TWI711829B - Handler for testing electronic component - Google Patents
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- TWI711829B TWI711829B TW108135544A TW108135544A TWI711829B TW I711829 B TWI711829 B TW I711829B TW 108135544 A TW108135544 A TW 108135544A TW 108135544 A TW108135544 A TW 108135544A TW I711829 B TWI711829 B TW I711829B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
- B65D81/18—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents providing specific environment for contents, e.g. temperature above or below ambient
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2862—Chambers or ovens; Tanks
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
- G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Mechanical Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
本發明涉及用於測試電子元件的處理器。本發明的用於測試電子元件的處理器將一個特定傳送裝置負責傳送的傳送區間分為第一負責區間和第二負責區間,並且使得在第一負責區間傳送時握持測試托盤的部位和在第二負責區間傳送時握持測試托盤的部位不同,當一起測試裝載於多個測試托盤的多個電子元件時,多個測試托盤在相應的傳送區間能夠彼此獨立且同時傳送。根據本發明,簡化和減少傳送裝置的結構,從而具有降低生產成本和減小設備的尺寸的效果。The invention relates to a processor for testing electronic components. The processor for testing electronic components of the present invention divides the transfer section in charge of a specific transfer device into a first charge zone and a second charge zone, and makes the part of the test tray held during the transfer in the first charge zone and The parts where the test tray is held during the second responsible section transfer are different. When multiple electronic components loaded on multiple test trays are tested together, the multiple test trays can be transferred independently and simultaneously in the corresponding transfer section. According to the present invention, the structure of the conveying device is simplified and reduced, thereby having the effect of reducing the production cost and the size of the equipment.
Description
發明領域 本發明涉及一種測試電子元件時使用的測試托盤以及用於測試電子元件的處理器(HANDLER),所述處理器在移動相應測試托盤的同時進行電子元件的測試。Invention field The present invention relates to a test tray used when testing electronic components and a processor (HANDLER) for testing electronic components. The processor performs testing of the electronic components while moving the corresponding test tray.
發明背景 如所生產的半導體器件的電子元件由測試器測試,然後分為合格品和不合格品,並只出貨合格品。Background of the invention For example, the electronic components of the produced semiconductor device are tested by a tester, and then divided into qualified products and unqualified products, and only qualified products are shipped.
測試器與電子元件之間的電連接是由用於測試電子元件的處理器(下面成為“處理器”)實現。The electrical connection between the tester and the electronic component is realized by a processor (hereinafter referred to as "processor") for testing the electronic component.
處理器根據待測試的電子元件的測試的類型以各種形式製造。在這種處理器中,對電子元件和測試器之間的電連接技術、溫度控制技術、與處理速度相關的技術、降低生產成本的技術以及設備小型化的技術等進行了持續的研究和開發。The processor is manufactured in various forms according to the test type of the electronic component to be tested. In this processor, continuous research and development have been carried out on the electrical connection technology between the electronic components and the tester, temperature control technology, processing speed-related technology, technology to reduce production costs, and technology to miniaturize equipment. .
處理器主要可以分為應用和未應用待輸送電子元件的測試托盤,本發明涉及應用測試托盤。Processors can be mainly divided into test trays with applied and unused electronic components to be transported. The present invention relates to applied test trays.
該發明的申請人在該發明之前提出一種應用了測試托盤的處理器(以下稱為“在先申請技術”),作為韓國專利申請10-2018-000000號。The applicant of the invention proposed a processor (hereinafter referred to as the "prior application technique") to which a test tray was applied before the invention, as Korean Patent Application No. 10-2018-000000.
根據如圖1的參照圖所示的在先申請技術,測試托盤TT沿著恆定的循環路徑C循環移動,並且同時測試裝載於兩個測試托盤TT的多個電子元件。這裡,兩個測試托盤TT在恆溫室SC、測試室TC、除熱室DC連接的一部分區間區分移動路徑C1、C2。另外,儘管圖1中未示出,但測試托盤TT和處理器HR具有可以將裝載於測試托盤TT的電子元件分成一半,並分為兩個階段進行測試的特徵結構。According to the prior application technique as shown in the reference diagram of FIG. 1, the test tray TT cyclically moves along a constant circulation path C, and simultaneously tests a plurality of electronic components loaded on two test trays TT. Here, the two test trays TT divide the movement paths C1 and C2 in a part of the section where the constant temperature chamber SC, the test chamber TC, and the heat removal chamber DC are connected. In addition, although not shown in FIG. 1, the test tray TT and the processor HR have a characteristic structure that can divide the electronic components loaded on the test tray TT into half and perform testing in two stages.
根據在先申請技術的特徵結構,同時測試裝載於兩個測試托盤TT的電子元件,還擴大了處理容量,並且通過最小限度地增加結構和空間來獲得降低生產成本和小型化。According to the characteristic structure of the prior application technology, the electronic components loaded on the two test trays TT are tested simultaneously, and the processing capacity is also expanded, and the production cost and miniaturization are achieved by minimizing the increase in structure and space.
另一方面,處理器HR中應具備用於循環移動測試托盤TT的各種傳送裝置。因此,如在先技術所示,為了同時測試裝載於兩個測試托盤TT的電子元件,需要具備相應的傳送裝置。韓國專利公開10-2000-0068397號(以下,稱為“現有技術”)中公開了一種將兩個測試托盤以彼此一體化的狀態傳送的技術。然而,為了如上述以彼此一體化的狀態傳送兩個測試托盤,傳送裝置也需要相應地設置。On the other hand, the processor HR should be equipped with various conveying devices for circulating the test tray TT. Therefore, as shown in the prior art, in order to test the electronic components loaded on the two test trays TT at the same time, it is necessary to have a corresponding transfer device. Korean Patent Publication No. 10-2000-0068397 (hereinafter, referred to as "prior art") discloses a technique for transferring two test trays in an integrated state with each other. However, in order to convey the two test trays in an integrated state with each other as described above, the conveying device also needs to be arranged accordingly.
此外,傳送裝置在傳送測試托盤時為了傳送至需要傳送的距離,必須確保相應的操作距離。In addition, the conveyor must ensure a corresponding operating distance in order to transfer the test tray to the required distance.
即,如在先技術或現有技術所示,如果恆溫室、測試室以及除熱室欲將兩個測試托盤容納在一起,則相應地,傳送裝置的尺寸必須變大且變得複雜,但是,這導致了設備過大。That is, as shown in the prior art or the prior art, if the constant temperature chamber, the test chamber, and the heat removal chamber are to accommodate two test trays together, the size of the conveying device must be enlarged and complicated accordingly, but, This caused the device to be too large.
