CN112325920B - Sensor chip calibration test scheduling method and system - Google Patents
Sensor chip calibration test scheduling method and system Download PDFInfo
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- CN112325920B CN112325920B CN202011231388.8A CN202011231388A CN112325920B CN 112325920 B CN112325920 B CN 112325920B CN 202011231388 A CN202011231388 A CN 202011231388A CN 112325920 B CN112325920 B CN 112325920B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D18/00—Testing or calibrating apparatus or arrangements provided for in groups G01D1/00 - G01D15/00
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
- G05B19/41865—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Abstract
The embodiment of the application discloses a sensor chip calibration test scheduling method and system, which are used for scheduling chip carrier plates of a plurality of sensors on a sensor calibration line to simultaneously perform calibration test in a plurality of chip test areas, and comprise the following steps: and determining whether the calibration test of the plurality of test areas is finished, whether the process temperature of the chip carrier plates of other non-test areas is ready, and whether the chip carrier plates are conveyed to the next temperature area or not and whether the chip carrier plates are conveyed to a certain temperature box of the next temperature area or not according to the judgment result. The scheduling system can ensure that the chip carrier plates stay in different temperature boxes of different temperature areas according to use requirements and execute process actions, and the stay time and the position information of each chip carrier plate can be controlled and checked in real time. And meanwhile, a plurality of chips are calibrated, so that the production efficiency of the calibration line is improved, and the redundancy of the number of chip carrier plates of the whole line is reduced.
Description
Technical Field
The embodiment of the application relates to the technical field of sensor chip calibration, in particular to a method and a system for calibrating, testing and scheduling a sensor chip.
Background
The automatic calibration line of the sensor chip is an important device in a sensor production line. The device is a batch online automatic calibration line, comprises a plurality of test temperature areas and a set of transmission mechanism penetrating through the whole line, and can be used for online calibration of sensor chips. One test temperature zone can simultaneously calibrate all chips on one chip carrier, and usually 64 chips are arranged on one chip carrier.
In order to improve the efficiency of the on-line automatic calibration of the sensor chip, the calibration test is usually performed simultaneously in four test temperature zones of the calibration line device. One chip calibration operation refers to that the chip carrier plate reaches a certain temperature according to the process requirements, calibration test is carried out under a specific environment such as pressure, and four chip calibration operations are carried out at the same time, namely four test temperature areas on the calibration line are used for calibrating the chips on the four chip carrier plates at the same time. However, in this case, when the chip carrier finishes the test in a certain temperature zone and enters the next temperature zone, if the temperature difference between the chip carrier and the next temperature zone is too large, condensation or thermal expansion and contraction may occur to damage the chip and the hardware structure; if too long temperature transition intervals are arranged among the test temperature zones, the production efficiency of the calibration line is reduced, and the quantity redundancy of the chip carrier plates of the whole line is improved.
Disclosure of Invention
Therefore, the embodiment of the application provides a method and a system for scheduling calibration tests of a sensor chip, so that a plurality of chip carrier boards can be subjected to calibration tests in a plurality of test temperature areas simultaneously and efficiently.
In order to achieve the above object, the embodiments of the present application provide the following technical solutions:
according to a first aspect of the embodiments of the present application, a sensor chip calibration test scheduling method is provided, which is used for scheduling chip carrier boards of a plurality of sensors on a sensor calibration line to perform calibration tests on N chip test areas simultaneously, wherein the calibration line includes N-1 test temperature areas at different temperatures and 1 re-test area, the test temperature areas include a pre-temperature box, a test box, a buffer box and a transition box according to a process sequence, wherein a last test temperature area does not include the transition box, and the re-test area includes a cooling box, a write box and a re-test box according to a sequence; except for the preheating boxes of the temperature area, each box comprises a chip carrier plate position, and the preheating box of the temperature area comprises four chip carrier plate positions; wherein N is an integer greater than or equal to 2; the dispatching method for calibrating the sensor chip comprises the following steps:
step 1: when the chip carrier plates respectively stay at four positions of the preheating box of the testing temperature zone and the cooling box of the retesting zone, accumulate to reach a certain time and reach the process temperature, judging whether the whole calibration line is in an idle state or not and whether all actions are finished or not; if yes, performing step 2; otherwise, waiting for all the process positions to finish the actions until the whole calibration line is in an idle state;
step 2: judging whether the chip carrier plates stay in the test boxes of the test temperature areas and the retest boxes of the retest areas; if not, performing step 3; if yes, waiting for the test box of each temperature zone and the retest box of the retest zone to finish the calibration test, and leaving the chip carrier plate from the test box and the retest box;
and step 3: judging whether the chip carrier plates of the buffer boxes of the test temperature regions need to be stably restored to the normal temperature or not, if not, transferring the chip carrier plates of the buffer boxes of the test temperature regions to corresponding transition boxes, and then performing the step 5; if yes, directly performing the step 5, and then transferring the chip carrier plates of the buffer boxes of the temperature areas to corresponding transition boxes;
and 4, step 4: judging whether the chip carrier plate needs two process cooling time units when leaving the high-temperature area, if not, transferring the chip carrier plate of the buffer box of the high-temperature area to a re-testing area cooling box, then performing the step 6, if so, directly performing the step 6, and then transferring the chip carrier plate of the buffer box of the high-temperature area to the re-testing area cooling box;
and 5: enabling the chip carrier plate of the test temperature zone preheating box close to the test box to enter the test box, enabling the chip carrier plate of the corresponding upstream temperature zone transition box to enter the first position of the preheating box of the temperature zone, and enabling other chip carrier plates in the preheating box to be shifted to a downstream direction in the preheating box;
step 6: transferring the chip carrier plates of the cooling box and the writing box of the retest area to a position in the downstream direction, and respectively entering the writing box and the retest box of the retest area;
and 7: chip carrier plates of the preheating box and the transition box of each testing temperature area, the cooling box of the retest area and the writing box stay at the current positions, and the accumulated process temperature time is timed; and the test boxes of the test temperature areas and the retest boxes of the retest areas perform calibration test on the chip carrier plates in the boxes.
Optionally, the calibration line includes three temperature zones connected in sequence, wherein the first temperature zone includes a low-temperature preheating box, a low-temperature testing box, a low-temperature buffering box and a transition box, the second temperature zone includes a normal-temperature preheating box, a normal-temperature testing box, a normal-temperature buffering box and a transition box, the third temperature zone includes a high-temperature preheating box, a high-temperature testing box and a high-temperature buffering box, and the retesting zone includes a cooling box, a writing box and a retesting box.
