TWI679436B - Handler for testing electronic devices - Google Patents

Handler for testing electronic devices Download PDF

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Publication number
TWI679436B
TWI679436B TW107127838A TW107127838A TWI679436B TW I679436 B TWI679436 B TW I679436B TW 107127838 A TW107127838 A TW 107127838A TW 107127838 A TW107127838 A TW 107127838A TW I679436 B TWI679436 B TW I679436B
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Taiwan
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test
chamber
area
opening
door
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TW107127838A
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Chinese (zh)
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TW201920970A (en
Inventor
羅閏成
Yun Sung Na
朴洙昌
Su Chang Park
林采光
Chea Kwang Lim
金在虎
Jae Ho Kim
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南韓商泰克元有限公司
Techwing Co., Ltd.
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2855Environmental, reliability or burn-in testing
    • G01R31/286External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867Handlers or transport devices, e.g. loaders, carriers, trays
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2855Environmental, reliability or burn-in testing
    • G01R31/286External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2862Chambers or ovens; Tanks
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2855Environmental, reliability or burn-in testing
    • G01R31/286External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2868Complete testing stations; systems; procedures; software aspects
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2855Environmental, reliability or burn-in testing
    • G01R31/2872Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature

Abstract

本發明涉及用於測試電子元件的處理器。根據本發明的用於測試電子元件的處理器中,將從測試室傳送到除熱室的測試託盤的輸送通道分為第一區域和長度短於第一區域的第二區域,在打開第一區域之前,能夠使設置於第二輸送裝置的把持構件的把持部位預先通過第二區域移動到測試室以等待測試。根據本發明,由於能夠在結束測試時將測試託盤從測試傳送到除熱室,因此能夠縮短測試託盤的循環時間而最終提高處理器的運轉率。The invention relates to a processor for testing electronic components. In the processor for testing electronic components according to the present invention, the conveying channel of the test tray transferred from the test chamber to the heat removal chamber is divided into a first region and a second region shorter than the first region. Before the area, the holding part of the holding member provided in the second conveying device can be moved to the test room through the second area in advance to wait for the test. According to the present invention, since the test tray can be transferred from the test to the heat removal chamber at the end of the test, the cycle time of the test tray can be shortened and the operating rate of the processor can be finally improved.

Description

用於測試電子元件的處理器Processor for testing electronic components

發明領域 本發明涉及一種用於測試電子元件的處理器。FIELD OF THE INVENTION The present invention relates to a processor for testing electronic components.

發明背景 如所生產的半導體器件的電子元件由測試器測試,然後分為合格品和不合格品,並只出貨合格品。BACKGROUND OF THE INVENTION The electronic components of a semiconductor device, such as produced, are tested by a tester, and then divided into qualified and unqualified products, and only qualified products are shipped.

為了測試電子元件,需要將電子元件與測試器電連接,測試器與電子元件之間的電連接由用於測試電子元件的處理器(下面稱為“處理器”)執行。In order to test an electronic component, the electronic component needs to be electrically connected to a tester, and the electrical connection between the tester and the electronic component is performed by a processor (hereinafter referred to as a “processor”) for testing the electronic component.

處理器可以根據對電子元件的測試條件或電子元件的類型等以各種形式製造。在這種各種類型中,本發明涉及一種具有測試室的處理器,其可以建立對電子元件的測試環境。The processor may be manufactured in various forms according to test conditions for electronic components, types of electronic components, and the like. Among these various types, the present invention relates to a processor having a test chamber that can establish a test environment for electronic components.

具有測試室的處理器主要結構包括:加載裝置、恒溫室、測試室、第一輸送裝置、加壓裝置、除熱室、第二輸送裝置、卸載裝置以及開閉裝置。The main structure of the processor with a test chamber includes: a loading device, a constant temperature room, a test room, a first conveying device, a pressurizing device, a heat removing room, a second conveying device, an unloading device, and an opening and closing device.

加載裝置將裝於在客戶託盤中的待測電子元件加載到位於加載位置上的測試託盤中。The loading device loads the electronic component to be tested contained in the customer tray into a test tray located at the loading position.

提供恒溫室以對來自加載位置的裝載於測試託盤上的電子元件施加熱刺激。雖然也有將電子元件在室溫下進行測試的情況,但由於需要考慮極端惡劣環境,主要在高溫或低溫狀態下進行測試,為此,提供恒溫室,用於預先對待測電子元件施加熱刺激。A thermostatic chamber is provided to apply thermal stimulation to the electronic components loaded on the test tray from the loading position. Although there are cases where electronic components are tested at room temperature, due to the need to consider the extremely harsh environment, testing is mainly performed at high or low temperatures. For this reason, a constant temperature chamber is provided for applying thermal stimulation to the electronic components to be tested in advance.

測試室提供空間和溫度環境,用於測試經過恒溫室而到測試位置的溫度測試託盤上的電子元件。這種測試室中結合有測試器的測試板。作為參考,在測試板上具備與電子元件電連接的測試插座。The test chamber provides a space and temperature environment for testing electronic components on a temperature test tray that passes through the constant temperature chamber to the test location. A test board with a tester incorporated in such a test chamber. For reference, a test socket electrically connected to an electronic component is provided on the test board.

提供第一輸送裝置,用於將恒溫室中的測試託盤傳送至測試室。這種第一輸送裝置可以構成為韓國專利公開第10-2008-0082591號中公開的“託盤傳送裝置”。A first conveying device is provided for transferring the test tray in the thermostatic chamber to the test chamber. Such a first conveying device may be configured as a “pallet conveying device” disclosed in Korean Patent Publication No. 10-2008-0082591.

加壓裝置將測試室內的位於測試位置中的測試託盤上的電子元件向測試器的測試插座側施壓,使得電子元件能夠電連接到測試插座。The pressurizing device presses the electronic components on the test tray located in the test position in the test room to the test socket side of the tester, so that the electronic components can be electrically connected to the test socket.

提供除熱室,用於通過去除來自測試室的測試託盤的電子部件在恒溫室和測試室中被施加的熱刺激,使電子元件盡可能恢復至接近室溫。A heat removal chamber is provided for recovering the electronic components as close to room temperature as possible by removing the thermal stimulus applied to the electronic components from the test tray of the test chamber in the thermostatic chamber and the test chamber.

提供第二輸送裝置,用於將測試室中的測試託盤傳送到除熱室。同樣地,第二輸送裝置可以具有與韓國專利公開第10-2008-0082591號公開的“託盤傳送裝置”相同的結構。A second conveying device is provided for transferring the test tray in the test chamber to the heat removal chamber. Similarly, the second conveying device may have the same structure as the “pallet conveying device” disclosed in Korean Patent Publication No. 10-2008-0082591.

卸載裝置將從除熱室傳送到卸載位置的已結束測試的溫度測試託盤中的電子元件進行卸載,並根據測試結果進行分類,以將它們移動到空的客戶託盤上。The unloading device unloads the electronic components in the finished temperature test tray transferred from the heat removal chamber to the unloading position, and sorts them based on the test results to move them to the empty customer tray.

開閉裝置用於開閉從測試室傳送到除熱室的測試託盤所經過的第二輸送通道,並且本發明涉及這種情況。The opening and closing device is used to open and close the second conveying passage through which the test tray transferred from the test chamber to the heat removal chamber passes, and the present invention relates to this case.

眾所周知,具有上述結構的處理器中的測試託盤通過包括第一輸送裝置和第二輸送裝置的多個傳送裝置,沿著經過加載位置、恒溫室的內部、測試室內部中的測試位置、除熱室的內部以及卸載位置並連接到加載位置的封閉的循環路徑而進行傳送。As is well known, the test tray in the processor having the above structure passes the loading position, the inside of the constant temperature chamber, the test position in the test chamber, and the heat removal through a plurality of conveying devices including a first conveying device and a second conveying device. The inside of the chamber and the closed loop path connected to the unloading position and the loading position are transferred.

通常,恒溫室具有根據測試溫度條件而預熱/預冷電子元件的溫度環境,而這種溫度環境類似於測試室內的溫度環境。因此,恒溫室內的溫度環境對測試室內的溫度環境幾乎沒有影響。由此,可以打開從恒溫室傳送到測試室的測試託盤所經過的第一輸送通道。Generally, a constant temperature chamber has a temperature environment for preheating / precooling electronic components according to test temperature conditions, and this temperature environment is similar to the temperature environment in the test room. Therefore, the temperature environment in the constant temperature room has little effect on the temperature environment in the test room. Thereby, the first conveyance passage through which the test tray transferred from the thermostatic chamber to the test chamber can be opened.

