CN104001680A - Testing sorter - Google Patents
Testing sorter Download PDFInfo
- Publication number
- CN104001680A CN104001680A CN201410189222.2A CN201410189222A CN104001680A CN 104001680 A CN104001680 A CN 104001680A CN 201410189222 A CN201410189222 A CN 201410189222A CN 104001680 A CN104001680 A CN 104001680A
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- Prior art keywords
- mentioned
- matching disc
- test
- semiconductor element
- loaded
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
- G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Environmental & Geological Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention relates to a testing sorter supporting semiconductor element tests; a pushing device pushes the semiconductor element to a tester for electric connection; an in/out switchgear is arranged in the pushing device, and allows or stops a matching plate from being supported by each support rail forming a support device supporting the matching plate, so the matching plate can enter a set position or withdraw from the set position; according to the invention, the matching plate can be stably arranged to improve reliability of the equipment.
Description
Technical field
The present invention relates to the Test handler of the test of supporting semiconductor element.
Background technology
Test handler is to support that each semiconductor element of the manufacturing process's manufacturing through specifying can be tested by tester (TESTER), and equipment semiconductor element being loaded according to grade separation and on user tray according to test result.
Fig. 1 be from directly over observed the concept map of general Test handler 100.
As shown in Figure 1, Test handler (TEST HANDLER) 100 is configured to and comprises: test pallet (TEST TRAY) 110, loading attachment (LOADING APPARATUS) 120, all hot cell (SOAK CHAMBER) 130, test cabinet (TEST CHAMBER) 140, propulsion plant (PUSHING APPARATUS) 150, move back equal hot cell (DESOAK CHAMBER) 160 and discharge mechanism (UNLOADING APPARATUS) 170 etc.
As shown in Figure 2, test pallet 110 is provided with can install multiple inserts 111 that semiconductor element D is set, and circulates along determined closed path C by multiple conveying devices (not shown).
The each semiconductor element that will test being loaded on user tray is loaded into the test pallet that is positioned at " loaded " position LP (LOADING POSITION) by " loaded " position 120.
In order to carry and the each semiconductor element that is loaded into test pallet 110 that comes is provided with equal hot cell 130 according to test environment conditions preheating or precooling from " loaded " position LP.
Be provided with test cabinet 140 in order to test through be transported to test position TP each semiconductor element (TEST POSITION), that be loaded into test pallet 110 after equal hot cell 130 preheatings/precooling.
For tester (TESTER) side that the each semiconductor element that is loaded into test pallet 110 that is positioned at test cabinet 140 is pushed to be combined with test cabinet 140 sides makes each semiconductor element be electrically connected with tester, and be provided with propulsion plant 150.The present invention relates to this propulsion plant 150, will further describe below this.
Come in order to carry from test cabinet 140 be loaded into test pallet 110, revert to normal temperature and be provided with and move back equal hot cell 160 through heating or cooling each semiconductor element.
Discharge mechanism 170 by from move back equal hot cell 160 be delivered to each semiconductor element unloading position UP, that be loaded into test pallet 110 according to test grade classify and be unloaded to empty user tray.
As mentioned above, each semiconductor element with the state that is loaded into test pallet 110 along closed path C circulation, this closed path C from " loaded " position LP through all hot cell 130, test cabinet 140, move back equal hot cell 160 and unloading position UP reconnects to " loaded " position LP.
Then, further illustrate propulsion plant 150.
Propulsion plant 150 is existing open by multiple patent documentations such as No. 10-0709114th, Korean granted patent (denomination of invention: Test handler, especially with reference to Fig. 6 wherein, hereinafter referred to as " prior art ").
Fig. 3 is the approximate three-dimensional map for existing propulsion plant 150.
As institute's reference in Fig. 3, propulsion plant 150 comprises matching disc 151, bracing or strutting arrangement 152 and cylinder (CYLINDER) 153.
Matching disc 151 has and the each semiconductor element that is loaded into test pallet 110 corresponding projectile 151a one to one.
Bracing or strutting arrangement 152 support matching disc 151 and comprise each supporting rail 152a-1, supporting rail 152a-2, parts 152b be set, brake 152c and bulb stopper 152d.