Optionally, the time that the chip carrier stays at a certain position within the beat time is a difference between the beat time and the action time, and the difference is unit time; the chip carrier plate stays in a test box and a buffer box of a certain test temperature zone for one unit time; the action time is a time combination of the step 3 and the step 4, and the beat time is a period triggered by the actions of the step 3 and the step 4 according to a set period.
Optionally, the step 7 of accumulated process temperature time timing comprises: the retention time of the chip carrier plate in the temperature zone preheating box for reaching the process temperature required by the test box in a certain temperature zone is four unit times; the chip carrier plate is used for reaching the process temperature required by the preheating box of the next temperature zone, and the retention time of the transition box in the temperature zone is one unit time; the chip carrier plate has two unit times of stay time of the cooling box and the writing box in the retest area for reaching the process temperature required by the retest box in the retest area.
Optionally, in step 3, it is determined whether the temperature of the chip carrier needs to be stably recovered when the chip carrier leaves a certain temperature region; if so, enabling the chip carrier plate to stay in a transition box at the tail of the temperature area for a unit time, and slowly recovering the temperature to the normal temperature; if not, the chip carrier plate only temporarily stays in the transition box of the temperature zone and then enters the next temperature zone;
in step 4, judging whether the chip carrier needs two process cooling times per unit time when leaving the high temperature area; if so, enabling the chip carrier plate to stay for a unit time in the temperature reduction box of the retest area, and then stay for a unit time in the write-in box; if not, the chip carrier plate is made to stay in the cooling box for a short time, and stays in the writing box for only one unit time, and then enters the retesting box.
Optionally, the method further comprises: and adjusting the whole line beat time and whether the chip carrier plates stay at each process position on line, and checking the real-time position information and the real-time test information of each chip carrier plate on line.
According to a second aspect of the embodiments of the present application, a sensor chip calibration test scheduling system is provided, which is used for performing calibration tests on chip carrier boards of a plurality of sensors on a sensor calibration line at the same time in N chip test areas, wherein the sensor calibration line includes N-1 temperature areas, 1 retest area and a transmission mechanism running through the whole line, which are sequentially connected, the N-1 temperature areas are three temperature areas at low, normal and high different temperatures, each temperature area includes a pre-temperature box, a test box, a buffer box and a transition box, and the high temperature area does not include a transition box; the retest area comprises a cooling box, a writing box and a retest box; the calibration test comprises the steps that a transmission mechanism sequentially transfers each chip carrier plate to a preheating box and a test box of each temperature area, calibration test is carried out, then the chip carrier plates enter a buffer box and a transition box, and finally the chip carrier plates are transferred to a cooling box, a writing box and a retest box of a retest area, all calibration tests are completed, wherein N is an integer greater than or equal to 2, and the system comprises:
the device comprises a judging module and a control module for driving a transmission mechanism;
when the whole line beat time is reached, the judging module judges whether the chip carrier plate of each temperature zone testing box finishes the calibration test or not; if not, the control module does not drive the transmission mechanism to carry out transfer operation on the chip carrier plate; if yes, the judging module further judges whether the chip carrier plate of the temperature zone testing box is transferred to the corresponding buffer box; if not, the control module does not drive the transmission mechanism to carry out transfer operation on the chip carrier plate; if so, the judging module further judges whether the chip carrier plate of the buffer box of each temperature zone needs to be stably recovered to the normal temperature before entering the next temperature zone; if not, the control module drives the transmission mechanism to transfer the chip carrier plate of the temperature zone buffer box to the corresponding transition box, and transfers the chip carrier plate and the chip carrier plate of the next temperature zone preheating box together to a position in the downstream direction, so that the chip carrier plate at the last position of the next temperature zone preheating box enters the corresponding test box; if the temperature zone buffer box is in the transition box, the control module drives the transmission mechanism to transfer the chip carrier plate of the temperature zone buffer box to the corresponding transition box, and the chip carrier plate stays in the transition box for one unit time. When the whole line beat time is reached, the judging module also judges whether the chip carrier plate of the retest box in the retest area has finished the calibration test and transfers the chip carrier plate to the discharging basket tool; if not, the control module does not drive the transmission mechanism to carry out transfer operation on the chip carrier plate; if so, the judging module further judges whether the chip carrier plate of the cooling box reaches the process temperature required by the retest box after a unit time; if not, the control module drives the transmission mechanism to transfer the chip carrier plate of the cooling box to the writing box and enables the chip carrier plate to stay in the writing box for one unit time; if so, the control module drives the transmission mechanism to transfer the chip carrier plate of the cooling box to the writing box, and the chip carrier plate is transferred to the retesting box after the chip carrier plate is temporarily stopped in the writing box.
Optionally, if the whole line beat time reaches, the determining module determines whether the chip carrier board of each temperature zone test box has completed the calibration test and transfers the chip carrier board to the corresponding buffer box; if so, the judging module further judges whether the current process temperature of the chip carrier plate of the buffer box of each temperature zone is lower than the admission temperature threshold of the next temperature zone; if the judgment result is that the temperature is lower than the entering temperature threshold of the next temperature zone, the control module drives the transmission mechanism to transfer the chip carrier plate of the buffer box to the corresponding transition box and enable the chip carrier plate to stay in the transition box for one unit time; and if the judgment result is that the chip carrier plate is not lower than the admission temperature threshold of the next temperature zone, the control module drives the transmission mechanism to transfer the chip carrier plate of the buffer box to the transition box, and the chip carrier plate is transferred to the preheating box of the next temperature zone after the transition box is temporarily stopped. When the whole line beat time reaches, the judging module also judges whether the chip carrier plate in the retest area of the retest box completes the calibration test and transfers the chip carrier plate to the discharging basket tool; if yes, the judging module further judges whether the chip carrier plate of the cooling box in the retest area is higher than the admission temperature threshold value of the retest box after one unit time; if the temperature is higher than the access temperature threshold value, the control module drives the transmission mechanism to transfer the chip carrier plate of the cooling box to the writing box and enables the chip carrier plate to stay in the writing box for one unit time; and if the temperature of the chip carrier plate is not higher than the access temperature threshold value, the control module drives the transmission mechanism to transfer the chip carrier plate of the cooling box in the retest area to the write-in box, and the chip carrier plate is transferred to the retest box after the write-in box makes a short stay. The admissible temperature threshold is a temperature range of the carrier plate allowed by the test area when the chip carrier plate enters a certain test area, and in the temperature range, the chip carrier plate cannot damage the chip carrier plate or the test area environment due to the temperature difference between the chip carrier plate and the test area.
