JP2016212089A - Semiconductor element test handler - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor element test handler that is used when testing fabricated semiconductor elements.SOLUTION: A semiconductor element handler according to the present invention is configured to have a test chamber disposed between a first chamber and second chamber on circulation paths of a test tray, in which the first chamber functions as a soak chamber or de-soak chamber, and a function of the second chamber is changed over accompanied by the change-over of the first chamber to function as the de-soak chamber or soak chamber, and further, the test tray also selects any one of two circulation paths different from each other to circulate along the selected one. Accordingly, even when a test temperature condition is largely changed, a stand-by time of the handler is largely shortened, which in turn an operation rate of the handler and processing capacity thereof improve.SELECTED DRAWING: Figure 10

Description

  The present invention relates to a handler used when testing a produced semiconductor device.

The handler is used to test a semiconductor device manufactured through a predetermined manufacturing process.
The handler moves the semiconductor elements from the customer tray to the test tray, supports the semiconductor elements loaded on the test tray to be simultaneously tested by the tester TESTER, and classifies the semiconductor elements by grade based on the test results. Move from test tray to customer tray.
The test tray described above has a position where the semiconductor element is carried into the test tray (hereinafter referred to as “carrying position”), and a position where the semiconductor element carried into the test tray is electrically connected to the tester (hereinafter referred to as “ It is circulated through a fixed circulation path that leads to the loading position again through a position where the tested semiconductor element is unloaded from the test tray (hereinafter referred to as “unloading position”). .

  Generally, a handler applies a thermal stimulus (high temperature or low temperature) to a semiconductor element in consideration of the use environment of the semiconductor element, and then removes the thermal stimulus applied to the semiconductor element from the semiconductor element when the test is completed. Have a process to do. At this time, the process of applying a thermal stimulus to the semiconductor element and removing the thermal stimulus applied to the semiconductor element from the semiconductor element is performed on the circulation path of the test tray.

The above-described handler includes a side docking type in which a semiconductor element is electrically connected to a tester in a state where the test tray is set up vertically (see, for example, Patent Document 1 below), and a state in which the test tray is horizontal. It is broadly classified into an underhead docking type in which a semiconductor element is electrically connected to a tester (for example, see Patent Document 2 below).
In both the side docking test handler and the underhead docking handler, the test tray will circulate along a predetermined circulation path. However, in the case of a side docking handler, the horizontal test tray where the semiconductor elements to be tested have been loaded is set to the vertical state compared to the underhead docking handler, or A process of returning the test tray that has been unloaded to a horizontal state and an attitude converter for this process are further required (see, for example, Patent Document 3 below).

FIG. 1 is a conceptual plan view of the side docking handler 100 among the above-described handlers.
The test handler 100 includes a test tray 110, a carry-in device 120, a first posture converter 130, a soak chamber 140, a test chamber 150, a pressing device 160, a desoak chamber 170, and a second posture change. A container 180, a carry-out device 190, a number of temperature controllers TC1 to TC6, and a controller CU.
A large number of semiconductor elements are stacked on the test tray 110 and circulate along a circulation path C defined by a large number of transporters (not shown) (for example, see Patent Document 4 below).
The carry-in device 120 carries the semiconductor elements to be tested loaded on the customer tray Cd into the test tray 110 at the carry-in position LP.
Such a carry-in device 120 may be configured by a pick-and-place device alone (see, for example, Patent Document 5 below), but may be configured by a plurality of pick-and-place devices and an activation-type carry-in table ( For example, see Patent Document 6 below).
The first posture changer 130 changes the posture of the horizontal test tray 110 conveyed from the carry-in position LP to the vertical state.
The soak chamber 140 is provided to apply a thermal stimulus in advance before testing the semiconductor elements loaded on the test tray 110 according to the test temperature condition. That is, the semiconductor element is preliminarily assimilated to the temperature inside the soak chamber 140 before being transferred to the test position TP. For this reason, the flow of the whole physical distribution becomes faster and the processing capacity is improved. Here, the test tray 110 is conveyed side by side within the soak chamber 140.
For reference, the first posture changer 130 is attached inside or outside the soak chamber 140. That is, the horizontal test tray 110 may be changed in posture to the vertical state in the soak chamber 140, and after the posture is changed to the vertical state, the test tray 110 enters the inside of the soak chamber 140. It may be.

The test chamber 150 is provided for testing a semiconductor device on the test tray 110 that has been transferred to the test position TP after receiving thermal stimulation in the soak chamber 140. The inside of the test chamber 150 is in communication with each other because the thermal state is always substantially the same as the inside of the soak chamber 140. For reference, the tester TESTER is attached to the window side of the test chamber 150.
The pressing device 160 presses the semiconductor element on the test tray 110 in the test chamber 150 toward the tester TESTER (see, for example, Patent Document 7 below).
Thereby, the semiconductor element in the test tray 110 is electrically connected to the tester TESTER.
The desoak chamber 170 is provided in order to remove a thermal stimulus from a semiconductor element in the test tray 110 that has been transferred from the test chamber 150. The reason why the desoak chamber 170 is provided in this way is to allow normal carrying-out work to be performed when carrying out a tested semiconductor element from the test tray 110, and the carrying-out device 190 is damaged, This is to prevent the merchantability of the semiconductor element from being damaged. For this reason, since the internal temperature of the desoak chamber 170 and the internal temperature of the test chamber 150 are different from each other, an open / close door DR for opening and closing between the desoak chamber 170 and the test chamber 150 needs to be provided. Similarly, the test tray 110 is conveyed side by side within the desoak chamber 170.
The second posture changer 180 changes the posture of the test tray 110 in a vertical state on which tested semiconductor elements are stacked to a horizontal state. Similarly, the second posture changer 180 is attached inside or outside the desoak chamber 170.
The carry-out device 190 classifies the semiconductor elements in the test tray 110 that have been transported to the carry-out position UP after the attitude is changed to the horizontal state, classifies them by test grade, and loads them on the empty customer tray Ce. Similarly, the carry-out device 190 may be configured by a pick-and-place device alone, but may be configured by a plurality of pick-and-place devices and a sort table, for example, as shown in Patent Document 8 below.
A number of temperature controllers TC <b> 1 to TC <b> 6 adjust the temperatures inside the soak chamber 140, the test chamber 150, and the desoak chamber 170. Here, since the inside of the test chamber 150 is directly related to the temperature condition of the semiconductor device to be tested, accurate temperature adjustment must be performed, and the temperature generated during the test must be adjusted. Since the change must be suppressed quickly, a plurality of temperature controllers TC3 to TC6 are required.
The controller CU controls components that require control among the components described above.