The movement for arranging and dismantling of each supporting rail 152a-1,152a-2 guiding matching disc 151, and support set matching disc 151.
Arranging on parts 152b in conjunction with being provided with each supporting rail 152a-1,152a-2.As a reference, also can possess according to embodiment the passage (DUCT) that the air of the temperature setting is provided to semiconductor element for parts 152b is set.
Brake 152c is being arranged on matching disc 151 while arranging on parts 152b, and restriction is guided by each supporting rail 152a-1,152a-2 and the excessive movement of the matching disc 151 of movement.
Bulb stopper 152d is arranged at supporting rail 152a-2, and this bulb stopper 152d is as preventing that the disengaging preventer that matching disc 151 departs from desired location from working., as shown in the cutaway view of Fig. 4, by the spring S of bulb stopper 152d, insert in the ball hole 151b of matching disc 151 one end of the ball B of resiliency supported, thereby prevent that set matching disc 151 from random departing from desired location.As a reference, if matching disc 151 departs from desired location, do not realize projectile 151a and be loaded into mating between each semiconductor element of test pallet 110, thereby can cause the bad and accessory damage of work.
Cylinder 153 is for bracing or strutting arrangement 152 is advanced and retreat, the drive source that finally makes the matching disc 151 that is supported in bracing or strutting arrangement 152 advance and retreat.By the action of this cylinder 153, the projectile 151a of matching disc 151 is to tester side pressurization semiconductor element D, or releasing pressurization.
In propulsion plant 150 as above, as Fig. 5 (a), (b) and (c), matching disc 151 its two ends are supported by each supporting rail 152a-1,152a-2 in the side of each supporting rail 152a-1,152a-2 and are directed, thereby matching disc 151 combinations are arranged on bracing or strutting arrangement, or are disassembled on the contrary.And, in the time of the specifications vary of the each semiconductor element that will test, must carry out the field-strip of the matching disc 151 illustrated with reference to Fig. 5 at every turn.
But, be intended to if be formed in to prevent that the spring S elastic force that matching disc 151 departs from the bulb stopper 152d of desired location is difficult to carry out by force the field-strip of matching disc 151, if even if the elastic force of spring S a little less than work impact the less problem that matching disc 151 departs from desired location that also can occur.And the unsettled variable of the elastic force of this so-called spring S becomes the reason of the reliability of reduction equipment.
On the other hand, turn around at the two ends of matching disc 151 when arranging or possess a pair of matching disc simultaneously as Fig. 6 of prior art, likely because operating personnel's error is arranged to each matching disc out of position each other.In this case, if matching disc is taking symmetrical exactly as benchmark through the line at center, be confused also harmless even if turn the position that the two ends of matching disc or two matching discs of Cheng Shuan are set around.But as the applicant's earlier application is No. 10-2012-000338th, patent application, if matching disc is taking through the line at center during as benchmark and asymmetric, turning the position that the two ends of matching disc or two matching discs of Cheng Shuan are set around while being confused each other, the bad and accessory damage problem of generation work.
Summary of the invention
Problem to be solved
The first object of the present invention is to provide a kind of dismounting at matching disc and stable installation to fix the technology that needn't consider unsettled variable.
The second object of the present invention is to provide a kind of technology of the correct setting that can guide matching disc.
Be intended to reach the first object according to Test handler of the present invention, comprising: loading attachment, the each semiconductor element that will test being loaded on user tray is loaded into the test pallet that is positioned at " loaded " position by it; Propulsion plant, it is pushed tester side to each semiconductor element is electrically connected with tester be delivered to each semiconductor element test position, that be loaded into test pallet after finishing by the loading operation of above-mentioned loading attachment; And, discharge mechanism, after finishing, its test from loaded each semiconductor element is delivered to the test pallet of unloading position, each semiconductor element is classified and is unloaded on user tray according to test grade, above-mentioned propulsion plant, comprise: matching disc, has and the each semiconductor element that is loaded into test pallet corresponding each projectile one to one; Bracing or strutting arrangement, for supporting above-mentioned matching disc; And drive source, makes above-mentioned bracing or strutting arrangement advance and retreat, above-mentioned bracing or strutting arrangement, comprising: each supporting rail, guides and support the movement of above-mentioned matching disc; Parts are set, and the combination of above-mentioned each supporting rail arranges; Brake, limiting above-mentioned matching disc, to exceed desired location be setting position and exceedingly moving; And the derailing switch of coming in and going out, allows or stops above-mentioned matching disc supported and enter setting position or exited from setting position by above-mentioned each supporting rail.
