CN113075426A - Processor for testing electronic components - Google Patents
Processor for testing electronic components Download PDFInfo
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- CN113075426A CN113075426A CN202110302478.XA CN202110302478A CN113075426A CN 113075426 A CN113075426 A CN 113075426A CN 202110302478 A CN202110302478 A CN 202110302478A CN 113075426 A CN113075426 A CN 113075426A
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- 238000012360 testing method Methods 0.000 title claims abstract description 262
- 238000006243 chemical reaction Methods 0.000 claims description 11
- 230000000638 stimulation Effects 0.000 claims description 3
- 230000002265 prevention Effects 0.000 claims 1
- 230000032258 transport Effects 0.000 description 15
- 230000004048 modification Effects 0.000 description 12
- 238000012986 modification Methods 0.000 description 12
- 238000000034 method Methods 0.000 description 6
- 239000008186 active pharmaceutical agent Substances 0.000 description 5
- 230000009471 action Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
- G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2862—Chambers or ovens; Tanks
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2868—Complete testing stations; systems; procedures; software aspects
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
Abstract
The invention relates to a processor for testing electronic components. In the handler for testing electronic components according to the present invention, the conveying path of the test tray conveyed from the test chamber to the heat removal chamber is divided into the first region and the second region shorter in length than the first region, and before the first region is opened, the grip portion of the grip member provided to the second conveying device can be moved in advance to the test chamber through the second region to wait for the test. According to the present invention, since the test tray can be transferred from the test to the heat removal chamber when the test is completed, the cycle time of the test tray can be shortened and the operation rate of the handler can be finally improved.
Description
The application is a divisional application of an application with the name of 'a processor for testing electronic components' and the application date of which is 2018, 08 and 07 of Chinese patent application No. 201810891362.2.
Technical Field
The invention relates to a processor for testing electronic components.
Background
The electronic components of the semiconductor device as produced are tested by a tester, and then divided into good products and defective products, and only the good products are shipped.
In order to test electronic components, it is necessary to electrically connect the electronic components with a tester, and electrical connection between the tester and the electronic components is performed by a processor (hereinafter referred to as "processor") for testing the electronic components.
The processor may be manufactured in various forms according to a test condition for the electronic component or a type of the electronic component, and the like. In such various types, the present invention relates to a processor having a test chamber that can establish a test environment for electronic components.
The main structure of the processor with the test chamber comprises: the device comprises a loading device, a thermostatic chamber, a test chamber, a first conveying device, a pressurizing device, a heat removal chamber, a second conveying device, an unloading device and an opening and closing device.
The loading device loads the electronic component to be tested loaded in the customer tray into the test tray located at the loading position.
A thermostatic chamber is provided to apply thermal stimuli to the electronic components loaded on the test tray from the loading position. Although there are cases where an electronic component is tested at room temperature, the test is mainly performed in a high-temperature or low-temperature state due to the extremely severe environment to be considered, and for this purpose, a thermostatic chamber is provided for previously applying thermal stimulation to the electronic component to be tested.
The test chamber provides a space and temperature environment for testing electronic components on the temperature test tray that passes through the thermostatic chamber to the test position. Such test chambers incorporate test boards with testers. For reference, a test socket electrically connected to the electronic component is provided on the test board.
A first transport device is provided for transporting the test trays in the thermostatic chamber to the test chamber. Such a first conveyor may be constituted as a "tray transfer device" disclosed in korean patent laid-open publication No. 10-2008-0082591.
The pressurizing means pressurizes the electronic component on the test tray in the test position within the test chamber to the test socket side of the tester so that the electronic component can be electrically connected to the test socket.
A heat removal chamber is provided for returning the electronic components to near room temperature as much as possible by removing the thermal stimulus applied to the electronic components from the test tray in the test chamber in the thermostatic chamber and the test chamber.
A second transport device is provided for transporting the test trays in the test chamber to the heat removal chamber. Also, the second transport device may have the same structure as the "tray transfer device" disclosed in korean patent laid-open publication No. 10-2008-0082591.