然而,測試室和除熱室的溫度環境具有很大差異。由此,從測試室傳送到除熱室的測試託盤所經過的第二輸送通道必須是可開閉的。即,當傳送測試託盤時應當打開第二輸送通道,當執行測試室中的電子元件的測試時應當關閉第二輸送通道。However, the temperature environment of the test chamber and the heat removal chamber is very different. Therefore, the second conveying path through which the test tray transferred from the test chamber to the heat removal chamber must be openable and closable. That is, the second conveyance path should be opened when the test tray is conveyed, and the second conveyance path should be closed when the test of the electronic components in the test chamber is performed.

將測試託盤從測試室傳送到除熱室有兩種方法。第一種方法是第一輸送裝置將後端的測試託盤移動到測試室內部,後端的測試託盤將前端的測試託盤推向除熱室側,使前端的測試託盤一定程度上傳送到除熱室側,然後第二輸送裝置將第二測試託盤進一步傳送至其餘部分。另外,第二種方法是第二輸送裝置在第一輸送裝置將後端的測試託盤傳送至測試室的內部之前將測試室內部中的測試託盤傳送到除熱室的內部。There are two ways to transfer the test tray from the test chamber to the heat removal chamber. The first method is that the first conveying device moves the rear-end test tray to the inside of the test chamber, and the rear-end test tray pushes the front-end test tray to the heat-removing chamber side, and the front-end test tray is uploaded to the heat-removing chamber side , And then the second conveying device further transfers the second test tray to the rest. In addition, the second method is that the second conveying device conveys the test tray in the test chamber to the inside of the heat removal chamber before the first conveying device transmits the rear-end test tray to the inside of the test chamber.

在上述第一種方法或第二種方法中,為了將測試託盤從測試室傳送到除熱室而必須打開第二輸送通道。In the first method or the second method described above, in order to transfer the test tray from the test chamber to the heat removal chamber, the second conveyance channel must be opened.

然而,當結束電子元件的測試之後,由於僅在第二輸送通道打開之後第二輸送裝置才會操作,因此,第二輸送裝置對測試託盤的傳送操作花費更多時間,這增加了測試託盤的循環時間,並最終導致處理器的運轉率降低。另外,由於打開第二輸送通道的時間變得更長,因此,測試室內的溫度環境恢復到測試環境的時間也成比例的延長,這也導致處理器的運轉率降低。However, after the test of the electronic components is ended, since the second conveying device is operated only after the second conveying channel is opened, the second conveying device takes more time to transport the test tray, which increases the test tray's The cycle time and ultimately the processor's operating rate decreases. In addition, since the time for opening the second conveying channel becomes longer, the time for the temperature environment in the test chamber to recover to the test environment is also prolonged proportionally, which also causes the operating rate of the processor to decrease.

但是如果始終打開第二輸送通道,則除熱室的溫度環境會擾亂測試室的溫度環境使得測試的可靠性降低。However, if the second conveying channel is always opened, the temperature environment of the heat removal chamber will disturb the temperature environment of the test chamber and reduce the reliability of the test.

發明概要 需要解決的課題 本發明的目的在於提供一種技術,用於在確保測試的可靠性的同時,第二輸送裝置預先執行用於傳送測試託盤的準備工作。 解決課題的手段SUMMARY OF THE INVENTION Problems to be Solved The object of the present invention is to provide a technique for ensuring the reliability of a test while the second conveyance device performs a preparation work for conveying a test tray in advance. Means of solving the problem

根據本發明的用於測試電子元件的處理器包括:加載裝置,將裝載於客戶託盤上的待測電子元件加載到加載位置中的測試託盤上;恒溫室,用於對裝載於來自加載位置的測試託盤上的電子元件施加熱刺激;測試室,提供空間和溫度環境以對經過所述恒溫室而到測試位置的溫度測試託盤上的電子元件進行測試;第一輸送裝置,將所述恒溫室中的測試託盤傳送到所述測試室;加壓裝置,將位於所述測試室內的測試位置的測試託盤上的電子元件向測試器的測試插座側施壓以使電子元件電連接到測試插座上;除熱室,用於除去來自所述測試室的測試託盤的電子元件在所述恒溫室和所述測試室中被施加的熱刺激;第二輸送裝置,用於將所述測試室中的測試託盤傳送到除熱室;卸載裝置,從所述除熱室到卸載位置的測試託盤中卸載電子元件並根據測試結果進行分類以移動到客戶託盤;第一開閉裝置,用於開閉作為從所述測試室傳送到所述除熱室的測試託盤的輸送通道中的一部分的第一區域。所述第二輸送裝置包括:把持構件,用於把持或解除把持測試託盤;執行器,用於執行所述把持構件把持或解除把持測試託盤;驅動器,用於使所述把持構件沿測試託盤的傳送方向移動,所述把持構件的把持部位構成能夠通過作為所述輸送通道中的另一部分的第二區域,所述第二區域的長度短於所述第一區域的長度,所述第一開閉裝置具備第一門和提供用於打開或關閉所述第一門的動力的第一驅動器,當測試託盤從所述測試室移動到所述除熱室時,則所述第一門打開,當關閉時,至少封閉所述第一區域並阻止測試託盤從所述測試室移動到所述除熱室,以有助於防止所述測試室和所述除熱室之間的熱交換,當所述第一區域打開時,所述輸送通道允許測試託盤從所述測試室的內部移動到所述除熱室的內部。The processor for testing electronic components according to the present invention includes: a loading device for loading an electronic component to be tested loaded on a customer tray onto a test tray in a loading position; and a thermostatic chamber for loading the The electronic components on the test tray apply thermal stimulus; the test room provides space and temperature environment to test the electronic components on the temperature test tray passing through the constant temperature room to the test position; the first conveying device connects the constant temperature room The test tray in the test chamber is transferred to the test chamber; the pressurizing device presses the electronic component on the test tray located at the test position in the test chamber to the test socket side of the tester to electrically connect the electronic component to the test socket. A heat removal chamber for removing thermal stimuli applied to the electronic components of the test tray from the test chamber in the constant temperature chamber and the test chamber; a second conveying device for removing the heat in the test chamber The test tray is transferred to the heat removal chamber; the unloading device unloads the electronic components from the heat removal chamber to the test tray at the unloading position and performs the test according to the test result. Class to move the tray to the client; a first opening and closing means for opening and closing the test chamber from said first region to a portion of the conveying path in addition to the test tray in the heat chamber as. The second conveying device includes: a holding member for holding or releasing the test tray; an actuator for executing the holding member to release or hold the test tray; and a driver for causing the holding member to move along the test tray. Moving in the conveying direction, the holding portion of the holding member constitutes a second region capable of passing through another part of the conveying path, the length of the second region is shorter than the length of the first region, and the first opening and closing The device is provided with a first door and a first driver that provides power for opening or closing the first door. When a test tray is moved from the test chamber to the heat removal chamber, the first door is opened. When closed, at least the first area is blocked and the test tray is prevented from moving from the test chamber to the heat removal chamber to help prevent heat exchange between the test chamber and the heat removal chamber. When the first area is opened, the conveying channel allows the test tray to move from the inside of the test chamber to the inside of the heat removal chamber.

根據發明的用於測試電子元件的處理器還可以包括用於開閉所述第二區域的第二開閉裝置,所述第二開閉裝置具備第二門和提供用於打開或關閉所述第二門的動力的第二驅動器,所述第二門打開所述第二區域,以使所述把持構件的把持部位即使在所述第一門關閉的狀態下也能通過所述第二區域從所述除熱室向所述測試室移動,當關閉時,封閉所述第二區域以有助於進一步防止所述測試室和所述除熱室之間的熱交換,並當所述第一區域和所述第二區域全部打開時,所述輸送通道允許測試託盤從所述測試室的內部移動到所述除熱室的內部。The processor for testing electronic components according to the invention may further include a second opening and closing device for opening and closing the second area, the second opening and closing device being provided with a second door and provided for opening or closing the second door A second drive of the power, the second door opens the second area, so that the holding portion of the holding member can pass from the second area through the second area even when the first door is closed. The heat removal chamber moves toward the test chamber, and when closed, closes the second region to help further prevent heat exchange between the test chamber and the heat removal chamber, and when the first region and When the second area is fully opened, the conveying channel allows the test tray to move from the inside of the test chamber to the inside of the heat removal chamber.

