WO2008075439A1

WO2008075439A1 - Electronic component testing equipment and method of testing electronic component

Info

Publication number: WO2008075439A1
Application number: PCT/JP2006/325542
Authority: WO
Inventors: Yuji Kaneko; Kazuyuki Yamashita
Original assignee: Advantest Corporation
Priority date: 2006-12-21
Filing date: 2006-12-21
Publication date: 2008-06-26
Also published as: TWI359273B; KR101158064B1; CN101563620A; KR20090095617A; JPWO2008075439A1; JP5022381B2; TW200827726A

Abstract

[PROBLEMS] To provide an electronic component testing equipment, and method of testing an electronic component, capable of shortening any time loss occurring in test tray stagnation. [MEANS FOR SOLVING PROBLEMS] Electronic component testing equipment (1) designed to test IC devices by electrical contact of IC device, while being mounted on test tray (TST), with socket (50) of test head (5) is equipped with carrier system (9) capable of circulatory delivery of test tray (TST) in a given direction within the electronic component testing equipment (1), which carrier system (9) is capable of wholly or partially delivering test tray (TST) in the direction reversed from the above given direction.

Description

Specification

Electronic component testing apparatus and electronic component testing method

Technical field

The present invention relates to an electronic device for testing an IC device by electrically contacting various electronic components such as a semiconductor integrated circuit element (hereinafter also referred to as an IC device) with a contact portion of a test head. The present invention relates to a component testing apparatus.

Background art

In the manufacturing process of electronic components such as IC devices, an electronic component testing apparatus is used to test the performance and function of the Ic device in the knocked state.

[0003] In a handler that constitutes an electronic component test apparatus, an electronic component is received from a tray (hereinafter referred to as a customer tray) for accommodating an IC device before testing or accommodating a tested IC device. A large number of IC devices are placed on a tray that circulates in the test equipment (hereinafter referred to as the test tray), the test tray is transported into the handler, and each IC device is accommodated in the test tray in the contact portion of the test head. The electronic component testing device body (hereinafter also referred to as a tester) performs the test. When the test is completed, the test tray loaded with each IC device is unloaded from the test head and placed on the customer tray according to the test result, so that it is sorted into categories such as non-defective products and defective products.

[0004] The test tray TST is circulated and transferred by a loader unit, a chamber unit (consisting of a soak chamber, a test chamber, and an unsoak chamber), and an unloader unit in the electronic component test apparatus. Is done. Since the IC device test is performed with a low-temperature or high-temperature thermal stress applied to the device, the interior of the soak chamber and the test chamber is kept at a low temperature or a high temperature.

In such a soak chamber or test chamber, the size and shape of the test tray may change due to thermal expansion and contraction. Due to this, the test tray could not be transported smoothly due to the bowing force of the bow I in the transport system, and the test tray might stagnate (so-called jamming) in the chamber. . [0006] As described above, when the test tray stagnates in the chamber portion, conventionally, the temperature in the chamber is once returned to room temperature, and a manual recovery operation has been performed. In other words, after the temperature in the chamber is set to a temperature at which an operator can work, the test tray is returned, and then the temperature in the chamber is raised again to a temperature at which the IC device can be tested (hereinafter also referred to as the test temperature). The temperature was falling. Such restoration work takes several hours, which has caused enormous time loss.

Disclosure of the invention

[0007] An object of the present invention is to provide an electronic component testing apparatus and an electronic component testing method capable of reducing time loss when a test tray is stagnant.

In order to achieve the above object, according to the present invention, the electronic device under test is brought into electrical contact with a contact portion of a test head while the electronic device under test is mounted on a tray. An electronic component test apparatus for testing a component, comprising: a transport system that circulates and transports the tray in a predetermined direction in the electronic component test apparatus, and the transport system is wholly or partially in the predetermined direction. And an electronic component test apparatus capable of transporting the tray in the reverse rotation direction reversed (see claim 1).

In the present invention, the transport system that circulates and transports the tray in a predetermined direction can transport the tray in the reverse direction reverse to the predetermined direction. As a result, when the test tray is jammed in the transport system, the tray is transported from the jammed position in the reverse direction reverse to the normal transport direction (hereinafter also referred to as return transport), and then the normal tray again. The tray can be transported in the transport direction (hereinafter also referred to as re-transport). This eliminates jamming automatically, eliminating the need for manual recovery and greatly reducing time loss.

[0010] Although not particularly limited in the above invention, the electronic component test apparatus further includes a detection unit that detects an abnormality in conveyance of the tray in the conveyance system, and a control unit that performs operation control of the conveyance system. And the control means controls the transport system so that the transport system transports the tray in the reverse direction in whole or in part when the detection means detects an abnormality in transport of the tray. Control is preferred (see claim 2). [0011] The detection unit detects a tray conveyance abnormality in the conveyance system, and the control unit controls the conveyance system based on the information, so that when the tray conveyance abnormality occurs, the sheet is automatically returned and conveyed immediately. To recover the transportation.

[0012] Although not particularly limited in the above invention, a recognition means for recognizing whether or not the tray has returned to a predetermined position when the transport system transports the tray in the reverse direction in whole or in part. It is preferable to further provide (refer to claim 3).

[0013] Although not particularly limited in the above invention, the control unit causes the transport system to transport the tray in the predetermined direction when the recognition unit recognizes that the tray has returned to the predetermined position. In addition, it is preferable to control the transport system (see claim 4).

[0014] By recognizing that the tray is correctly returned to the predetermined position as a result of the return conveyance by the recognition unit, the conveyance system performs the return conveyance, so that the tray re-conveyance is started at an appropriate timing. .

[0015] Although not particularly limited in the above invention, the electronic component test apparatus includes a soak portion that applies a predetermined thermal stress to the electronic device under test before the test, and a test of the electronic device under test that is subjected to the thermal stress. A test unit that performs the above-described operation, and the transport system is provided in the soak unit, and a transport unit that transports the tray to the test unit, and a transport unit that is provided in the test unit and transports the tray. It is preferable that the carry-in means can carry the tray in the reverse direction (see claim 5).

[0016] Since the carrying-in means in the soak part can return and convey the tray, when jamming occurs in at least one of the soak part and the test part, the jamming can be eliminated.

[0017] Although not particularly limited in the above invention, the carry-in means contacts the tray and conveys the tray in the predetermined direction; and the conveyance means conveys the tray in the reverse direction. And a second contact portion that contacts the tray and conveys the tray in the reverse direction (refer to claim 6).