Above-mentioned discrepancy derailing switch, comprising: switchboard, opens wide or closes the discrepancy path of above-mentioned matching disc according to mobile status; And, housing is set, for above-mentioned switchboard is arranged in the mode that can move.
Above-mentioned discrepancy derailing switch further comprises the operating handle of the movement for operating above-mentioned switchboard, the above-mentioned housing that arranges holds above-mentioned switchboard, and there is the guide groove of the movement between open position at above-mentioned switchboard (opening wide the position in the discrepancy path of matching disc) and closed position (closing the position in the discrepancy path of matching disc) and the aforesaid operations handle of being combined with above-mentioned switchboard a part of can pass and give prominence to passes through hole, above-mentioned is that its length direction is the shape of the moving direction of above-mentioned switchboard by hole.
Above-mentioned discrepancy derailing switch further comprises the fixed factors for the position of fixing above-mentioned switchboard.
Be positioned at setting position and above-mentioned discrepancy derailing switch has cut out the discrepancy path of above-mentioned matching disc at above-mentioned matching disc, one end of above-mentioned matching disc and above-mentioned brake join and the other end and the above-mentioned switchboard of above-mentioned matching disc join.
Above-mentioned matching disc has the incision site for guiding correct setting, and the above-mentioned parts that arrange have pilot pin in the position corresponding with above-mentioned incision site.
Be intended to reach the second object according to Test handler of the present invention, comprising: loading attachment, the each semiconductor element that will test being loaded on user tray is loaded into the test pallet that is positioned at " loaded " position by it; Propulsion plant, it is pushed tester side to each semiconductor element is electrically connected with tester be delivered to each semiconductor element test position, that be loaded into test pallet after finishing by the loading operation of above-mentioned loading attachment; And, discharge mechanism, after finishing, its test from loaded each semiconductor element is delivered to the test pallet of unloading position, each semiconductor element is classified and is unloaded on user tray according to test grade, above-mentioned propulsion plant, comprise: a pair of matching disc, has and the each semiconductor element that is loaded into test pallet corresponding each projectile one to one; And, bracing or strutting arrangement, for supporting above-mentioned a pair of matching disc, above-mentioned bracing or strutting arrangement, comprising: each supporting rail, guides and support the movement of above-mentioned a pair of matching disc; Parts are set, and the combination of above-mentioned each supporting rail arranges; And at least one brake, limits the excessive movement of above-mentioned matching disc, above-mentioned a pair of matching disc has respectively the incision site for guiding correct setting, and the above-mentioned parts that arrange have respectively pilot pin in the position corresponding with above-mentioned each incision site.
Invention effect
According to the present invention, fully control dismounting and the dislocation of matching disc by the derailing switch of coming in and going out, thereby needn't consider unsettled variable in the dismounting of matching disc and stable installation on fixing, and prevent obscuring of matching disc, thereby improve the reliability of equipment.
Brief description of the drawings
Fig. 1 is the approximate vertical view of general test separator.
Fig. 2 to Fig. 5 be for illustrate prior art with reference to figure.
Fig. 6 is for according to the approximate vertical view of the Test handler of the first embodiment of the present invention.
Fig. 7 is for the approximate three-dimensional map of propulsion plant of Test handler that is adapted to Fig. 6.
Fig. 8 is for the approximate three-dimensional map of discrepancy derailing switch of propulsion plant that is adapted to Fig. 7.
Fig. 9 to Figure 13 be for the propulsion plant at Fig. 7 alternately matching disc operation with reference to figure.
Figure 14 is for the approximate three-dimensional map of propulsion plant that is adapted to Test handler according to a second embodiment of the present invention.
Figure 15 is for the top view of a pair of matching disc of propulsion plant that is adapted to Figure 14.