由所述第一開閉裝置的所述第一區域的開閉動作和由所述第二開閉裝置的所述第二區域的開閉動作能夠彼此獨立地執行,所述第二驅動器和所述第一驅動器獨立分開設置。The opening and closing operation of the first area by the first opening and closing device and the opening and closing operation of the second area by the second opening and closing device can be performed independently of each other, the second driver and the first driver Set up separately.

所述第二門具有驅動凸起,所述第二驅動器包括驅動部件和用於正逆旋轉所述驅動部件的驅動源,所述驅動部件通過正向旋轉推動所述驅動凸起以由所述第二門關閉所述第二區域,或者通過反向旋轉拉動所述驅動凸起以打開所述第二區域,並具有用於將所述驅動部件的正逆旋轉運動轉換成所述驅動凸起的進退運動的轉換槽,所述驅動凸起插入到所述轉換槽。The second door has a driving protrusion, the second driver includes a driving member and a driving source for rotating the driving member in a forward and reverse direction, and the driving member pushes the driving protrusion through forward rotation to be driven by the driving member. A second door closes the second area, or pulls the driving protrusion by a reverse rotation to open the second area, and has a function for converting forward and reverse rotation movements of the driving member into the driving protrusion. The conversion groove of the forward and backward movement is inserted into the conversion groove.

所述第二門具有驅動凸起,所述第二驅動器包括驅動部件和用於將所述驅動部件沿第一方向進退的驅動源,所述驅動部件通過所述第一方向上的進退使所述驅動凸起沿不同於所述第一方向的第二方向進退,以通過所述第二門開閉所述第二區域,並具有將第一方向上的進退運動轉換成所述驅動凸起的第二方向上的進退運動的轉換槽,所述驅動凸起插入所述轉換槽。The second door has a driving protrusion, the second driver includes a driving member and a driving source for advancing and retreating the driving member in a first direction, and the driving member makes The driving protrusion advances and retreats in a second direction different from the first direction to open and close the second area through the second door, and has a mechanism for converting the forward and backward movement in the first direction into the driving protrusion. The driving groove for moving forward and backward in the second direction is inserted into the switching groove.

為了防止所述除熱室內的空氣通過所述第二區域移動到所述測試室內,還包括通過向所述測試室的內部供應氣體使所述測試室內的氣壓高於所述除熱室內的氣壓的供氣裝置,並通過所述供氣裝置,使得供應到所述測試室內部的氣體具有能夠保持所述測試室內的溫度環境的溫度。In order to prevent the air in the heat removal chamber from moving into the test chamber through the second area, the method further includes making the pressure in the test chamber higher than the pressure in the heat removal chamber by supplying gas to the inside of the test chamber. A gas supply device through which the gas supplied to the inside of the test chamber has a temperature capable of maintaining the temperature environment in the test chamber.

第一區域寬度窄於第二區域的寬度。 發明效果The width of the first region is narrower than the width of the second region. Invention effect

根據本發明,由於通過第二開閉裝置形成的第二區域的開閉與第一開閉裝置無關,因此保持了測試的可靠性以及縮短了從電子產品結束測試時到測試託盤完成傳送為止需要的時間,最終,具有能夠提高處理器的運轉率的效果。According to the present invention, since the opening and closing of the second area formed by the second opening and closing device has nothing to do with the first opening and closing device, the reliability of the test is maintained and the time required from the end of the test of the electronic product to the completion of the transfer of the test tray, Finally, there is an effect that the operating rate of the processor can be increased.

具體實施方式 將參照附圖說明本發明的優選實施例,但為了說明的簡潔,盡可能省略或壓縮對重複或者實質相同的結構的說明。 <對於處理器結構的概括性說明>DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described with reference to the accompanying drawings, but for the sake of brevity of description, descriptions of repetitive or substantially identical structures are omitted or compressed as much as possible. < General description of processor structure >

圖1是本發明的一個實施例的處理器100的概念性俯視圖,圖2是在圖1的處理器100中具有測試託盤TT經過測試室TC與除熱室DC之間的輸送通道TW的特徵部位P的立體圖。參照圖1和圖2,根據本實施例的處理器100,包括:加載裝置110、恒溫室SC、測試室TC、第一輸送裝置120、加壓裝置130、除熱室DC、第二輸送裝置140、卸載裝置150、第一開閉裝置160(參照圖2)、第二開閉裝置170(參照圖2)以及供氣裝置180。FIG. 1 is a conceptual top view of a processor 100 according to an embodiment of the present invention, and FIG. 2 is a feature of the processor 100 of FIG. 1 having a test tray TT passing through a test path TW between a test chamber TC and a heat removal chamber DC A perspective view of the part P. 1 and 2, the processor 100 according to this embodiment includes a loading device 110, a constant temperature chamber SC, a test chamber TC, a first conveying device 120, a pressurizing device 130, a heat removing chamber DC, and a second conveying device. 140. An unloading device 150, a first opening and closing device 160 (see FIG. 2), a second opening and closing device 170 (see FIG. 2), and an air supply device 180.

上述加載裝置110、恒溫室SC、測試室TC、第一輸送裝置120、加壓裝置130、除熱室DC以及卸載裝置150與前述背景技術中的說明相同,因此省略對其說明,下面,說明與本發明相關的第二輸送裝置140、第一開閉裝置160、第二開閉裝置170以及供氣裝置180。The loading device 110, the thermostatic chamber SC, the test chamber TC, the first conveying device 120, the pressurizing device 130, the heat removing chamber DC, and the unloading device 150 are the same as those described in the background art, and therefore descriptions thereof are omitted. Hereinafter, description The second conveying device 140, the first opening and closing device 160, the second opening and closing device 170, and the air supply device 180 related to the present invention.

第二輸送裝置140將位於測試室TC內的測試位置TP上的測試託盤TT傳送到除熱室DC。為此,如圖3所示,第二輸送裝置140包括:把持構件141、執行器142以及驅動器143。The second conveying device 140 transfers the test tray TT located at the test position TP in the test chamber TC to the heat removal chamber DC. To this end, as shown in FIG. 3, the second conveying device 140 includes a gripping member 141, an actuator 142, and a driver 143.

把持構件141在把持部位GP上具有把持銷141a,由於能夠前後進退,因此把持銷141a通過該進退而插入或抽出於測試託盤TT的保持孔GH,從而把持或解除把持測試託盤TT。The gripping member 141 has a gripping pin 141a at the gripping position GP. Since the gripping pin 141a can advance and retreat forward and backward, the gripping pin 141a is inserted into or withdrawn from the holding hole GH of the test tray TT through the advancement and retraction, thereby gripping or releasing the gripping of the test tray TT.

執行器142使把持構件141向前後進退,以使把持構件141把持或解除把持測試託盤TT。The actuator 142 moves the holding member 141 forward and backward so that the holding member 141 holds or releases the holding of the test tray TT.

驅動器143使把持構件141左右移動,從而使把持構件141的把持部位GP位於除熱室DC的內部或位於測試室TC的內部。當然,把持構件141在把持測試託盤TT的狀態下能夠通過驅動器143的操作來執行測試託盤TT的傳送。這種驅動器143可以通過應用馬達M和傳送帶B而構成,但不限於這種構成。The driver 143 moves the holding member 141 left and right, so that the holding portion GP of the holding member 141 is located inside the heat removal chamber DC or inside the test chamber TC. Of course, the holding member 141 can perform the transfer of the test tray TT by the operation of the driver 143 in a state of holding the test tray TT. Such a driver 143 may be configured by applying a motor M and a conveyor belt B, but is not limited to this configuration.

第一開閉裝置160開閉作為輸送通道TW中的一部分的第一區域TW1,並包括第一門161和第一驅動器162。The first opening and closing device 160 opens and closes the first area TW1 as a part of the conveyance path TW, and includes a first door 161 and a first driver 162.

第一門161開閉第一區域TW1,即,如果第一門161開啟則第一區域TW1打開,如果第一門161關閉則第一區域TW1封閉,由此,阻止測試託盤TT從測試室TC移動到除熱室DC。另外,第一門161在關閉狀態下根據封閉第一區域TW1的程度來相應地防止測試室TC和除熱室DC之間的熱交換。The first door 161 opens and closes the first area TW1, that is, if the first door 161 is opened, the first area TW1 is opened, and if the first door 161 is closed, the first area TW1 is closed, thereby preventing the test tray TT from moving from the test chamber TC To the heat removal chamber DC. In addition, the first door 161 prevents the heat exchange between the test chamber TC and the heat removal chamber DC correspondingly according to the degree of closing the first area TW1 in the closed state.