Optionally, the allowable temperature threshold includes a difference between a workpiece temperature of the chip carrier and an ambient temperature of each box when the chip carrier enters the normal-temperature-region preheating box from the low-temperature-region transition box, enters the high-temperature-region preheating box from the normal-temperature-region transition box, and enters the retest box from the retest-region writing box.
Optionally, the method further comprises: the adjusting module is used for adjusting the beat time of the whole line and whether the chip carrier plate stays at each process position on line; and the checking module is used for checking the real-time position information and the real-time test information of each chip carrier plate on line.
According to a third aspect of embodiments herein, there is provided an apparatus comprising: the device comprises a data acquisition device, a processor and a memory; the data acquisition device is used for acquiring data; the memory is to store one or more program instructions; the processor is configured to execute one or more program instructions to perform the method of any of the first aspect.
According to a fourth aspect of embodiments herein, there is provided a computer-readable storage medium having one or more program instructions embodied therein for performing the method of any of the first aspects.
To sum up, the embodiment of the present application provides a method and a system for scheduling calibration tests of sensor chips, which are used for scheduling chip carriers of a plurality of sensors on a sensor calibration line to perform calibration tests in a plurality of chip test areas simultaneously, and the method includes: and determining whether the calibration test of the plurality of test areas is finished, whether the process temperature of the chip carrier plates of other non-test areas is ready, and whether the chip carrier plates are conveyed to the next temperature area or not and whether the chip carrier plates are conveyed to a certain temperature box of the next temperature area or not according to the judgment result. The scheduling system can ensure that the chip carrier plates stay in different temperature boxes of different temperature areas according to use requirements and execute process actions, and the stay time and the position information of each chip carrier plate can be controlled and checked in real time. And meanwhile, a plurality of chips are calibrated, so that the production efficiency of the calibration line is improved, and the redundancy of the number of chip carrier plates of the whole line is reduced. In addition, when the chip carrier plate finishes the test of a certain temperature zone and enters the next temperature zone, the damage to the chip and a hardware mechanism caused by condensation or expansion with heat and contraction with cold due to overlarge temperature difference between the chip carrier plate and the next temperature zone can be avoided.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It should be apparent that the drawings in the following description are merely exemplary, and that other embodiments can be derived from the drawings provided by those of ordinary skill in the art without inventive effort.
The structures, ratios, sizes, and the like shown in the present specification are only used for matching with the contents disclosed in the specification, so that those skilled in the art can understand and read the present invention, and do not limit the conditions for implementing the present invention, so that the present invention has no technical significance, and any structural modifications, changes in the ratio relationship, or adjustments of the sizes, without affecting the functions and purposes of the present invention, should still fall within the scope of the present invention.
Fig. 1 is a schematic diagram of a sensor chip calibration line device according to an embodiment of the present disclosure;
fig. 2 is a flowchart of a sensor chip calibration test scheduling method according to an embodiment of the present disclosure;
fig. 3 is a schematic diagram of an embodiment of a sensor chip calibration test scheduling method according to an embodiment of the present application;
fig. 4 is a schematic diagram of a second embodiment of a scheduling method for calibration testing of a sensor chip according to the present application;
fig. 5 is a block diagram of a calibration test scheduling system for a sensor chip according to an embodiment of the present disclosure.
Detailed Description
The present invention is described in terms of particular embodiments, other advantages and features of the invention will become apparent to those skilled in the art from the following disclosure, and it is to be understood that the described embodiments are merely exemplary of the invention and that it is not intended to limit the invention to the particular embodiments disclosed. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The scheduling method for calibrating the sensor chip provided by the embodiment of the application is applied to the sensor chip calibration line equipment, the chip carrier plate used for dispatching a plurality of sensors on the sensor calibration line simultaneously performs calibration test in four chip test areas, the chip calibration line equipment comprises N testing temperature areas and 1 transmission mechanism, wherein the N testing temperature areas are N-1 temperature areas at different temperatures and 1 retest area at normal temperature, each temperature zone of the N-1 temperature zones comprises a preheating box, a test box, a buffer box and a transition box (the last temperature zone does not comprise the transition box), the 1 retest area comprises a cooling box, a writing box and a retest box, each box comprises a chip carrier plate position except the preheating box of the temperature area, and the preheating box of the temperature area comprises four chip carrier plate positions.
Fig. 1 is a schematic diagram of a sensor chip calibration line device according to an embodiment of the present application. As shown in fig. 1, in this embodiment, the sensor chip calibration line apparatus includes a loading unit 1, four testing temperature zones 2-1, 2-2, 2-3, and 2-4, a conveying mechanism 3, and an unloading unit 4. Wherein the test temperature zone 2-1 comprises a low-temperature preheating box, a low-temperature test box, a low-temperature buffer box and a low-temperature transition box; the test temperature zone 2-2 comprises a normal temperature preheating box, a normal temperature test box, a normal temperature buffer box and a normal temperature transition box; the test temperature zone 2-3 comprises a high-temperature preheating box, a high-temperature test box and a high-temperature buffer box; the test temperature zone 2-4 comprises a cooling box, a writing box and a retesting box.
The chip carrier plate in the embodiment of the application can contain 64 chips with the size of 5mm multiplied by 5mm, the material is PCB, and the chip distance is 10 mm. The calibration test process of each chip carrier plate can comprise the following steps:
firstly, manually putting the chip carrier plate basket into a loading unit to load the chip carrier plate. After loading, the chip carrier plate is transferred to the low-temperature-region preheating box by the conveying mechanism and stays in the low-temperature-region preheating box for a certain time, so that the temperature of the chip carrier plate reaches the process temperature required by the test box. And then transferring the chip carrier plate to a low-temperature test box by the transmission mechanism, starting low-temperature calibration test, and transferring the chip carrier plate to a low-temperature buffer box by the transmission mechanism after the test is finished. And then, the chip carrier plate is transferred to the low-temperature transition box by the transmission mechanism and stays in the low-temperature transition box for a certain time, so that the temperature of the chip carrier plate reaches the temperature required by the normal-temperature preheating box. And repeating the calibration test process of the low-temperature region in the normal-temperature test region and the high-temperature test region. After the calibration test of the high-temperature test box is completed on the chip carrier plate, the chip carrier plate is transferred to the cooling box of the retest area by the transmission mechanism, and stays in the cooling box and the writing box for a certain time, so that the temperature of the chip carrier plate reaches the process temperature required by the retest box, and then all the calibration tests are completed in the retest box. And after the calibration test of the retest box is completed, the chip carrier plate is transferred to the unloading unit by the transmission mechanism, and the whole calibration test process is finished.
