JPS644540B2 - - Google Patents

Info

Publication number
JPS644540B2
JPS644540B2 JP56079282A JP7928281A JPS644540B2 JP S644540 B2 JPS644540 B2 JP S644540B2 JP 56079282 A JP56079282 A JP 56079282A JP 7928281 A JP7928281 A JP 7928281A JP S644540 B2 JPS644540 B2 JP S644540B2
Authority
JP
Japan
Prior art keywords
particle size
resin
less
present
ppb
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56079282A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57195151A (en
Inventor
Masaji Ishii
Masashi Hasegawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denki Kagaku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denki Kagaku Kogyo KK filed Critical Denki Kagaku Kogyo KK
Priority to JP56079282A priority Critical patent/JPS57195151A/ja
Publication of JPS57195151A publication Critical patent/JPS57195151A/ja
Publication of JPS644540B2 publication Critical patent/JPS644540B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP56079282A 1981-05-27 1981-05-27 Low-radioactive resin composition Granted JPS57195151A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56079282A JPS57195151A (en) 1981-05-27 1981-05-27 Low-radioactive resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56079282A JPS57195151A (en) 1981-05-27 1981-05-27 Low-radioactive resin composition

Publications (2)

Publication Number Publication Date
JPS57195151A JPS57195151A (en) 1982-11-30
JPS644540B2 true JPS644540B2 (https=) 1989-01-26

Family

ID=13685503

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56079282A Granted JPS57195151A (en) 1981-05-27 1981-05-27 Low-radioactive resin composition

Country Status (1)

Country Link
JP (1) JPS57195151A (https=)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56135510A (en) * 1980-03-26 1981-10-23 Japan Atom Energy Res Inst Halogenated acenaphthylene polymer and flame-retarding and radiation resistance-imparting agent therefrom
JPS5863152A (ja) * 1981-10-09 1983-04-14 Fujikura Ltd 半導体素子封止用材料
JPS58102546A (ja) * 1981-12-14 1983-06-18 Mitsubishi Electric Corp 樹脂封止形半導体装置
JPS58127354A (ja) * 1982-01-25 1983-07-29 Shin Etsu Chem Co Ltd 半導体素子封止用樹脂組成物
JPS59221352A (ja) * 1983-05-31 1984-12-12 Sumitomo Bakelite Co Ltd 低放射線性エポキシ樹脂組成物
JPS6047032A (ja) * 1983-08-24 1985-03-14 Oki Electric Ind Co Ltd タブレツトの製造方法
JPS60180911A (ja) * 1984-02-27 1985-09-14 Nippon Chem Ind Co Ltd:The 高純度シリカおよびその製造法
JPS60191016A (ja) * 1984-03-12 1985-09-28 Nippon Chem Ind Co Ltd:The 高純度シリカゲル
JPS6117416A (ja) * 1984-07-03 1986-01-25 Nippon Chem Ind Co Ltd:The 高純度シリカおよびその製造方法
JPS6140811A (ja) * 1984-07-31 1986-02-27 Nippon Chem Ind Co Ltd:The 溶融用水和シリカおよびこれを用いた溶融シリカの製造方法
JPS6148422A (ja) * 1984-08-17 1986-03-10 Nippon Chem Ind Co Ltd:The 高純度シリカ及びその製法
JPS6148421A (ja) * 1984-08-17 1986-03-10 Nippon Chem Ind Co Ltd:The 高純度シリカおよびその製法
JPS61190556A (ja) * 1985-02-12 1986-08-25 Rishiyou Kogyo Kk 電子部品封止用樹脂組成物
JPS6212609A (ja) * 1985-07-11 1987-01-21 Nippon Chem Ind Co Ltd:The 改質溶融球状シリカおよびその製造方法
JPH0696445B2 (ja) * 1988-08-25 1994-11-30 日本化学工業株式会社 微細溶融球状シリカおよびその製造法
JPH0694369B2 (ja) * 1989-05-24 1994-11-24 日本化学工業株式会社 改質溶融球状シリカおよびその製造方法
JP4934085B2 (ja) * 2008-03-06 2012-05-16 電気化学工業株式会社 エネルギー線硬化性樹脂組成物とそれを用いた接着剤及び硬化体

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5843335B2 (ja) * 1974-07-04 1983-09-26 ニホンデンシキンゾク カブシキガイシヤ ゴウセイセキエイガラスノ セイゾウホウ
JPS5177612A (ja) * 1974-12-28 1976-07-06 Toshiba Ceramics Co Chokojundosekieigarasuseihinno seizohoho
FR2334796A2 (fr) * 1975-06-19 1977-07-08 Commissariat Energie Atomique Dispositif d'isolation thermique d'un caisson en beton pre-contraint
JPS54141569A (en) * 1978-04-26 1979-11-02 Toshiba Corp Semiconductor device
JPS554952A (en) * 1978-06-28 1980-01-14 Toshiba Corp Semiconductor device
JPS5522816A (en) * 1978-08-04 1980-02-18 Hitachi Ltd Resin sealed electronic parts
JPS5529532A (en) * 1978-08-23 1980-03-01 Toshiba Corp Epoxy resin composition
JPS5819136B2 (ja) * 1979-03-06 1983-04-16 日東電工株式会社 半導体封止用エポキシ樹脂組成物
JPS55128850A (en) * 1979-03-28 1980-10-06 Hitachi Ltd Semiconductor device
JPS5610947A (en) * 1979-07-10 1981-02-03 Toshiba Corp Semiconductor sealing resin composition
JPS5645053A (en) * 1979-09-21 1981-04-24 Hitachi Ltd Semiconductor device
JPS5659837A (en) * 1979-09-28 1981-05-23 Hitachi Chem Co Ltd Epoxy resin composition
JPS6015152B2 (ja) * 1980-01-09 1985-04-17 株式会社日立製作所 樹脂封止半導体メモリ装置
JPS56116647A (en) * 1980-02-20 1981-09-12 Hitachi Ltd Manufacturing of silica-alumina type filler for semiconductor memory element covering resin
DE3118130A1 (de) * 1981-05-07 1982-12-02 Siemens AG, 1000 Berlin und 8000 München Elektrisch isolierende einkapselungsmasse fuer halbleiteranordnungen

Also Published As

Publication number Publication date
JPS57195151A (en) 1982-11-30

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