第一驅動器162提供用於打開或關閉第一門161的動力,使得第一門161開閉第一區域TW1。本實施例中的第一驅動器162應用氣缸,但可以應用馬達或其他驅動裝置。The first driver 162 provides power for opening or closing the first door 161, so that the first door 161 opens and closes the first area TW1. The first driver 162 in this embodiment is an air cylinder, but a motor or other driving device may be applied.

第二開閉裝置170開閉作為輸送通道TW中的另一部分的第二區域TW2。即,第二區域TW2與第一區域TW1一起形成輸送通道TW,並且是不同於第一區域TW1的部分。該第二開閉裝置170包括第二門171和第二驅動器172。The second opening / closing device 170 opens and closes the second region TW2 which is another part of the conveyance path TW. That is, the second area TW2 forms a conveyance path TW together with the first area TW1, and is a portion different from the first area TW1. The second opening and closing device 170 includes a second door 171 and a second driver 172.

為了即使在第一門161關閉的狀態下也能夠通過第二區域TW2使把持構件141的把持部位GP從除熱室DC向測試室TC移動,第二門171打開第二區域TW2,當關閉時,封閉第二區域TW2以進一步防止測試室TC和除熱室DC之間的熱交換。當然,第二區域TW2具有允許把持構件141的把持部位GP通過但不允許測試託盤TT通過的長度L2,並且短於第一區域TW1的長度L1。在本說明中,長度L1、L2是指作為第一區域TW1或第二區域TW2的第一方向的上下方向上的長度,更具體地,是指垂直於通過第二輸送裝置140傳送測試託盤TT的方向並且還垂直於通過加壓裝置130對電子元件施壓的方向上的方向。In order to move the holding portion GP of the holding member 141 from the heat removal chamber DC to the test chamber TC through the second region TW2 even when the first door 161 is closed, the second door 171 opens the second region TW2. The second region TW2 is closed to further prevent heat exchange between the test chamber TC and the heat removal chamber DC. Of course, the second region TW2 has a length L2 that allows the grip portion GP of the grip member 141 to pass but does not allow the test tray TT to pass, and is shorter than the length L1 of the first region TW1. In this description, the lengths L1 and L2 refer to the lengths in the vertical direction as the first direction of the first region TW1 or the second region TW2, and more specifically, to the test tray TT conveyed perpendicularly through the second conveying device 140 And also perpendicular to the direction in which the electronic component is pressed by the pressing device 130.

另外,根據本實施例,在作為第二方向的前後方向上,可將第一區域TW1以短於第二區域TW2的寬度W2的方式來形成寬度W1。即,在現有技術中,構成一個輸送通道而沒有第一區域和第二區域的區分,該輸送通道的寬度在所有部位中都相同,這種輸送通道的寬度需確保把持構件的把持部位和測試託盤一起移動的程度。因此,輸送通道的面積大,則在移動測試託盤時,測試室內的熱氣或冷氣的損失會相應的增加。然而,根據本發明,由於不需要增加與把持構件141的把持部位GP無關的第一區域TW1的寬度,因此,可以考慮第一區域TW1的寬度具有確保測試託盤TT可通多的最小寬度W1,並相應地減少當測試託盤TT移動時測試室TC內的熱氣或冷氣的損失。由此,第二區域TW2具有確保把持構件141的把持部位GP和測試託盤TT一起通過的寬度W2,但第一區域TW1具有僅供測試託盤TT通過的寬度W1。在此,寬度W1、W2是指由加壓裝置130對電子元件的施壓方向且是把持構件141用於把持或解除把持測試託盤TT的進退方向上的長度。In addition, according to this embodiment, the width W1 of the first region TW1 may be shorter than the width W2 of the second region TW2 in the front-rear direction as the second direction. That is, in the prior art, a conveying channel is constituted without a distinction between a first area and a second area. The width of the conveying channel is the same in all parts. The width of this conveying channel needs to ensure the holding position and test of the holding member. The extent to which the trays move together. Therefore, if the area of the conveying channel is large, the loss of hot or cold air in the test chamber will increase correspondingly when the test tray is moved. However, according to the present invention, since it is not necessary to increase the width of the first region TW1 irrespective of the holding portion GP of the holding member 141, it can be considered that the width of the first region TW1 has a minimum width W1 to ensure that the test tray TT can pass through, And correspondingly reduce the loss of hot or cold air in the test chamber TC when the test tray TT moves. Thereby, the second region TW2 has a width W2 for ensuring that the gripping portion GP of the gripping member 141 and the test tray TT pass together, but the first region TW1 has a width W1 for passing only the test tray TT. Here, the widths W1 and W2 refer to the pressing direction of the electronic components by the pressing device 130 and are the lengths in the advancing and retreating directions of the holding member 141 for holding or releasing the holding of the test tray TT.

作為參考,儘管本實施例中示出了測試託盤TT以垂直豎立的狀態測試所裝載的電子元件的垂直式處理器100,但本發明也可應用測試託盤TT以水平的狀態測試所裝載的電子元件的水平式處理器。因此,在水平式處理器中,測試託盤TT在水平的狀態下被傳送,水平式處理器中的第一區域TW1或第二區域TW2的長度L1、L2是指前後方向(或水平方向)上的長度。For reference, although the vertical processor 100 for testing the loaded electronic components in the test tray TT in a vertical state is shown in this embodiment, the present invention can also be applied to test the loaded electronics in a horizontal state in the test tray TT. Horizontal processor with components. Therefore, in the horizontal processor, the test tray TT is transferred in a horizontal state, and the lengths L1 and L2 of the first region TW1 or the second region TW2 in the horizontal processor refer to the front-back direction (or horizontal direction). length.

第二驅動器172提供用於打開或關閉第二門171的動力,本實施例中應用了氣缸,但可以應用馬達等。通過如上所述的第二驅動器172的操作,如圖4(a)所示,由第二門171封閉第二區域TW2,或者如圖4(b)所示,即使是在通過第一門161使第一區域TW1封閉的狀態下也能夠打開第二區域TW2。當然,如圖4(b)所示,當第二區域TW2打開時,把持構件171的把持部位GP能夠通過第二區域TW2從除熱室DC移動到測試室TC。The second driver 172 provides power for opening or closing the second door 171. A cylinder is used in this embodiment, but a motor or the like may be used. Through the operation of the second driver 172 as described above, as shown in FIG. 4 (a), the second area TW2 is closed by the second door 171, or as shown in FIG. 4 (b), even when passing through the first door 161 The second region TW2 can be opened even when the first region TW1 is closed. Of course, as shown in FIG. 4 (b), when the second region TW2 is opened, the holding portion GP of the grasping member 171 can be moved from the heat removal chamber DC to the test chamber TC through the second region TW2.

根據如上所述的本發明,如圖2所示,僅在第一區域TW1和第二區域TW2全部打開時,輸送通道TW才允許測試託盤TT從測試室TC移動到除熱室DC。According to the present invention as described above, as shown in FIG. 2, the conveying path TW allows the test tray TT to be moved from the test chamber TC to the heat removal chamber DC only when the first and second regions TW1 and TW2 are all opened.

另外,根據本實施例,由於第一開閉裝置160和第二開閉裝置170彼此獨立地操作,因此,根據第一門161的第一區域TW1的開閉動作和根據第二門171的第二區域TW2的開閉動作彼此獨立地執行。為此,本實施例中,第二驅動器172和第一驅動器162獨立分開設置。In addition, according to the present embodiment, since the first opening and closing device 160 and the second opening and closing device 170 operate independently of each other, the opening and closing operation according to the first area TW1 of the first door 161 and the second area TW2 according to the second door 171 The opening and closing actions are performed independently of each other. For this reason, in this embodiment, the second driver 172 and the first driver 162 are provided separately and separately.