The calibration test process of the chip carrier provided by the embodiment of the application comprises the following steps: each chip carrier plate stays at four positions of the preheating box of each test temperature area for a certain time in sequence according to the process sequence, and the chip carrier plates reach the process temperature; after the process temperature is reached, the test box enters a corresponding test box for calibration test; after the test is finished, the chip carrier plate enters a corresponding buffer box to wait, and when the corresponding transition box is idle, the chip carrier plate enters the transition box to stay for a set time and is enabled to reach the process temperature; respectively executing the steps in N-1 test temperature areas according to the use requirement; and after the test is finished in the last test temperature area, entering a cooling box of the retest area for a set time, enabling the temperature to reach the process temperature, and finally finishing the final calibration test in the retest box of the retest area.
Fig. 2 is a flowchart of a sensor chip calibration test scheduling method provided in an embodiment of the present application, which specifically includes the following steps:
step 201: when the chip carrier plates respectively stay at four positions of the preheating box of the testing temperature zone and the cooling box of the retesting zone, accumulate to reach a certain time and reach the process temperature, judging whether the whole calibration line is in an idle state or not and whether all actions are finished or not; if yes, go to step 202; otherwise, waiting all the process positions to finish the actions until the whole calibration line is in an idle state.
Step 202: judging whether the chip carrier plates stay in the test boxes of the test temperature areas and the retest boxes of the retest areas; if not, go to step 203; if so, waiting for the test box of each temperature zone and the retest box of the retest zone to finish the calibration test, and leaving the chip carrier plate from the test box and the retest box.
Step 203: judging whether the chip carrier plates of the buffer boxes of each test temperature zone need to be stably restored to the normal temperature or not, if not, transferring the chip carrier plates of the buffer boxes of each temperature zone to corresponding transition boxes, and then performing step 205; if yes, go to step 205 directly, and then transfer the chip carrier boards of the buffer boxes of each temperature zone to the corresponding transition boxes.
Step 204: and judging whether the chip carrier plate needs two process cooling time units when leaving the high-temperature area, if not, transferring the chip carrier plate of the buffer box of the high-temperature area to a re-testing area cooling box, then performing step 206, if so, directly performing step 206, and then transferring the chip carrier plate of the buffer box of the high-temperature area to the re-testing area cooling box.
Step 205: the chip carrier plate of the test temperature zone preheating box close to the test box enters the test box, the chip carrier plate of the corresponding upstream temperature zone transition box enters the first position of the preheating box of the temperature zone, and other chip carrier plates in the preheating box are shifted to a position in the downstream direction in the preheating box.
Step 206: and transferring the chip carrier plates of the cooling box and the writing box of the retest area to a position in the downstream direction, and respectively entering the writing box and the retest box of the retest area.
Step 207: chip carrier plates of the preheating box and the transition box of each testing temperature area, the cooling box of the retest area and the writing box stay at the current positions, and the accumulated process temperature time is timed; and the test boxes of the test temperature areas and the retest boxes of the retest areas perform calibration test on the chip carrier plates in the boxes.
In a possible implementation manner, the calibration line comprises three temperature zones connected in sequence, wherein the first temperature zone comprises a low-temperature preheating box, a low-temperature testing box, a low-temperature buffer box and a transition box, the second temperature zone comprises a normal-temperature preheating box, a normal-temperature testing box, a normal-temperature buffer box and a transition box, the third temperature zone comprises a high-temperature preheating box, a high-temperature testing box and a high-temperature buffer box, and the retesting zone comprises a cooling box, a writing box and a retesting box.
In a possible implementation manner, the time that the chip carrier stays at a certain position within the beat time is the difference between the beat time and the action time, and the difference is unit time; the chip carrier plate stays in a test box and a buffer box of a certain test temperature zone for one unit time; the action time is a time sum of the step 203 and the step 204, and the beat time is a period triggered by the actions of the step 203 and the step 204 according to a set period.
In one possible embodiment, the accumulated process temperature time timer of step 207 comprises: the retention time of the chip carrier plate in the temperature zone preheating box for reaching the process temperature required by the test box in a certain temperature zone is four unit times; the chip carrier plate is used for reaching the process temperature required by the preheating box of the next temperature zone, and the retention time of the transition box in the temperature zone is one unit time; the chip carrier plate has two unit times of stay time of the cooling box and the writing box in the retest area for reaching the process temperature required by the retest box in the retest area.
In a possible implementation manner, in step 203, it is determined whether the temperature of the chip carrier needs to be stably recovered when the chip carrier leaves a certain temperature zone; if so, enabling the chip carrier plate to stay in a transition box at the tail of the temperature area for a unit time, and slowly recovering the temperature to the normal temperature; if not, the chip carrier plate only temporarily stays in the transition box of the temperature zone and then enters the next temperature zone;
in step 204, it is determined whether the chip carrier needs two process cooling times per unit time when leaving the high temperature region; if so, enabling the chip carrier plate to stay for a unit time in the temperature reduction box of the retest area, and then stay for a unit time in the write-in box; if not, the chip carrier plate is made to stay in the cooling box for a short time, and stays in the writing box for only one unit time, and then enters the retesting box.
In one possible embodiment, the method further comprises: and adjusting the whole line beat time and whether the chip carrier plates stay at each process position on line, and checking the real-time position information and the real-time test information of each chip carrier plate on line.
Fig. 3 is a flowchart of a scheduling method for calibrating and testing a sensor chip in the embodiment of the present application, and fig. 4 is a flowchart of another scheduling method for calibrating a sensor chip in the embodiment of the present application, which will be described in detail below with reference to the embodiment of the present application.
Step S1: when the chip carrier plate stays in the preheating box and the retest cooling box of each temperature zone and reaches the process temperature, judging whether a transmission mechanism of the whole calibration line is in an idle state, and whether the test boxes of each temperature zone and the retest cooling box of the retest zone complete the calibration test and transfer the corresponding next process position; if so, go to step S2; otherwise, waiting for the transmission mechanism of the whole calibration line to be in an idle state, completing the calibration test of the test box of each temperature area and the retest box of the retest area, and transferring the chip carrier plate to the corresponding next process position.