發明概要 需要解決的課題 本發明是基於在先技術擴展而得出,本發明的目的在於提供一種技術,其可以實現用於傳送測試托盤的多個傳送裝置的尺寸最小化。 解決課題的手段Summary of the invention Problems to be solved The present invention is derived based on the expansion of the prior art. The purpose of the present invention is to provide a technique that can minimize the size of multiple conveying devices for conveying test trays. Means to solve the problem
根據本發明的第一方案的用於測試電子元件的處理器,其包括:加載裝置,將多個待測試的電子元件加載到位於加載位置的測試托盤;連接裝置,將利用所述加載裝置完成電子元件的加載之後裝載在來到測試位置上的所述測試托盤中的電子元件電連接到測試器;卸載裝置,從利用所述連接裝置電連接到測試器的電子元件的測試完成之後來到卸載位置的所述測試托盤,將已完成測試的多個電子元件進行卸載;多個傳送裝置,用於沿著經由所述加載位置、所述測試位置及所述卸載位置而連接到所述加載位置的循環路徑傳送所述測試托盤;以及控制裝置,控制所述加載裝置、所述連接裝置、所述卸載裝置及所述多個傳送裝置,所述多個傳送裝置在一次操作中僅傳送一個測試托盤,使得沿著所述循環路徑傳送的多個測試托盤能夠彼此獨立地單獨傳送,所述多個傳送裝置中的至少一個特定傳送裝置選擇性地握持所述測試托盤的前端邊或後端邊以沿著所述循環路徑傳送,-所述前端邊是指沿著所述循環路徑傳送測試托盤時位於前方的邊,所述後端邊是指位於與所述前端邊相對的後方的邊-,所述控制裝置將所述特定傳送裝置負責的傳送區間沿著所述測試托盤的傳送方向順序地分為第一傳送區域和第二傳送區域,並控制所述特定傳送裝置,從而當所述特定傳送裝置在所述第一傳送區域傳送所述測試托盤時,使得所述特定傳送裝置握持所述測試托盤的前端邊,而當所述特定傳送裝置在所述第二傳送區域傳送所述測試托盤時,使得所述特定傳送裝置握持所述測試托盤的後端邊。The processor for testing electronic components according to the first aspect of the present invention includes: a loading device that loads a plurality of electronic components to be tested on a test tray located at a loading position; and a connecting device that uses the loading device to complete After the electronic component is loaded, the electronic component loaded in the test tray that comes to the test position is electrically connected to the tester; the unloading device comes after the completion of the test of the electronic component electrically connected to the tester by the connecting device The test tray in the unloading position unloads a plurality of electronic components that have been tested; a plurality of conveying devices are used to connect to the loading position along the loading position, the test position, and the unloading position. The test tray is conveyed by the circulation path of the position; and a control device that controls the loading device, the connecting device, the unloading device, and the multiple conveying devices, and the multiple conveying devices convey only one in one operation Test trays, so that a plurality of test trays conveyed along the circulation path can be independently conveyed independently of each other, and at least one specific conveying device of the plurality of conveying devices selectively holds the front edge or rear of the test tray The end edge is conveyed along the circulation path, the front edge refers to the edge located in the front when the test tray is transferred along the circulation path, and the rear edge refers to the rear edge opposite to the front edge On the other hand, the control device divides the conveying section in charge of the specific conveying device into a first conveying area and a second conveying area sequentially along the conveying direction of the test tray, and controls the specific conveying device so as to When the specific conveying device conveys the test tray in the first conveying area, the specific conveying device holds the front edge of the test tray, and when the specific conveying device conveys the test tray in the second conveying area When the test tray is being tested, the specific conveying device is made to hold the rear end of the test tray.
根據本發明的第二方案的用於測試電子元件的處理器,其包括:加載裝置,將多個待測試的電子元件加載到位於加載位置的測試托盤;連接裝置,將利用所述加載裝置完成電子元件的加載之後裝載在來到測試位置上的所述測試托盤中的電子元件電連接到測試器;卸載裝置,從利用所述連接裝置電連接到測試器的電子元件的測試完成之後來到卸載位置的所述測試托盤,將已完成測試的多個電子元件進行卸載;多個傳送裝置,用於沿著經由所述加載位置、所述測試位置及所述卸載位置而連接到所述加載位置的循環路徑傳送所述測試托盤;以及控制裝置,控制所述加載裝置、所述連接裝置、所述卸載裝置及所述多個傳送裝置,多個測試托盤能夠在所述測試位置並排放置,所述連接裝置能夠將裝載於所述多個測試托盤的多個電子元件一起電連接到測試器,在所述多個傳送裝置中,負責在所述多個測試托盤進入所述測試位置的傳送區間或者從所述測試位置前進的傳送區間進行傳送的特定傳送裝置具有多個,以對應所述多個測試托盤的數量,由此,所述多個測試托盤彼此獨立,但能夠同時傳送。The processor for testing electronic components according to the second aspect of the present invention includes: a loading device, which loads a plurality of electronic components to be tested on a test tray located at a loading position; and a connecting device, which will be completed by the loading device After the electronic component is loaded, the electronic component loaded in the test tray that comes to the test position is electrically connected to the tester; the unloading device comes after the completion of the test of the electronic component electrically connected to the tester by the connecting device The test tray in the unloading position unloads a plurality of electronic components that have been tested; a plurality of conveying devices are used to connect to the loading position along the loading position, the test position, and the unloading position. Position of the circulation path to transport the test tray; and a control device that controls the loading device, the connecting device, the unloading device, and the multiple conveying devices, and the multiple test trays can be placed side by side at the test location, The connecting device can electrically connect the plurality of electronic components loaded on the plurality of test trays to the tester, and the plurality of conveying devices are responsible for the conveying of the plurality of test trays into the test position. There are a plurality of specific conveying devices for conveying in a section or a conveying section advancing from the test position to correspond to the number of the plurality of test trays. Therefore, the plurality of test trays are independent of each other but can be conveyed simultaneously.
所述特定傳送裝置選擇性地握持所述測試托盤的前端邊或後端邊以沿著所述循環路徑傳送。這裡,前端邊是指沿著循環路徑傳送測試托盤時位於前方的邊,後端邊是指位於與前端邊相對的後方的邊。The specific conveying device selectively grips the front edge or the rear edge of the test tray to convey it along the circulation path. Here, the front edge refers to the side located forward when the test tray is conveyed along the circulation path, and the rear edge refers to the side located at the rear opposite to the front edge.
所述特定傳送裝置包括:握持器,具有握持構件,所述握持構件能夠選擇性地握持所述測試托盤的前端邊或後端邊;以及移動器,定位所述握持構件,使得所述握持構件選擇性地握持所述測試托盤的前端邊或後端邊,並通過移動所述握持構件來沿著所述循環路徑傳送被所述握持器握持的測試托盤。The specific conveying device includes: a holder having a holding member capable of selectively holding a front end or a rear end of the test tray; and a mover that positions the holding member, The holding member is made to selectively hold the front edge or the rear edge of the test tray, and the holding member is moved to convey the test tray held by the holder along the circulation path .
所述握持器還包括升降源,所述升降源使所述握持構件進行升降,從而使所述握持構件能夠對所述測試托盤的前端邊或後端邊進行握持或解除握持,所述握持構件中具有握持槽,所述測試托盤的前端邊或後端邊能夠插入所述握持槽,從而能夠利用升降對所述測試托盤的前端邊或後端邊進行握持或解除握持。The holder further includes a lifting source that lifts and lowers the holding member so that the holding member can hold or release the front edge or the rear edge of the test tray , The holding member has a holding groove, and the front edge or the rear edge of the test tray can be inserted into the holding groove, so that the front edge or the rear edge of the test tray can be held by lifting Or lift the grip.