另一方面,供氣裝置180通過向測試室TC的內部供應氣體,使測試室TC內的氣壓高於除熱室DC內的氣壓。此時,通過供氣裝置180供應的氣體可能會根據測試溫度條件而不同。例如,如果是高溫測試,則供應高溫的空氣,如果是低溫測試,則供應低溫的氣體。即,通過供氣裝置18供應到測試室TC的內的氣體優選具有能夠保持測試室TC內的溫度環境的溫度。該供氣裝置180通過向測試室TC內供應氣體,使測試室TC的內部形成氣壓高於除熱室DC的內部,尤其即使在第二區域TW2打開的狀態下,也能夠有助於防止除熱室DC內的空氣移動到測試室TC內。當然,當第二區域TW2打開時,供應的氣體的量優選大於第二區域TW2封閉時,以控制測試室TC的內部和除熱室DC的內部之間的壓力差,使其保持在一定水平或更高。On the other hand, the gas supply device 180 supplies gas to the inside of the test chamber TC, so that the pressure in the test chamber TC is higher than that in the heat removal chamber DC. At this time, the gas supplied through the gas supply device 180 may vary according to the test temperature conditions. For example, if it is a high-temperature test, high-temperature air is supplied, and if it is a low-temperature test, low-temperature gas is supplied. That is, the gas supplied into the test chamber TC by the gas supply device 18 preferably has a temperature capable of maintaining the temperature environment in the test chamber TC. The gas supply device 180 supplies gas to the test chamber TC, so that the pressure inside the test chamber TC becomes higher than that of the heat removal chamber DC. In particular, even when the second region TW2 is open, it can help prevent The air in the hot room DC moves into the test room TC. Of course, when the second region TW2 is opened, the amount of gas supplied is preferably larger than when the second region TW2 is closed, so as to control the pressure difference between the inside of the test chamber TC and the inside of the heat removal chamber DC to keep it at a certain level Or higher.

接下來,將說明具有上述結構的處理器100中主要部位的動作。Next, operations of main parts in the processor 100 having the above-mentioned structure will be described.

當通過加壓裝置130將測試室TC內的測試託盤TT和電子元件推向後方的測試器TESTER中的測試板TB側而使電子元件電連接到測試插座,則進行電子元件的測試。優選在第一區域TW1和第二區域TW2全部封閉的狀態下開始測試。在測試將要結束或者至少打開第一區域TW1之前預先操作第二開閉裝置170以打開第二區域TW2,並如圖5所示,操作第二輸送裝置140,使得把持構件141的把持部位GP位於測試室TC的內部。在圖5的狀態下,若電子元件的測試結束,則解除通過加壓裝置130對測試託盤TT的施壓,並且已被推向後方的測試託盤TT向前方返回。此時,如圖6所示,測試託盤TT向前方返回並且在測試室TC內等待的把持部位GP的把持銷141a插入到測試託盤TT的保持孔GH中,與此同時,通過第一開閉裝置160使第一區域TW1也被打開。接著,通過第二輸送裝置140的驅動器143的動作使把持構件141向右側移動,測試託盤TT從測試室TC的內部傳送到除熱室DC的內部。當傳送測試託盤TT結束,則封閉第一區域TW1和第二區域TW2以對裝載於後端的測試託盤TT上的電子元件進行適當的測試。When the test tray TT and the electronic components in the test chamber TC are pushed toward the test board TB side of the tester TESTER by the pressurizing device 130 to electrically connect the electronic components to the test socket, the electronic component test is performed. It is preferable to start the test in a state where the first region TW1 and the second region TW2 are all closed. Before the test is about to end or at least the first area TW1 is opened, the second opening and closing device 170 is operated in advance to open the second area TW2, and as shown in FIG. 5, the second conveying device 140 is operated so that the holding portion GP of the holding member 141 is located at the test The interior of the room TC. In the state of FIG. 5, when the test of the electronic component is completed, the pressing of the test tray TT by the pressurizing device 130 is released, and the test tray TT that has been pushed to the rear is returned forward. At this time, as shown in FIG. 6, the holding pin 141 a of the holding portion GP waiting forward in the test chamber TC while the test tray TT returns forward is inserted into the holding hole GH of the test tray TT, and at the same time, passes through the first opening and closing device. 160 causes the first region TW1 to also be opened. Next, the operation of the driver 143 of the second conveying device 140 moves the holding member 141 to the right, and the test tray TT is transferred from the inside of the test chamber TC to the inside of the heat removal chamber DC. When the transfer test tray TT is completed, the first area TW1 and the second area TW2 are closed to perform an appropriate test on the electronic components loaded on the test tray TT at the rear end.

作為參考,當第二區域TW2開閉時間點、當把持構件141的把持部位GP預先移動到測試室TC的內部的時間點或者當第二區域TW2已打開時,供應的氣體的量能夠根據處理器100的具體規格或測試溫度條件等以多種方式被確定。 <特徵部位的第一變形例>For reference, when the second region TW2 is opened and closed, when the holding portion GP of the holding member 141 is moved to the inside of the test chamber TC in advance, or when the second region TW2 has been opened, the amount of supplied gas can be based on the processor The specific specifications of 100 or test temperature conditions are determined in a variety of ways. <First Modification of Characteristic Part>

圖7根據圖1的處理器100的特徵部位的第一變形例的右側視圖。FIG. 7 is a right side view of a first modification of a characteristic portion of the processor 100 according to FIG. 1.

參照前述的圖2的第二門171具有平開門式結構,根據本變形例的第二開閉裝置170A的第二門171A具有推拉門式結構。為此,在第二門171A上具有驅動凸起DP。另外,第二驅動器172A包括驅動部件DE以及驅動源DS。Referring to the aforementioned second door 171 of FIG. 2 has a flat door type structure, and the second door 171A of the second opening and closing device 170A according to this modification has a sliding door type structure. To this end, a driving projection DP is provided on the second door 171A. The second driver 172A includes a driving unit DE and a driving source DS.

驅動部件DE通過正向旋轉向後方推動驅動凸起DP,以通過第二門171A封閉第二區域TW2,並通過反向旋轉向前方拉動驅動凸起DP,以打開第二區域TW2。為此,驅動部件DE中具有將自身的正逆旋轉運動轉換成驅動凸起DP的進退運動的轉換槽TG,並且驅動凸起DP插入轉換槽TG中。The driving part DE pushes the driving protrusion DP to the rear through forward rotation to close the second region TW2 through the second door 171A, and pulls the driving protrusion DP to the front through the reverse rotation to open the second region TW2. To this end, the driving part DE has a conversion groove TG that converts its forward and reverse rotational movement into a forward and backward movement of the driving protrusion DP, and the driving protrusion DP is inserted into the conversion groove TG.

提供驅動源DS以使驅動部件DE正逆旋轉,在本變形例中,由氣缸來實現,但並不限於此,可由馬達等來實現。The driving source DS is provided to rotate the driving member DE in the forward and reverse directions. In the present modification, the air cylinder is used to implement this, but it is not limited thereto, and may be implemented by a motor or the like.

作為參考,圖7的(a)示出第二門171A打開的狀態,圖7的(b)示出第二門171A關閉的狀態。For reference, (a) of FIG. 7 illustrates a state where the second door 171A is opened, and (b) of FIG. 7 illustrates a state where the second door 171A is closed.

如前述的圖2的實施例所述,在本變形例中,第二開閉裝置170A也與第一開閉裝置160A獨立設置。第一開閉裝置160A在結構上與參照圖2的第一開閉裝置160相同,因此將省略說明。 <特徵部位的第二變形例>As described in the foregoing embodiment of FIG. 2, in this modification, the second opening and closing device 170A is also provided independently of the first opening and closing device 160A. The first opening-closing device 160A is structurally the same as the first opening-closing device 160 with reference to FIG. 2, and therefore description thereof will be omitted. <Second Modification of Characteristic Part>

圖8是根據圖1的處理器100的特徵部位的第二變形例的右側視圖。FIG. 8 is a right side view of a second modification of the characteristic portion of the processor 100 according to FIG. 1.

在本變形例中,第二開閉裝置170B的第二門171B也具有推拉門式結構。In this modification, the second door 171B of the second opening and closing device 170B also has a sliding door type structure.

在本變形例中,第二門171B也具備驅動凸起DP,並且第二驅動器172B由驅動部件DE和驅動源DS構成。In this modification, the second door 171B is also provided with the driving projection DP, and the second driver 172B is composed of the driving member DE and the driving source DS.

驅動部件DE在作為第一方向D1的上下方向上進退,根據驅動部件DE的進退使驅動凸起DP在作為正交於第一方向D1的第二方向D2的前後方向上進退,並通過第二門171B使第二區域TW2開閉。為此,驅動部件DE具有用於將驅動部件DE的第一方向(上下方向)上的進退運動轉換成第二門171B的第二方向(前後方向)上的進退運動的轉換槽TG,轉換槽TG分別相對於第一方向D1和第二方向D2以預定角度θ1和θ2傾斜。然後,驅動凸起DP插入轉換槽TG。The driving member DE advances and retreats in the vertical direction as the first direction D1, and the driving protrusion DP advances and retreats in the forward and backward direction as the second direction D2 orthogonal to the first direction D1 according to the advance and retreat of the driving member DE, and passes through the second The door 171B opens and closes the second area TW2. For this purpose, the driving member DE has a switching groove TG for converting the forward and backward movement of the driving member DE in the first direction (up and down direction) into the forward and backward movement of the second door 171B in the second direction (forward and backward direction). TG is inclined at predetermined angles θ1 and θ2 with respect to the first direction D1 and the second direction D2, respectively. Then, the driving projection DP is inserted into the conversion groove TG.