Because 23 process positions (excluding a loading unit and an unloading unit) are arranged in the sensor chip calibration line equipment, each chip carrier plate must sequentially pass through each process position, and in order to avoid temperature leakage between different temperature zones as much as possible, only two to five adjacent chip carrier plates are allowed to simultaneously move between at most two boxes with different temperatures, so that at least three process positions are free and used as buffer positions for chip carrier plate transfer according to the layout of each test temperature zone and each box. Meanwhile, a certain chip carrier needs to stay at a certain process position for a certain time to adjust the temperature of the chip carrier, and the chip carrier cannot be moved in the period, so that other chip carriers cannot be moved when the chip carrier stays, and therefore, all chip carrier transfer actions of the whole line must be coordinated to be performed in a uniform takt time. When a chip carrier plate of a test box in a certain temperature area is tested, the corresponding buffer box is always in an idle state; and when the test is finished, transferring the chip carrier plates to the corresponding buffer boxes, waiting for the whole line to be in an idle state, and waiting for starting the chip carrier plate transfer of each process position by taking the state at the moment as an initial state.
And judging whether the chip carrier plate of the buffer box of a certain temperature zone directly enters the preheating zone of the next temperature zone or the chip carrier plate of the cooling box of the re-measurement zone directly enters the re-measurement box, and whether the conditions of dewing, expansion due to heat, contraction due to cold and the like caused by temperature difference damage the hardware structure of the chip carrier plate or the equipment. If so, transferring the chip carrier plate of the temperature zone buffer box to a corresponding transition box, enabling the chip carrier plate to stay in the transition box for one beat period, stably recovering the temperature to the normal temperature, and transferring the chip carrier plate to a preheating box of the next temperature zone in the next beat period; and transferring the chip carrier plate of the cooling box in the retest area to a writing box, enabling the chip carrier plate to stay in the writing box for one beat period, stably recovering the temperature to the normal temperature, and transferring the chip carrier plate to the retest box in the next beat period.
In this step, it is determined whether the temperature of the chip carrier in the temperature zone buffer box reaches the allowable temperature threshold of the next temperature zone preheating box. If the temperature reaches the admission temperature threshold value, transferring the chip to a corresponding transition box, and after the chip is temporarily stopped, transferring a process position to the downstream side together with the chip carrier plate of the preheating box of the next temperature zone; a chip carrier plate at the outlet of the preheating box of the next temperature zone enters a corresponding test box, a chip carrier plate of a transition box of the temperature zone and three chip carrier plates in the inlet direction of the preheating box of the next temperature zone together enter four process positions of the preheating box; in this case, the chip carrier directly enters the temperature environment of the next temperature zone from the temperature environment of the current temperature zone. If the allowable temperature threshold value is not reached, transferring four chip carrier plates in the preheating box of the next temperature zone to a process position in the downstream direction, namely, transferring one chip carrier plate at the outlet of the preheating box into a corresponding test box, and transferring one process position of three chip carrier plates in the inlet direction of the preheating box to the outlet direction, and then transferring the chip carrier plate of the buffer box of the temperature zone to the transition box of the temperature zone so as to enable the chip carrier plate to stay in the transition box for one beat period; under the condition, after leaving the temperature area, the chip carrier plate is firstly stably restored to the normal temperature in the transition box, and then enters the temperature environment of the next temperature area.
In this step, it is also determined whether the temperature of the chip carrier in the review area cooling box reaches the access temperature threshold of the review box. If the access temperature threshold is reached, transferring the data to a writing box, and transferring the data to a retesting box after short stay; in this case, the temperature of the chip carrier is reduced from the high temperature only after the time of one cycle of the temperature reduction box from the high temperature region. If the admission temperature threshold value is not reached, transferring the data to a writing box, and enabling the data to stay in the writing box for one beat period; in this case, the temperature of the chip carrier is lowered from a high temperature to a normal temperature after leaving the high temperature zone and in the cooling box and the writing box for a total of two clock cycles.
By the scheduling method for the calibration test of the chip carrier plate, the calibration operation of four chips can be simultaneously carried out, namely the four test temperature areas on the calibration line simultaneously calibrate the chips on the four chip carrier plates, so that the production efficiency of the calibration line is improved, and the redundancy of the number of the chip carrier plates of the whole line is reduced. In addition, the embodiment of the application can also ensure that when the chip carrier finishes the test of a certain temperature zone and enters the next temperature zone, the phenomenon that the chip and a hardware mechanism are damaged due to condensation or expansion with heat and contraction with cold caused by overlarge temperature difference between the chip carrier and the next temperature zone is avoided.
To sum up, the embodiment of the present application provides a sensor chip calibration test scheduling method, which is used for scheduling chip carriers of a plurality of sensors on a sensor calibration line to perform calibration tests in a plurality of chip test areas simultaneously, and includes: and determining whether the calibration test of the plurality of test areas is finished, whether the process temperature of the chip carrier plates of other non-test areas is ready, and whether the chip carrier plates are conveyed to the next temperature area or not and whether the chip carrier plates are conveyed to a certain temperature box of the next temperature area or not according to the judgment result. The scheduling system can ensure that the chip carrier plates stay in different temperature boxes of different temperature areas according to use requirements and execute process actions, and the stay time and the position information of each chip carrier plate can be controlled and checked in real time. And meanwhile, a plurality of chips are calibrated, so that the production efficiency of the calibration line is improved, and the redundancy of the number of chip carrier plates of the whole line is reduced. In addition, when the chip carrier plate finishes the test of a certain temperature zone and enters the next temperature zone, the damage to the chip and a hardware mechanism caused by condensation or expansion with heat and contraction with cold due to overlarge temperature difference between the chip carrier plate and the next temperature zone can be avoided.
Based on the same technical concept, the embodiment of the present application further provides a sensor chip calibration test scheduling system, as shown in fig. 5, the scheduling system includes a determining module 501 and a control module 502. The determining module 501 performs determination on each of the above conditions, and the control module 502 drives the transmission mechanism to operate.
