JPWO2007026499A1 - 携帯電話 - Google Patents

携帯電話 Download PDF

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Publication number
JPWO2007026499A1
JPWO2007026499A1 JP2007533148A JP2007533148A JPWO2007026499A1 JP WO2007026499 A1 JPWO2007026499 A1 JP WO2007026499A1 JP 2007533148 A JP2007533148 A JP 2007533148A JP 2007533148 A JP2007533148 A JP 2007533148A JP WO2007026499 A1 JPWO2007026499 A1 JP WO2007026499A1
Authority
JP
Japan
Prior art keywords
resin
substrate
substrate structure
frame
frame body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007533148A
Other languages
English (en)
Japanese (ja)
Inventor
正浩 小野
正浩 小野
吉博 宇田
吉博 宇田
盛司 山口
盛司 山口
和博 新地
和博 新地
留河　悟
悟 留河
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Publication of JPWO2007026499A1 publication Critical patent/JPWO2007026499A1/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20463—Filling compound, e.g. potted resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H10W42/261—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their shapes or dispositions
    • H10W42/273—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their shapes or dispositions the arrangements being between laterally adjacent chips, e.g. walls between chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H10W42/281—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their materials
    • H10W42/284—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their materials shielding resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H10W42/281—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their materials
    • H10W42/287—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their materials materials for magnetic shielding, e.g. ferromagnetic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Thermal Sciences (AREA)
  • Electromagnetism (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Casings For Electric Apparatus (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Telephone Set Structure (AREA)
JP2007533148A 2005-08-30 2006-08-03 携帯電話 Pending JPWO2007026499A1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005250201 2005-08-30
JP2005250201 2005-08-30
PCT/JP2006/315420 WO2007026499A1 (ja) 2005-08-30 2006-08-03 基板構造および電子機器

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2008261535A Division JP2009027191A (ja) 2005-08-30 2008-10-08 携帯電話

Publications (1)

Publication Number Publication Date
JPWO2007026499A1 true JPWO2007026499A1 (ja) 2009-03-26

Family

ID=37808601

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2007533148A Pending JPWO2007026499A1 (ja) 2005-08-30 2006-08-03 携帯電話
JP2008261535A Pending JP2009027191A (ja) 2005-08-30 2008-10-08 携帯電話

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2008261535A Pending JP2009027191A (ja) 2005-08-30 2008-10-08 携帯電話

Country Status (6)

Country Link
US (1) US20100044100A1 (https=)
EP (1) EP1933610A4 (https=)
JP (2) JPWO2007026499A1 (https=)
KR (1) KR20080039506A (https=)
CN (1) CN101273673B (https=)
WO (1) WO2007026499A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018022744A (ja) * 2016-08-02 2018-02-08 株式会社デンソー 電子機器

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JP4650244B2 (ja) * 2005-12-02 2011-03-16 株式会社村田製作所 回路モジュールおよびその製造方法
JP4543089B2 (ja) * 2008-01-11 2010-09-15 株式会社東芝 半導体装置
JP4138862B1 (ja) * 2008-01-15 2008-08-27 松下電器産業株式会社 回路基板モジュール及び電子機器
CN104392968B (zh) * 2008-11-21 2018-05-18 先进封装技术私人有限公司 半导体基板
JP2011253976A (ja) * 2010-06-03 2011-12-15 Murata Mfg Co Ltd 複合モジュール
JP2012043900A (ja) * 2010-08-17 2012-03-01 Nec Saitama Ltd 電子部品のシールド構造、およびそれを用いた電子機器
EP2461657A1 (de) * 2010-12-02 2012-06-06 Siemens Aktiengesellschaft Elektrische Baugruppe und Verfahren zur Herstellung einer elektrischen Baugruppe
JP5956783B2 (ja) * 2012-03-02 2016-07-27 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
CN103281866B (zh) * 2013-05-13 2016-03-30 广东美的制冷设备有限公司 Pcb板及其电路图的设计方法、电子装置
CN107222981B (zh) * 2013-05-20 2019-07-02 日月光半导体制造股份有限公司 电子模块的制造方法
WO2016088681A1 (ja) * 2014-12-04 2016-06-09 株式会社村田製作所 電子部品及びその製造方法
WO2016092695A1 (ja) * 2014-12-12 2016-06-16 株式会社メイコー モールド回路モジュール及びその製造方法
JP6500667B2 (ja) * 2015-07-17 2019-04-17 Tdk株式会社 コンバータ装置およびコンバータ装置製造方法
JP6645057B2 (ja) * 2015-07-17 2020-02-12 Tdk株式会社 コンバータ装置およびコンバータ装置製造方法
JP6615557B2 (ja) * 2015-09-30 2019-12-04 日亜化学工業株式会社 発光装置及びその製造方法
JP6672113B2 (ja) * 2016-09-09 2020-03-25 Ｔｏｗａ株式会社 電子回路装置及び電子回路装置の製造方法
CN106550070B (zh) * 2016-11-08 2020-02-21 捷开通讯(深圳)有限公司 一种轻薄移动终端及其制作方法
JP6935309B2 (ja) * 2017-11-24 2021-09-15 矢崎総業株式会社 電力伝送ユニット
CN108173991A (zh) * 2017-12-26 2018-06-15 广东欧珀移动通信有限公司 电子装置
EP3731267A1 (en) * 2019-04-25 2020-10-28 Infineon Technologies AG Semiconductor module and method for producing the same
WO2022176547A1 (ja) 2021-02-18 2022-08-25 株式会社村田製作所 高周波モジュール及び通信装置
US12183714B2 (en) * 2021-05-07 2024-12-31 Taiwan Semiconductor Manufacturing Company, Ltd. Package structures and method for forming the same
US11830859B2 (en) * 2021-08-30 2023-11-28 Taiwan Semiconductor Manufacturing Company, Ltd. Package structures and method for forming the same
JP7805739B2 (ja) * 2021-09-30 2026-01-26 芝浦メカトロニクス株式会社 成膜方法、樹脂層形成装置、成膜装置及び電磁波シールド付回路基板
CN116978798A (zh) * 2022-04-21 2023-10-31 华为技术有限公司 芯片封装结构及其制备方法、电子设备
US11729897B1 (en) * 2022-06-27 2023-08-15 Meta Platforms Technologies, Llc Electromagnetic shielding structure for an overmolded printed circuit board
DE112023000516T5 (de) * 2022-09-16 2024-12-12 Fuji Electric Co., Ltd. Halbleitermodul, halbleitervorrichtung und fahrzeug

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Publication number Priority date Publication date Assignee Title
JP2018022744A (ja) * 2016-08-02 2018-02-08 株式会社デンソー 電子機器

Also Published As

Publication number Publication date
CN101273673B (zh) 2010-12-08
US20100044100A1 (en) 2010-02-25
WO2007026499A1 (ja) 2007-03-08
CN101273673A (zh) 2008-09-24
EP1933610A4 (en) 2009-05-06
JP2009027191A (ja) 2009-02-05
EP1933610A1 (en) 2008-06-18
KR20080039506A (ko) 2008-05-07

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