT« Λ .Ο 2247-9261-PF 43