As is apparent from the above, the test tray 110 is loaded into the loading position LP, the soak chamber 140, the test position TP in the test chamber 150, the desoak chamber 170, and the unloading position UP. It will circulate along the closed circulation path C leading to LP.
In some embodiments, even if they are the same side docking handler, the loading position and the unloading position are the same, the attitude change of the test tray is also performed in a single attitude converter, and the loading and unloading are performed by the same component. In some cases, it may be realized (for example, see Patent Documents 9 and 10 below). In this case, the test tray circulates along a closed circulation path that leads from the loading / unloading position to the soak chamber, the test chamber and the desoak chamber to the loading / unloading position.
On the other hand, since the use environment of semiconductor elements is diverse, the test temperature condition is low temperature (for example, −40 ° C.) or high temperature (for example, 90 ° C.). For this reason, it may be necessary to perform a high temperature test after the low temperature test or a low temperature test after the high temperature test. For example, after the low temperature test is performed with the inside of the soak chamber 140 adjusted to a temperature of −40 ° C. and the inside of the desoak chamber 170 adjusted to a temperature of 70-80 ° C., the temperature of 90 ° C. It may be necessary to perform a high temperature test under certain conditions. In this case, the internal temperature of the soak chamber 140 must be adjusted to 90 ° C., and the internal temperature of the desoak chamber 170 must be lowered. At this time, since it takes about 2 hours to raise the internal temperature of the soak chamber 140 from −40 ° C. to 90 ° C., the waiting time of the handler is prolonged, which leads to a reduction in operating rate and processing capacity. Such a problem also occurs when switching to a low temperature test after a high temperature test.
For reference, in the case of the test chamber 150, since the internal space is narrow and the number of temperature controllers TC2 to TC5 is sufficient, it is possible to respond quickly to changes in test temperature conditions.

Korean Open Patent No. 10-1997-0077466 Republic of Korea Open Patent 10-2000-0068397 Korean Patent Registration 10-0714106 Republic of Korea registered utility model 20-0389824 Republic of Korea Utility Model 20-2010-0012620 Republic of Korea Open Patent No. 10-2007-0077905 Republic of Korea Open Patent No. 10-2005-0055685 Republic of Korea Open Patent 10-2007-0079223 Republic of Korea Open Patent No. 10-1998-056230 Korean Registered Patent No. 10-0560729

  The present invention provides a technique for minimizing handler latency when test temperature conditions are significantly varied.

  The handler for semiconductor device test according to the first embodiment of the present invention devised to achieve the above-described object circulates along the first circulation path according to the test temperature condition, or The test tray that circulates along the circulation path 2 and is loaded with semiconductor elements and the semiconductor elements to be tested are moved from the customer tray to the test tray at the loading position, or the tested semiconductor elements are An element moving portion that is classified from the test tray at the unloading position and moved to a customer tray and a test tray on which a semiconductor element to be tested is loaded according to the operation of the element moving portion. A plurality of conveyors that circulate along one circulation path or circulate along the second circulation path, and the first circulation path by the plurality of conveyors. The test tray that circulates along or along the second circulation path is housed inside, and the semiconductor elements loaded on the test tray according to the set first temperature condition are A first chamber provided to assimilate to a temperature corresponding to the first temperature condition; and at least one first temperature to assimilate the interior of the first chamber to the first temperature condition The test tray that circulates along the first circulation path by the adjuster and the plurality of transporters, or accommodates the test tray that circulates along the second circulation path. A second chamber provided to assimilate the semiconductor elements loaded on the test tray according to the temperature condition to a temperature corresponding to the second temperature condition, and the second chamber includes the second chamber. Temperature And at least one second temperature controller for assimilation, and disposed between the first chamber and the second chamber on the first circulation path and the second circulation path A test chamber provided to support a test of the semiconductor device loaded on the test tray accommodated therein, and at least one third chamber for assimilating the inside of the test chamber to a test temperature condition The temperature controller and the test tray that circulates along the second circulation path are disposed on a section where the test tray is conveyed from the first chamber to the second chamber, and is unloaded from the first chamber. And an auxiliary chamber for accommodating the test tray and the plurality of transporters so that the test tray circulates along the first circulation path and the second circulation path. The first circulation path has a section in which the test tray passes through the inside of the first chamber, the inside of the test chamber, and the inside of the second chamber in this order, The second circulation path has a section in which the test tray passes through the inside of the first chamber, the inside of the auxiliary chamber, and the inside of the second chamber in this order.

  Preferably, each of the first temperature condition and the second temperature condition is changed according to a setting, and the first temperature condition and the second temperature condition are different from each other, and the first circulation path and the second temperature condition are different from each other. In the second circulation path, the transport direction of the test tray is different from each other in at least some sections.