The unloading device unloads the electronic components in the temperature test tray, which has been completed from the heat removing chamber to the unloading position, and sorts them according to the test results to move them onto empty customer trays.
The opening and closing means is for opening and closing the second conveyance path through which the test tray transferred from the test chamber to the heat removal chamber passes, and the present invention relates to such a case.
As is well known, the test tray in the handler having the above-described structure is transferred along a closed circulation path passing through the loading position, the inside of the thermostatic chamber, the test position in the inside of the test chamber, the inside of the heat removal chamber, and the unloading position and connected to the loading position by a plurality of transfer devices including the first transfer device and the second transfer device.
Generally, the thermostatic chamber has a temperature environment for preheating/precooling the electronic components according to the test temperature conditions, and this temperature environment is similar to the temperature environment in the test chamber. Therefore, the temperature environment in the thermostatic chamber has little influence on the temperature environment in the test chamber. Thereby, the first conveying path through which the test tray transferred from the thermostatic chamber to the test chamber passes can be opened.
However, the temperature environments of the test chamber and the heat removal chamber have a large difference. Thus, the second conveyance path through which the test tray transferred from the test chamber to the heat removal chamber passes must be openable and closable. That is, the second conveyance path should be opened when the test tray is conveyed, and closed when the test of the electronic components in the test chamber is performed.
There are two methods of transferring the test tray from the test chamber to the heat removal chamber. The first method is that the first transport means moves the rear-end test tray to the inside of the test chamber, the rear-end test tray pushes the front-end test tray toward the heat removing chamber side so that the front-end test tray is transported to the heat removing chamber side to some extent, and then the second transport means transports the second test tray further to the remaining portion. In addition, the second method is that the second conveyor conveys the test tray in the interior of the test chamber to the interior of the heat removal chamber before the first conveyor conveys the test tray at the rear end to the interior of the test chamber.
In the first method or the second method described above, the second conveyance path must be opened in order to transfer the test tray from the test chamber to the heat removal chamber.
However, after the test of the electronic components is finished, since the second conveying device is operated only after the second conveying passage is opened, the conveying operation of the test tray by the second conveying device takes more time, which increases the cycle time of the test tray and eventually leads to a decrease in the operating rate of the handler. In addition, since the time for opening the second conveyance path becomes longer, the time for the temperature environment in the test chamber to return to the test environment is also proportionally prolonged, which also results in a reduction in the operating rate of the processor.
However, if the second transfer passage is always opened, the temperature environment of the heat removal chamber disturbs the temperature environment of the test chamber, so that the reliability of the test is lowered.
Disclosure of Invention
Problems to be solved
An object of the present invention is to provide a technique for a second conveying device to perform a preparatory work for conveying a test tray in advance while ensuring reliability of a test.
Means for solving the problems
The processor for testing electronic components according to the present invention comprises: a loading device for loading the electronic component to be tested loaded on the customer tray onto the test tray in the loading position; a thermostatic chamber for applying thermal stimulation to the electronic components loaded on the test tray from the loading position; a test chamber providing a space and a temperature environment to test the electronic components on the temperature test tray passing through the thermostatic chamber to a test position; a first conveying device for conveying the test tray in the thermostatic chamber to the test chamber; a pressurizing device for pressurizing the electronic component on the test tray located at the test position in the test chamber to the test socket side of the tester so as to electrically connect the electronic component to the test socket; a heat removal chamber for removing a thermal stimulus applied to the electronic components from the test tray of the test chamber in the thermostatic chamber and the test chamber; a second transport device for transporting the test tray in the test chamber to the heat removal chamber; an unloading device for unloading the electronic components from the test tray from the heat removal chamber to the unloading position and classifying the electronic components according to the test result to move to the customer tray; and a first opening/closing device for opening/closing a first area which is a part of a transport path of the test tray transferred from the test chamber to the heat removal chamber. The second conveying device includes: a holding member for holding or releasing holding of the test tray; an actuator for performing gripping or releasing gripping of the test tray by the gripping member; a driver for moving the gripping member in a conveying direction of the test tray, a gripping portion of the gripping member constituting a second region capable of passing through as another part in the conveying path, the second region having a length shorter than that of the first region, the first opening and closing device including a first door and a first driver providing power for opening or closing the first door, when the test tray moves from the test chamber to the heat removal chamber, the first door is opened and, when closed, encloses at least the first area and prevents movement of a test tray from the test compartment to the heat removal compartment to help prevent heat exchange between the test compartment and the heat removal compartment, the transfer passage allows the test tray to move from the inside of the test chamber to the inside of the heat removal chamber when the first area is opened.