設置驅動源DS,以使驅動部件DE上下進退,在本變形例中是由氣缸來實現,但不限於此,可由馬達等來實現。The driving source DS is provided so that the driving member DE moves forward and backward. In this modification, the driving source DS is implemented by a cylinder, but is not limited thereto, and may be implemented by a motor or the like.

作為參考,圖8的(a)示出第二區域TW2打開的狀態,圖8的(b)示出第二區域TW2封閉的狀態。For reference, (a) of FIG. 8 illustrates a state where the second region TW2 is opened, and (b) of FIG. 8 illustrates a state where the second region TW2 is closed.

一方面,在上述實施例中,設定第二輸送裝置140傳送一個測試託盤TT的情況,但是,如專利公開第10-2008-0082591號中所公開,在本發明中當然適用第二輸送裝置140一起傳送兩個測試託盤TT的情況。例如,如果是同時傳送測試室內的兩個並排的測試託盤的情況,則如圖9所示,可以採用設置兩個具有第一門的第一開閉裝置以及設置具有一個位於兩個第一門之間的第二門的第二開閉裝置的結構。參照圖9的例子,由於可以通過把持構件同時傳送兩個測試託盤,因此,能夠僅設置一個第二開閉裝置。根據圖9的例子,由於能夠通過一個把持構件同時傳送兩個測試託盤,從而可以相應地減小第二區域,因此具有即使在第二區域打開時也能夠使測試室內的溫度環境的變化最小化的相對的優勢。即,如圖9的例子所示,可知,當一次傳送多個測試託盤時,可以更優選地應用本發明。On the one hand, in the above-mentioned embodiment, the case where the second conveying device 140 is set to convey one test tray TT, but as disclosed in Patent Publication No. 10-2008-0082591, of course, the second conveying device 140 is applicable in the present invention. Case of transferring two test trays TT together. For example, if two side-by-side test trays are transferred in the test room at the same time, as shown in FIG. 9, two first opening and closing devices with first doors and one with two first doors may be used. The structure of the second opening and closing device of the second door. Referring to the example of FIG. 9, since two test trays can be transported simultaneously by the holding member, only one second opening and closing device can be provided. According to the example of FIG. 9, since two test trays can be simultaneously conveyed by one holding member, the second area can be correspondingly reduced, so that even when the second area is opened, changes in the temperature environment in the test room can be minimized. Relative advantage. That is, as shown in the example of FIG. 9, it can be seen that the present invention can be applied more preferably when a plurality of test trays are conveyed at one time.

當然,也可以將多個測試託盤分別傳送到多個第二輸送裝置上,此時,參照圖2至圖8,可以分別提供多個根據說明的實施例的第一開閉裝置和第二開閉裝置。在此,多個第一開閉裝置和第二開閉裝置可以將圖2至圖8的例中所示的結構以線對稱的方式佈置或者平行地佈置。Of course, a plurality of test trays can also be respectively transferred to a plurality of second conveying devices. At this time, referring to FIG. 2 to FIG. 8, a plurality of first opening and closing devices and second opening and closing devices according to the illustrated embodiments may be provided respectively. . Here, the plurality of first opening and closing devices and the second opening and closing device may arrange the structures shown in the examples of FIGS. 2 to 8 in a line-symmetrical manner or in parallel.

作為參考,如果通過供氣裝置180精確地控制氣體供應量和溫度,則可以充分地考慮省略第二開閉裝置,並始終打開第二區域。For reference, if the gas supply amount and temperature are accurately controlled by the gas supply device 180, it can be fully considered that the second opening and closing device is omitted and the second region is always opened.

如上所述,本發明的具體說明是通過參照附圖的實施例和變形例而得出,然而,上述實施例和變形例僅是為了說明本發明的優選例。因此,應理解為本發明不限於所公開的實施例,本發明的範圍應當被理解為在所附申請專利範圍及其等同無的範圍內。As described above, the detailed description of the present invention is obtained by referring to the embodiments and modifications of the drawings. However, the above embodiments and modifications are only for explaining preferred examples of the present invention. Therefore, it should be understood that the present invention is not limited to the disclosed embodiments, and the scope of the present invention should be understood to be within the scope of the appended patent applications and their equivalents.

100‧‧‧用於測試電子元件的處理器100‧‧‧ processor for testing electronic components

110‧‧‧加載裝置110‧‧‧Loading device

120‧‧‧第一輸送裝置120‧‧‧The first conveying device

130‧‧‧加壓裝置130‧‧‧Pressure device

140‧‧‧第二輸送裝置140‧‧‧second conveyor

141‧‧‧把持構件141‧‧‧holding component

141a‧‧‧把持銷141a‧‧‧ holding pin

142‧‧‧執行器142‧‧‧Actuator

143‧‧‧驅動器143‧‧‧Drive

150‧‧‧卸載裝置150‧‧‧Unloading device

160、160A‧‧‧第一開閉裝置160, 160A‧‧‧The first opening and closing device

161‧‧‧第一門161‧‧‧The first door

162‧‧‧第一驅動器162‧‧‧First Drive

170、170A、170B‧‧‧第二開閉裝置170, 170A, 170B‧‧‧Second opening and closing device

171、171A、171B‧‧‧第二門171, 171A, 171B‧‧‧Second Door

172、172A、172B‧‧‧第二驅動器172, 172A, 172B‧‧‧Second Drive

180‧‧‧供氣裝置180‧‧‧Air supply device

B‧‧‧傳送帶B‧‧‧ Conveyor

D1‧‧‧第一方向D1‧‧‧ first direction

D2‧‧‧第二方向D2‧‧‧ Second direction

DC‧‧‧除熱室DC‧‧‧De-heating room

DE‧‧‧驅動部件DE‧‧‧Driver

DP‧‧‧驅動凸起DP‧‧‧ drive bump

DS‧‧‧驅動源DS‧‧‧Driver

GH‧‧‧保持孔GH‧‧‧ holding hole

GP‧‧‧把持部位GP‧‧‧ Holding position

L1、L2‧‧‧長度L1, L2‧‧‧ length

M‧‧‧馬達M‧‧‧Motor

SC‧‧‧恒溫室SC‧‧‧ constant temperature room

TB‧‧‧測試板TB‧‧‧test board

TC‧‧‧測試室TC‧‧‧Test Room

TG‧‧‧轉換槽TG‧‧‧ Conversion tank

TP‧‧‧測試位置TP‧‧‧Test location

TT‧‧‧測試託盤TT‧‧‧test tray

TW‧‧‧輸送通道TW‧‧‧Conveying channel

TW1‧‧‧第一區域TW1‧‧‧ Zone 1

TW2‧‧‧第二區域TW2‧‧‧Second Zone

W1、W2‧‧‧寬度W1, W2‧‧‧Width

θ1、θ2‧‧‧角度θ1, θ2‧‧‧ angle

圖1是根據本發明的一個實施例的處理器100的概念性俯視圖。 圖2是提取應用於圖1的處理器的特徵部位的立體圖。 圖3是提取應用於圖1的第二輸送裝置的立體圖。 圖4是應用於圖1的處理器的特徵部位右側視圖。 圖5和圖6是用於說明應用於圖1的處理器的特徵部位的操作的參考視圖。 圖7是應用於圖1的處理器的特徵部位的第一變形例。 圖8應用於圖1的處理器的特徵部位的第二變形例。 圖9是用於說明當一次傳送多個測試託盤時應用本發明的例的參考視圖。FIG. 1 is a conceptual top view of a processor 100 according to an embodiment of the present invention. FIG. 2 is a perspective view extracting a feature portion applied to the processor of FIG. 1. FIG. 3 is a perspective view extracting a second conveying device applied to FIG. 1. 4 is a right side view of a characteristic portion applied to the processor of FIG. 1. 5 and 6 are reference views for explaining operations applied to characteristic parts of the processor of FIG. 1. FIG. 7 is a first modified example of a characteristic portion applied to the processor of FIG. 1. FIG. 8 is a second modification of the characteristic portion applied to the processor of FIG. 1. FIG. 9 is a reference view for explaining an example in which the present invention is applied when a plurality of test trays are transferred at a time.