[0018] Although not particularly limited in the above invention, the electronic component test apparatus includes a test unit that performs a test of the electronic component to be tested that has been subjected to thermal stress over a soak unit, and the tested component to be tested. An unsoak part excluding the predetermined thermal stress given to the test electronic component; The transport system includes a transport unit that is provided in the test unit and transports the tray, and a transport unit that is provided in the unsoak unit and transports the tray out of the test unit. The means is preferably capable of transporting the tray in the reverse direction (see claim 7).

[0019] Since the unloading means in the unsoak part can return and transport the test tray, when jamming occurs in at least one of the soak part and the unsoak part, the jamming can be eliminated by the return transport.

[0020] Although not particularly limited in the present invention, the carry-out means is a first contact portion that contacts the tray and transports the tray in the predetermined direction, and when the tray is transported in the reverse direction. And a second abutting portion that abuts on the tray and conveys the tray in the reverse direction (refer to claim 8).

(2) To achieve the above object, according to the present invention, the electronic device under test is brought into electrical contact with the contact portion of the test head while the electronic device under test is mounted on a tray. An electronic component testing apparatus for testing an electronic component, and a tray conveying method for conveying the tray, the conveying system circulating and conveying the tray in a predetermined direction in the electronic component testing apparatus In addition, there is provided a tray transporting method for transporting the tray in a reverse rotation direction that is totally or partially reverse to the predetermined direction (see claim 9).

In the present invention, the transport system that circulates and transports the tray in a predetermined direction transports the tray in the reverse direction that is reverse to the predetermined direction.

Accordingly, when the test tray is jammed in the transport system, it is possible to transport the tray again from the jammed position and then transport it again. This eliminates jamming automatically, eliminating the need for manual recovery and greatly reducing time loss.

[0023] Although not particularly limited in the above invention, the transport system is wholly or partially based on a detection step of detecting an abnormality in the transport of the tray in the transport system and a detection result of the detection step. It is preferable to include a reverse transport step for transporting the tray in the reverse direction (see claim 10). [0024] By providing a detection step for detecting tray conveyance abnormality in the conveyance system, the conveyance state can be automatically monitored in real time. Also, based on the detection result in the detection step, the transport system in the reverse transport step either fully or partially returns and transports the tray. It can be performed. Therefore, it is possible to reduce the time loss until jamming occurs in the transport system and the force is restored.

[0025] Although not particularly limited in the above invention, the transport system recognizes whether or not the tray is returned to a predetermined position when the tray is transported in the reverse direction, in whole or in part. It is preferable that the method further comprises a step and a re-transport step in which the transport system transports the tray in the predetermined direction based on a recognition result of the recognition step (see claim 11).

[0026] In the recognition step, after recognizing that the tray has been correctly returned to the predetermined position by the return conveyance, the conveyance system performs the return conveyance in the re-conveyance step, so that the tray can be re-conveyed appropriately. It starts at the right time.

[0027] Although not particularly limited in the above invention, the electronic component testing apparatus includes a soak portion that applies a predetermined thermal stress to the electronic device under test before the test, and an electronic device that is subjected to the thermal stress. A test unit that performs a test, and detects an abnormality in the conveyance of the tray that has occurred in at least one of the soak unit or the test unit in the detection step, and in the reverse conveyance step, detects the tray in the test unit. It is preferable that the material is conveyed to the soak part (see claim 12).

[0028] By detecting a conveyance abnormality that has occurred in at least one of the soak part and the test part and returning the tray from the test part to the soak part, jamming can be automatically eliminated.

[0029] Although not particularly limited in the above invention, the electronic component test apparatus includes a test unit that performs a test of an electronic component to be tested in which thermal stress is applied to the soak unit, and the test target before the test. An unsoak part that excludes the predetermined thermal stress applied to the electronic component, and in the detection step, an abnormality in the conveyance of the tray that occurs in at least one of the test part or the unsoak part is detected, and the reverse In the transporting step, it is preferable that the tray is transported to the unsoak part force to the test part (see claim 13). [0030] Jamming can be automatically eliminated by detecting a conveyance abnormality that has occurred in at least one of the test unit and the unsoak unit, and returning the tray to the test unit as well. Explanation

FIG. 1 is a schematic cross-sectional view showing an electronic device test apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view showing an electronic component testing apparatus according to an embodiment of the present invention.

FIG. 3 is a conceptual diagram showing tray handling in the electronic component testing apparatus according to the embodiment of the present invention.

FIG. 4 is an exploded perspective view showing an IC stocker used in the electronic component testing apparatus according to the embodiment of the present invention.

FIG. 5 is a perspective view showing a customer tray used in the electronic component testing apparatus according to the embodiment of the present invention.

FIG. 6 is an exploded perspective view showing a test tray used in the electronic component testing apparatus according to the embodiment of the present invention.

FIG. 7 is a schematic cross-sectional view showing a chamber portion of the electronic device test apparatus according to the embodiment of the present invention.

[FIG. 8A] FIG. 8A is an arrow view of the vertical transfer device in the soak chamber of the chamber section shown in FIG. 7 as viewed from the VII I direction (part 1).

[FIG. 8B] FIG. 8B is a view of the vertical transfer device in the soak chamber of the chamber section shown in FIG.

[FIG. 8C] FIG. 8C is an arrow view of the vertical transfer device in the soak chamber of the chamber portion shown in FIG.

[FIG. 8D] FIG. 8D is a view of the vertical transfer device in the soak chamber of the chamber portion shown in FIG.

[FIG. 8E] FIG. 8E is a view of the vertical transfer device in the soak chamber of the chamber portion shown in FIG.

[FIG. 8F] FIG. 8F shows a vertical transfer device in the soak chamber of the chamber shown in FIG. It is an arrow view seen from the direction (Part 6).

[FIG. 8G] FIG. 8G is an arrow view of the vertical transfer device in the soak chamber of the chamber portion shown in FIG.

[FIG. 8H] FIG. 8H is a view of the vertical transfer device in the soak chamber of the chamber portion shown in FIG.

FIG. 81 is an arrow view of the vertical transfer device in the soak chamber of the chamber shown in FIG. 7 as viewed from the VIII direction (No. 9).

FIG. 9 is an enlarged view of a tray carry-in device and a tray carry-out device.