  The semiconductor device test handler according to the second embodiment of the present invention devised to achieve the above-described object circulates along the first circulation path according to the test temperature condition, or A test tray that circulates along two circulation paths and is loaded with semiconductor elements, and a semiconductor tray that is to be tested in accordance with a test temperature condition, in the first or second position from the customer tray. Or an element moving part for classifying the tested semiconductor elements from the test tray at the first position or the second position based on the test results and moving them to the customer tray, and the element moving part A test tray loaded with semiconductor elements to be tested in response to the operation of the circuit is circulated along the first circulation path or is circulated along the second circulation path. The test tray that circulates along the first circulation path or circulates along the second circulation path by the plurality of transporters and the plurality of transporters is accommodated inside, and is set. A first chamber provided to assimilate a semiconductor element loaded on the test tray according to a temperature condition of 1 to a temperature corresponding to the first temperature condition; and an interior of the first chamber is provided in the first chamber Circulate along the first circulation path by at least one or more first temperature regulators for assimilation to one temperature condition and the plurality of transporters, or in the second circulation path The test tray that circulates along the inside is accommodated inside, and is provided for assimilating the semiconductor elements loaded on the test tray to a temperature corresponding to the second temperature condition according to the set second temperature condition Second A chamber, at least one second temperature controller for assimilating the interior of the second chamber to the second temperature condition, and on the first circulation path and the second circulation path A test chamber disposed between the first chamber and the second chamber and provided to support a test of a semiconductor element mounted on the test tray housed in the test chamber; and an interior of the test chamber At least one third temperature controller for assimilating the test tray to the test temperature condition, and the plurality of transports so that the test tray circulates along the first circulation path or the second circulation path. A controller for controlling the container, wherein each of the plurality of transporters is configured to transport the test tray along the first circulation path or the second circulation path according to the control of the controller. The first position and the second position are selectively switched to a carry-in position or a carry-out position according to a test temperature condition, and the first position and the second position are selectively switched according to a test temperature condition. The circulation direction of the test tray along the circulation path and the circulation direction of the test tray along the second circulation path are opposite to each other.

  Preferably, the element moving portion carries a semiconductor element into the test tray at the first position or unloads the semiconductor element from the test tray at the first position according to a test temperature condition. The semiconductor device is loaded into the test tray at the second position or the semiconductor device is unloaded from the test tray at the second position depending on the first moving device and the test temperature condition A second mobile unit, wherein the control unit controls the second mobile unit to carry a semiconductor element into the test tray at the first position. Control is performed so that the mobile device carries out the semiconductor element from the test tray at the second position, and control is performed so that the second mobile device carries the semiconductor element into the test tray at the second position. You Case, the first mobile device is controlled so as to carry the semiconductor device from the test tray in the first position.

  According to the present invention, the waiting time due to the variation of the test set temperature is greatly shortened, so that the operation rate and processing capacity of the test handler are improved.

It is a conceptual top view with respect to the handler for the conventional semiconductor element test. It is a notional top view with respect to the handler for a semiconductor device test by the 1st Embodiment of this invention. FIG. 3 is a reference diagram for explaining a circulation path of a test tray in the semiconductor element test handler shown in FIG. 2. FIG. 3 is a reference diagram for explaining a circulation path of a test tray in the semiconductor element test handler shown in FIG. 2. FIG. 3 is a reference diagram for explaining a circulation path of a test tray in the semiconductor element test handler shown in FIG. 2. FIG. 3 is a reference diagram for explaining a circulation path of a test tray in the semiconductor element test handler shown in FIG. 2. FIG. 3 is a reference diagram for explaining a circulation path of a test tray in the semiconductor element test handler shown in FIG. 2. FIG. 3 is a reference diagram for explaining a circulation path of a test tray in the semiconductor element test handler shown in FIG. 2. It is a conceptual top view with respect to the handler by the application of the handler shown in FIG. It is a conceptual top view with respect to the handler for a semiconductor element test by the 2nd Embodiment of this invention. FIG. 11 is a reference diagram for explaining a circulation path of a test tray in the semiconductor element test handler shown in FIG. 10. FIG. 11 is a reference diagram for explaining a circulation path of a test tray in the semiconductor element test handler shown in FIG. 10.

  Hereinafter, preferred embodiments according to the present invention described above will be described with reference to the accompanying drawings, but redundant descriptions will be omitted or compressed as much as possible to simplify the description.

<First Embodiment>
FIG. 2 is a conceptual plan view of a semiconductor device test handler 200 (hereinafter abbreviated as “handler”) according to the first embodiment of the present invention.
As shown in FIG. 2, the handler 200 according to the embodiment of the present invention includes a test tray 210, a carry-in device 220, a carry-out device 230, a first attitude converter 240, a first chamber 250, and a second Chamber 260, test chamber 270, auxiliary chamber AC, pressing device 280, second attitude converter 290, a number of transporters TF1 to TF9, a plurality of temperature controllers TC1 to TC7 and a controller CU. Is provided.
The test tray 210 circulates along the first circulation path C1 (see FIG. 3) or circulates along the second circulation path C2 (see FIG. 4) depending on the test temperature condition. Here, the first circulation path C1 passes through the loading position LP, the inside of the first chamber 250, the test position TP inside the test chamber 270, the inside of the second chamber 260, and the unloading position UP. This is a closed route that leads to the loading position LP. The second circulation path C2 is a path that is adopted when the test temperature condition changes significantly, and details thereof will be described later.