Claims (9)

一種用於測試電子元件的處理器,其中,包括: 測試室,提供空間和溫度環境,以供測試託盤的電子元件進行測試; 加壓裝置,將所述測試室內的位於測試位置的測試託盤上的電子元件向測試器的測試插座側施壓,以使電子元件電連接到測試插座上; 除熱室,用於除去來自所述測試室的測試託盤的電子元件的在所述測試室中被施加的熱; 傳送裝置,用於將所述測試室中的測試託盤傳送到所述除熱室;以及 第一開閉裝置,用於開閉作為從所述測試室傳送到所述除熱室的測試託盤的輸送通道中的一部分的第一區域, 所述傳送裝置包括: 把持構件,用於把持或解除把持測試託盤; 執行器,使所述把持構件把持或解除把持測試託盤; 驅動器,用於使所述把持構件沿測試託盤的傳送方向移動, 所述把持構件的把持部位構成為能夠通過作為所述輸送通道中的另一部分的第二區域,所述第二區域的長度短於所述第一區域的長度, 所述第一開閉裝置具備第一門和提供用於打開和關閉所述第一門的動力的第一驅動器,當使測試託盤從所述測試室向所述除熱室移動時,所述第一門打開,當所述第一門關閉時,至少封閉所述第一區域並阻止測試託盤從所述測試室向所述除熱室移動,並且防止所述測試室和所述除熱室之間的熱交換, 當所述第一區域打開時,所述輸送通道允許測試託盤從所述測試室的內部向所述除熱室的內部移動。A processor for testing electronic components, comprising: a test chamber that provides a space and a temperature environment for testing electronic components of a test tray; a pressurizing device that places a test tray on the test tray in a test position in the test chamber The electronic component of the tester presses the test socket side of the tester so that the electronic component is electrically connected to the test socket; a heat removal chamber for removing the electronic components from the test tray of the test chamber is in the test chamber Applied heat; a transfer device for transferring a test tray in the test chamber to the heat removal chamber; and a first opening and closing device for opening and closing as a test transferred from the test chamber to the heat removal chamber A first area of a part of a transport path of a tray, the conveying device includes: a holding member for holding or releasing the test tray; an actuator for holding or releasing the test tray by the holding member; a driver for The holding member moves in a conveying direction of the test tray, and the holding portion of the holding member is configured to be able to pass through as a conveying passage. A second region of another part, the length of the second region is shorter than the length of the first region, the first opening and closing device is provided with a first door and provides power for opening and closing the first door The first drive of the first drive, when the test tray is moved from the test chamber to the heat removal chamber, the first door is opened, and when the first door is closed, at least the first area is blocked and the test tray is blocked Moving from the test chamber to the de-heating chamber and preventing heat exchange between the test chamber and the de-heating chamber, when the first area is opened, the conveying channel allows the test tray to be removed from the The inside of the test chamber moves toward the inside of the heat removal chamber. 如請求項1所述的用於測試電子元件的處理器,其中, 還包括用於開閉所述第二區域的第二開閉裝置, 所述第二開閉裝置具有第二門和提供用於打開和關閉所述第二門的動力的第二驅動器,所述第二門以使所述把持構件的把持部位即便在所述第一門關閉的狀態下也能從所述除熱室通過所述第二區域向所述測試室移動的方式打開所述第二區域,當所述第二門關閉時,封閉所述第二區域以防止所述測試室和所述除熱室之間的熱交換, 當所述第一區域和所述第二區域全部打開時,所述輸送通道允許測試託盤從所述測試室的內部向所述除熱室的內部移動。The processor for testing electronic components according to claim 1, further comprising a second opening and closing device for opening and closing the second area, the second opening and closing device having a second door and provided for opening and closing A power-driven second driver that closes the second door, so that the second door can pass the first heat-removing chamber through the first heat-removing chamber through the first door even when the first door is closed. Opening the second area in a way that the two areas move toward the test room, and when the second door is closed, closing the second area to prevent heat exchange between the test room and the heat removal room, When the first area and the second area are all opened, the conveying channel allows the test tray to move from the inside of the test chamber to the inside of the heat removal chamber. 如請求項2所述的用於測試電子元件的處理器,其中, 基於所述第一開閉裝置的所述第一區域的開閉動作和基於所述第二開閉裝置的所述第二區域的開閉動作能夠彼此獨立實現, 所述第二驅動器和所述第一驅動器獨立分開設置。The processor for testing an electronic component according to claim 2, wherein the opening and closing operation based on the first area of the first opening and closing device and the opening and closing of the second area based on the second opening and closing device The actions can be realized independently of each other, and the second driver and the first driver are provided separately and separately. 如請求項2所述的用於測試電子元件的處理器,其中, 所述第二門具有驅動凸起, 所述第二驅動器包括驅動部件和用於使所述驅動部件正逆旋轉的驅動源,所述驅動部件通過正向旋轉推動所述驅動凸起以使所述第二區域被所述第二門封閉,或者通過反向旋轉拉動所述驅動凸起以打開所述第二區域,所述驅動部件包括用於將所述驅動部件的正逆旋轉運動轉換成所述驅動凸起的進退運動的轉換槽, 所述驅動凸起插入於所述轉換槽。The processor for testing an electronic component according to claim 2, wherein the second door has a driving protrusion, and the second driver includes a driving part and a driving source for rotating the driving part forward and backward , The driving member pushes the driving protrusion through a positive rotation so that the second area is closed by the second door, or pulls the driving protrusion through a reverse rotation to open the second area, so The driving member includes a conversion groove for converting a forward and reverse rotation movement of the driving member into a forward and backward movement of the driving protrusion, and the driving protrusion is inserted into the conversion groove. 如請求項2所述的用於測試電子元件的處理器,其中, 所述第二門具有驅動凸起, 所述第二驅動器包括驅動部件和用於使所述驅動部件在第一方向上進退的驅動源,通過所述驅動部件在所述第一方向上的進退,使得所述驅動凸起在不同於所述第一方向的第二方向上進退,進而通過所述第二門使所述第二區域開閉,所述驅動部件包括用於將在第一方向上的進退運動轉換成所述驅動凸起的第二方向上的進退運動的轉換槽, 所述驅動凸起插入於所述轉換槽。The processor for testing an electronic component according to claim 2, wherein the second door has a driving protrusion, and the second driver includes a driving member and a driving member for advancing and retreating the driving member in a first direction. The driving source of the driving source advances and retreats in the first direction through the driving member, so that the driving protrusion advances and retreats in a second direction different from the first direction, and further causes the driving protrusion through the second door The second region is opened and closed, and the driving member includes a conversion groove for converting the forward and backward movement in the first direction into the forward and backward movement in the second direction of the driving protrusion, and the driving protrusion is inserted in the conversion groove. 如請求項1所述的用於測試電子元件的處理器,其中, 還包括供氣裝置,通過向所述測試室的內部供應空氣,使所述測試室內的氣壓高於所述除熱室的氣壓,以防止所述除熱室內的空氣通過所述第二區域移動到所述測試室內, 通過所述供氣裝置向所述測試室的內部供應的氣體具有用於保持所述測試室內的溫度環境的溫度。The processor for testing electronic components according to claim 1, further comprising an air supply device, and by supplying air to the inside of the test chamber, the air pressure in the test chamber is higher than that of the heat removal chamber. Air pressure to prevent the air in the heat removal chamber from moving into the test chamber through the second area, and the gas supplied to the inside of the test chamber through the air supply device has a temperature for maintaining the temperature in the test chamber Ambient temperature. 如請求項1所述的用於測試電子元件的處理器,其中, 所述第一區域的寬度比所述第二區域的寬度窄。The processor for testing an electronic component according to claim 1, wherein a width of the first region is narrower than a width of the second region. 一種用於測試電子元件的處理器,其中,包括: 加載裝置,將裝載於客戶託盤上的待測電子元件加載到位於加載位置的測試託盤上; 恒溫室,用於對裝載於來自加載位置的測試託盤上的電子元件施加熱刺激; 測試室,提供空間和溫度環境,以對經過所述恒溫室來到測試位置的溫度測試託盤上的電子元件進行測試; 第一輸送裝置,將所述恒溫室中的測試託盤傳送到所述測試室; 加壓裝置,將所述測試室內的位於測試位置的測試託盤上的電子元件向測試器的測試插座側施壓,以使電子元件電連接到測試插座上; 除熱室,用於除去來自所述測試室的測試託盤的電子元件的在所述恒溫室和所述測試室中被施加的熱刺激; 第二輸送裝置,用於將所述測試室中的測試託盤傳送到所述除熱室; 卸載裝置,從由所述除熱室來到卸載位置的測試託盤中卸載電子元件,根據測試結果進行分類並移動到客戶託盤;以及 第一開閉裝置,用於開閉作為從所述測試室傳送到所述除熱室的測試託盤的輸送通道中的一部分的第一區域, 作為與由所述第一開閉裝置開閉的所述第一區域不同的部分且形成所述輸送通道的第二區域,與所述第一開閉裝置無關, 所述第二輸送裝置包括: 把持構件,用於把持或解除把持測試託盤; 執行器,使所述把持構件把持或解除把持測試託盤;以及 驅動器,用於使所述把持構件沿測試託盤的傳送方向移動, 所述第一開閉裝置包括:第一門,當測試託盤從所述測試室向所述除熱室移動時打開,當所述第一門關閉時,至少封閉所述第一區域並阻止測試託盤從所述測試室向所述除熱室移動,以防止所述測試室和所述除熱室之間的熱交換;第一驅動器,提供用於打開或關閉所述第一門的動力, 所述第二區域具有允許所述把持構件的把持部位通過的寬度以及長度短於所述第一區域的長度, 當所述第一區域打開時,所述輸送通道允許測試託盤從所述測試室的內部向所述除熱室的內部移動。A processor for testing electronic components, comprising: a loading device for loading an electronic component to be tested loaded on a customer tray onto a test tray located at a loading position; a thermostatic chamber for loading a load from a loading position The electronic components on the test tray apply thermal stimulus; the test chamber provides space and temperature environment to test the electronic components on the temperature test tray that has reached the test position through the constant temperature chamber; The test tray in the chamber is transferred to the test chamber; a pressurizing device presses the electronic components on the test tray located in the test position in the test chamber to the test socket side of the tester so that the electronic components are electrically connected to the test On a socket; a heat removal chamber for removing thermal stimuli applied to the electronic components from the test tray of the test chamber in the thermostatic chamber and the test chamber; a second conveying device for transferring the test The test tray in the chamber is transferred to the de-heating chamber; an unloading device, which unloads the electrons from the test tray from the de-heating chamber to the unloading position. And the first opening and closing device for opening and closing the first area as a part of the conveying path of the test tray transferred from the test chamber to the heat removal chamber, as The second area that is different from the first area opened and closed by the first opening and closing device and forms the conveying channel is independent of the first opening and closing device. The second conveying device includes a holding member for An actuator for gripping or releasing the test tray; an actuator for causing the gripping member to grip or release the test tray; and a driver for moving the gripping member in a transfer direction of the test tray, the first opening and closing device includes: A door that is opened when the test tray is moved from the test chamber to the heat removal chamber, and when the first door is closed, at least the first area is closed and the test tray is prevented from moving from the test chamber to the heat removal chamber A hot chamber is moved to prevent heat exchange between the test chamber and the heat removal chamber; a first driver provides power for opening or closing the first door, The second area has a width and a length that allow the holding portion of the holding member to pass through is shorter than the length of the first area. When the first area is opened, the conveying channel allows a test tray to pass from the test chamber. The inside moves toward the inside of the heat removal chamber. 如請求項8所述的用於測試電子元件的處理器,其中, 還包括用於開閉所述第二區域的第二開閉裝置, 所述第二開閉裝置具備第二門和提供用於打開和關閉所述第二門的動力的第二驅動器,所述第二門以使所述把持構件的把持部位即便在所述第一門關閉的狀態也能從所述除熱室通過所述第二區域向所述測試室移動的方式打開第二區域,當所述第二門關閉時,封閉所述第二區域以防止述測試室和所述除熱室之間的熱交換, 當所述第一區域和所述第二區域全部打開時,所述輸送通道允許測試託盤從所述測試室的內部向所述除熱室的內部移動。The processor for testing an electronic component according to claim 8, further comprising a second opening and closing device for opening and closing the second area, the second opening and closing device having a second door and provided for opening and closing A power-driven second driver for closing the second door, so that the second door can pass the second heat-removing chamber from the heat-removing chamber to the second door so that the holding portion of the holding member is closed. The second area is opened in a manner that the area moves toward the test room. When the second door is closed, the second area is closed to prevent heat exchange between the test room and the heat removal room. When one area and the second area are all opened, the conveying channel allows the test tray to move from the inside of the test chamber to the inside of the heat removal chamber.
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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102461321B1 (en) * 2017-08-18 2022-11-02 (주)테크윙 Handler for testing electro devices
KR102638649B1 (en) * 2020-07-07 2024-02-19 세메스 주식회사 Semiconductor device pressing apparatus and test handler comprising the same
JP2022021241A (en) * 2020-07-21 2022-02-02 株式会社アドバンテスト Electronic component handling device and electronic component testing device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008075439A1 (en) * 2006-12-21 2008-06-26 Advantest Corporation Electronic component testing equipment and method of testing electronic component
US20130086804A1 (en) * 2010-07-09 2013-04-11 Panasonic Corporation Component-mounting device, and component-mounting method
CN103302037A (en) * 2012-03-16 2013-09-18 泰克元有限公司 Test sorting machine
CN104001680A (en) * 2013-06-18 2014-08-27 泰克元有限公司 Testing sorter
CN106076876A (en) * 2015-04-30 2016-11-09 泰克元有限公司 Semiconductor element test separator