The handler for testing electronic components according to the present invention may further include a second opening and closing device for opening and closing the second area, the second opening and closing device including a second door and a second actuator providing power for opening or closing the second door, the second door opening the second area to allow the grip portion of the grip member to move from the heat removal chamber to the test chamber through the second area even in a state where the first door is closed, and when closed, closing the second area to help further prevent heat exchange between the test chamber and the heat removal chamber, and when the first area and the second area are all opened, the transport path allowing the test tray to move from the inside of the test chamber to the inside of the heat removal chamber.
The opening and closing operation of the first region by the first opening and closing means and the opening and closing operation of the second region by the second opening and closing means can be performed independently of each other, and the second driver and the first driver are separately provided independently.
The second door has a driving protrusion, the second driver includes a driving member and a driving source for forward and reverse rotating the driving member, the driving member pushes the driving protrusion by forward rotation to close the second region by the second door or pulls the driving protrusion by reverse rotation to open the second region, and has a conversion groove for converting forward and reverse rotation movement of the driving member into forward and reverse movement of the driving protrusion, the driving protrusion being inserted into the conversion groove.
The second door has a driving protrusion, the second actuator includes a driving member and a driving source for advancing and retreating the driving member in a first direction, the driving member advances and retreats the driving protrusion in a second direction different from the first direction by the advance and retreat in the first direction to open and close the second region through the second door, and has a conversion groove for converting the advance and retreat movement in the first direction into the advance and retreat movement in the second direction of the driving protrusion, and the driving protrusion is inserted into the conversion groove.
In order to prevent the air in the heat removal chamber from moving into the test chamber through the second region, the testing device further includes a gas supply device that makes the gas pressure in the test chamber higher than the gas pressure in the heat removal chamber by supplying gas to the inside of the test chamber, and by the gas supply device, the gas supplied to the inside of the test chamber has a temperature capable of maintaining a temperature environment in the test chamber.
The first region width is narrower than the second region width.
Effects of the invention
According to the present invention, since the opening and closing of the second area formed by the second opening and closing means is independent of the first opening and closing means, the reliability of the test is maintained and the time required from the end of the test of the electronic product to the completion of the transfer of the test tray is shortened, and finally, the operation rate of the processor can be improved.
Drawings
FIG. 1 is a conceptual top view of a processor 100 according to one embodiment of the invention.
Fig. 2 is a perspective view of extracting a characteristic portion applied to the processor of fig. 1.
Fig. 3 is a perspective view of the second conveyance device extracted and applied to fig. 1.
Fig. 4 is a right side view of a feature applied to the processor of fig. 1.
Fig. 5 and 6 are reference views for explaining the operation of the feature applied to the processor of fig. 1.
Fig. 7 is a first modification of the characteristic portion applied to the processor of fig. 1.
Fig. 8 is applied to a second modification of the characteristic portion of the processor of fig. 1.
Fig. 9 is a reference view for explaining an example to which the present invention is applied when a plurality of test trays are conveyed at a time.
Wherein the reference numerals are as follows:
100: the processor 110 for testing electronic components: loading device
SC: a thermostatic chamber TC: test chamber
120: first conveying device 130: pressure device
DC: the heat removal chamber 140: second conveying device
141: the holding member 142: actuator
143: the driver 150: unloading device
160: first opening/closing device 161: first door
162: the first driver 170: second opening and closing device
171: the second door 172: second driver
180: air supply device TW: conveying channel
TW 1: first region TW 2: first region
DE: driving part DS: driving source
TG: conversion tank
Detailed Description
Preferred embodiments of the present invention will be described with reference to the accompanying drawings, but for simplicity of description, descriptions of overlapping or substantially identical structures will be omitted or compressed as much as possible.