The carry-in device 220 carries the semiconductor elements to be tested loaded on the customer tray Cd into the test tray 210 at the carry-in position LP. The carry-out device 230 classifies the semiconductor elements in the test tray 210 that have been transported to the carry-out position UP, classifies them by test grade, and loads them on the empty customer tray Ce. The carry-in device 220 and the carry-out device 230 described above are components that move the semiconductor element between the test tray 210 and the customer tray Cd / Ce. Further, for example, when the configuration of the handler shown in Patent Document 9 is adopted. Therefore, the carry-in device 220 and the carry-out device 230 are collectively referred to as an element moving part DTP.
The first posture converter 240 changes the posture of the test tray 210 in the horizontal state to the vertical state. In the embodiment of the present invention, the first attitude converter 240 is provided in the first chamber 250. However, in some embodiments, as shown in FIG. It may be attached to the outside of the first chamber 250A. For reference, FIG. 5 shows an example in which the first attitude converter 240A is attached to the upper portion of the first chamber 250A. However, depending on the embodiment, the first posture converter 240A is attached to the right side or the front side of the first chamber. May be.
In the first chamber 250, the semiconductor elements loaded on the test tray 210 are set to a set temperature condition (hereinafter, the set temperature condition in the first chamber is referred to as a “first temperature condition”). Assimilate to the corresponding temperature. Whether such a first chamber 250 functions as a soak chamber depending on which of the first circulation path C1 and the second circulation path C2 the test tray 210 circulates. Or, it functions as a de-soak chamber.
Further, the first chamber 250 is a carry-out unit that opens and closes a carry-out hole in which the test tray 210 whose posture is changed to the vertical state by the first posture changer 240 is carried out to the auxiliary chamber AC without passing through the test chamber 270. A door 251 is provided. Of course, the test tray 210 is conveyed in the front-rear direction inside the first chamber 250.

The second chamber 260 is set to a temperature condition in which the semiconductor elements mounted on the test tray 210 are set (hereinafter, the set temperature condition in the second chamber is referred to as “second temperature condition”). Assimilate to the corresponding temperature. Such a second chamber 260 also functions as a de-soak chamber depending on which of the first circulation path C1 and the second circulation path C2 the test tray 210 circulates along. Or function as a soak chamber.
The second chamber 260 includes a loading door 261 that opens and closes a loading hole into which the test tray 210 that has been conveyed from the first chamber 250 side via the auxiliary chamber AC without passing through the test chamber 270 is loaded. Similarly, the test tray 210 is transported in the front-rear direction inside the second chamber 260.
The first temperature condition and the second temperature condition described above are variables that are set by the administrator in consideration of the test temperature environment, and thus are variable elements. Of course, if the first temperature condition is a temperature condition for applying a thermal stimulus to the semiconductor element, the second temperature condition is a temperature condition for removing the thermal stimulus from the semiconductor element. If the condition is a temperature condition for applying a thermal stimulus to the semiconductor element, the first temperature condition is a temperature condition for removing the thermal stimulus from the semiconductor element. Temperature conditions need to be different from each other.
The test chamber 270 supports the test of the semiconductor elements housed inside and loaded on the test tray 210 at the test position TP. Such a test chamber 270 is disposed between the first chamber 250 and the second chamber 260 on the first circulation path C1 and the second circulation path C2. Of course, the inside of the test chamber 270 has a temperature environment corresponding to the third temperature condition which is the test temperature condition.
On the other hand, the inside of the first chamber 250 and the test chamber 270 is communicated or blocked by the first opening / closing door DR1, and the inside of the second chamber 260 and the test chamber 170 is inside by the second opening / closing door DR2. They are communicated or blocked from each other.

The auxiliary chamber AC is in front of the test chamber 270 and is disposed between the first chamber 250 and the second chamber 260. Such an auxiliary chamber AC must accommodate the test tray 210 in the process in which the test tray 210 circulating along the second circulation path C2 moves from the inside of the first chamber 250 to the inside of the second chamber 260. I must.
That is, the test tray 210 that circulates along the second circulation path C <b> 2 is conveyed from the inside of the first chamber 250 to the second chamber 260 through the inside of the auxiliary chamber AC. At this time, since the test tray 210 enters the inside of the second chamber 260 having the second temperature condition through the inside of the first chamber 250 having the first temperature condition, the auxiliary chamber AC moves the test tray 210 to the inside. Prior to being transferred to the second chamber 260, the semiconductor element serves to remove to some extent thermal stimuli received in the interior of the first chamber 250. For this reason, the inside of the auxiliary chamber AC must have a fourth temperature condition that removes to some extent the thermal stimulation that the semiconductor element of the accommodated test tray 210 receives in the inside of the first chamber 250.
At this time, in order to remove the thermal stimulus from the semiconductor element of the test tray 210 inside the auxiliary chamber AC, any one or a combination of a cooler, a heater, a blower, etc. is provided. On the other hand, the fourth temperature condition is adjusted by performing the control necessary for the thermal stimulation. For example, when raising the internal temperature of the auxiliary chamber A, the temperature can be adjusted only with a heater and a blower, even if a cooler is not provided. Of course, only the heater may be used to raise the temperature, but when it is desired to quickly raise the temperature, the heater and the air blower are operated together to quickly raise the temperature due to the convection phenomenon, and the auxiliary chamber AC Keep all parts at the same temperature. Even in the case of lowering the temperature, it is possible to lower the temperature with only a blower without a cooler.
The pressing device 280 presses the semiconductor element of the test tray 210 in the test chamber 270 toward the tester. Thereby, the semiconductor element in the test tray 210 is electrically connected to the tester.
The second posture changer 290 changes the posture of the test tray 210 in a vertical state on which tested semiconductor elements are stacked to a horizontal state. Similarly, in the embodiment of the present invention, the second attitude converter 290 is provided inside the second chamber 260. However, in some embodiments, the second attitude converter is provided outside the second chamber. It may be attached.