The dispatching system is used for dispatching chip carrier plates of a plurality of sensors on a sensor calibration line to simultaneously carry out calibration test in N chip test areas, the sensor calibration line comprises N-1 temperature areas, 1 retest area and a transmission mechanism which penetrates through the whole line, the N-1 temperature areas are sequentially connected, the temperature areas are low, normal and high temperature areas, the temperature areas are different, each temperature area comprises a preheating box, a test box, a buffer box and a transition box, and the high temperature area does not comprise a transition box; the retest area comprises a cooling box, a writing box and a retest box; the calibration test comprises the steps that the chip carrier plates are sequentially transferred to a preheating box and a test box of each temperature area by a transmission mechanism, calibration test is carried out, then the chip carrier plates enter a buffer box and a transition box, and finally the chip carrier plates are transferred to a cooling box, a writing box and a retest box of a retest area, and all calibration test is completed, wherein N is an integer larger than or equal to 2.
When the whole line beat time arrives, the determining module 501 determines whether the chip carrier board of each temperature zone test box has completed the calibration test; if not, the control module 502 does not drive the transmission mechanism to perform the transfer operation on the chip carrier; if yes, the determining module 501 further determines whether the chip carrier board of the temperature zone testing box has been transferred to the corresponding buffer box; if not, the control module 502 does not drive the transmission mechanism to perform the transfer operation on the chip carrier; if yes, the determining module 501 further determines whether the chip carrier of the buffer box of each temperature zone needs to be stably returned to normal temperature before entering the next temperature zone; if not, the control module 502 drives the transmission mechanism to transfer the chip carrier plate of the temperature zone buffer box to the corresponding transition box, and transfers the chip carrier plate and the chip carrier plate of the next temperature zone preheating box together to a position in the downstream direction, so that the chip carrier plate at the last position of the next temperature zone preheating box enters the corresponding test box; if yes, the control module 502 drives the transfer mechanism to transfer the chip carrier plate of the temperature zone buffer box to the corresponding transition box, and the chip carrier plate stays in the transition box for one unit time. When the whole line beat time arrives, the determining module 501 further determines whether the chip carrier of the retest box in the retest area has completed the calibration test and transfers the chip carrier to the discharging basket; if not, the control module 502 does not drive the transmission mechanism to perform the transfer operation on the chip carrier; if yes, the determining module 501 further determines whether the chip carrier of the cooling box reaches the process temperature required by the retest box after a unit time; if not, the control module 502 drives the transmission mechanism to transfer the chip carrier plate of the cooling box to the writing box, and the chip carrier plate is made to stay in the writing box for a unit time; if so, the control module 502 drives the transmission mechanism to transfer the chip carrier plate of the cooling box to the writing box, and the chip carrier plate is transferred to the testing box after the writing box makes a short stop.
In a possible implementation manner, if the time of the whole line beat reaches, the determining module 501 determines whether the chip carrier of each temperature zone test box has completed the calibration test and transfers the chip carrier to the corresponding buffer box; if yes, the determining module 501 further determines whether the current process temperature of the chip carrier of the buffer box of each temperature zone is lower than the admissible temperature threshold of the next temperature zone; if the determination result is that the temperature is lower than the entering temperature threshold of the next temperature zone, the control module 502 drives the transmission mechanism to transfer the chip carrier plate of the buffer box to the corresponding transition box, and the chip carrier plate stays in the transition box for a unit time; if the judgment result is that the temperature is not lower than the admission temperature threshold of the next temperature zone, the control module 502 drives the transmission mechanism to transfer the chip carrier plate of the buffer box to the transition box, and the chip carrier plate is transferred to the preheating box of the next temperature zone after the transition box is temporarily stopped. When the whole line beat time reaches, the judging module 501 also judges whether the chip carrier plate in the retest area of the retest box has completed the calibration test and transfers the chip carrier plate to the discharging basket; if yes, the determining module 501 further determines whether the chip carrier of the cooling box in the retest area is higher than the allowable temperature threshold of the retest box after a unit time; if the temperature is higher than the access temperature threshold, the control module 502 drives the transmission mechanism to transfer the chip carrier plate of the cooling box to the writing box, and the chip carrier plate stays in the writing box for a unit time; if the temperature is not higher than the access temperature threshold, the control module 502 drives the transmission mechanism to transfer the chip carrier of the cooling box in the retest area to the write-in box, and the chip carrier is transferred to the retest box after the write-in box makes a short stay. The admissible temperature threshold is a temperature range of the carrier plate allowed by the test area when the chip carrier plate enters a certain test area, and in the temperature range, the chip carrier plate cannot damage the chip carrier plate or the test area environment due to the temperature difference between the chip carrier plate and the test area.
In a possible embodiment, the allowable temperature threshold includes a difference between a workpiece temperature of the chip carrier itself and an ambient temperature of each box when the chip carrier enters the normal-temperature-region preheating box from the low-temperature-region transition box, enters the high-temperature-region preheating box from the normal-temperature-region transition box, and enters the retest box from the retest-region writing box.
In one possible embodiment, the system further comprises: the adjusting module is used for adjusting the beat time of the whole line and whether the chip carrier plate stays at each process position on line; and the checking module is used for checking the real-time position information and the real-time test information of each chip carrier plate on line.
Based on the same technical concept, an embodiment of the present application further provides an apparatus, including: the device comprises a data acquisition device, a processor and a memory; the data acquisition device is used for acquiring data; the memory is to store one or more program instructions; the processor is configured to execute one or more program instructions to perform the method.
Based on the same technical concept, the embodiment of the present application also provides a computer-readable storage medium, wherein the computer-readable storage medium contains one or more program instructions, and the one or more program instructions are used for executing the method.
In the present specification, each embodiment of the method is described in a progressive manner, and the same and similar parts among the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments. Reference is made to the description of the method embodiments.
It is noted that while the operations of the methods of the present invention are depicted in the drawings in a particular order, this is not a requirement or suggestion that the operations must be performed in this particular order or that all of the illustrated operations must be performed to achieve desirable results. Additionally or alternatively, certain steps may be omitted, multiple steps combined into one step execution, and/or one step broken down into multiple step executions.
Although the present application provides method steps as in embodiments or flowcharts, additional or fewer steps may be included based on conventional or non-inventive approaches. The order of steps recited in the embodiments is merely one manner of performing the steps in a multitude of orders and does not represent the only order of execution. When an apparatus or client product in practice executes, it may execute sequentially or in parallel (e.g., in a parallel processor or multithreaded processing environment, or even in a distributed data processing environment) according to the embodiments or methods shown in the figures. The terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, the presence of additional identical or equivalent elements in a process, method, article, or apparatus that comprises the recited elements is not excluded.