[10A] FIG. 10A is a schematic cross-sectional view showing the state of normal transport of the test tray by the tray carrying-in device (part 1).

[10B] FIG. 10B is a schematic cross-sectional view showing the state of normal transport of the test tray by the tray loading device (part 2).

[10C] FIG. 10C is a schematic cross-sectional view showing the normal transport state of the test tray by the tray loading device (part 3).

[10D] FIG. 10D is a schematic cross-sectional view showing the state of normal transport of the test tray by the tray loading device (part 4).

[10E] FIG. 10E is a schematic cross-sectional view showing the state of normal transport of the test tray by the tray loading device (part 5).

[FIG. 11A] FIG. 11A is a schematic cross-sectional view showing a state in which the test tray is returned and conveyed by the tray carrying-in device (part 1).

[FIG. 11B] FIG. 11B is a schematic cross-sectional view showing a state where the test tray is returned and conveyed by the tray carrying-in device (part 2).

[11C] FIG. 11C is a schematic cross-sectional view showing the state of the test tray being returned and conveyed by the tray carrying-in device (part 3).

[FIG. 11D] FIG. 11D is a schematic cross-sectional view showing a state where the test tray is returned and conveyed by the tray carrying-in device (part 4).

[FIG. 11E] FIG. 11E is a schematic cross-sectional view showing the state of the test tray being returned and conveyed by the tray carrying-in device (No. 5). Explanation of symbols

[0032] 1 ... Electronic component testing apparatus

100 ... Chamber part

101 ... Device base

102 ... Tray conveyor

110 ··· Soak chamber

111 ... Vertical conveyor

119 ... Tray carry-in device

119b: contact part

119c ... Standing up

120 ... Test Channo

126 ... Conveyor belt

130 ... Unsoak chamber

131 ··· Tray unloading device

131b ... Abutting part

131c: Standing part

132 ... Vertical conveyor

200 ... storage

300 ··· Loader

400 ··· Unloader section

5 ... Test head

9 ... Transport system

TST ... Test tray

720 ... Recess

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a schematic sectional view showing an electronic component testing apparatus according to an embodiment of the present invention, FIG. 2 is a perspective view showing an electronic component testing apparatus according to an embodiment of the present invention, and FIG. 3 is an embodiment of the present invention. It is a conceptual diagram which shows the handling of a tray in the electronic component testing apparatus which concerns on.

FIG. 3 is a diagram for understanding the tray handling method in the electronic component testing apparatus according to the present embodiment. In practice, the members arranged side by side in the vertical direction are flattened. Some parts are shown. Therefore, its mechanical (three-dimensional) structure will be described with reference to FIG.

[0036] The electronic device test apparatus 1 according to the present embodiment is configured to determine whether the IC device can operate properly using the test head 5 and the tester 6 in a state where a high-temperature or low-temperature temperature stress is applied to the IC device. This is a device that classifies IC devices based on the test results. The test of IC devices by this electronic component test equipment 1 is performed by the test tray TST (see Fig. 6) that is circulated and transported in the handler 1 from the customer tray KST (see Fig. 5) on which many IC devices to be tested are mounted. ) Is executed by replacing the IC device. IC devices are indicated by! / In the figure and indicated by IC!

As shown in FIG. 1, a space 8 is provided in the lower part of the handler 1, and the test head 5 is disposed in this space 8 so as to be replaceable. A socket 50 is provided on the test head 5 and is connected to the tester 6 through the cable 7. Then, the IC device and the socket 50 on the test head 5 are brought into electrical contact through the opening formed in the apparatus base 101 of the handler 1, and the IC device is tested by an electric signal from the tester 6. Is becoming possible. When changing the type of IC device, the shape of the IC device of that type is replaced with a socket suitable for the number of pins.

As shown in FIG. 2 and FIG. 3, the handler 1 in the present embodiment stores an IC device to be tested from now on, and stores a storage unit 200 that classifies and stores tested IC devices, and a storage unit A loader unit 300 for feeding IC devices sent from 200 to the chamber unit 100, a chamber unit 100 including the test head 5, and an unloader unit 400 for classifying and extracting tested IC devices tested in the chamber unit 100. , Is organized. In the present embodiment, as shown in FIG. 3, a series of mechanisms for circulating and transporting the test tray TST between the loader unit 300, the soak chamber 110, the test chamber 120, the unsoak chamber 130, and the unloader unit 400 is provided. Collectively referred to as the transport system 9.

[0039] Each part of the handler 1 will be described below. [0040] <Storage unit 200>

FIG. 4 is an exploded perspective view showing an IC stocker used in the electronic component test apparatus according to the embodiment of the present invention, and FIG. 5 is a perspective view showing a customer tray used in the electronic component test apparatus according to the embodiment of the present invention. .

[0041] The storage unit 200 includes a pre-test stock force 201 for storing an IC device before a test, and a tested stock force 202 for storing an IC device classified according to a test result.

As shown in FIG. 4, these stockers 201 and 202 include a frame-shaped tray support frame 203, and an elevator 204 that moves up and down with the lower force of the tray support frame 203 entering the upper part. It has. A plurality of customer trays KST are stacked on the tray support frame 203, and only the stacked customer trays KST are moved up and down by the elevator 204. In the customer tray KST in this embodiment, as shown in FIG. 5, the concave accommodating portions for accommodating the IC devices are arranged in 14 rows × 13 columns.

[0043] Since the pre-test stock force 201 and the tested stock force 202 have the same structure, the numbers of the pre-test stocker 201 and the tested stock force 202 are appropriately set as necessary. It can be done.

In this embodiment, as shown in FIG. 2 and FIG. 3, two stockers S TK-B are provided in the stock force 201 before the test, and two empty tray stocks STK-E are provided next to it. It has been. Each empty tray stock strength STK-E is obtained by stacking empty customer trays K ST sent to the unloader section 400! /.

[0045] Next to the empty tray stock force STK—E, there are 8 stockers STK—1, S TK 2,..., STK-8 in the tested stock force 202, depending on the test results. It can be sorted and stored in up to 8 categories. In other words, in addition to non-defective products and defective products, it is possible to sort non-defective products into high-speed, medium-speed, low-speed, or defective products that require retesting. It has become.

[0046] <Loader section 300>

FIG. 6 is an exploded perspective view showing a test tray used in the electronic device testing apparatus according to the embodiment of the present invention.