A number of transporters TF1 to TF9 transport the test tray 210 for each section on the first circulation path C1 and the second circulation path C2. Of course, in addition to the large number of transporters TF1 to TF9, a transporter necessary for the transport flow of the test tray 210 may be further provided. In particular, the transporters denoted by reference numerals TF8 and TF9 are bypass transporters for use in transporting the test tray 210 at the loading position LP into the second chamber 260 via the auxiliary chamber AC without passing through the test chamber 270. It is. The transporters denoted by reference characters TF2 and TF5 selectively transport the test tray 210 in both the front and rear directions, and the transporters denoted by reference characters TF3 and TF4 selectively transport the test tray 210 in both the left and right directions.
The plurality of temperature controllers TC1 to TC7 adjust the internal temperatures of the first chamber 250, the second chamber 260, the test chamber 270, and the auxiliary chamber AC. The temperature controller indicated by reference numeral TC1 adjusts the internal temperature of the first chamber 250, and the temperature controller indicated by reference numeral TC2 adjusts the internal temperature of the second chamber 260. Further, the temperature regulators TC3 to TC6 adjust the internal temperature of the test chamber 270, and the temperature regulator TC7 adjusts the temperature of the auxiliary chamber AC. Here, the plurality of temperature controllers TC1 to TC7 are each one of a cooler, a heater, a blower, or the like, or a combination thereof. In particular, the temperature controller denoted by reference numeral TC6 preferably has a structure disclosed in, for example, Application No. 10-2013-0013988 previously filed by the present applicant. For reference, in the case of a blower, normal temperature external air is blown into the chamber, and the air inside the chamber to which thermal stimulation has been applied is extracted to bring the internal temperature of the chamber close to normal temperature. Using this method, the internal temperature of the chamber is adjusted to a set temperature (for example, room temperature). Here, the blower simply includes a fan and plays a role of cooling. Of course, the air heated in the heater is circulated inside the chamber, thereby increasing the temperature inside the chamber uniformly and quickly.

  The controller CU controls components that require control among the components described above. In particular, the controller CU performs the first mode control and the second mode control according to the test temperature condition, and circulates the test tray 210 along the first circulation path C1 during the first mode control. In the second mode, the transporters TF1 to TF9 are controlled so as to circulate the test tray 210 along the second circulation path C2.

  Next, a test tray circulation method performed in the handler 200 having the above-described configuration will be described.

1. Circulation of the test tray 210 during the temperature condition test in the first mode During the temperature condition test in the first mode (for example, considering a low temperature test mode of −40 ° C.), the internal temperature of the first chamber 250 is −40 The internal temperature of the second chamber 260 must be adjusted to 70-80 ° C.
For reference, when the internal temperature of the second chamber 260 is adjusted to 70 to 80 ° C., the test moved out of the second chamber 260 and moved to the unloading position UP when considering the circulation time of the test tray 210. The temperature of the semiconductor elements stacked on the tray 210 is in the range of 15 ° C. to 20 ° C., which is close to normal temperature.
3, the test tray 210 has a loading position LP, the inside of the first chamber 250, and the <test tray 210 in the rear of the first chamber 250, as shown in FIG. The test position TP inside the test chamber 270, the inside of the second chamber 260, <the test tray 210 is transported forward inside the second chamber 260>, and the unloading position UP After passing through this order, it circulates along the 1st circulation path | route C1 connected to the carrying-in position LP. At this time, the posture of the test tray 210 is changed from the horizontal state to the vertical state by the first posture converter 240 inside the first chamber 250, and the second posture converter 290 inside the second chamber 260. Through the process of changing the posture from the vertical state to the horizontal state.
When the test tray 210 circulates along the first circulation path C1 described above, the first chamber 250 functions as a soak chamber, and the second chamber 260 functions as a desoak chamber. Therefore, the test tray 210 has a section that passes through the first chamber 250, the test chamber 270, and the second chamber 260 in this order, and the semiconductor element that is assimilated to low temperature through the first chamber 250 is After being tested by the tester inside the test chamber 270, the temperature returns to room temperature through the second chamber 260.

2. Circulation of the test tray 210 during the temperature condition test in the second mode During the temperature condition test in the second mode (for example, considering the high temperature test mode of 90 ° C.), the internal temperature of the second chamber 260 is set to 90 ° C. Adjusted. For this reason, the waiting time required for raising the internal temperature of the second chamber 260, which is already at 70 to 80 ° C., to 90 ° C. is significantly shortened within 3 minutes, thereby saving energy.
Under the temperature setting conditions described above, the test tray 210 includes the loading position LP, the inside of the first chamber 250, the inside of the auxiliary chamber AC, and the inside of the second chamber 260, as shown in FIG. <The test tray 210 is conveyed backward in the second chamber 260>, the test position TP in the test chamber 270, the inside of the first chamber 250, and <the test tray 210 is in the first chamber Is transferred forward in the interior of the chamber 250>, passes through the interior of the auxiliary chamber AC, the interior of the second chamber 260, and the unloading position UP in this order, and then enters the second circulation path C2 connected to the loading position LP. Circulate along. Details of the second circulation path C2 will be described.

As shown in FIG. 6, first, the test tray 210 is transported from the loading position LP to the first chamber 250, and is changed from the horizontal state to the vertical state by the first attitude converter 240 inside the first chamber 250. After the posture change, the bypass section BPS that moves to the inside of the second chamber 260 through the inside of the auxiliary chamber AC is moved without passing through the inside of the test chamber 270.
Next, as shown in FIG. 7, the test tray 210 moves in the second chamber 260 and a section TMS that passes through the inside of the test chamber 270 and the first chamber 250 in this order. At this time, the second chamber 260 functions as a soak chamber, and the first chamber 250 functions as a desoak chamber. Here, the test tray 210 is transported rearward in the second chamber 260 and transported forward in the first chamber 250. For this reason, the semiconductor element assimilated to a high temperature through the second chamber 260 is tested by a tester inside the test chamber 270 and then returned to the normal temperature through the first chamber 250. For reference, by supplying normal temperature outside air to the inside of the first chamber 250, the high temperature semiconductor element is cooled to be close to normal temperature inside the first chamber 250.
Next, as shown in FIG. 8, the test tray 210 that has been transported forward in the first chamber 250 is moved into the second chamber 260 through the auxiliary chamber AC, and then the second tray 260. The posture changer 290 moves the unloading movement section UMS that returns to the horizontal state and moves to the unloading position UP.