General description of processor architecture
Fig. 1 is a conceptual top view of a handler 100 of one embodiment of the present invention, and fig. 2 is a perspective view of a feature point P having a test tray TT passing through a transport lane TW between a test chamber TC and a heat removal chamber DC in the handler 100 of fig. 1. Referring to fig. 1 and 2, a processor 100 according to the present embodiment includes: a loading device 110, a thermostatic chamber SC, a test chamber TC, a first transport device 120, a pressurizing device 130, a heat removal chamber DC, a second transport device 140, an unloading device 150, a first opening/closing device 160 (refer to fig. 2), a second opening/closing device 170 (refer to fig. 2), and an air supply device 180.
The loading device 110, the thermostatic chamber SC, the test chamber TC, the first transport device 120, the pressurizing device 130, the heat removing chamber DC, and the unloading device 150 are the same as those described in the background art, and therefore, description thereof will be omitted, and the second transport device 140, the first opening/closing device 160, the second opening/closing device 170, and the gas supply device 180 according to the present invention will be described below.
The second conveyor 140 conveys the test tray TT positioned at the test position TP in the test chamber TC to the heat removal chamber DC. To this end, as shown in fig. 3, the second conveyor 140 includes: a gripping member 141, an actuator 142, and a driver 143.
The gripping member 141 has a gripping pin 141a at the gripping portion GP, and is capable of advancing and retreating forward and backward, so that the gripping pin 141a is inserted into or withdrawn from the holding hole GH of the test tray TT by the advancing and retreating, and grips or releases the gripping of the test tray TT.
The actuator 142 advances and retracts the grip member 141 forward and backward to grip or release the grip of the test tray TT by the grip member 141.
The driver 143 moves the grip member 141 left and right, so that the grip portion GP of the grip member 141 is positioned inside the heat removal chamber DC or inside the test chamber TC. Of course, the gripping member 141 can perform conveyance of the test tray TT by operation of the driver 143 in a state of gripping the test tray TT. Such a driver 143 may be constructed by applying the motor M and the conveyor belt B, but is not limited to such a construction.
The first opening and closing device 160 opens and closes the first region TW1 that is a part of the conveyance path TW, and includes a first door 161 and a first driver 162.
The first door 161 opens and closes the first region TW1, that is, the first region TW1 is opened if the first door 161 is opened, and the first region TW1 is closed if the first door 161 is closed, thereby preventing the test tray TT from moving from the test chamber TC to the heat removal chamber DC. In addition, the first door 161 prevents heat exchange between the test chamber TC and the heat removing chamber DC in accordance with the degree of closing the first region TW1 in the closed state, respectively.
The first driver 162 provides power for opening or closing the first door 161 so that the first door 161 opens and closes the first region TW 1. The first driver 162 in this embodiment employs an air cylinder, but a motor or other driving means may be employed.
The second opening-closing device 170 opens and closes a second region TW2 that is another part in the conveyance path TW. That is, the second region TW2 forms the conveyance channel TW together with the first region TW1, and is a portion different from the first region TW 1. The second opening and closing device 170 includes a second door 171 and a second actuator 172.
In order to enable the grip portion GP of the grip member 141 to move from the heat removal chamber DC to the test chamber TC through the second region TW2 even in the state where the first door 161 is closed, the second door 171 opens the second region TW2, and when closed, closes the second region TW2 to further prevent heat exchange between the test chamber TC and the heat removal chamber DC. Of course, the second region TW2 has a length L2 that allows the grip portion GP of the grip member 141 to pass but does not allow the test tray TT to pass, and is shorter than the length L1 of the first region TW 1. In this specification, the lengths L1, L2 refer to lengths in the up-down direction as the first direction of the first region TW1 or the second region TW2, and more specifically, refer to directions perpendicular to the direction in which the test tray TT is conveyed by the second conveying device 140 and also perpendicular to the direction in which the electronic components are pressed by the pressing device 130.