The customer tray KST described above is a tray provided between the storage unit 200 and the device base 101. The transfer arm 205 is carried from the lower side of the apparatus base 101 to the two window portions 370 of the loader unit 300. In the loader unit 300, the IC device loaded in the customer tray KST is transferred by the device transfer device 310 to the precursor 360, where the positional relationship between the IC devices is corrected. Thereafter, the IC device transferred to the precursor 360 is moved again by the transfer device 310, stopped at the loader unit 300, and loaded onto the test tray TST.

[0048] As shown in FIG. 6, the test tray TST includes a rectangular frame 701 with parallel bars 702 provided at equal intervals, both sides of the bars 702, and sides 701 a of the frame 701 facing the bars 702. In addition, a plurality of mounting pieces 703 are formed so as to protrude at equal intervals. The insert housing portion 704 is configured by the space between these bars 702 or between the bars 702 and the side 701a and the two mounting pieces 703.

[0049] Each insert accommodating portion 704 accommodates one insert 710, and this insert 710 is attached to two attachment pieces 703 in a floating state using fasteners 705. . For this purpose, attachment holes 706 for attaching the insert 710 to the attachment piece 703 are formed at both ends of the insert 710. As shown in Fig. 6, 64 such inserts 710 are attached to one test tray TST, and are inserted into 4 rows and 16 rows IJ.

Note that each insert 710 has the same shape and the same dimensions, and an IC device is accommodated in each insert 710. The IC housing portion of the insert 710 is determined according to the shape of the IC device to be housed. In the example shown in FIG.

[0051] Further, on the back surface of the frame 701 of the test tray TST in the present embodiment, there are recessed portions 720 (see FIG. 7) for engaging the standing portions 119c and 131c of the tray carry-in device 119 and the tray carry-out device 131. Is formed.

[0052] The loader unit 300 includes a device transfer device 310 that transfers an IC device from the customer tray KST to the test tray TST. As shown in FIG. 2, the device transfer device 310 moves back and forth between the two rails 311 installed on the device base 101 and the test tray TST and the customer tray KST by the two rails 311. (This reciprocating movement direction is defined as the Y direction.) A movable arm 312 capable of being supported by the movable arm 312. A movable head 320 movable in the X-axis direction and a force are also configured.

[0053] A suction pad (not shown) is mounted downward on the movable head 320 of the device transport device 310, and the suction head moves while sucking to hold the IC device from the customer tray KST. Then, transfer the IC device to the test tray TST. For example, about eight suction pads are attached to one movable head 320, and eight IC devices can be loaded onto the test tray TST at a time.

[0054] <Chamber part 100>

FIG. 7 is a schematic cross-sectional view showing the inside of the chamber portion of the electronic component testing apparatus according to the embodiment of the present invention, and FIGS. FIG.

[0055] After the IC device is loaded by the loader unit 300, the test tray TST described above is sent to the chamber unit 100, and the test of each IC device is performed with the IC device mounted on the test tray TST. The

[0056] As shown in FIGS. 2, 3, and 7, the chamber unit 100 includes a soak chamber 110 that applies a target high-temperature or low-temperature stress to the IC device loaded on the test tray TST. The test chamber 120 that contacts an IC device that has been subjected to thermal stress in the soak chamber 110 to the test head 5, the unsoak chamber 130 that removes thermal stress from the IC device tested in the test chamber 120, and the force It is composed.

As shown in FIG. 2, the soak chamber 110 is arranged so as to protrude upward from the test chamber 120. As shown in FIG. 7, a vertical transfer device 111, a tray carry-in device 119, a protruding piece 118, and a sensor 1191 are provided inside the soak chamber 110.

[0058] The vertical transfer device 111 includes a first support mechanism 112 and a second support mechanism 115, and alternately between the first support mechanism 112 and the second support mechanism 115. The test tray TST can be lowered while delivering the test tray TST.

[0059] As shown in FIG. 8A, the first support mechanism 112 includes four first support members 113, and an actuator (not shown) that moves the support members 113 up and down and rotates them. It is. Each first support member 113 has a cylindrical shaft 113a and a test tray TST horizontally. A plurality of (three in this example) branch portions 113b project from the shaft 113a to support them, and force is also configured. The actuator moves the first support member 113 up and down along the axis of the shaft 113a and rotates it about the axis. In FIG. 8A, only two first support members 113 are shown. These four first support members 113 are arranged so as to face each other so as to support the test tray TST in the vicinity of each corner. The plurality of branch portions 113b are provided on the shaft 112a so as to protrude at equal intervals from each other and in the radial direction of the shaft 112a.

[0060] The second support mechanism 115 includes four second support members 116, an air cylinder (not shown) that moves the second support member 116 in the Y direction, and a force. Each second support member 116 protrudes from a base 116a located adjacent to and parallel to the shaft 113a of the first support member 113 and a base 116a to horizontally support the test tray TST. A plurality (three in this example) of protrusions 116b and force are also configured. The air cylinder moves each of the four second support members 116 in the Y direction perpendicular to the transport direction of the test tray TST. The plurality of projecting portions 116b are provided so as to project at equal intervals from each other and in the radial direction of the base portion 116a. In FIG. 8A, only two second support members 116 are shown. These four second support means 116 are arranged such that two test trays TST are provided in the vicinity of each corner portion, and the protruding portions 116b face each other.

When this vertical transfer device 111 receives the test tray TST for the loader unit 300 as well, as shown in FIG. 8A, first, the protruding portion 116b of the second support member 116 of the second support mechanism 115 is moved to the test tray. Hold TST.

Next, as shown in FIG. 8B, the first support member 113 of the first support mechanism 112 rises, and the branch portion 113b receives the test tray TST from the second support member 116. When the delivery of the test tray is finished, the raising of the first support member 113 is finished.

[0063] Next, as shown in FIG. 8C, the second support members 116 facing each other are moved away from each other. Then, the movement ends when the second support member 116 is separated to a position where the descending test tray TST and the protruding portion 116b do not interfere with each other.

Next, as shown in FIG. 8D, the actuator supports the first support that supports the test tray TST. The test tray TST is lowered by lowering the holding member 113.

Next, as shown in FIG. 8E, the second support members 116 facing each other again approach each other until they receive the lowered test tray TST. Then, as shown in FIG. 8F, when the first support member 113 is lowered and contact with the test tray TST is released, the first support member 113 has the lowest! The test tray TST supported by the unit 113b is placed on the transport roller 117 and then transported to the test chamber 120. Another test tray TST is transferred from the first support member 113 to the second support member 116. The placement position on the transport roller 117 from which the test tray TST has been delivered from the first instruction member 113 is referred to as a start position.