所述握持器包括旋轉源,所述旋轉源使所述握持構件旋轉,以使所述握持構件對所述測試托盤的前端邊進行握持或解除握持,所述測試托盤包括:多個裝載元件,用於裝載多個電子元件;以及設置框架,設置有多個所述裝載元件,並形成所述測試托盤的外框,所述設置框架的前端邊和後端邊具有一部分向前方或後方開放的卡扣槽,-前方是指測試托盤沿著循環路徑傳送時欲前進的方向,後方是指前方的相反方向-,所述握持構件能夠插入所述卡扣槽,並且所述握持構件具有握持部分,在所述握持構件插入所述卡扣槽的狀態下,所述握持部分能夠根據該旋轉狀態懸掛所述設置框架的前端邊和後端邊以對所述測試托盤進行握持或解除握持。The holder includes a rotation source that rotates the holding member so that the holding member can hold or release the front edge of the test tray, and the test tray includes: A plurality of loading elements for loading a plurality of electronic components; and a setting frame, provided with a plurality of the loading elements, and forming the outer frame of the test tray, the front and rear sides of the setting frame have a The front or rear opening of the buckle slot,-the front refers to the direction in which the test tray is going to advance when transported along the circulation path, and the rear refers to the opposite direction to the front-the gripping member can be inserted into the buckle slot, and The gripping member has a gripping portion, and in a state where the gripping member is inserted into the buckle groove, the gripping portion can hang the front and rear sides of the setting frame according to the rotating state to align the The test tray is held or released.
所述用於測試電子元件的處理器還包括:恆溫室,容納利用所述加載裝置對待測試的電子元件完成加載的所述測試托盤,對已容納的所述測試托盤中所裝載的電子元件進行預熱或預冷;測試室,容納來自所述恆溫室的所述測試托盤,並支援溫度環境,使得已容納的所述測試托盤中裝載的電子元件能夠進行測試;以及除熱室,容納來自所述測試室的所述測試托盤,並用於在將所述測試托盤傳送到所述卸載位置之前,使裝載於所述測試托盤的多個電子元件恢復到常溫,所述恆溫室、所述測試室及所述除熱室在所述循環路徑上並排佈置,所述多個傳送裝置中將所述測試托盤從所述恆溫室傳送到所述測試室的第二傳送裝置包括:第二握持器,具有第二握持構件,所述第二握持構件能夠握持所述測試托盤的後端邊;及第二移動器,定位所述第二握持構件以握持所述測試托盤的後端邊,並通過移動所述第二握持構件來傳送被所述第二握持器握持的所述測試托盤,以從所述恆溫室傳送到所述測試室,所述多個傳送裝置中將所述測試托盤從所述測試室傳送到所述除熱室的第三傳送裝置可以包括:第三握持器,具有第三握持構件,所述第三握持構件能夠選擇性地握持所述測試托盤的前端邊或後端邊;及第三移動器,定位所述第三握持構件以選擇性地握持所述測試托盤的前端邊或後端邊,並通過移動所述第三握持構件來傳送被所述第三握持器握持的所述測試托盤,以從所述測試室傳送到所述除熱室。The processor for testing electronic components further includes: a constant temperature chamber, accommodating the test tray that is loaded with the electronic component to be tested by the loading device, and performing processing on the electronic components loaded in the stored test tray Preheating or pre-cooling; a test chamber, which contains the test tray from the constant temperature chamber, and supports a temperature environment so that the electronic components loaded in the stored test tray can be tested; and a heat removal chamber, which contains The test tray of the test chamber is used to restore the plurality of electronic components loaded on the test tray to normal temperature before the test tray is transferred to the unloading position, the constant temperature chamber, the test The chamber and the heat removal chamber are arranged side by side on the circulation path, and among the plurality of transfer devices, the second transfer device that transfers the test tray from the constant temperature chamber to the test chamber includes: a second grip A device having a second holding member capable of holding the rear end of the test tray; and a second mover that positions the second holding member to hold the test tray The rear end, and by moving the second holding member to transfer the test tray held by the second holder to transfer from the constant temperature chamber to the test chamber, the plurality of transfers The third transfer device for transferring the test tray from the test chamber to the heat removal chamber in the device may include: a third holder having a third holding member, and the third holding member can be selectively Holding the front or rear end of the test tray; and a third mover, positioning the third holding member to selectively hold the front or rear end of the test tray, and moving The third holding member transfers the test tray held by the third holder to transfer the test tray from the test chamber to the heat removal chamber.
所述第二握持構件利用所述第二握持構件的升降或者所述測試托盤的升降能夠對所述測試托盤進行握持或解除握持,所述第三握持器包括:第三握持構件,能夠選擇性地握持所述測試托盤的前端邊或後端邊以及旋轉源,使所述第三握持構件正向和反向旋轉,以使所述第三握持構件能夠對所述測試托盤的前端邊或後端邊進行握持或解除握持。 發明效果The second holding member can use the lifting of the second holding member or the lifting of the test tray to hold or release the holding of the test tray, and the third holding device includes: a third holding device The holding member can selectively hold the front edge or the rear edge of the test tray and the rotation source, so that the third holding member can be rotated forward and backward, so that the third holding member can be aligned The front edge or the rear edge of the test tray is held or released. Invention effect
根據本發明,其具有以下效果,通過簡化傳送裝置的結構,以使與其他結構的機械干涉而導致的設計的複雜性最小,從而降低了生產成本,並且由於該尺寸減小,從而防止了設備過大。According to the present invention, it has the effect of simplifying the structure of the conveying device to minimize the complexity of the design caused by mechanical interference with other structures, thereby reducing the production cost, and due to the reduction in size, preventing the equipment is too big.
較佳實施例之詳細說明 將參考附圖說明本發明的優選實施例,單位了說明的簡潔,盡可能省略或壓縮對重複或者實質相同的結構的說明。 >術語的定義>Detailed description of the preferred embodiment The preferred embodiments of the present invention will be described with reference to the accompanying drawings, and the description is concise, and the description of repeated or substantially identical structures is omitted or compressed as much as possible. >Definition of terms>
在本說明中,測試托盤的結構中使用的名稱中,術語“前端邊”是指當沿著循環路徑傳送測試托盤時位於測試托盤的前行方向側的前方的一側,術語“後端邊”是指位於與前端邊相對的後方的一側。In this description, among the names used in the structure of the test tray, the term "front edge" refers to the side located in front of the forward direction side of the test tray when the test tray is conveyed along the circulation path, and the term "rear edge" "Refers to the side opposite to the front edge.
因此,參照圖2,當測試托盤TT沿第一箭頭方向a傳送時,Y軸上的後側邊S3是前端邊,前側邊S1是後端邊。另外,當測試托盤TT沿第二箭頭方向b傳送時,X軸上的右側邊S4是前端邊,左側邊S2是後端邊。Therefore, referring to FIG. 2, when the test tray TT is transported in the first arrow direction a, the rear side S3 on the Y axis is the front end side, and the front side S1 is the rear end side. In addition, when the test tray TT is transported in the second arrow direction b, the right side S4 on the X axis is the front end, and the left side S2 is the rear end.
同樣,術語“前方”是指沿著循環路徑傳送測試托盤TT時的要前行的方向,術語“後方”是指前方的相反反向。 >測試托盤的說明>Likewise, the term "front" refers to the direction to travel when the test tray TT is conveyed along the circular path, and the term "rear" refers to the reverse of the front. >Description of the test tray>
參照圖2,測試托盤TT包括多個裝載元件LE和設置框架IF。2, the test tray TT includes a plurality of loading elements LE and a setting frame IF.
多個裝載元件LE用於裝載電子元件D。A plurality of loading components LE are used for loading electronic components D.