In addition, according to the present embodiment, the first region TW1 may be formed to have a width W1 shorter than the width W2 of the second region TW2 in the front-rear direction, which is the second direction. That is, in the related art, a conveyance path having the same width in all the portions is configured without distinction of the first region and the second region, and such a width of the conveyance path needs to ensure the degree to which the gripping portions of the gripping members move together with the test tray. Therefore, the area of the transfer passage is large, and the loss of hot or cold air in the test chamber is increased when the test tray is moved. However, according to the present invention, since it is not necessary to increase the width of the first region TW1 regardless of the grip portion GP of the grip member 141, it may be considered that the width of the first region TW1 has the minimum width W1 that ensures that the test tray TT can pass through, and accordingly reduces the loss of hot air or cold air in the test chamber TC when the test tray TT moves. Thus, the second region TW2 has a width W2 that ensures passage of the grip portion GP of the grip member 141 together with the test tray TT, but the first region TW1 has a width W1 that allows passage of only the test tray TT. Here, the widths W1, W2 are lengths in the direction in which the pressing device 130 presses the electronic component and in the direction in which the gripping member 141 advances and retreats to grip or release the grip of the test tray TT.
For reference, although the vertical type handler 100 in which the test tray TT tests the loaded electronic components in a vertically erected state is shown in the present embodiment, the present invention is also applicable to a horizontal type handler in which the test tray TT tests the loaded electronic components in a horizontal state. Therefore, in the horizontal handler, the test tray TT is conveyed in a horizontal state, and the lengths L1, L2 of the first area TW1 or the second area TW2 in the horizontal handler refer to the lengths in the front-rear direction (or horizontal direction).
The second driver 172 provides power for opening or closing the second door 171, and an air cylinder is applied in the present embodiment, but a motor or the like may be applied. By the operation of the second actuator 172 as described above, the second region TW2 is closed by the second door 171 as shown in fig. 4(a), or the second region TW2 can be opened even in a state where the first region TW1 is closed by the first door 161 as shown in fig. 4 (b). Of course, as shown in fig. 4(b), when the second region TW2 is opened, the grip part GP of the grip member 171 can move from the heat removal chamber DC to the test chamber TC through the second region TW 2.
According to the present invention as described above, as shown in fig. 2, the transport path TW allows the test tray TT to move from the test chamber TC to the heat removal chamber DC only when the first region TW1 and the second region TW2 are all open.
In addition, according to the present embodiment, since the first opening and closing device 160 and the second opening and closing device 170 operate independently of each other, the opening and closing action according to the first region TW1 of the first door 161 and the opening and closing action according to the second region TW2 of the second door 171 are performed independently of each other. For this reason, in the present embodiment, the second driver 172 and the first driver 162 are separately provided independently.
On the other hand, the gas supply device 180 supplies gas to the inside of the test chamber TC so that the gas pressure in the test chamber TC becomes higher than the gas pressure in the heat removal chamber DC. At this time, the gas supplied through the gas supply device 180 may be different according to the test temperature conditions. For example, if the test is a high temperature test, air of a high temperature is supplied, and if the test is a low temperature test, air of a low temperature is supplied. That is, the gas supplied into the test chamber TC by the gas supply means 18 preferably has a temperature capable of maintaining a temperature environment in the test chamber TC. This air supply device 180 can contribute to preventing the air in the heat removal chamber DC from moving into the test chamber TC even in a state where the second region TW2 is opened, in particular, by supplying the gas into the test chamber TC so that the pressure inside the test chamber TC is higher than the pressure inside the heat removal chamber DC. Of course, when the second region TW2 is opened, the amount of gas supplied is preferably greater than when the second region TW2 is closed, so as to control the pressure difference between the inside of the test chamber TC and the inside of the heat removing chamber DC to be maintained at a certain level or higher.
Next, the operation of the main part in the processor 100 having the above-described structure will be described.