The units, devices, modules, etc. set forth in the above embodiments may be implemented by a computer chip or an entity, or by a product with certain functions. For convenience of description, the above devices are described as being divided into various modules by functions, and are described separately. Of course, in implementing the present application, the functions of each module may be implemented in one or more software and/or hardware, or a module implementing the same function may be implemented by a combination of a plurality of sub-modules or sub-units, and the like. The above-described embodiments of the apparatus are merely illustrative, and for example, the division of the units is only one logical division, and other divisions may be realized in practice, for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or units, and may be in an electrical, mechanical or other form.
Those skilled in the art will also appreciate that, in addition to implementing the controller as pure computer readable program code, the same functionality can be implemented by logically programming method steps such that the controller is in the form of logic gates, switches, application specific integrated circuits, programmable logic controllers, embedded microcontrollers and the like. Such a controller may therefore be considered as a hardware component, and the means included therein for performing the various functions may also be considered as a structure within the hardware component. Or even means for performing the functions may be regarded as being both a software module for performing the method and a structure within a hardware component.
The application may be described in the general context of computer-executable instructions, such as program modules, being executed by a computer. Generally, program modules include routines, programs, objects, components, data structures, classes, etc. that perform particular tasks or implement particular abstract data types. The application may also be practiced in distributed computing environments where tasks are performed by remote processing devices that are linked through a communications network. In a distributed computing environment, program modules may be located in both local and remote computer storage media including memory storage devices.
From the above description of the embodiments, it is clear to those skilled in the art that the present application can be implemented by software plus necessary general hardware platform. Based on such understanding, the technical solutions of the present application may be embodied in the form of a software product, which may be stored in a storage medium, such as a ROM/RAM, a magnetic disk, an optical disk, or the like, and includes several instructions for enabling a computer device (which may be a personal computer, a mobile terminal, a server, or a network device) to execute the method according to the embodiments or some parts of the embodiments of the present application.
The embodiments in the present specification are described in a progressive manner, and the same or similar parts among the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments. The application is operational with numerous general purpose or special purpose computing system environments or configurations. For example: personal computers, server computers, hand-held or portable devices, tablet-type devices, multiprocessor systems, microprocessor-based systems, set top boxes, programmable electronic devices, network PCs, minicomputers, mainframe computers, distributed computing environments that include any of the above systems or devices, and the like.
The above-mentioned embodiments are further described in detail for the purpose of illustrating the invention, and it should be understood that the above-mentioned embodiments are only illustrative of the present invention and are not intended to limit the scope of the present invention, and any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (9)
1. A calibration test scheduling method of a sensor chip is used for scheduling chip carrier plates of a plurality of sensors on a sensor calibration line to simultaneously carry out calibration test in N chip test areas, wherein the calibration line comprises N-1 test temperature areas at different temperatures and 1 retest area, the test temperature areas comprise a preheating box, a test box, a buffer box and a transition box according to the process sequence, the last test temperature area does not contain the transition box, and the retest area comprises a cooling box, a writing box and a retest box according to the sequence; except for the preheating boxes of the temperature area, each box comprises a chip carrier plate position, and the preheating box of the temperature area comprises four chip carrier plate positions; wherein N is an integer greater than or equal to 2; the sensor chip calibration scheduling method is characterized by comprising the following steps:
step 1: when the chip carrier plates respectively stay at four positions of the preheating box of the testing temperature zone and the cooling box of the retesting zone, accumulate to reach a certain time and reach the process temperature, judging whether the whole calibration line is in an idle state or not and whether all actions are finished or not; if yes, performing step 2; otherwise, waiting for all the process positions to finish the actions until the whole calibration line is in an idle state;
step 2: judging whether the chip carrier plates stay in the test boxes of the test temperature areas and the retest boxes of the retest areas; if not, performing step 3; if yes, waiting for the test box of each temperature zone and the retest box of the retest zone to finish the calibration test, and leaving the chip carrier plate from the test box and the retest box;
and step 3: judging whether the chip carrier plates of the buffer boxes of the test temperature regions need to be stably restored to the normal temperature or not, if not, transferring the chip carrier plates of the buffer boxes of the test temperature regions to corresponding transition boxes, and then performing the step 5; if yes, directly performing the step 5, and then transferring the chip carrier plates of the buffer boxes of the temperature areas to corresponding transition boxes;
and 4, step 4: judging whether the chip carrier plate needs two process cooling time units when leaving the high-temperature area, if not, transferring the chip carrier plate of the buffer box of the high-temperature area to a re-testing area cooling box, then performing the step 6, if so, directly performing the step 6, and then transferring the chip carrier plate of the buffer box of the high-temperature area to the re-testing area cooling box;
and 5: enabling the chip carrier plate of the test temperature zone preheating box close to the test box to enter the test box, enabling the chip carrier plate of the corresponding upstream temperature zone transition box to enter the first position of the preheating box of the temperature zone, and enabling other chip carrier plates in the preheating box to be shifted to a downstream direction in the preheating box;
step 6: transferring the chip carrier plates of the cooling box and the writing box of the retest area to a position in the downstream direction, and respectively entering the writing box and the retest box of the retest area;
and 7: chip carrier plates of the preheating box and the transition box of each testing temperature area, the cooling box of the retest area and the writing box stay at the current positions, and the accumulated process temperature time is timed; each test temperature zone test box and each retest zone retest box carry out calibration test on the chip carrier plates in the test temperature zones;
the stay time of the chip carrier plate at a certain position in the beat time is the difference value between the beat time and the action time, and the difference value is unit time; the chip carrier plate stays in a test box and a buffer box of a certain test temperature zone for one unit time; the action time is a time combination of the step 3 and the step 4, and the beat time is a period triggered by the actions of the step 3 and the step 4 according to a set period.
2. The method of claim 1, wherein the calibration line comprises three temperature zones connected in sequence, wherein the first temperature zone comprises a low-temperature preheating box, a low-temperature testing box, a low-temperature buffer box and a transition box, the second temperature zone comprises a normal-temperature preheating box, a normal-temperature testing box, a normal-temperature buffer box and a transition box, the third temperature zone comprises a high-temperature preheating box, a high-temperature testing box and a high-temperature buffer box, and the repeated testing zone comprises a cooling box, a writing box and a repeated testing box.
3. The method of claim 1, wherein said step 7 accumulated process temperature time timing comprises: the retention time of the chip carrier plate in the temperature zone preheating box for reaching the process temperature required by the test box in a certain temperature zone is four unit times; the chip carrier plate is used for reaching the process temperature required by the preheating box of the next temperature zone, and the retention time of the transition box in the temperature zone is one unit time; the chip carrier plate has two unit times of stay time of the cooling box and the writing box in the retest area for reaching the process temperature required by the retest box in the retest area.