設置框架IF中設置有裝載元件LE,並構成測試托盤TT的外框。這種設置框架IF的X軸方向上的兩個側邊具有向外側(前側和後側)部分地開放的卡扣槽JG。因此,當在平面上觀察時,兩個卡扣槽JG具有在X軸方向方帶有尾部的軸對稱“T”形狀。The mounting frame IF is provided with a loading element LE, and constitutes the outer frame of the test tray TT. The two sides in the X-axis direction of this setting frame IF have snap grooves JG partially open to the outside (front side and rear side). Therefore, when viewed on a plane, the two locking grooves JG have an axisymmetric "T" shape with a tail in the X-axis direction.
如圖3所示,測試托盤TT利用多個傳送裝置沿著封閉的循環路徑C進行循環移動,所述封閉的循環路徑C為經由加載位置LP、測試位置TP、卸載位置UP以及待機位置WP連接到加載位置LP。As shown in FIG. 3, the test tray TT uses a plurality of conveying devices to cyclically move along a closed circulation path C, which is connected via a loading position LP, a test position TP, an unloading position UP, and a standby position WP. To the loading position LP.
當測試托盤TT位於加載位置LP時,待測試的多個電子元件D加載到測試托盤TT。When the test tray TT is located at the loading position LP, a plurality of electronic components D to be tested are loaded on the test tray TT.
當測試托盤TT位於測試位置TP時,裝載於測試托盤TT的多個電子元件D與測試器電連接,以供多個電子元件D能夠被測試器測試。When the test tray TT is located at the test position TP, the multiple electronic components D loaded on the test tray TT are electrically connected to the tester, so that the multiple electronic components D can be tested by the tester.
在卸載位置UP,已完成測試的多個電子元件D從測試托盤TT卸載。At the unloading position UP, the plurality of electronic components D that have completed the test are unloaded from the test tray TT.
在待機位置WP,在當前加載位置LP進行加載操作的前一個測試托盤TT完成加載操作後傳送到恆溫室SC為止,後一個空的測試托盤TT在移動到加載位置LP之前進行等待。In the standby position WP, the previous test tray TT that performs the loading operation at the current loading position LP is transferred to the constant temperature chamber SC after the loading operation is completed, and the latter empty test tray TT waits before moving to the loading position LP.
作為參考,在圖3的概念圖中,如在先技術所示,示出了為了擴大處理容量而具有一次裝載到兩個測試托盤TT的多個電子元件D同時測試的結構的處理器HR。因此,當在平面上觀察時,恆溫室SC、測試室TC以及除熱室DC中各容納有兩個測試托盤TT。因此,從恆溫室SC進入測試室TC內的測試位置TP或者從測試位置TP進入除熱室DC的傳送路徑C1、C2分為兩個,在該傳送路徑C1、C2中,兩個測試托盤TT彼此獨立而不結合,但是彼此可以同時傳送。當然,根據實施方法,當然也可以考慮簡化為一次僅對一個測試托盤TT中裝載的多個電子元件D進行測試的結構,也可以考慮對三個以上的測試托盤TT中裝載的多個電子元件D進行測試的結構以實現擴大處理容量。 >處理器的概略的說明>For reference, in the conceptual diagram of FIG. 3, as shown in the prior art, a processor HR having a structure in which a plurality of electronic components D loaded on two test trays TT at a time are simultaneously tested in order to expand the processing capacity is shown. Therefore, when viewed on a plane, two test trays TT are each contained in the constant temperature chamber SC, the test chamber TC, and the heat removal chamber DC. Therefore, the conveying paths C1 and C2 from the constant temperature chamber SC to the test position TP in the test chamber TC or from the test position TP to the heat removal chamber DC are divided into two. In the conveying paths C1, C2, two test trays TT They are independent of each other and not combined, but they can be transmitted simultaneously. Of course, according to the implementation method, it can of course also be considered to be simplified to a structure in which only multiple electronic components D loaded in one test tray TT are tested at a time, or multiple electronic components loaded in more than three test trays TT can be considered. D is the structure for testing to achieve expansion of processing capacity. >Outline description of the processor>
圖4是用於說明根據本發明的一實施例的用於測試電子元件的處理器HR(以下,簡稱為“處理器”)的結構的概念性的俯視圖。4 is a conceptual top view for explaining the structure of a processor HR (hereinafter, simply referred to as "processor") for testing electronic components according to an embodiment of the present invention.
如圖4所示,根據本實施例的處理器HR包括:加載裝置100、恆溫室SC、測試室TC、連接裝置200、除熱室DC、卸載裝置300、第一傳送裝置400、兩個第二傳送裝置500、兩個第三傳送裝置600、第四傳送裝置700、第五傳送裝置800以及控制裝置900。As shown in FIG. 4, the processor HR according to this embodiment includes: a
加載裝置100將多個待測試的電子元件D從客戶托盤CT1加載到位於加載位置LP的測試托盤TT。The
當在平面上觀察時,恆溫室SC可以容納兩個測試托盤TT,對已容納的測試托盤TT中所裝載的多個電子元件D預先被加熱或冷卻。即,恆溫室SC容納利用加載裝置100對待測試的電子元件D完成加載的測試托盤TT,並用於對已容納的測試托盤TT中裝載的多個電子元件D進行預熱或預冷。When viewed on a plane, the thermostatic chamber SC can accommodate two test trays TT, and the plurality of electronic components D loaded in the accommodated test trays TT are heated or cooled in advance. That is, the constant temperature chamber SC accommodates the test tray TT loaded with the electronic component D to be tested by the
測試室TC可以容納來自恆溫室SC的兩個測試托盤TT,並用於提供能夠測試所容納的測試托盤TT中裝載的多個電子元件D的溫度環境。在這種測試室TC中,裝載於測試托盤TT的多個電子元件D與位於下方的測試器(未示出)電連接,從而由測試器進行測試。The test chamber TC can accommodate two test trays TT from the constant temperature chamber SC, and is used to provide a temperature environment capable of testing a plurality of electronic components D loaded in the accommodated test tray TT. In this test chamber TC, a plurality of electronic components D loaded on the test tray TT are electrically connected to a tester (not shown) located below, so that the tester performs testing.
連接裝置200對在並排放置在位於測試室TC內部的測試位置TP處的兩個測試托盤TT中裝載的多個電子元件D向下方進行按壓,以使所述多個電子元件D與測試器電連接。The connecting
當在平面上觀察時,除熱室260能夠容納兩個測試托盤TT,在將測試托盤TT發送到卸載位置UP之前,將來自測試室TC的測試托盤TT中裝載的多個電子元件D恢復到常溫或接近常溫,以便在稍後進行多個電子元件D的適當的卸載操作。When viewed on a plane, the heat removal chamber 260 can accommodate two test trays TT, and before the test tray TT is sent to the unloading position UP, the multiple electronic components D loaded in the test tray TT from the test chamber TC are restored to Normal temperature or close to normal temperature, so that proper unloading operation of a plurality of electronic components D can be performed later.
如上所述的恆溫室SC、測試室TC以及除熱室DC在循環路徑C上沿X軸方向並排放置。The constant temperature chamber SC, the test chamber TC, and the heat removal chamber DC as described above are placed side by side along the X-axis direction on the circulation path C.