When the electronic components are electrically connected to the test sockets by pushing the test tray TT and the electronic components in the test chamber TC toward the test board TB in the TESTER at the rear side by the pressurizing means 130, the electronic components are tested. It is preferable to start the test in a state where the first region TW1 and the second region TW2 are all closed. The second opening and closing means 170 is operated in advance to open the second region TW2 before the test is about to be ended or at least the first region TW1 is opened, and as shown in fig. 5, the second conveying means 140 is operated such that the grip portion GP of the grip member 141 is located inside the test chamber TC. In the state of fig. 5, when the test of the electronic component is completed, the pressing of the test tray TT by the pressing device 130 is released, and the test tray TT pushed backward returns forward. At this time, as shown in fig. 6, the holding pin 141a of the holding portion GP that the test tray TT returns forward and waits in the test chamber TC is inserted into the holding hole GH of the test tray TT, and at the same time, the first opening/closing device 160 opens the first region TW 1. Next, the gripping member 141 is moved to the right side by the operation of the actuator 143 of the second conveyor 140, and the test tray TT is transferred from the inside of the test chamber TC to the inside of the heat removal chamber DC. When the transfer of the test tray TT is finished, the first and second areas TW1 and TW2 are closed to perform appropriate tests on the electronic components loaded on the test tray TT at the rear end.
For reference, when the second region TW2 is opened and closed, when the grip portion GP of the grip member 141 is moved to the inside of the test chamber TC in advance, or when the second region TW2 has been opened, the amount of gas supplied can be determined in various ways according to specific specifications of the processor 100, test temperature conditions, or the like.
< first modification of characteristic portion >
Fig. 7 is a right side view of a first variation of the features of the processor 100 of fig. 1.
The second door 171 referred to in the foregoing fig. 2 has a side hung door type structure, and the second door 171A of the second opening/closing device 170A according to the present modification has a sliding door type structure. For this, the second door 171A has a driving protrusion DP thereon. In addition, the second driver 172A includes a driving part DE and a driving source DS.
The driving part DE pushes the driving protrusion DP in the rear direction by the forward rotation to close the second region TW2 by the second door 171A, and pulls the driving protrusion DP in the front direction by the reverse rotation to open the second region TW 2. For this purpose, the driving part DE has therein a conversion groove TG that converts its forward and reverse rotational movement into forward and backward movement of the driving protrusion DP, and the driving protrusion DP is inserted into the conversion groove TG.
The drive source DS is provided to rotate the drive member DE in the forward and reverse directions, and in the present modification, the drive source is realized by a cylinder, but the drive source is not limited to this, and may be realized by a motor or the like.
For reference, (a) of fig. 7 shows a state in which the second door 171A is opened, and (b) of fig. 7 shows a state in which the second door 171A is closed.
As described in the embodiment of fig. 2, in the present modification, the second opening/closing device 170A is also provided independently of the first opening/closing device 160A. The first opening and closing device 160A is identical in structure to the first opening and closing device 160 with reference to fig. 2, and thus, description will be omitted.
< second modification of characteristic portion >
Fig. 8 is a right side view of a second variation of features of the processor 100 according to fig. 1.
In this modification, the second door 171B of the second opening/closing device 170B also has a sliding door type structure.
In the present modification, the second door 171B is also provided with the driving projection DP, and the second actuator 172B is constituted by the driving member DE and the driving source DS.
The driving member DE advances and retreats in the vertical direction D1, and the driving protrusion DP advances and retreats in the front-rear direction D2, which is the second direction D1 perpendicular to the first direction D1, according to the advance and retreat of the driving member DE, and the second region TW2 is opened and closed by the second door 171B. For this, the driving part DE has a conversion groove TG for converting the advancing and retreating movement of the driving part DE in the first direction (up and down direction) into the advancing and retreating movement of the second door 171B in the second direction (front and rear direction), the conversion groove TG being inclined at predetermined angles θ 1 and θ 2 with respect to the first direction D1 and the second direction D2, respectively. Then, the driving protrusion DP is inserted into the switching groove TG.
The driving source DS is provided to advance and retract the driving member DE vertically, and is realized by an air cylinder in the present modification, but is not limited thereto, and may be realized by a motor or the like.