Symbol description
200-Test handler, 210-test pallet, 220-loading attachment, 250, 350-propulsion plant, 251, 351T, 351B-matching disc, 251a-projectile, 251b-incision site, 251c-identifying hole, 252-bracing or strutting arrangement, 252a-1, 252a-2, 352a-1, 352a-2, 352a-3-supporting rail, 252b, 352b-passage, 252b-1, 352b-1a, 352b-1b-pilot pin, 252c, 352c-brake, 252d, 352d-discrepancy derailing switch, 252d-1-switchboard, PS-locating slot, 252d-2-handle, 252d-3-arrange housing, GS-guide groove, TH-pass through hole, 252d-4-bulb stopper, 253-drive source, 270-discharge mechanism, IP-setting position.
Detailed description of the invention
According to a preferred embodiment of the invention as above referring to brief description of the drawings, be convenient to explanation for purpose of brevity, omit as far as possible or sketch the explanation repeating.
Fig. 6 is for according to the approximate vertical view of the Test handler 200 of the first embodiment of the present invention.
As shown in Figure 6, Test handler 200 according to the present invention be configured to comprise test pallet 210, loading attachment 220, all hot cell 230, test cabinet 240, propulsion plant 250, move back equal hot cell 260 and discharge mechanism 270 etc.
In above-mentioned formation, test pallet 210, loading attachment 220, all hot cell 230, test cabinet 240, move back equal hot cell 260 and discharge mechanism 270 is identical with content mentioned in " background technology ", thereby the description thereof will be omitted.
As institute's reference in Fig. 7, propulsion plant 250 comprises matching disc 251, bracing or strutting arrangement 252 and drive source 253.
Matching disc 251 has and the each semiconductor element that is loaded into test pallet 210 corresponding projectile 251a one to one, and has incision site 251b in a lateral edge portions.Here, incision site 251b plays a part the correct setting of guiding matching disc 251.And, on matching disc 251, be formed with identifying hole 251c.
Bracing or strutting arrangement 252 supports matching disc 251.This bracing or strutting arrangement 252 comprises a pair of supporting rail 252a-1,252a-2, passage 252b, brake 252c, derailing switch 252d and location indentifier 252e come in and go out.
A pair of supporting rail 252a-1,252a-2 guide and support the movement of matching disc 251, and are arranged at passage 252b with the state of an apart determining deviation.
In order the air of the temperature setting to be provided and passage 252b to be set to the each semiconductor element that will test, in the present embodiment this passage 252b also as each supporting rail 252a-1,252a-2 parts being set and bringing into play function in conjunction with what arrange.In addition, passage 252b has the pilot pin 252b-1 corresponding with the incision site 251b of matching disc 251.Here, pilot pin 252b-1 is outstanding towards the direction at matching disc 251 places, and guides the correct setting of matching disc 251.Pilot pin 252b-1 can be with specific implementations such as bolts.
It is setting position and exceedingly moving that brake 252c restriction matching disc 251 exceedes desired location.This brake 252c can be integrally formed on a side wall surface that forms passage 252b, can also be made separately and is combined with passage 252b.
The derailing switch 252d that comes in and goes out allows or stops matching disc 251 supported and enter setting position IP or exited from setting position IP by a pair of supporting rail 252a-1,252a-2.For this reason, as institute's reference in Fig. 8, the derailing switch 252d that comes in and goes out comprises switchboard 252d-1, handle 252d-2, housing 252d-3 and a pair of bulb stopper 252d-4 is set.
Switchboard 252d-1 is positioned at the position relative with brake 252c, opens wide or close the discrepancy path of matching disc 251 according to mobile status.Be provided with locating slot PS at the two ends of this switchboard 252d-1.
Be provided with handle 252d-2 for moving of console switch plate 252d-1.
Install housing 252d-3 is set for switchboard 252d-1 can be moved, this arranges housing 252d-3 and is combined with passage 252b.This set housing 252d-3 has guide groove GS and passes through hole TH.
Guide groove GS is at the wall that forms passage 252b and the spatial accommodation that formation between housing 252d-3 is set holds switchboard 252d-1.Therefore, switchboard 252d-1 moves to open position or closed position under the state being contained in guide groove GS.Certainly, guide groove GS also has the function of the movement of guide switch plate 252d-1.Here, so-called open position refers to the position in the discrepancy path of opening wide matching disc, refers to the position in the discrepancy path of closing matching disc as closed position.