4. The method according to claim 1, wherein in step 3, it is determined whether the temperature of the chip carrier board needs to be stably recovered when the chip carrier board leaves a certain temperature zone; if so, enabling the chip carrier plate to stay in a transition box at the tail of the temperature area for a unit time, and slowly recovering the temperature to the normal temperature; if not, the chip carrier plate only temporarily stays in the transition box of the temperature zone and then enters the next temperature zone;
in step 4, judging whether the chip carrier needs two process cooling times per unit time when leaving the high temperature area; if so, enabling the chip carrier plate to stay for a unit time in the temperature reduction box of the retest area, and then stay for a unit time in the write-in box; if not, the chip carrier plate is made to stay in the cooling box for a short time, and stays in the writing box for only one unit time, and then enters the retesting box.
5. The method of claim 4, wherein the method further comprises: and adjusting the whole line beat time and whether the chip carrier plates stay at each process position on line, and checking the real-time position information and the real-time test information of each chip carrier plate on line.
6. A sensor chip calibration test dispatching system is used for dispatching chip carrier plates of a plurality of sensors on a sensor calibration line to simultaneously perform calibration test in N chip test areas, wherein the sensor calibration line comprises N-1 temperature areas, 1 retest area and a transmission mechanism penetrating through the whole line which are sequentially connected, the N-1 temperature areas are low, normal and high temperature areas at different temperatures, each temperature area comprises a preheating box, a test box, a buffer box and a transition box, and the high temperature area does not comprise a transition box; the retest area comprises a cooling box, a writing box and a retest box; the calibration test comprises the steps that a transmission mechanism sequentially transfers each chip carrier plate to a preheating box and a test box of each temperature area, calibration test is carried out, then the chip carrier plates enter a buffer box and a transition box, and finally the chip carrier plates are transferred to a cooling box, a writing box and a retest box of a retest area, all calibration tests are completed, wherein N is an integer greater than or equal to 2, and the system is characterized by comprising:
the device comprises a judging module and a control module for driving a transmission mechanism;
when the whole line beat time is reached, the judging module judges whether the chip carrier plate of each temperature zone testing box finishes the calibration test or not; if not, the control module does not drive the transmission mechanism to carry out transfer operation on the chip carrier plate; if yes, the judging module further judges whether the chip carrier plate of the temperature zone testing box is transferred to the corresponding buffer box; if not, the control module does not drive the transmission mechanism to carry out transfer operation on the chip carrier plate; if so, the judging module further judges whether the chip carrier plate of the buffer box of each temperature zone needs to be stably recovered to the normal temperature before entering the next temperature zone; if not, the control module drives the transmission mechanism to transfer the chip carrier plate of the temperature zone buffer box to the corresponding transition box, and transfers the chip carrier plate and the chip carrier plate of the next temperature zone preheating box together to a position in the downstream direction, so that the chip carrier plate at the last position of the next temperature zone preheating box enters the corresponding test box; if so, the control module drives the transmission mechanism to transfer the chip carrier plate of the temperature zone buffer box to the corresponding transition box and enables the chip carrier plate to stay in the transition box for one unit time; when the whole line beat time is reached, the judging module also judges whether the chip carrier plate of the retest box in the retest area has finished the calibration test and transfers the chip carrier plate to the discharging basket tool; if not, the control module does not drive the transmission mechanism to carry out transfer operation on the chip carrier plate; if so, the judging module further judges whether the chip carrier plate of the cooling box reaches the process temperature required by the retest box after a unit time; if not, the control module drives the transmission mechanism to transfer the chip carrier plate of the cooling box to the writing box and enables the chip carrier plate to stay in the writing box for one unit time; if so, the control module drives the transmission mechanism to transfer the chip carrier plate of the cooling box to the writing box, and the chip carrier plate is transferred to the retesting box after the chip carrier plate is temporarily stopped in the writing box.
7. The system of claim 6, wherein if the whole line beat time is reached, the determining module determines whether the chip carrier board of each temperature zone test box has completed the calibration test and transfers to the corresponding buffer box; if so, the judging module further judges whether the current process temperature of the chip carrier plate of the buffer box of each temperature zone is lower than the admission temperature threshold of the next temperature zone; if the judgment result is that the temperature is lower than the entering temperature threshold of the next temperature zone, the control module drives the transmission mechanism to transfer the chip carrier plate of the buffer box to the corresponding transition box and enable the chip carrier plate to stay in the transition box for one unit time; if the judgment result is that the chip carrier plate is not lower than the admission temperature threshold of the next temperature zone, the control module drives the transmission mechanism to transfer the chip carrier plate of the buffer box to the transition box, and the chip carrier plate is transferred to the preheating box of the next temperature zone after the transient retention of the transition box; when the whole line beat time reaches, the judging module also judges whether the chip carrier plate in the retest area of the retest box completes the calibration test and transfers the chip carrier plate to the discharging basket tool; if yes, the judging module further judges whether the chip carrier plate of the cooling box in the retest area is higher than the admission temperature threshold value of the retest box after one unit time; if the temperature is higher than the access temperature threshold value, the control module drives the transmission mechanism to transfer the chip carrier plate of the cooling box to the writing box and enables the chip carrier plate to stay in the writing box for one unit time; if the temperature of the chip carrier plate is not higher than the access temperature threshold value, the control module drives the transmission mechanism to transfer the chip carrier plate of the cooling box in the retest area to the write-in box, and the chip carrier plate is transferred to the retest box after the write-in box makes a short stay; the admissible temperature threshold is a temperature range of the carrier plate allowed by the test area when the chip carrier plate enters a certain test area, and in the temperature range, the chip carrier plate cannot damage the chip carrier plate or the test area environment due to the temperature difference between the chip carrier plate and the test area.
8. The system of claim 7, wherein the admission temperature threshold comprises a difference between a workpiece temperature of the chip carrier itself and an ambient temperature of each chamber when the chip carrier enters the constant temperature zone pre-warming chamber from the low temperature zone transition chamber, enters the high temperature zone pre-warming chamber from the constant temperature zone transition chamber, and enters the re-testing chamber from the re-testing zone writing chamber.
9. The system of claim 7, further comprising: the adjusting module is used for adjusting the beat time of the whole line and whether the chip carrier plate stays at each process position on line; and the checking module is used for checking the real-time position information and the real-time test information of each chip carrier plate on line.
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