For reference, (a) of fig. 8 shows a state where the second region TW2 is open, and (b) of fig. 8 shows a state where the second region TW2 is closed.
On the one hand, in the above-described embodiment, the case where the second conveyance device 140 conveys one test tray TT is set, but as disclosed in patent publication No. 10-2008-0082591, the case where the second conveyance device 140 conveys two test trays TT together is of course applied in the present invention. For example, if two test trays arranged side by side in the test chamber are simultaneously transferred, as shown in fig. 9, a configuration may be adopted in which two first opening/closing devices having first doors are provided and a second opening/closing device having a second door positioned between the two first doors is provided. Referring to the example of fig. 9, since two test trays can be simultaneously conveyed by the gripping member, only one second opening and closing device can be provided. According to the example of fig. 9, since two test trays can be simultaneously conveyed by one gripping member, the second area can be reduced accordingly, and therefore, there is a relative advantage that the change of the temperature environment in the test chamber can be minimized even when the second area is opened. That is, as shown in the example of fig. 9, it is understood that the present invention can be more preferably applied when a plurality of test trays are conveyed at a time.
Of course, a plurality of test trays may be transferred to a plurality of second conveying devices, and in this case, referring to fig. 2 to 8, a plurality of first opening and closing devices and a plurality of second opening and closing devices according to the illustrated embodiments may be provided, respectively. Here, the plurality of first opening and closing means and the second opening and closing means may be arranged in a line-symmetrical manner or in parallel with the structure shown in the example of fig. 2 to 8.
For reference, if the gas supply amount and temperature are precisely controlled by the gas supply device 180, it may be sufficiently considered to omit the second opening and closing device and to always open the second area.
As described above, the specific description of the present invention is given by referring to the embodiment and the modification of the drawings, however, the embodiment and the modification are only preferred examples for describing the present invention. Therefore, it is intended that the invention not be limited to the disclosed embodiments, but that it be understood that it is within the scope of the appended claims and their equivalents.
Claims (7)
1. A processor for testing electronic components, comprising:
a loading device for loading the electronic component to be tested loaded on the customer tray onto the test tray located at the loading position;
a thermostatic chamber for applying thermal stimulation to the electronic components loaded on the test tray from the loading position;
the test chamber provides a space and a temperature environment so as to test the electronic components on the test tray which passes through the thermostatic chamber and arrives at a test position;
a first conveying device for conveying the test tray in the thermostatic chamber to the test chamber;
a pressurizing device for pressurizing the electronic component on the test tray at the test position in the test chamber to the test socket side of the tester so as to electrically connect the electronic component to the test socket;
a heat removal chamber for removing the thermal stimulus applied in the thermostatic chamber and the test chamber from the electronic components of the test tray of the test chamber;
a second transport device for transporting the test tray in the test chamber to the heat removal chamber;
an unloading device for unloading the electronic components from the test tray from the heat removing chamber to an unloading position, classifying the electronic components according to the test result, and moving the electronic components to a customer tray; and
two or more opening/closing devices located in a transport path of the test tray transported from the test chamber to the heat removal chamber,
the opening and closing device includes:
a first opening and closing device for opening and closing a first area which is a part of a transport path of the test tray transferred from the test chamber to the heat removal chamber; and
a second opening and closing means for opening and closing the second area,
the second area that is a portion different from the first area opened and closed by the first opening and closing means and that forms the conveyance path is independent of the first opening and closing means,
the second conveying device includes:
a holding member for holding or releasing holding of the test tray;
an actuator configured to cause the gripping member to grip or release gripping of the test tray; and
a driver for moving the holding member in a conveying direction of the test tray,
the first opening and closing device includes:
a first door that opens when a test tray is moved from the test chamber to the heat removal chamber, and closes at least the first region and prevents movement of a test tray from the test chamber to the heat removal chamber when the first door is closed to help prevent heat exchange between the test chamber and the heat removal chamber; and
a first driver providing power for opening or closing the first door,
the second opening and closing device includes:
a second door that opens to open the second region such that a grip portion of the grip member can move from the heat removal chamber to the test chamber through the second region even in a state where the first door is closed, and that closes the second region to contribute to further prevention of heat exchange between the test chamber and the heat removal chamber when the second door is closed; and
a second driver providing power for opening or closing the second door,
the transfer passage allows the test tray to move from the inside of the test chamber to the inside of the heat removal chamber when the first area and the second area are all open.