By hole TH, the opposite side of the handle 252d-2 that one side is combined with switchboard 252d-1 can be passed through and give prominence to.Therefore, operating personnel grasps the opposite side of outstanding handle 252d-2 and movement that can console switch plate 252d-1.Therefore, there is the shape of the moving direction that its length direction is switchboard 252d-1 (moving direction of handle) by hole TH.And, the structure arranging through the state by hole TH with a part of handle 252d-2, the not only displacement of limit switch plate 252d-1, but also prevent that switchboard 252d-1 from departing from guide groove GS.
Bulb stopper 252d-4 arranges housing 252d-3 in conjunction with being arranged at, and as the fixed factors that switchboard 252d-1 is fixed on to open position or closed position., the ball of the resiliency supported of bulb stopper 252d-4 inserts in the locating slot PS of switchboard 252d-1, thereby switchboard 252d-1 can be fixed on to open position or closed position.
Location indentifier 252e, in the time that matching disc 251 is pushed setting position IP by operating personnel, makes operating personnel can identify whether matching disc 251 is positioned at setting position IP exactly.Possess the bulb stopper of being combined with supporting rail 252a-1,252a-2 as this location indentifier 252e, insert in the identifying hole 251c of matching disc 251 by the ball of bulb stopper, make operating personnel identify matching disc 251 and be positioned at exactly setting position IP.
Can possess cylinder or motor as drive source 253, so that bracing or strutting arrangement 252 and the matching disc 251 that supported by bracing or strutting arrangement 252 are advanced and retreat.
Then, the alternately operation of matching disc 251 in the Test handler 200 with formation as above is described.
Operating personnel's operating handle 252d-2 and switchboard 252d-1 is moved to open position as shown in Figure 9, thus the discrepancy path of matching disc 251 opened wide.Under the state of Fig. 9, operating personnel extracts current matching disc 251 out to arrow a direction, and makes as shown in Figure 10 matching disc 251N enter to arrow b direction.Thus, if matching disc 251N is positioned at setting position IP as shown in Figure 11, first matching disc 251N is fixed on fixed position by location indentifier 252e.Operating personnel is after having identified the state of Figure 11, and operating handle 252d-2 makes switchboard 252d-1 move to as shown in Figure 12 closed position, thereby closes the discrepancy path of matching disc 251.Therefore,, with one end of matching disc 251 and brake 252c joins and the other end of matching disc 251 and switchboard 252d-1 join state, matching disc 251 is stably set.
On the other hand, as shown in figure 13, if because operating personnel's error causes matching disc 251N to turn upside down and makes matching disc 251N enter setting position IP, one end of matching disc 251N contacts with pilot pin 252b-1, thereby stop matching disc 251N further to enter towards setting position IP.Thus, make operating personnel can identify wrong the getting the hang of of matching disc 251N, and the incision site 251b that is transformed into matching disc 251N be positioned at pilot pin 252b-1 place part correct state and matching disc 251N is set.
Figure 14 is for the approximate three-dimensional map of propulsion plant 350 that is adapted to Test handler according to a second embodiment of the present invention.
In the first embodiment, a matching disc 251 mates with a test pallet 210, but divided two matching disc 351T, 351B mate with a test pallet 210 in a second embodiment.
As shown in figure 15, in the present embodiment, with regard to divided each matching disc 351T, 351B, projectile 351a is not with centre line C L
1, CL
2for benchmark configures symmetrically.Therefore, each matching disc 351T, 351B have incision site 351b-1, the 351b-2 for the correct setting of matching disc 351T, 351B, and passage 352b has two pilot pin 352b-1a, 352b-1b of the correct setting for guiding respectively two matching disc 351T, 351B.
And, also possess three supporting rail 352a-1,352a-2,352a-3, to support and to guide two matching disc 351T, 351B of cutting apart.Now, the supporting rail 352a-3 that is positioned at middle part supports matching disc 351T, 351B together and guides.
Certainly, according to also possessing brake 352c, discrepancy derailing switch 352d and location indentifier 352e-1,352e-2 in the propulsion plant 350 of the present embodiment.