In addition, the test tray on which the stacked semiconductor elements are unloaded from the unloading position UP ends one cycle while moving to the loading position LP.
Of course, in the embodiment of the present invention, the first attitude converter 240 is disposed in the first chamber 250 and the second attitude converter 290 is disposed in the second chamber 260. As an example, the test tray 210 passes through the inside of the first chamber 250 in the bypass section BPS on the second circulation path C2, and the test tray 210 passes through the inside of the second chamber 260 in the unloading movement section UMS. It passes.
However, when the first posture changer is disposed outside the first chamber and the second posture changer is also disposed outside the second chamber, the test tray is in the bypass section BPS in the first section. It is not necessary to go through the chamber, and it is not necessary to go through the second chamber in the carry-out movement section. In such a case, the auxiliary chamber can be omitted. That is, the most important role among the roles of the auxiliary chamber AC is that the flow of the flow along the circulation path such as C2 of FIG. It is to return the semiconductor element assimilated to this temperature state to an appropriate temperature state.
As described above, the moving direction of the test tray 210 that moves through the second chamber 260 in the second circulation path C2 and the section passing through the inside of the test chamber 270 and the first chamber 250 in this order is the first circulation path. The direction is different from the moving direction of the first tray 250 in the path C1, and the moving direction of the test tray 210 moving through the test chamber 270 and the second chamber 260 in this order.

3. Application Example In the embodiment described above, a single auxiliary chamber AC is provided. However, depending on the embodiment, two auxiliary chambers AC1 and AC2 may be provided as shown in FIG.
The roles of the two auxiliary chambers AC1 and AC2 in the embodiment of FIG. 9 are divided during the temperature condition test in the second mode.
For example, when the temperature condition test in the second mode is a high temperature test, the inside of the first chamber 250 is in a cooled state, and the inside of the second chamber 260 is in a heated state. The test tray 210 circulates along the closed circulation path C shown in FIG.
First, the test tray 210 in which the semiconductor elements have been loaded at the loading position LP passes through the first chamber 250 and the first auxiliary chamber AC1 in this order, and then enters the second chamber 260.
At this time, the semiconductor elements loaded on the test tray 210 absorb cold air that is not required inside the first chamber 250. In this state, when entering the inside of the second chamber 260, the load on the second chamber 260 (temperature increase time, congestion of the test tray, etc.) increases. For this reason, the load of the second chamber 260 is reduced by preheating the semiconductor element in the first auxiliary chamber AC1 in advance.
On the other hand, the test tray 210 that has finished testing the stacked semiconductor elements moves through the first chamber 250, the second auxiliary chamber AC2, and the second chamber 260 in this order, and then moves to the unloading position UP. That is, the semiconductor element cooled in the first chamber 250 absorbs high heat that is not required through the second chamber 260. In such a case, there is a possibility that problems such as damage to the suction pad of the unloading device 230 or unevenness of the semiconductor element may occur during the unloading process. For this reason, in the second auxiliary chamber AC2, the semiconductor element is appropriately further cooled in consideration of the degree of heating of the semiconductor element in the second chamber 260, so that the semiconductor element can be unloaded from the unloading position UP. To be done.
Of course, three or more auxiliary chambers may be provided depending on how the roles are divided. That is, one or more auxiliary chambers are provided to meet the required role.
Note that the auxiliary chamber does not have a separate temperature controller and may be provided only in a space away from the outside and serve only as a bypass.

<Second Embodiment>
FIG. 10 is a conceptual plan view of a handler 900 according to the second embodiment of the present invention. As shown in FIG. 10, the handler 900 according to the embodiment of the present invention includes a test tray 910, an element moving part DTP, a first attitude converter 940, a first chamber 950, and a second chamber 960. , A test chamber 970, a pressing device 980, a second attitude converter 990, a number of transporters TF1 to TF7, a plurality of temperature controllers TC1 to TC6 and a controller CU.
The test tray 910 circulates along the first circulation path C1 (see FIG. 11) or circulates along the second circulation path C2 (see FIG. 12) depending on the test temperature condition. The first circulation path C1 passes through the first position P1, the inside of the first chamber 950, the test position TP inside the test chamber 970, the inside of the second chamber 960, and the unloading position UP. This is a closed route that leads to the second position P2. In addition, the second circulation path C2 is a path that is adopted when the test temperature condition changes drastically, and the second position P2, the inside of the second chamber 960, and the inside of the test chamber 970 are tested. It is a closed path that connects the position TP and the interior of the first chamber 950 and through the first position P1 to the second position P2. Here, the first position P <b> 1 and the second position P <b> 2 are positions where the element moving portion DTP carries semiconductor elements into the test tray 910 and carries semiconductor elements out of the test tray 910.

The element moving part DTP moves the semiconductor element to be tested according to the test temperature condition from the customer tray Cd / Ce to the test tray 910 at the first position P1 or the second position P2, or has been tested. Are classified from the test tray 910 at the first position P1 or the second position P2 based on the test result and moved to the customer tray Cd / Ce. For this purpose, the element moving part DTP includes a first moving unit 920 and a second moving unit 930.
The first mobile unit 920 carries the semiconductor elements loaded on the customer tray Cd into the test tray 910 at the first position P1 according to the test temperature condition, or the test tray at the first position P1. After carrying out the semiconductor element from 910, it is moved to the empty customer tray Cd.
The second mobile unit 930 carries the semiconductor elements loaded on the customer tray Ce into the test tray 910 at the second position P2 or the test tray at the second position P2 according to the test temperature condition. After unloading the semiconductor element from 910, it is moved to an empty customer tray Ce.
That is, the first moving device 920 and the second moving device 930 selectively perform a loading function or a loading function along the circulation path of the test tray 910. Of course, since the processing capacities during the temperature condition test in the first mode and the temperature condition test in the second mode are preferably the same, the first mobile unit 920 and the second mobile unit 930 are symmetrical to each other. It is preferable that it is provided in the structure which comprises.
The first posture changer 940 changes the posture of the horizontal test tray 910 to the vertical state.