Next, as shown in FIG. 8G, the first support member 113 is rotated 90 ° about the shaft 113a, and the branch portions 113b are substantially parallel to each other. Become.

Next, as shown in FIG. 8H, the first support member 113 is raised. At this time, the first support member 113 rises without contacting the test tray TST. Then, as shown in FIG. 81, the first support member 113 rotates by the same angle in the direction opposite to the rotation direction of FIG. 8G, so that the branch portions 113b face each other again and hold the test tray TST again. Is possible.

[0068] It should be noted that while the plurality of test trays TST are supported by the vertical transfer device 111, the test tray TST previously placed in the test chamber 120 is in the soak chamber 110 until the test is completed. stand by. Mainly, high-temperature or low-temperature thermal stress is applied to IC devices during this standby.

[0069] Further, the vertical transport device 111 can also raise the test tray TST in the reverse manner of lowering the test tray TST described above.

[0070] Test tray TS T force lowered to the start position on the transport roller 117 from the vertical transport device 111 is sent into the test chamber 120 by the tray carry-in device 119 and the transport belt 126 in the test chamber.

As shown in FIGS. 9 and 10A, the tray carry-in device 119 includes a contact member 119a, an upright portion 119c, a rail 119g, a transport roller 117, and an air cylinder 114. The tray carry-in device 119 is moved from the soak chamber 110 side to the test chamber 120 side before the test. Transports test tray TST loaded with IC devices. Further, as will be described later, the test tray TST that is in the process of moving toward the test chamber 120 can be returned to the start position during the return conveyance. The abutting member 119a can slide on the rail 119g by the driving force of the air cylinder 114! /

[0072] The contact member 119a includes a contact portion 119b that contacts the test tray TST during normal conveyance, and stoppers 119d and 119e that limit the movement of an upright portion 119c described later. A contact part 119b is provided on the upper right side of the contact part member 119a in FIG. 9, and the contact part 119b protrudes upward. During normal transport, the end of the test tray TST is brought into contact with the end of the soak chamber 110, and the test tray TST is pushed out toward the test chamber 120.

[0073] The stoppers 119d and 119e are provided so as to surround the upright portion 119c in the X direction, and limit the rotation operation of the upright portion 119c within a predetermined range. More specifically, the stopper 119d is provided with an upright portion 119c that is tilted so as not to interfere with the test tray TST by a protruding piece 118 described later when the test tray TST is transported from the soak chamber 110 side to the test chamber 120 side. Limit operation. The stopper 119e limits the rotation of the upright portion 119c so that the upright portion 119c rises up to about 90 degrees in the X direction.

The standing portion 119c is rotatably attached to the contact member 119a via the shaft 119h so as to protrude upward from the force of the contact member 119a, and is urged toward the stopper 119e by the spring 119f. Therefore, in the normal state, the standing portion 119c is in contact with the stopper 119e and is standing in the Z direction. As will be described later, when the test tray TST is returned and conveyed, the standing portion 119c engages with the concave portion 720 of the test tray TST to push the test tray TST back to the start position. Further, a rail 119g extends in the X direction below the standing portion 119c and the contact member 119a.

[0075] The rail 119g forms a so-called linear guide together with the contact member 119a. The rail 119g has such a length that the tray carry-in device 119 can perform normal conveyance and return conveyance of the test tray TST described later. Specifically, as will be described later, the rail 119g has such a length that the contact member 119b can move from the start position to a position where the upright portion 119c can come into contact with the protruding piece 118 and stop when it falls down. Have. Also rail 1 A conveyance roller 117 is provided in parallel with the extending direction of 19 g.

The transport roller 117 does not have a driving source in particular, and follows the movement of the test tray TST moved by the tray carry-in device 119. An air cylinder 114 is provided in the vicinity of the end of the conveying roller 117 on the soak chamber 110 side.

[0077] The air cylinder 114 is a driving means capable of moving the contact member 119a back and forth in the X-axis direction. In this embodiment, the force driving means using the air cylinder 114 is not limited to this, and for example, a motor having a ball screw mechanism can be used.

Returning to FIG. 7, the protruding piece 118 is between the two transport rollers 117 and is provided near the end point of the transport path of the test tray TST in the soak chamber 110, and the test tray TST to be transported In addition, the contact member 119a that moves is arranged so as not to interfere with only the upright portion 119c. The projecting piece 118 is a member that comes into contact with the upright portion 119c and tilts the upright portion 119c toward the stopper 119d when the test tray TST is conveyed by a tray carry-in device 119 described later.

[0079] Further, a sensor 1191 is provided at a position in the vicinity of the start position in the soak chamber 110 where the test tray TST can be detected as being in the start position.

[0080] The sensor 1191 moves the test tray TST to the start position by return conveyance when the vertical conveyance device 111 causes the force tray force that the test tray TST is correctly placed on the start position on the roller 117 and jamming occurs. It is used to detect whether or not the force has returned correctly, and to transmit the detection result to the control device 1 287. The return of the test tray TST when jamming occurs will be described in detail later.

FIG. 10A to FIG. 10E are schematic cross-sectional views showing a state of normal transport of the test tray by the tray carry-in device. Here, with reference to FIG. 10A to FIG. 10E, the normal conveyance by the tray carry-in device 119 described above will be described in detail, and the return conveyance performed when jamming of the test tray TST occurs will be described later.

First, the test tray TST to which thermal stress is applied in the soak chamber 110 is placed at the start position on the transport roller 117 of the tray carry-in device 119 by the vertical transport device 111. Then, when the test of the test tray TST previously placed in the test chamber 120 is completed and the Z-axis drive device 129, which will be described later, rises, the tray loading device 119 causes the pre-test I Test tray TST loaded with C device is transported toward the test chamber 120 side.