As mentioned above, although by with reference to the embodiment of accompanying drawing carried out for specific description of the present invention, but the above embodiments are just enumerated preferred example and are understood the present invention, therefore, not should be understood to the present invention and be confined to the above embodiments, determined by appending claims and equivalent concepts thereof and should be understood to interest field of the present invention.
Claims (7)
1. a Test handler, is characterized in that, comprising:
Loading attachment, the each semiconductor element that will test being loaded on user tray is loaded into the test pallet that is positioned at " loaded " position by it;
Propulsion plant, it is pushed tester side to each semiconductor element is electrically connected with tester be delivered to each semiconductor element test position, that be loaded into test pallet after finishing by the loading operation of above-mentioned loading attachment; And,
Discharge mechanism, is delivered to the test pallet of unloading position after its test from loaded each semiconductor element finishes, and each semiconductor element is classified and is unloaded on user tray according to test grade,
Above-mentioned propulsion plant, comprising:
Matching disc, has and the each semiconductor element that is loaded into test pallet corresponding each projectile one to one;
Bracing or strutting arrangement, for supporting above-mentioned matching disc; And,
Drive source, makes above-mentioned bracing or strutting arrangement advance and retreat,
Above-mentioned bracing or strutting arrangement, comprising:
Each supporting rail, guides and supports the movement of above-mentioned matching disc;
Parts are set, and the combination of above-mentioned each supporting rail arranges;
Brake, limiting above-mentioned matching disc, to exceed desired location be setting position and exceedingly moving; And,
Discrepancy derailing switch, allows or stops above-mentioned matching disc supported and enter setting position or exited from setting position by above-mentioned each supporting rail.
2. Test handler according to claim 1, is characterized in that,
Above-mentioned discrepancy derailing switch, comprising:
Switchboard, opens wide or closes the discrepancy path of above-mentioned matching disc according to mobile status; And,
Housing is set, for above-mentioned switchboard is arranged in the mode that can move.
3. Test handler according to claim 2, is characterized in that,
Above-mentioned discrepancy derailing switch further comprises the operating handle of the movement for operating above-mentioned switchboard,
The above-mentioned housing that arranges holds above-mentioned switchboard, and there is the guide groove of the movement between open position at above-mentioned switchboard (opening wide the position in the discrepancy path of matching disc) and closed position (closing the position in the discrepancy path of matching disc) and the aforesaid operations handle of being combined with above-mentioned switchboard a part of can pass and give prominence to passes through hole
Above-mentioned is that its length direction is the shape of the moving direction of above-mentioned switchboard by hole.
4. Test handler according to claim 3, is characterized in that,
Above-mentioned discrepancy derailing switch further comprises the fixed factors for the position of fixing above-mentioned switchboard.
5. Test handler according to claim 2, is characterized in that,
Be positioned at setting position and above-mentioned discrepancy derailing switch has cut out the discrepancy path of above-mentioned matching disc at above-mentioned matching disc, one end of above-mentioned matching disc and above-mentioned brake join and the other end and the above-mentioned switchboard of above-mentioned matching disc join.
6. Test handler according to claim 1, is characterized in that,
Above-mentioned matching disc has the incision site for guiding correct setting,
The above-mentioned parts that arrange have pilot pin in the position corresponding with above-mentioned incision site.