The first chamber 950 has a temperature condition in which the semiconductor elements mounted on the test tray 910 are set (hereinafter, the temperature condition set in the first chamber is referred to as a “first temperature condition”). Assimilate to the temperature corresponding to. Whether the first chamber 950 functions as a soak chamber depending on which of the first circulation path C1 and the second circulation path C2 the test tray 910 circulates. Or, it functions as a de-soak chamber. Of course, the test tray 910 may be transported in the front-rear direction inside the first chamber 950.
The second chamber 960 has a temperature condition in which the semiconductor elements mounted on the test tray 910 are set (hereinafter, the set temperature condition in the second chamber is referred to as a “second temperature condition”). Assimilate to the temperature corresponding to. Such a second chamber 960 also functions as a de-soak chamber depending on which of the first circulation path C1 and the second circulation path C2 the test tray 910 circulates. Or function as a soak chamber. Similarly, the test tray 910 may be transported in the front-rear direction inside the second chamber 960.
The test chamber 970 supports testing of semiconductor elements that are housed inside and loaded on the test tray 910 at the test position TP. Such a test chamber 970 is disposed between the first chamber 950 and the second chamber 960 on the first circulation path C1 and the second circulation path C2. Of course, the inside of the test chamber 970 has a temperature environment corresponding to the third temperature condition which is the test temperature condition.
On the other hand, the inside of the first chamber 950 and the test chamber 970 is communicated or blocked by the first opening / closing door DR1, and the inside of the second chamber 960 and the test chamber 970 is kept by the second opening / closing door DR2. They are communicated or blocked from each other.
The pressing device 980 presses the semiconductor element of the test tray 910 in the test chamber 970 toward the tester. Thereby, the semiconductor element in the test tray 910 is electrically connected to the tester.
The second posture changer 990 changes the posture of the vertical test tray 910 loaded with the tested semiconductor elements to the horizontal state.

A large number of transporters TF1 to TF7 transport the test tray 210 by section on the first circulation path C1 and the second circulation path C2. Of course, in addition to the large number of transporters TF1 to TF8, a transporter necessary for the flow of transport of the test tray 210 may be further provided. Each of these large number of transporters TF1 to TF7 transports the test tray 910 in the transport direction (forward direction) along the first circulation path C1 or the second according to the control of the controller CU. Is conveyed in the conveyance direction (reverse direction) along the circulation path C2. That is, since the circulation direction of the test tray 910 along the first circulation path C1 and the circulation direction along the second circulation path C2 are opposite to each other, each of the multiple mobile devices TF1 to TF7 The test tray 910 is selectively conveyed in the forward and reverse directions according to the test temperature condition.
The plurality of temperature controllers TC1 to TC6 adjust the internal temperatures of the first chamber 950, the second chamber 960, and the test chamber 970. Similarly, each of the temperature controllers TC1 to TC6 is a cooler, a heater, a blower, or the like, or a combination thereof.
The controller CU controls components that require control among the components described above. In particular, the controller CU performs the first mode control and the second mode control according to the test temperature condition, and circulates the test tray 910 along the first circulation path C1 during the first mode control. The transporters TF1 to TF7 are controlled, and the transporters TF1 to TF7 are controlled to circulate the test tray 910 along the second circulation path C2 in the second mode. Note that when the controller CU controls the first mobile unit 920 to carry the semiconductor element into the test tray 910 at the first position P1, the second mobile unit 930 has the second position P2. When the control is performed so that the semiconductor element is carried out from the test tray 910 located at the second position, and the second mobile unit 930 is controlled so as to carry the semiconductor element into the test tray 910 located at the second position P2, the first Control is performed so that the mobile device 920 carries out the semiconductor element from the test tray 910 at the first position P1.

1. Circulation of the test tray 910 during the temperature condition test in the first mode The internal temperature of the first chamber 950 is −40 ° C. during the temperature condition test in the first mode (for example, considering the low temperature test mode of −40 ° C.). And the internal temperature of the second chamber 960 must be adjusted to 70-80 ° C.
Under the temperature setting conditions described above, the test tray 910 has the first position P1, the inside of the first chamber 950, and the <test tray 910 is the inside of the first chamber 950, as shown in FIG. The test position TP inside the test chamber 970, the inside of the second chamber 960, <the test tray 910 is carried forward inside the second chamber 960>, and the second After passing through the position P2 in this order, it circulates along the first circulation path C1 leading to the first position P1. At this time, the posture of the test tray 910 is changed from the horizontal state to the vertical state by the first posture changer 940 in the first chamber 950, and the second posture changer 990 is set in the second chamber 960. Through the process of changing the posture from the vertical state to the horizontal state.
During the temperature condition test in the first mode described above, the first position P1 is the loading position, and the first mobile unit 920 performs the loading function. In addition, the 2nd position P2 turns into a carrying-out position, and the 2nd moving device 930 performs a carrying-out function.

2. Circulation of the test tray 910 during the temperature condition test in the second mode During the temperature condition test in the second mode (for example, considering the high temperature test mode of 90 ° C.), the internal temperature of the second chamber 960 is set to 90 ° C. Adjusted. Under the temperature setting conditions described above, the test tray 910 has the second position P2, the inside of the second chamber 960, and the <test tray 910 is the inside of the second chamber 960, as shown in FIG. The test position TP inside the test chamber 970, the inside of the first chamber 950, <the test tray 910 is carried forward inside the first chamber 950>, and the first After passing through the first position P1 in this order, it circulates along the second circulation path C2 leading to the second position P2.
Similarly, at the time of the temperature condition test in the second mode, the second position P2 becomes the loading position, and the second mobile unit 930 performs the loading function. Moreover, the 1st position P1 turns into a carrying out position, and the 1st mobile device 920 performs a carrying out function.