More specifically, as shown in FIG. 10A, when the test tray TST descends onto the transport roller 117, a recess 720 formed on the opposite side of the test tray TST from the IC device mounting surface is The standing portion 119c of the tray carry-in device 119 is inserted. As shown in FIGS. 10B and 10C, when the tray carry-in device 119 is moved in the X direction by the air cylinder 114, the contact portion 119b pushes the rear end of the test tray TST toward the test chamber 120. The center of gravity force of the test tray TST pushed out in this way is moved from the conveying roller 117 on the soak chamber 110 side onto the conveying belt 126 on the test chamber 120 described later, as shown in FIGS. 10D and 10E. The upright portion 119c that moves together with the member 119a comes into contact with the protruding piece 118 and falls to the stopper 119d side. In this manner, the rising portion 119c is retracted from the test tray TST transfer path, so that interference between the test tray TST transferred to the test chamber 120 side and the stand portion 119c is avoided.

[0084] As described above, in normal conveyance, the center of gravity of the test tray TST is moved by the tray carry-in device 119 onto the conveyance belt 126 on the test chamber 120 side, which will be described later, as well as the force on the conveyance roller 117 on the soak chamber 110 side. Thus, the test tray TST is carried into the test chamber 120 side as well as the soak chamber 110 side force.

In the test chamber 120, as shown in FIG. 7, a transport belt 126 that transports the test tray TST, a sensor 125 that is connected to the control device 1287 and monitors the transport state of the test tray TST, Tray stopper 122 that contacts test tray TST that has been transported to stop transport of test tray TST on test head 5, and IC device that contacts IC device mounted on stopped test tray TST Z-axis drive device 1 29 to press against 50 and force S are provided.

[0086] The conveyor belt 126 is a member that extends in the X direction, and is rotationally driven by a driving unit (not shown). The test tray TST is moved in the X direction during normal conveyance and in the X direction during return conveyance. Can be transported in the reverse rotation direction. Further, the transport belt 126 is supported by a spring member or the like (not shown) so that it can move up and down so that it can move up and down when the Z-axis driving device 129 presses the IC device and the test tray TST. [0087] The sensor 125 is provided between the tray stopper 122 and the socket 50 in the X direction, and whether or not the test tray TST has been transported to a position where an IC device mounted on the test tray TST can be properly tested. To check. The result of monitoring by the sensor 125 is sent to the control device 1287 connected to the sensor 125.

[0088] The tray stop taper 122 is provided in the vicinity of the sensor 125 and at a position that does not interfere with the conveyance of the test tray TST. The tray stopper 122 is a member for stopping the test tray TST at the test position, and can be advanced and retracted in the Y direction by an actuator such as an air cylinder (not shown). When it is necessary to stop the test tray TST, such as when testing an IC device, the actuator protrudes the tray stopper 122 to the position where it abuts the test tray TST, and stops the test tray TST at the test position. When the test is finished and the test tray TST is moved to the unsoak chamber, or when the jamming occurs between the test chamber and the unsoak chamber, which will be described later, the actuator is used for the tray stopper. Move the 122 back to the position where it does not contact the test tray TST.

Also, an opening (not shown) is provided at the bottom of the apparatus base in the test chamber 120. The opening has a size that allows the test head 5 to enter the center of the opening. As shown in FIG. 7, a plurality of socket 50 force test trays TST are arranged on the top of the test head 5 so as to face the inserts 710 of the test tray TST. On the other hand, in the test chamber 120, as shown in the figure, a plurality of pushers 1281 for pressing the IC device toward the socket 50 at the time of testing oppose each socket 50 on the test head 5. It is provided as follows.

Each pusher 1281 is held by a match plate 1282, and this match plate 1282 can be moved up and down by a Z-axis drive device 129.

As shown in FIG. 7, the Z-axis drive device 129 includes a shaft 1296, a drive plate 1297, and a projection 1298, and is moved up and down by an actuator (not shown).

[0092] The shaft 1296 passes through the upper wall surface of the test chamber 120, and the drive plate 1 297 is fixed at the lower end of the shaft 1296. The horse play block 1297ί and the match play block 1282 are provided so as to face each other, and have a plurality of convex portions 1298 projecting on the lower surface thereof. these The convex portion 1298 is arranged on the lower surface of the drive plate 1297 so as to face the pusher 1281 held by the match plate 1282. This convex part 1298 should push the pusher 1281 during the test! RU

[0093] When the test tray TST is carried from the soak chamber 110 into the test channel 120 by the tray carry-in device 119 and the conveyance belt 126, the test tray TST is conveyed onto the test head 5, and each pusher 1281 is connected to the IC device. The IC device is tested by pressing the IC 50 against the socket 50 and bringing the IC device input / output terminals into electrical contact with the contact pins of the socket 50.

This test result is stored in an address determined by, for example, an identification number assigned to the test tray TST and an IC device number assigned inside the test tray TST.

When the test of the IC device held on the test tray TST is completed, the test tray TST is transferred from the test chamber 120 to the unsoak chamber 130. Transport from the test chamber 120 to the unsoak chamber 130 is performed by a transport belt 126 and a tray carry-out device 131.

Specifically, first, a test tray TST loaded with a tested IC device is pushed out from the test chamber 120 to the unsoak chamber 130 side by the transport belt 126. Next, the test tray TST is delivered to the tray carry-out device 131 of the unsoak chamber 130. The tray carry-out device 131 conveys the test tray TST to a predetermined position in the unsoak chamber 130.

[0097] As with the soak chamber 110, the unsoak chamber 130 is also arranged so as to protrude above the test chamber 120 as shown in FIG. 2, and as shown in FIGS. , A vertical transfer device 132, a protruding piece 138, and a sensor 133 are provided.

[0098] As shown in FIGS. 9 and 10A, the tray carry-out device 131 includes a contact member 131a, an upright portion 131c, a rail 131g, a transport roller 137, and an air cylinder 139. It can be transported in the X direction. The tray carry-out device 131 has the same configuration as the tray carry-in device 119 in the soak chamber 110, and is provided in the opposite direction to the tray carry-in device 119 in the X direction. The detailed explanation is omitted here. [0099] Further, since the vertical transfer device 132 is the same as the vertical transfer device 111 in the soak chamber 110, a detailed description thereof is omitted here.

[0100] Further, the projecting piece 138 is between the two transport rollers 137 and is provided near the start point of the transport path of the test tray TST in the unsoak chamber 130, and the test tray TST to be transported, The moving contact member 131a does not interfere with the moving contact member 131a, and is disposed at a position where only the standing portion 131c can be contacted. Since the protruding piece 138 is the same as the protruding piece 118 in the soak chamber 110, a detailed description of its configuration and operation is omitted here.