7. a Test handler, is characterized in that, comprising:
Loading attachment, the each semiconductor element that will test being loaded on user tray is loaded into the test pallet that is positioned at " loaded " position by it;
Propulsion plant, it is pushed tester side to each semiconductor element is electrically connected with tester be delivered to each semiconductor element test position, that be loaded into test pallet after finishing by the loading operation of above-mentioned loading attachment; And,
Discharge mechanism, is delivered to the test pallet of unloading position after its test from loaded each semiconductor element finishes, and each semiconductor element is classified and is unloaded on user tray according to test grade,
Above-mentioned propulsion plant, comprising:
A pair of matching disc, has and the each semiconductor element that is loaded into test pallet corresponding each projectile one to one; And,
Bracing or strutting arrangement, for supporting above-mentioned a pair of matching disc,
Above-mentioned bracing or strutting arrangement, comprising:
Each supporting rail, guides and supports the movement of above-mentioned a pair of matching disc;
Parts are set, and the combination of above-mentioned each supporting rail arranges; And,
At least one brake, limits the excessive movement of above-mentioned matching disc,
Above-mentioned a pair of matching disc has respectively the incision site for guiding correct setting,
The above-mentioned parts that arrange have respectively pilot pin in the position corresponding with above-mentioned each incision site.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2013-0069776 | 2013-06-18 | ||
| KR1020130069776A KR102072390B1 (en) | 2013-06-18 | 2013-06-18 | Test handler |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104001680A true CN104001680A (en) | 2014-08-27 |
| CN104001680B CN104001680B (en) | 2017-07-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410189222.2A Active CN104001680B (en) | 2013-06-18 | 2014-05-07 | Testing, sorting machine |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR102072390B1 (en) |
| CN (1) | CN104001680B (en) |
| TW (1) | TWI509264B (en) |
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| CN104889077A (en) * | 2014-03-07 | 2015-09-09 | 泰克元有限公司 | Sorting machine for test of semiconductor member and testing support method of the sorting machine |
| KR20160064722A (en) * | 2014-11-28 | 2016-06-08 | (주)테크윙 | Test handler |
| CN106076876A (en) * | 2015-04-30 | 2016-11-09 | 泰克元有限公司 | Semiconductor element test separator |
| TWI679436B (en) * | 2017-08-18 | 2019-12-11 | 南韓商泰克元有限公司 | Handler for testing electronic devices |
| CN111659627A (en) * | 2017-01-11 | 2020-09-15 | 泰克元有限公司 | Pressure device for test sorting machine |
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| KR102312491B1 (en) * | 2015-08-11 | 2021-10-15 | (주)테크윙 | Handler for testing semiconductor |
| TWI613136B (en) * | 2017-05-05 | 2018-02-01 | Electronic component carrier and its operation classification equipment | |
| KR102469918B1 (en) * | 2018-03-27 | 2022-11-23 | (주)테크윙 | Treatment chamber and handler comprising same |
| KR20210043040A (en) | 2019-10-10 | 2021-04-21 | 삼성전자주식회사 | Apparatus for testing semiconductor device |
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| CN104889077A (en) * | 2014-03-07 | 2015-09-09 | 泰克元有限公司 | Sorting machine for test of semiconductor member and testing support method of the sorting machine |
| CN104889077B (en) * | 2014-03-07 | 2017-09-12 | 泰克元有限公司 | Method is supported in test in semiconductor element test separator and the separator |
| KR20160064722A (en) * | 2014-11-28 | 2016-06-08 | (주)테크윙 | Test handler |
| CN107003350A (en) * | 2014-11-28 | 2017-08-01 | 泰克元有限公司 | Testing, sorting machine |
| CN111375570A (en) * | 2014-11-28 | 2020-07-07 | 泰克元有限公司 | Test sorting machine |
| KR102187839B1 (en) | 2014-11-28 | 2020-12-08 | (주)테크윙 | Test handler |
| CN111375570B (en) * | 2014-11-28 | 2022-05-24 | 泰克元有限公司 | Test sorting machine |
| CN106076876A (en) * | 2015-04-30 | 2016-11-09 | 泰克元有限公司 | Semiconductor element test separator |
| CN106076876B (en) * | 2015-04-30 | 2018-09-25 | 泰克元有限公司 | semiconductor element test sorting machine |
| CN111659627A (en) * | 2017-01-11 | 2020-09-15 | 泰克元有限公司 | Pressure device for test sorting machine |
| CN111659627B (en) * | 2017-01-11 | 2022-05-03 | 泰克元有限公司 | Pressure device for test sorting machine |
| TWI679436B (en) * | 2017-08-18 | 2019-12-11 | 南韓商泰克元有限公司 | Handler for testing electronic devices |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201500745A (en) | 2015-01-01 |
| TWI509264B (en) | 2015-11-21 |
| CN104001680B (en) | 2017-07-04 |
| KR20140147902A (en) | 2014-12-31 |
| KR102072390B1 (en) | 2020-02-04 |
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