CN109670378A - 指纹模组及设有该指纹模组的电子设备 - Google Patents
指纹模组及设有该指纹模组的电子设备 Download PDFInfo
- Publication number
- CN109670378A CN109670378A CN201710953668.1A CN201710953668A CN109670378A CN 109670378 A CN109670378 A CN 109670378A CN 201710953668 A CN201710953668 A CN 201710953668A CN 109670378 A CN109670378 A CN 109670378A
- Authority
- CN
- China
- Prior art keywords
- chip
- mould group
- fingerprint mould
- pad
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710953668.1A CN109670378A (zh) | 2017-10-13 | 2017-10-13 | 指纹模组及设有该指纹模组的电子设备 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710953668.1A CN109670378A (zh) | 2017-10-13 | 2017-10-13 | 指纹模组及设有该指纹模组的电子设备 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN109670378A true CN109670378A (zh) | 2019-04-23 |
Family
ID=66139885
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710953668.1A Withdrawn CN109670378A (zh) | 2017-10-13 | 2017-10-13 | 指纹模组及设有该指纹模组的电子设备 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN109670378A (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110188677A (zh) * | 2019-05-29 | 2019-08-30 | 维沃移动通信有限公司 | 指纹模组及移动终端 |
-
2017
- 2017-10-13 CN CN201710953668.1A patent/CN109670378A/zh not_active Withdrawn
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110188677A (zh) * | 2019-05-29 | 2019-08-30 | 维沃移动通信有限公司 | 指纹模组及移动终端 |
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Legal Events
Date | Code | Title | Description |
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information |
Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Applicant after: OFilm Microelectronics Technology Co.,Ltd. Address before: 330029 Nanchang Avenue, Nanchang high tech Zone, Nanchang, Jiangxi 1189 Applicant before: NANCHANG OFILM BIO-IDENTIFICATION TECHNOLOGY Co.,Ltd. Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Applicant after: Jiangxi OMS Microelectronics Co.,Ltd. Address before: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Applicant before: OFilm Microelectronics Technology Co.,Ltd. |
|
CB02 | Change of applicant information | ||
WW01 | Invention patent application withdrawn after publication |
Application publication date: 20190423 |
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WW01 | Invention patent application withdrawn after publication |