卸載裝置300將從除熱室DC移動到卸載位置UP的測試托盤TT中裝載的多個電子元件D從測試托盤TT中進行卸載,並根據測試類別進行分類,然後將分類後的所述多個電子元件D裝載到空的客戶托盤CT2。The
第一傳送裝置400至第五傳送裝置800沿著循環路徑C傳送測試托盤TT。The
第一傳送裝置400在從加載位置LP到恆溫室SC內部為止的第一傳送區間①上傳送測試托盤TT。The
第二傳送裝置500在從恆溫室SC的內部到測試位置TP為止的第二傳送區間②-1、②-2上傳送測試托盤TT。The
第三傳送裝置600在從測試位置TP到除熱室DC的內部為止的第三傳送區間③-1、③-2上傳送測試托盤TT。The
第四傳送裝置700在從除熱室DC的內部到卸載位置UP為止的第四傳送區間④上傳送測試托盤TT。The
第五傳送裝置800在從卸載位置UP經由待機位置WP到加載位置LP為止的第五傳送區間⑤上傳送測試托盤TT。The fifth conveying
上述的第一傳送裝置400至第五傳送裝置800在一次操作中僅傳送一個測試托盤TT,使得沿著循環路徑C傳送的多個測試托盤TT彼此獨立地單獨傳送。當然,兩個第二傳送裝置500也可以將兩個測試托盤TT彼此獨立地單獨從恆溫室SC傳送到測試位置TP,但也可以控制成同時傳送,兩個第三傳送裝置600也可以將兩個測試托盤TT彼此獨立地單獨從測試位置TP傳送到除熱室DC,並且也可以控制成同時傳送。The above-mentioned
控制裝置900控制上述每個結構。
>特徵結構的說明>
1. 第一傳送裝置The
第一傳送裝置400從加載位置LP將對多個電子元件D完成加載的測試托盤TT傳送到恆溫室SC的內部。為此,第一傳送裝置400位於恆溫室SC中的測試托盤TT的上方,如圖5的部分立體分解圖所示,所述第一傳送裝置400包括第一握持器410和第一移動器420。The
第一握持器410對測試托盤TT的前端邊或後端邊進行握持或解除該握持。這裡,前端邊和後端邊是Y軸方向上彼此相對的邊。這種第一握持器410包括:第一握持構件411、第一結合構件412、第一升降軌道413以及第一升降源414。The
第一握持構件411可以針對應該在Y軸方向上移動的測試托盤TT的前端邊或後端邊進行握持或解除握持,並且以能夠升降的方式結合到第一結合構件412。為此,第一握持構件411包括握持槽GG,測試托盤TT的前端邊或後端邊能夠插入所述握持槽GG中,以能夠利用所述第一握持構件411的升降對測試托盤TT的前端邊或後端邊進行握持或解除握持。另外,第一結合構件412中具有插入凸起IP,所述插入凸起IP能夠插入後述的第一升降軌道413的導軌槽RG中。The
第一結合構件412與第一移動器420的第一輸送帶421結合,當第一移動器420操作時,所述第一結合構件412在Y軸方向上移動。因此,結合於第一結合構件412的第一握持構件411也一起移動,最終由第一握持構件411握持的測試托盤TT沿著Y軸方向移動。The
第一升降軌道413在Y軸方向上具有較長的導軌槽RG,並設置成能夠升降。該第一升降軌道413的導軌槽RG中插入有上文提及的插入凸起IP,由此第一握持構件411與第一升降軌道413的升降聯動而升降。此外,當第一握持構件411在插入凸起IP插入導軌槽RG的狀態下沿Y軸方向移動時,第一升降軌道413不僅用於將第一升降源414的升降動力傳遞到握持構件411,還用於支撐第一握持構件411的同時引導第一握持構件411的移動。The
第一升降源414使第一升降軌道413進行升降,最終使第一握持構件411進行升降。因此,如圖6(a)和圖6(b)所示,當第一升降源414使第一握持構件411下降,測試托盤TT被第一握持構件411握持,當第一升降源414使第一握持構件411升高時,由第一握持構件411對測試托盤TT的握持解除。當然,根據實施方式,代替使第一握持構件411升降,當然可以考慮第一握持構件411通過測試托盤TT的升降來對測試托盤TT進行握持或解除握持的方式。The
第一移動器420使第一握持構件411定位成選擇性地握持測試托盤TT的前端邊或後端邊,並且使第一握持構件411沿著Y軸方向移動,從而將被第一握持器410握持的測試托盤TT沿著循環路徑C在Y軸方向上傳送。為此,第一移動器420包括第一輸送帶421和第一驅動源422。The
第一輸送帶421以在Y軸方向上隔開恆定間隔設置的一對皮帶輪P1、P2作為旋轉轉折點來正向和反向旋轉。因此,結合於第一輸送帶421的第一結合構件412可以在Y軸方向上正向和反向移動,最終,第一握持構件411和被所述第一握持構件411握持的測試托盤TT可以在Y軸方向上正向和反向移動。The
第一驅動源422使第一輸送帶421正向和反向旋轉。The
說明利用這種第一傳送裝置400的測試托盤TT的Y軸方向上的移動。The movement in the Y-axis direction of the test tray TT using this
參考圖7等,第一傳送裝置400的傳送區間①在測試托盤TT的傳送方向上分為前方的第一負責區間①1
和後方的第二負責區間①2
。第二負責區間①2
和第一負責區間①1
分別對應於申請專利範圍中的第一傳送區域和第二傳送區域。Referring to FIG. 7 and the like, the
首先,如圖7所示,控制第一握持構件411,以握持位於加載位置LP的前一個測試托盤TTf的前端邊,如圖8所示,當傳送前一個測試托盤TTf以從第二負責區間①2
進入第一負責區間①1
內時(即,從第一傳送區域中傳送前一個測試托盤TTf),前一個測試托盤TTf傳送第二負責區間①2
的距離程度。然後,如圖9所示,控制第一握持構件411,以握持前一個測試托盤TTf的後端邊,如圖10所示,當從第二傳送區域傳送前一個測試托盤TTf時,前一個測試托盤TTf傳送第一負責區間①1
的距離程度。此時,如圖9和圖10所示,作為後發起的後一個測試托盤TTr從待機位置WP傳送到加載位置LP。First, as shown in FIG. 7, the first holding
如圖10所示,當完成前一個測試托盤TTf的傳送時,如圖11所示,控制第一握持構件411以握持後一個測試托盤TTr的前端邊,如圖12所示,後一個測試托盤TTr由第一傳送裝置400傳送第二負責區間①2
的距離程度。As shown in FIG. 10, when the transfer of the previous test tray TTf is completed, as shown in FIG. 11, the first holding
如上所述,前一個測試托盤TTf和後一個測試托盤TTr利用第一傳送裝置400順序地進入和恆溫室SC的內部而容納在其中,並在Y軸方向上並排放置。As described above, the previous test tray TTf and the next test tray TTr are sequentially entered and contained in the inside of the constant temperature chamber SC using the
如此地,控制第一傳送裝置400,以使第一握持構件411能夠選擇性地握持測試托盤TT的前端邊或後端邊,從而可以減小操作距離,並由此,可以實現第一傳送裝置400的尺寸最小化。
2. 第二傳送裝置In this way, the first conveying
在Y軸方向上並排放置的一對第二傳送裝置500將恆溫室SC中的兩個測試托盤TT分別沿測試室TC側的X軸方向單獨地傳送每一個,由此,兩個測試托盤TT在第二傳送區間②-1、②-2進行傳送,從而從恆溫室SC移動到測試位置TP。這裡,減少測試托盤TT的傳送時間,也將帶來增加處理容量的效果,因此,優選地,同時操作一對第二傳送裝置500,從而控制兩個測試托盤TT同時傳送。A pair of
為此,第二傳送裝置500位於恆溫室SC中放置的測試托盤TT的下方,並如圖13的立體分解圖所示,所述第二傳送裝置500包括第二握持器510和第二移動器520。To this end, the
第二握持器510可以握持測試托盤TT的後端邊。這裡,後端邊是圖中的X軸方向上的左側的邊。這種第二握持器510包括第二握持構件511和第二結合構件512。The