In addition, a sensor 133 is provided in the vicinity of the end point of conveyance of the test tray TST in the X direction of the tray carry-out device 131 and at a position where the conveyance of the test tray TST can be monitored. A controller 1287 is connected to the sensor 133. The sensor 133 determines whether or not the test tray T ST has been transported from the test chamber 120 to the unsoak chamber 130, and the test tray T ST from the vertical transport device 132 onto the tray carry-out device 131 during reverse transport described later. Used to detect whether is returned. The detection result is transmitted from the sensor 133 to the control device 1287.

[0102] In this unsoak chamber 130, when a high temperature is applied in the soak chamber 110, the IC device is cooled to the room temperature by blowing air. On the other hand, when a low temperature is applied in the soak chamber 110, the IC device is heated with warm air or a heater to return to a temperature at which condensation does not occur, and then the heat-removed IC device is removed from the unloader section. Carry out to 400.

[0103] As described above, when the test tray TST is transported from the test chamber 120 to the unsoak chamber 130 by the transport belt 126, the upright portion 131c of the tray unloading device 131 rises, and the test tray TST Engages with recess 720 on the back. In this state, the tray carry-out device 131 moves in the X direction on the linear guide, so that the test tray TST is moved to a predetermined position in the unsoak chamber 130 while sliding on the transport roller 137.

As described above, when the test tray TST moves to a predetermined position, the tray carry-out device 131 stops. Then, the vertical conveyance device 132 raises the test tray TST in the reverse manner to the above-described vertical conveyance device 111 lowering the test tray TST.

[0105] In order to carry the test tray TST from the apparatus base 101 to the upper part of the soak chamber 110 The entrance is formed. Similarly, an outlet for carrying out the test tray TST to the apparatus base 101 is also formed in the upper part of the unsoak chamber 130. The apparatus base 101 is provided with a tray transfer device 102 for taking the test tray TST in and out of the chamber section 100 through these inlets and outlets. The tray conveying device 102 may be constituted by, for example, a rotating roller.

[0106] The test tray TST unloaded from the unsoak chamber 130 by the tray transfer device 102 is loaded into the customer tray KST by the device transfer device 4 10 as described later. After being reloaded and emptied, it is returned to the soak chamber 110 via the unloader unit 400 and the loader unit 300! /.

[0107] <Unloader section 400>

In this embodiment, the unloader unit 400 is also provided with two transport devices 410 having the same structure as the device transport device 310 provided in the loader unit 300, and the device transport device 410 is carried out to the unloader unit 400. The test tray TST force is also transferred to the customer tray KST according to the test results of the tested IC device strength test.

As shown in FIG. 2, the device base 101 in the unloader unit 400 has a pair of customer trays KST carried from the storage unit 200 to the unloader unit 400 as desired on the upper surface of the device base 101. Two sets of windows 470 are formed.

[0109] Although not shown, an elevating table for elevating and lowering the customer tray KST is provided under each window portion 470. Here, a fully loaded IC device that has been tested is loaded. The customer tray KST is placed and lowered, and this full tray is transferred to the tray transfer arm 205.

[0110] Next, with regard to the jamming elimination procedure by return conveyance and re-conveyance when jamming of the test tray TST occurs, the case where jamming occurs during conveyance from the soak chamber 110 to the test chamber 120 is taken as an example. 7 and 11A to 1 A description will be given using IE.

[0111] FIGS. 11A to 11E are schematic sectional views showing the return conveyance of the test tray TST by the tray carry-in device 119 of the present invention.

[0112] As shown in FIG. 11A, when the test tray TST descends onto the transport roller 117, the tray loading device is placed in the recess 720 formed on the opposite side of the test tray TST from the IC device mounting surface. 119 standing part 119c is inserted. As shown in FIG. 11B, when the tray transfer device 119 is moved in the X direction by the air cylinder 114, the contact portion 119b pushes the rear end of the test tray TST toward the test chamber 120.

[0113] During this transfer, as shown in FIG. 11C, when jamming of the test tray TST occurs in the soak chamber 110 and the test tray TST is not transferred to the test chamber 120, the test tray 120 is provided in the test chamber 120. The sensor 125 cannot confirm the transport of the test tray TST. Therefore, information that the test tray TST has reached cannot be transmitted to the controller 1287. As described above, when the information that the test tray TST has reached from the sensor 125 does not come and the normal carrying start force by the tray carry-in device 119 continues for a predetermined time, the control device 1287 enters the soak chamber 110. Recognize that jamming has occurred.

It should be noted that the detection of the occurrence of jamming may be detected based on the fact that the sensor force for detecting the extension of the air cylinder 114 has not been detected for a predetermined time.

[0115] When the jamming of the test tray TST is recognized, the control device 1287 instructs the tray carry-in device 119 to perform the return conveyance. At this time, the standing portion 119 is still inserted in the recess 720 of the test tray TST. If necessary, the control device 1287 stops the driving of the conveyance system 9 other than the chamber unit 100 until the jamming is resolved.

Next, the tray carry-in device 119 that has been instructed to perform the return conveyance drives the air cylinder 114 to move the test tray TST in the −X direction from the jammed position. During this return conveyance, as shown in FIG. 11D, the contact between the test tray TST and the contact portion 119b is released, and instead, the upright portion 119c inserted into the recess 720 contacts the inner wall of the recess 720. To return the test tray TST to the start position.

Then, as shown in FIG. 11E, when the test tray TST returns to the start position, the sensor 1191 senses it and transmits the information to the control device 1287. Upon receiving information from the sensor 1191 that the test tray TST has returned to the start position, the control device 1287 instructs the tray carry-in device 119 to re-transport the test tray TST. In response to the instruction, the tray carry-in device 119 again transfers the test tray TST from the soak chamber 110 to the test chamber 120 side. As a result, the test tray TST passes through the location jammed earlier. Then, it is transferred to the test chamber 120 normally. In addition, the control device 1287 restarts driving of the conveyance system 9 other than the chamber unit 100 that has been stopped.

[0118] In this way, jamming is eliminated by transporting the test tray TST back and forth in the position where jamming has occurred, and carrying it again. Since jamming is automatically resolved, manual recovery work is unnecessary, and time loss can be reduced.

[0119] The embodiment described above is described for facilitating the understanding of the present invention, and is not described for limiting the present invention. Therefore, each element disclosed in the above embodiment includes all design changes and equivalents belonging to the technical scope of the present invention.