  As described above, the specific description of the present invention has been made by the embodiment based on the accompanying drawings. However, since the above-described embodiment has only been described by way of a preferred example of the present invention, The invention should not be understood as being limited only to the above-described embodiments, and the scope of the present invention should be understood as the claims and their equivalents described below.

200, 900 Test handler 210, 910 Test tray DTP element moving part 220 Loading device 230 Unloading device 920 First moving device 930 Second moving device 240, 940 First attitude converter 250, 950 First chamber 260, 960 Second chamber 270, 970 Test chamber 290, 990 Second attitude changer TF1-TF9 Transporter C1 First circulation path C2 Second circulation path

Claims (4)

A test tray that circulates along the first circulation path according to the test temperature condition or circulates along the second circulation path and is loaded with semiconductor elements;
Move the semiconductor elements to be tested from the customer tray to the test tray at the loading position, or sort the tested semiconductor elements based on the test results and move from the test tray at the loading position to the customer tray Let the element move part,
A plurality of test trays loaded with semiconductor elements to be tested according to the operation of the element moving part are circulated along the first circulation path, or are circulated along the second circulation path. A transporter;
The test tray that circulates along the first circulation path by the multiple conveyors or circulates along the second circulation path is accommodated inside, and the first temperature condition is set. In response, a first chamber provided for assimilating the semiconductor elements loaded on the test tray to a temperature corresponding to the first temperature condition;
At least one first temperature controller for assimilating the interior of the first chamber to the first temperature condition;
The test tray that circulates along the first circulation path by the multiple transporters or circulates along the second circulation path is accommodated inside, and the second temperature condition is set. And a second chamber provided for assimilating the semiconductor elements loaded on the test tray to a temperature corresponding to the second temperature condition,
At least one second temperature controller for assimilating the interior of the second chamber to the second temperature condition;
The semiconductor device mounted on the test tray, which is disposed between the first chamber and the second chamber on the first circulation path and the second circulation path and is housed inside, is tested. A test chamber provided to assist;
At least one third temperature controller for assimilating the interior of the test chamber to a test temperature condition;
The test tray that circulates along the second circulation path is disposed on a section for conveying the test tray from the first chamber to the second chamber, and accommodates the test tray carried out from the first chamber. An auxiliary chamber,
A controller for controlling the plurality of transporters so that the test tray circulates along the first circulation path or the second circulation path;
With
The first circulation path has a section in which the test tray passes through the inside of the first chamber, the inside of the test chamber, and the inside of the second chamber in this order,
The second circulation path has a section in which the test tray passes through the inside of the first chamber, the inside of the auxiliary chamber, and the inside of the second chamber in this order.
Handler for semiconductor device test.   The first temperature condition and the second temperature condition are respectively changed according to the setting, and the first temperature condition and the second temperature condition are different from each other, and the first circulation path and the second temperature condition are different from each other. 2. The semiconductor device test handler according to claim 1, wherein the circulation paths of the test trays have different transport directions in at least a part of the sections. A test tray that circulates along the first circulation path according to the test temperature condition or circulates along the second circulation path and is loaded with semiconductor elements;
The semiconductor element to be tested is moved from the customer tray to the test tray at the first position or the second position according to the test temperature condition, or the tested semiconductor element is moved to the first position or the second position. An element moving part for classifying the test tray from the test tray at the position and moving it to the customer tray,
A plurality of test trays loaded with semiconductor elements to be tested according to the operation of the element moving part are circulated along the first circulation path, or are circulated along the second circulation path. A transporter;
The test tray that circulates along the first circulation path by the multiple conveyors or circulates along the second circulation path is accommodated inside, and the first temperature condition is set. In response, a first chamber provided for assimilating the semiconductor elements loaded on the test tray to a temperature corresponding to the first temperature condition;
At least one first temperature controller for assimilating the interior of the first chamber to the first temperature condition;
The test tray that circulates along the first circulation path by the multiple transporters or circulates along the second circulation path is accommodated inside, and the second temperature condition is set. And a second chamber provided for assimilating the semiconductor elements loaded on the test tray to a temperature corresponding to the second temperature condition,
At least one second temperature controller for assimilating the interior of the second chamber to the second temperature condition;
The semiconductor device mounted on the test tray, which is disposed between the first chamber and the second chamber on the first circulation path and the second circulation path and is housed inside, is tested. A test chamber provided to assist;
At least one third temperature controller for assimilating the interior of the test chamber to a test temperature condition;
A controller for controlling the plurality of transporters so that the test tray circulates along the first circulation path or the second circulation path;
With
Each of the plurality of transporters selectively moves the test tray in the transport direction along the first circulation path or the transport direction along the second circulation path according to the control of the controller. Configured,
The first position and the second position are selectively switched to a carry-in position or a carry-out position according to a test temperature condition,
The test tray circulation direction along the first circulation path and the test tray circulation direction along the second circulation path are opposite to each other.
Handler for semiconductor device test.   The element moving part carries in a semiconductor element to the test tray at the first position or takes out a semiconductor element from the test tray at the first position according to a test temperature condition. A second semiconductor device and a second semiconductor device for loading a semiconductor device into the test tray at the second position or a second semiconductor device from the test tray at the second position according to a test temperature condition. And when the control unit controls the semiconductor device to be loaded into the test tray at the first position, the second mobile unit When controlling to carry out semiconductor elements from the test tray at the second position, and controlling the second mobile unit to carry semiconductor elements into the test tray at the second position Is Serial first translator semiconductor device handler for testing according to claim 3, wherein the controller controls so as to carry the semiconductor device from the test tray in the first position.

Images