第二握持構件511具有能夠握持測試托盤TT的後端邊的T形形狀的握持部分GP。握持部分GP具有圖中的左側方向上帶有尾部的T形形狀,並且可以插入位於測試托盤TT的後端邊的卡扣槽JG。因此,如圖14所示,T形形狀的握持部分GP插入測試托盤TT的T形形狀的卡扣槽JG,由此,第二握持構件511可以處於握持的狀態,以能夠推動測試托盤TT。此時,握持部分GP插入卡扣槽JG的方式可以通過使測試托盤TT在Z軸方向上下降的方式來實現,但也可以考慮以通過第二握持構件511在Z軸方向上升高來握持測試托盤TT的方式實現,或者像後述的第三傳送裝置600通過旋轉第二握持構件511來握持測試托盤TT的方式實現。The
第二結合構件512與第二移動器520的第二輸送帶521結合,握持構件511結合到這種第二結合構件512。The
第二移動器520可以使第二握持構件511定位成握持測試托盤TT的後端邊,並且使第二握持構件511沿X軸方向移動,最終,使被第二握持器510握持的測試托盤TT沿著循環路徑C在X軸方向上移動。因此,如圖15(a)和圖15(b)所示,測試托盤TT被第二傳送裝置500推動,以在第二傳送區間②-1、②-2進行傳送,由此,所述測試托盤TT從恆溫室SC移動到測試室TC內的測試位置TP。為此,與第一傳送裝置400類似地,第二移動器520具有第二輸送帶521和第二驅動源522。The
作為參考,本實施例中的第二驅動源522優選考慮實施為在一對第二傳送裝置500中共用的結構,以降低成本和簡化結構。
3. 第三傳送裝置For reference, the
當在測試位置TP完成對裝載在測試托盤TT的電子元件的測試時,第三傳送裝置600在第三傳送區間③-1、③-2傳送測試托盤TT,並將測試托盤TT移動到除熱室DC的內部。為此,第三傳送裝置600位於除熱室DC中的測試托盤TT的下方,並如圖16的立體分解圖所示,所述第三傳送裝置600包括第三握持器610和移動器620。When the test of the electronic components loaded on the test tray TT is completed at the test position TP, the
第三握持器610對測試托盤TT的前端邊或後端邊進行握持或解除握持。這裡,前端邊和後端邊是在X軸方向上彼此相對的邊。這種第三握持器610包括:第三握持構件611、第三結合構件612以及旋轉源613。The
第三握持構件611可以通過旋轉來對測試托盤TT的前端邊或後端邊進行握持或解除握持。為此,第三握持構件611具有握持部分GP,所述握持部分GP設置成與第三握持構件611的旋轉軸成90度彎曲(即,設置成沿著與旋轉軸正交的方向延伸),從而可以選擇性地握持測試托盤TT的前端邊或後端邊。The third
第三傳送裝置620拉動測試托盤TT以進行傳送,因此當第三握持構件611握持測試托盤TT的前端邊或後端邊時,如圖17(a)所示,握持部分GP進行正向旋轉,由此握持部分GP插入測試托盤TT的卡扣槽JG,並在測試托盤TT處於能夠在X軸方向上朝右側方向拉動的狀態時,所述第三握持構件611處於握持狀態,當第三握持構件611對測試托盤TT解除對其的握持狀態時,如圖17(b)所示,握持部分GP進行反向旋轉,從而當握持部分GP處於與測試托盤TT的卡扣槽JG分離的狀態時,所述第三握持構件611可以解除握持。The
第三結合構件612結合到第三移動器620的輸送帶621,並當第三移動器620操作時,所述第三結合構件612在X軸方向上移動。因此,與第三結合構件612結合的第三握持構件611也一起移動,最終,被第三握持構件611握持的測試托盤TT在X軸方向上移動。The
當第三握持構件611欲對測試托盤TT的前端邊或後端邊進行握持或解除其握持時,旋轉源613使第三握持構件611正向旋轉或反向旋轉,由此,第三握持構件611可以對測試托盤TT進行握持或解除握持。這裡,旋轉源613設置為氣缸,並將單軸元件SE夾設在所述旋轉源613和所述第三握持構件611之間,使得旋轉源613在與第三握持構件611的旋轉軸隔開規定間隔的位置處推動或拉動第三握持構件611,從而實現第三握持構件611的旋轉。然而,根據實施方式,當然也可以考慮使用旋轉馬達用作旋轉源613,以直接旋轉第三握持構件611。When the third gripping
在本實施例中,使第三握持構件611正向和反向旋轉,由此,實現第三握持器610對測試托盤TT進行握持或解除對其的握持,根據實施方式,與第二傳送裝置500類似地,當然也可以是通過第三握持構件611的升降或測試托盤TT的升降對測試托盤TT進行握持或解除對其握持的結構。即,可以充分考慮第二傳送裝置500和第三傳送裝置600同時採用相同的結構,但由於考慮到以下幾種方面:第二傳送裝置500推動測試托盤TT且第三傳送裝置600拉動測試托盤TT的方面,第二傳送裝置500用一次操作來完成第二傳送區間②-1、②-2上的測試托盤TT的傳送工作且第三傳送裝置600用兩次操作完成第三傳送區間③-1、③-2上的測試托盤TT的傳送工作的方面,第二傳送裝置500只需要握持測試托盤TT的後端邊而第三傳送裝置600需要對測試托盤TT的前端邊和後端邊均能夠進行握持的方面,如本實施所述,優選地,第二傳送裝置500和第三傳送裝置600具有不同的握持結構。In this embodiment, the third gripping
第三移動器620將第三握持構件611定位成以選擇性地握持測試托盤TT的前端邊或後端邊,使第三握持構件611在X軸方向上移動,從而使被第三握持器610握持的測試托盤TT沿著循環路徑C在X軸方向上傳送。同樣,優選地,一對第三傳送裝置600共享設置在第三移動器620的第三驅動源622。The
接下來,說明利用第三傳送裝置600的測試托盤TT的X軸方向上的移動。Next, the movement in the X-axis direction of the test tray TT using the
如圖18所示,第三傳送裝置600的第三傳送區間③-1、③-2分為前方的第一負責區間③1
和後方的第二負責區間③2
。第二負責區間③2
和第一負責區間③1
分別對應於申請專利範圍的第一傳送區域和第二傳送區域。As shown, the third transfer means the third transfer section ③-1, is responsible for the
首先,當測試托盤TT在第二負責區間③2
(第一傳送區域)傳送時,如圖18所示,如果第三握持構件611握持測試托盤TT的前端邊,則如圖19所示,第三移動器620進行操作以傳送測試托盤TT,使得測試托盤TT的前端邊位於第一負責區間③1
(第二傳送區域)內,並且測試托盤TT的後端邊位於第二負責區間③2
內。此後,如圖20所示,如果第三握持構件611握持測試托盤TT的後端邊,則如圖21所示,第三移動器620進行操作以進一步傳送測試托盤TT,使得測試托盤TT的前端邊和後端邊均位於第一負責區間③1
內。如此地,第三傳送裝置600通過分為兩次的傳送過程,使多個測試托盤TT從測試位置TP傳送到除熱室DC的內部。利用這種操作方法,第三握持構件611可以不必進入測試器室TC內部的深處,因此不僅可以縮短該操作距離,還可以按其比例使第三傳送裝置600的尺寸最小。First, when the test tray TT is transferred in the second responsible section ③ 2 (first transfer area), as shown in FIG. 18, if the third holding
這種第三傳送裝置600也在Y軸方向上並排地成對設置,一對第三傳送裝置600可以彼此獨立地進行握持操作,但是為了提高處理速度和減少成本,共享一個第三驅動源622,以在操作時能夠實現為傳送工作彼此同時進行。因此,兩個測試托盤TT雖然彼此獨立,但同時進行傳送。This third conveying
當然,如上所述,第二傳送裝置500和第三傳送裝置600不同之處僅在於推動和拉動方面,因此優選可以考慮具有相同的結構。因此,與第三傳送裝置600相同,第二傳送裝置500也可以實施為經過兩次過程傳送測試托盤TT的方式。
4. 第四傳送裝置Of course, as described above, the second conveying