2. The processor for testing electronic components of claim 1,
the length of the second region in the up-down direction is shorter than the length of the first region in the up-down direction.
3. The processor for testing electronic components of claim 1,
the length of the second region in the front-rear direction is longer than the length of the first region in the front-rear direction.
4. The processor for testing electronic components of claim 1,
the opening and closing operation of the first region by the first opening and closing means and the opening and closing operation of the second region by the second opening and closing means can be realized independently of each other,
the second driver and the first driver are independently and separately provided.
5. The processor for testing electronic components of claim 4,
the second door has a driving protrusion,
the second driver includes a driving member that pushes the driving protrusion by a forward rotation to close the second region by the second door or pulls the driving protrusion by a reverse rotation to open the second region, and a driving source for forward and reverse rotating the driving member, the driving member including a conversion groove for converting forward and reverse rotation movement of the driving member into forward and reverse movement of the driving protrusion,
the driving protrusion is inserted into the transfer groove.
6. The processor for testing electronic components of claim 1,
the second door has a driving protrusion,
the second actuator includes a driving member and a driving source for advancing and retreating the driving member in a first direction, the driving protrusion is advanced and retreated in a second direction different from the first direction by the advance and retreat of the driving member in the first direction, and the second region is opened and closed by the second door, the driving member includes a conversion groove for converting an advance and retreat movement in the first direction into an advance and retreat movement in the second direction of the driving protrusion,
the driving protrusion is inserted into the transfer groove.
7. The processor for testing electronic components of claim 1,
further comprising air supply means for making the air pressure in the test chamber higher than the air pressure in the heat removal chamber by supplying air to the inside of the test chamber to prevent the air in the heat removal chamber from moving into the test chamber through the second region,
the gas supplied to the inside of the test chamber by the gas supply means has a temperature capable of maintaining a temperature environment inside the test chamber.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020170104868A KR102461321B1 (en) | 2017-08-18 | 2017-08-18 | Handler for testing electro devices |
| KR10-2017-0104868 | 2017-08-18 | ||
| CN201810891362.2A CN109406833B (en) | 2017-08-18 | 2018-08-07 | Processor for testing electronic components |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810891362.2A Division CN109406833B (en) | 2017-08-18 | 2018-08-07 | Processor for testing electronic components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113075426A true CN113075426A (en) | 2021-07-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110302478.XA Pending CN113075426A (en) | 2017-08-18 | 2018-08-07 | Processor for testing electronic components |
| CN201810891362.2A Active CN109406833B (en) | 2017-08-18 | 2018-08-07 | Processor for testing electronic components |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810891362.2A Active CN109406833B (en) | 2017-08-18 | 2018-08-07 | Processor for testing electronic components |
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| Country | Link |
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| KR (1) | KR102461321B1 (en) |
| CN (2) | CN113075426A (en) |
| TW (1) | TWI679436B (en) |
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| KR102461321B1 (en) * | 2017-08-18 | 2022-11-02 | (주)테크윙 | Handler for testing electro devices |
| KR102638649B1 (en) * | 2020-07-07 | 2024-02-19 | 세메스 주식회사 | Semiconductor device pressing apparatus and test handler comprising the same |
| JP2022021241A (en) * | 2020-07-21 | 2022-02-02 | 株式会社アドバンテスト | Electronic component handling device and electronic component testing device |
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Also Published As
| Publication number | Publication date |
|---|---|
| KR102461321B1 (en) | 2022-11-02 |
| TWI679436B (en) | 2019-12-11 |
| KR20190020257A (en) | 2019-02-28 |
| TW201920970A (en) | 2019-06-01 |
| CN109406833A (en) | 2019-03-01 |
| CN109406833B (en) | 2021-04-09 |
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