For example, in the above-described embodiment, the return conveyance when jamming occurs when the test tray TST is conveyed from the soak chamber 110 to the test chamber 120 has been described. However, the test chamber 120 and the unsoak chamber 130 are described. If jamming occurs during this time, it can be returned and transported in the unsoak chamber 130.

[0121] In this case, the information that the test tray TST has reached is not transmitted from the sensor 133 to the control device 1287 even when the conveying start force of the test tray TST in the unsoak chamber 130 has also passed for a predetermined time. The controller 1287 recognizes that jamming has occurred in the unsoak chamber 130.

[0122] In this case, the tray carry-out device 131 of the unsoak chamber 130 is used for the return conveyance.

That is, at the time of return conveyance, the tray carry-out device 131 receives an instruction from the control device 1287 to perform return conveyance. Then, the contact portion 131b of the tray carry-out device 131 may push out the tray in the direction reverse to the X direction. In this case, when the center of gravity of the test tray TST moves to the test chamber 120 side, the upright portion 131c comes into contact with the projecting piece 138, and the contact portion 131c falls to a position where it does not interfere with the test tray TST. Is done smoothly.

[0123] In addition, when it is necessary to carry back the plurality of test trays TST in the chamber portion 100 due to jamming, in addition to the tray carry-in device 119 and the tray carry-out device 131 described above, The vertical conveyance devices 111 and 132 and the tray conveyance device 102 may be used to perform the reverse conveyance in the entire conveyance system 9. In this case, the vertical transfer devices 111 and 132 and the tray The ray transport device 102 returns and transports the test tray TST in the opposite manner to normal transport. Also, in the above-described embodiment, the case where the test tray TST is transported only once and transported again is described. If the jamming cannot be resolved with a single applied force, the return transfer and re-transfer may be repeated multiple times. Also, if jamming is still not resolved after repeating the return transfer and re-transfer a predetermined number of times, an alarm may be issued.

Claims

The scope of the claims

[1] An electronic component testing apparatus for testing the electronic device under test by bringing the electronic device under test into electrical contact with a contact portion of a test head with the electronic device under test mounted on a tray. There,

A transport system that circulates and transports the tray in a predetermined direction in the electronic component testing apparatus, and the transport system can transport the tray in a reverse direction that is reverse to the predetermined direction in whole or in part. Electronic component testing equipment.

[2] The electronic component testing apparatus comprises:

Detecting means for detecting an abnormality in conveyance of the tray in the conveyance system;

Control means for controlling the operation of the transport system;

Further comprising

The control means controls the transport system so that the transport system transports the tray in the reverse direction in whole or in part when the detection means detects an abnormality in transport of the tray. The electronic component test apparatus according to claim 1.

3. The apparatus according to claim 2, further comprising recognition means for recognizing whether or not the tray has returned to a predetermined position when the transport system transports the tray in the reverse direction in whole or in part. Electronic component testing equipment.

[4] The control unit may control the transport system so that the transport system transports the tray in the predetermined direction when the recognition unit recognizes that the tray has returned to the predetermined position. 3. Electronic component testing apparatus according to 3.

[5] The electronic component testing apparatus comprises:

A soak part that applies a predetermined thermal stress to the electronic device under test before the test,

A test unit for testing the electronic device under test given thermal stress;

With

The transport system is

A carry-in means provided in the soak part for carrying the tray into the test part; and a carrying means provided in the test part for carrying the tray. The carry-in means reverses the tray in the reverse direction. Claims 1 to 4 capable of being conveyed in the direction The electronic component testing apparatus described.

[6] The carrying-in means is

A first abutting portion for contacting the tray and conveying the tray in the predetermined direction; and when conveying the tray in the reverse direction, a first abutting portion for contacting the tray and conveying the tray in the reverse direction 2 abutments,

6. The electronic component testing apparatus according to claim 5, comprising:

[7] The electronic component testing apparatus comprises:

A test section for testing the electronic device under test that has been subjected to thermal stress in the soak section;

An unsoaked portion excluding the predetermined thermal stress applied to the tested electronic component under test;

With

The transport system is

A conveying means provided in the test unit for conveying the tray;

An unloading unit provided in the unsoak unit and unloading the tray from the test unit;

5. The electronic component testing apparatus according to claim 1, wherein the carry-out means is capable of carrying the tray in the reverse direction.

[8] The unloading means is

A first abutting portion that abuts on the tray and conveys the tray in the predetermined direction; and when the tray is conveyed in the reverse direction, a first abutting portion that abuts on the tray and conveys the tray in the reverse direction 2 abutments,

The electronic component testing apparatus according to claim 7, comprising:

[9] An electronic component testing apparatus for testing the electronic device under test by bringing the electronic device under test into electrical contact with a contact portion of a test head while the electronic device under test is mounted on a tray. A tray transport method for transporting the tray,

The tray is transported in a reverse direction that is reverse to the predetermined direction, entirely or partially, to a transport system that circulates and transports the tray in a predetermined direction within the electronic component testing apparatus. Tray transport method.

[10] a detection step of detecting an abnormality in conveyance of the tray in the conveyance system;

10. The tray transport method according to claim 9, further comprising: a reverse transport step in which the transport system transports the tray in the reverse direction in whole or in part based on a detection result of the detection step.

[11] A recognition step of recognizing whether or not the tray has returned to a predetermined position when the transport system transports the tray in the reverse direction, in whole or in part,

11. The tray transport method according to claim 10, further comprising: a re-transport step in which the transport system transports the tray in the predetermined direction based on a recognition result of the recognition step.

[12] The electronic component testing apparatus comprises:

A soak part that applies a predetermined thermal stress to the electronic device under test before testing, and a test unit that performs a test of the electronic device under test subjected to the thermal stress, and in the detection step, Detecting an abnormality in the conveyance of the tray occurring in at least one of the soak part or the test part,

12. The tray transport method according to claim 10, wherein the tray is transported from the test unit to the soak unit in the reverse transport step.

[13] The electronic component testing apparatus comprises:

A test unit for testing an electronic device under test to which thermal stress is applied in the soak unit, and an unsoak unit for removing the predetermined thermal stress applied to the electronic device under test before the test,

In the detection step, an abnormality in conveyance of the tray that occurs in at least one of the test unit or the unsoak unit is detected,

12. The tray transport method according to claim 10, wherein the tray is transported from the unsoak section to the test section in the reverse transport step.