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3706817A1 (en) * 1986-03-03 1987-09-10 Microhandling Handhabungsgerae Device for separating integrated circuits ICs
TW379285B (en) * 1997-07-02 2000-01-11 Advantest Corp Testing device for semiconductor components and the testing trays used in the testing apparatus
JP3409841B2 (en) * 1998-10-07 2003-05-26 沖電気工業株式会社 Profile extraction method
KR100541546B1 (en) * 2003-07-14 2006-01-10 삼성전자주식회사 Semiconductor device test apparatus
KR100560729B1 (en) * 2005-03-22 2006-03-14 미래산업 주식회사 Handler for testing semiconductor
KR100714106B1 (en) * 2005-12-15 2007-05-02 (주)테크윙 Test handler and operation method of test handler
KR100892254B1 (en) * 2006-07-20 2009-04-17 (주)테크윙 Test handler
JP4996184B2 (en) * 2006-09-19 2012-08-08 東京エレクトロン株式会社 Wafer temperature control apparatus and wafer temperature control method
KR100997131B1 (en) * 2008-07-18 2010-11-29 (주) 예스티 Apparatus for openning and closing door of chamber
KR100897067B1 (en) * 2008-08-26 2009-05-14 (주)테크윙 Tray transfer apparatus for test handler
JP5938932B2 (en) * 2012-02-14 2016-06-22 セイコーエプソン株式会社 Handler and parts inspection device
KR101456446B1 (en) * 2014-03-10 2014-10-31 (주)풍천엔지니어링 plume and power reduction high-efficiency counter flow cooling tower and control method thereof
KR102123052B1 (en) * 2014-06-23 2020-06-15 (주)테크윙 Test handler
KR102120714B1 (en) * 2014-07-09 2020-06-17 (주)테크윙 Handler for testing semiconductor device
KR102187839B1 (en) * 2014-11-28 2020-12-08 (주)테크윙 Test handler
US20160187414A1 (en) * 2014-12-30 2016-06-30 United Microelectronics Corp. Device having finfets and method for measuring resistance of the finfets thereof
US10163686B2 (en) * 2015-03-30 2018-12-25 Taiwan Semiconductor Manufacturing Company, Ltd. Thermal sensor arrangement and method of making the same
TW201715241A (en) * 2015-10-23 2017-05-01 Hon Tech Inc Electronic device operation apparatus and test handler using the same comprising a test mechanism, a transport mechanism, and a temperature control unit
WO2017120514A1 (en) * 2016-01-08 2017-07-13 Aehr Test Systems Method and system for thermal control of devices in an electronics tester
CN106908711A (en) * 2017-02-06 2017-06-30 张家港市欧微自动化研发有限公司 A kind of high/low temperature test device for being applied to IC tests
KR102461321B1 (en) * 2017-08-18 2022-11-02 (주)테크윙 Handler for testing electro devices

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008075439A1 (en) * 2006-12-21 2008-06-26 Advantest Corporation Electronic component testing equipment and method of testing electronic component
US20130086804A1 (en) * 2010-07-09 2013-04-11 Panasonic Corporation Component-mounting device, and component-mounting method
CN103302037A (en) * 2012-03-16 2013-09-18 泰克元有限公司 Test sorting machine
CN104001680A (en) * 2013-06-18 2014-08-27 泰克元有限公司 Testing sorter
CN106076876A (en) * 2015-04-30 2016-11-09 泰克元有限公司 Semiconductor element test separator

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