第四傳送裝置700用於將除熱室TC內的測試托盤TT傳送到卸載位置UP,其結構與第一傳送裝置400基本相同,因此將省略對其說明。然而,第四傳送裝置700首先將位於前方的測試托盤TT傳送到卸載位置UP,然後將位於後方的測試托盤TT傳送到卸載位置UP,因此經過兩次過程。
5. 第五傳送裝置The fourth conveying
設置第五傳送裝置800,以將位於卸載位置UP的測試托盤TT經由待機位置WP傳送到加載位置LP,其結構和操作與第三傳送裝置600基本相同。然而,優選地,設置用於升降測試托盤TT的握持構件的升降源,以根據升降源的操作來對握持構件進行升降,並且使所述握持構件處於能夠懸掛測試托盤TT的邊的狀態,或者能夠解除該狀態。當然,即使在第五傳送裝置800的情況下,也可以充分考慮實施為通過升降測試托盤TT來代替升降源使握持構件旋轉,從而使握持構件能夠對測試托盤TT進行握持或解除握持。在某些情況下,當然也可以考慮將握持構件設置成均可以進行升降和旋轉。
>其他考慮因素>The fifth conveying
根據本發明,第一傳送裝置400、第三傳送裝置600、第四傳送裝置700以及第五傳送裝置800為了使尺寸最小,以分為兩次傳送的方式實施。另外,在某些情況下,在需要傳送經由待機位置WP的長距離的第五傳送裝置800的情況下,也可以以分為三次以上的過程來傳送測試托盤TT的方式實施。在這種情況下,測試托盤TT必須準確地定位在正確的位置上,以便通過握持構件411、611、811適當地握持測試托盤TT。因此,優選地,可以考慮設置可升降的止擋件,以便可以將測試托盤TT傳送到準確的位置。According to the present invention, the first conveying
例如,觀察一種路徑,該路徑為利用第四傳送裝置700將測試托盤TT從除熱室DC傳送到卸載位置UP,然後利用第五傳送裝置800經由待機位置WP將所述測試托盤TT傳送到加載位置LP。在該路徑上,為了利用第五傳送裝置800適當地握持測試托盤TT,如圖22的概略圖所示,用於設置測試托盤TT的準確位置的四個止擋件SP1、SP2、SP3、SP4中的每一個都可以利用升降器UD進行升降。For example, consider a path that uses the
參照圖23(a)至圖23(f)說明止擋件SP1、SP2、SP3、SP4的作用。The functions of the stoppers SP1, SP2, SP3, and SP4 will be described with reference to Figs. 23(a) to 23(f).
首先,當利用第四傳送裝置700將測試托盤TT傳送到Y軸方向上的卸載位置UP時,如圖23(a)所示,從第一止擋件SP1下降的狀態起,如圖23(b)所示,第一止擋件SP1開始升高,以定位對測試托盤TT在Y軸方向上的位置。此時,第二止擋件SP2處於升高的狀態,因此測試托盤TT的X軸方向被準確地設定。First, when the test tray TT is transferred to the unloading position UP in the Y-axis direction by the
接著,當欲將測試托盤TT傳送到X軸方向的待機位置WP時,如圖23(c)所示,首先,第二止擋件SP2下降。在該狀態下,如圖23(d)所示,當測試托盤TT傳送到待機位置WP時,利用處於升高的狀態的第三止擋件SP3,防止了測試托盤TT的過度傳送,並且第二止擋件SP2升高,從而準確地定位測試托盤TT在X軸方向上的位置。Next, when the test tray TT is to be transferred to the standby position WP in the X-axis direction, as shown in FIG. 23(c), first, the second stopper SP2 is lowered. In this state, as shown in FIG. 23(d), when the test tray TT is transferred to the standby position WP, the third stopper SP3 in a raised state prevents excessive transfer of the test tray TT, and The second stopper SP2 is raised, thereby accurately positioning the position of the test tray TT in the X-axis direction.
類似的,即使當測試托盤TT從待機位置WP傳送到加載位置LP時,如圖23(e)和圖23(f)所示,利用第三止擋件SP3的下降和升高以及第四止擋件SP4對所述測試托盤TT的防止過度傳送,可以將測試托盤準確地位於加載位置LP。Similarly, even when the test tray TT is transferred from the standby position WP to the loading position LP, as shown in FIG. 23(e) and FIG. 23(f), the lowering and raising of the third stopper SP3 and the fourth stop The stopper SP4 prevents excessive transfer of the test tray TT, and the test tray can be accurately located at the loading position LP.
可以在整個傳送路徑中所需要的位置上設置所需數量的這種止擋件SP和升降器UD。A required number of such stoppers SP and lifters UD can be provided at required positions in the entire conveying path.
作為參考,如圖23所述,第一止擋件SP1可以通過升降導軌GR來實現,以引導測試托盤TT在X軸方向上移動,第四止擋件SP4也可以通過升降導軌來實現,以引導所述測試托盤TT在Y軸方向上移動。即,優選地,可以考慮用導軌來代替一部分用於準確地設定測試托盤TT的位置的多個止擋件,所述導軌用於在測試托盤TT的傳送路徑上引導測試托盤TT的傳送。另外,以上述方式,在將導軌用作止擋件的部分中,導軌必須實現升降,以使導軌不會干擾測試托盤TT的傳送。For reference, as shown in FIG. 23, the first stopper SP1 can be implemented by the lifting rail GR to guide the test tray TT to move in the X-axis direction, and the fourth stopper SP4 can also be implemented by the lifting rail to The test tray TT is guided to move in the Y-axis direction. That is, preferably, it may be considered to replace a part of the multiple stoppers for accurately setting the position of the test tray TT with a guide rail for guiding the transfer of the test tray TT on the transfer path of the test tray TT. In addition, in the above manner, in the portion where the guide rail is used as a stopper, the guide rail must be raised and lowered so that the guide rail does not interfere with the transfer of the test tray TT.
如上所述,本發明的具體說明是通過參照附圖的實施例而得出,然而,上述實施例僅是為了說明本發明的優選例,因此,應理解為本發明不限於所公開的實施例,本發明的範圍應當被理解為在所附申請專利範圍及其等同無的範圍內。As mentioned above, the specific description of the present invention is obtained by referring to the embodiments of the drawings. However, the above-mentioned embodiments are only to illustrate the preferred examples of the present invention. Therefore, it should be understood that the present invention is not limited to the disclosed embodiments. The scope of the present invention should be understood to be within the scope of the attached patent application and its equivalents.
100:加載裝置 200:連接裝置 260:除熱室 300:卸載裝置 400:第一傳送裝置 410:第一握持器 411:握持構件 412:第一結合構件 413:第一升降軌道 414:第一升降源 420:第一移動器 421:第一輸送帶 422:第一驅動源 500:第二傳送裝置 510:第二握持器 511:第二握持構件 512:第二結合構件 520:第二移動器 521:第二輸送帶 522:第二驅動源 600:第三傳送裝置 610:第三握持器 611:第三握持構件 612:第三結合構件 613:旋轉源 620:移動器 621:輸送帶 622:第三驅動源 700:第四傳送裝置 800:第五傳送裝置 811:握持構件 900:控制裝置 a:第一箭頭方向 b:第二箭頭方向 C:循環路徑 C1、C2:傳送路徑 CT2:客戶托盤 D:電子元件 DC:除熱室 GG:握持槽 GP:握持部分 HR:用於測試電子元件的處理器 IF:設置框架 IP:插入凸起 JG:卡扣槽 LE:裝載元件 LP:加載位置 P1、P2:皮帶輪 RG:導軌槽 S1:前側邊 S2:左側邊 S3:後側邊 S4:右側邊 SC:恆溫室 SP1、SP2、SP3、SP4:止擋件 TC:測試室 TP:測試位置 TT、TTf、TTr:測試托盤 UD:升降器 UP:卸載位置 WP:待機位置100: loading device 200: Connecting device 260: Heat removal chamber 300: Uninstall device 400: The first conveyor 410: First Holder 411: Grip member 412: The first joining member 413: The first lifting track 414: First Lifting Source 420: first mover 421: The first conveyor belt 422: first drive source 500: second conveyor 510: Second Holder 511: second holding member 512: The second joining member 520: second mover 521: Second conveyor belt 522: second drive source 600: third conveyor 610: Third Holder 611: third holding member 612: Third Combination Member 613: Rotation Source 620: Mover 621: Conveyor Belt 622: third drive source 700: Fourth Transmission Device 800: Fifth Transmission Device 811: Grip member 900: control device a: the direction of the first arrow b: second arrow direction C: loop path C1, C2: Transmission path CT2: customer tray D: Electronic components DC: Heat removal chamber GG: Grip slot GP: grip part HR: Processor for testing electronic components IF: set frame IP: Insert bump JG: buckle slot LE: Load components LP: Loading position P1, P2: pulley RG: Rail groove S1: Front side S2: left side S3: back side S4: Right side SC: Constant temperature room SP1, SP2, SP3, SP4: stopper TC: test room TP: test location TT, TTf, TTr: test tray UD: Lifter UP: Uninstall location WP: Standby position
圖1是根據在先技術的用於測試電子元件的處理器的概念性的俯視圖。 圖2是能夠應用于根據本發明的用於測試電子元件的處理器的測試托盤的立體圖。 圖3是應用了圖2的測試托盤的根據本發明的一實施例的用於測試電子元件的處理器的概念性的俯視圖。 圖4是用於說明圖3的用於測試電子元件的處理器的構成的概念性的俯視圖。 圖5是應用於圖3的用於測試電子元件的處理器的第一傳送裝置的概略性部分立體分解圖。 圖6(a)和圖6(b)是用於說明圖5的第一傳送裝置進行握持和解除握持測試托盤的動作的參考圖。 圖7至圖12是用於說明圖5的第一傳送裝置進行的第一傳送操作的參考圖。 圖13是應用於圖3的用於測試電子元件的處理器的第二傳送裝置的立體分解圖。 圖14用於說明圖13的第二傳送裝置握持測試托盤的動作的參考圖。 圖15(a)和圖15(b)是用於說明圖14的第二傳送裝置的傳送操作的參考圖。 圖16是應用於圖3的用於測試電子元件的處理器的第三傳送裝置的立體分解圖。 圖17(a)和圖17(b)是用於說明圖16的第三傳送裝置進行握持和解除握持測試托盤的動作的參考圖。 圖18至圖21是用於說明圖16的第三傳送裝置的傳送操作的參考圖。 圖22(a)、圖22(b)和圖23(a)至圖23(f)是用於說明能夠應用於圖3的用於測試電子元件的處理器止擋件的概略性參考圖。FIG. 1 is a conceptual top view of a processor for testing electronic components according to the prior art. 2 is a perspective view of a test tray that can be applied to the processor for testing electronic components according to the present invention. 3 is a conceptual top view of a processor for testing electronic components according to an embodiment of the present invention to which the test tray of FIG. 2 is applied. 4 is a conceptual plan view for explaining the configuration of the processor for testing electronic components of FIG. 3. FIG. 5 is a schematic partial perspective exploded view of the first transmission device applied to the processor for testing electronic components of FIG. 3. 6(a) and 6(b) are reference diagrams for explaining the operation of holding and releasing the test tray by the first conveying device of FIG. 5. 7 to 12 are reference diagrams for explaining the first transfer operation performed by the first transfer device of FIG. 5. FIG. 13 is an exploded perspective view of a second transfer device applied to the processor for testing electronic components of FIG. 3. FIG. 14 is a reference diagram for explaining the action of the second conveying device in FIG. 13 holding the test tray. 15(a) and 15(b) are reference diagrams for explaining the transfer operation of the second transfer device of FIG. 14. FIG. 16 is a perspective exploded view of a third transfer device applied to the processor for testing electronic components of FIG. 3. 17(a) and FIG. 17(b) are reference diagrams for explaining the operation of the third conveying device of FIG. 16 to hold and release the test tray. 18 to 21 are reference diagrams for explaining the transfer operation of the third transfer device of FIG. 16. FIGS. 22(a), 22(b), and FIGS. 23(a) to 23(f) are schematic reference diagrams for explaining the processor stopper for testing electronic components that can be applied to FIG. 3.
400:第一傳送裝置 400: The first conveyor
410:第一握持器 410: First Holder
411:握持構件 411: Grip member
412:第一結合構件 412: The first joining member
413:第一升降軌道 413: The first lifting track
414:第一升降源 414: First Lifting Source
420:第一移動器 420: first mover
421:第一輸送帶 421: The first conveyor belt
422:第一驅動源 422: first drive source
GG:握持槽 GG: Grip slot
IP:插入凸起 IP: Insert bump
P1、P2:皮帶輪 P1, P2: pulley
RG:導軌槽 RG: Rail groove
Claims (8)
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KR1020180117643A KR20200038040A (en) | 2018-10-02 | 2018-10-02 | Handler for testing electronic component |
KR10-2018-0117643 | 2018-10-02 |
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CN115754575A (en) | 2023-03-07 |
CN111077403A (en) | 2020-04-28 |
KR20200038040A (en) | 2020-04-10 |
CN111077403B (en) | 2022-12-06 |
TW202016559A (en) | 2020-05-01 |
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