JPS634701B2 - - Google Patents

Info

Publication number
JPS634701B2
JPS634701B2 JP55173287A JP17328780A JPS634701B2 JP S634701 B2 JPS634701 B2 JP S634701B2 JP 55173287 A JP55173287 A JP 55173287A JP 17328780 A JP17328780 A JP 17328780A JP S634701 B2 JPS634701 B2 JP S634701B2
Authority
JP
Japan
Prior art keywords
semiconductor element
semiconductor device
support member
resin
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55173287A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57111034A (en
Inventor
Hideo Inayoshi
Akira Suzuki
Kunihiro Tsubosaki
Toyoichi Ueda
Daisuke Makino
Nobuo Ichimura
Kazunari Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Microcomputer System Ltd
Hitachi Ltd
Resonac Corp
Original Assignee
Hitachi Microcomputer System Ltd
Hitachi Chemical Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Microcomputer System Ltd, Hitachi Chemical Co Ltd, Hitachi Ltd filed Critical Hitachi Microcomputer System Ltd
Priority to JP55173287A priority Critical patent/JPS57111034A/ja
Priority to US06/327,554 priority patent/US4803543A/en
Priority to GB8136841A priority patent/GB2089126B/en
Priority to KR1019810004865A priority patent/KR850001975B1/ko
Priority to FR8123055A priority patent/FR2496984B1/fr
Priority to DE19813148786 priority patent/DE3148786A1/de
Priority to IT68603/81A priority patent/IT1172862B/it
Publication of JPS57111034A publication Critical patent/JPS57111034A/ja
Priority to SG941/85A priority patent/SG94185G/en
Priority to MY414/86A priority patent/MY8600414A/xx
Publication of JPS634701B2 publication Critical patent/JPS634701B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W74/40—
    • H10W20/40—
    • H10W70/417—
    • H10W74/111—
    • H10W74/121—
    • H10W74/473—
    • H10W72/01515—
    • H10W72/073—
    • H10W72/07337—
    • H10W72/075—
    • H10W72/30—
    • H10W72/325—
    • H10W72/352—
    • H10W72/353—
    • H10W72/354—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5522—
    • H10W72/5524—
    • H10W72/884—
    • H10W74/00—
    • H10W90/736—
    • H10W90/756—

Landscapes

  • Die Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP55173287A 1980-12-10 1980-12-10 Semiconductor device and its manufacture Granted JPS57111034A (en)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP55173287A JPS57111034A (en) 1980-12-10 1980-12-10 Semiconductor device and its manufacture
US06/327,554 US4803543A (en) 1980-12-10 1981-12-04 Semiconductor device and process for producing the same
GB8136841A GB2089126B (en) 1980-12-10 1981-12-07 Semiconductor device and process for producing the same
DE19813148786 DE3148786A1 (de) 1980-12-10 1981-12-09 Halbleitereinrichtung und verfahren zu deren herstellung
FR8123055A FR2496984B1 (fr) 1980-12-10 1981-12-09 Dispositif a semiconducteur comprenant un element semiconducteur fixe a un element de support a l'aide d'un element organique; et son procede de fabrication
KR1019810004865A KR850001975B1 (ko) 1980-12-10 1981-12-09 반도체장치 및 그 제조방법
IT68603/81A IT1172862B (it) 1980-12-10 1981-12-09 Dispositivo a semiconduttore e procedimento per la sua fabbricazione
SG941/85A SG94185G (en) 1980-12-10 1985-12-07 Semiconductor device and process for producing the same
MY414/86A MY8600414A (en) 1980-12-10 1986-12-30 Semiconductor device and process for producing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55173287A JPS57111034A (en) 1980-12-10 1980-12-10 Semiconductor device and its manufacture

Publications (2)

Publication Number Publication Date
JPS57111034A JPS57111034A (en) 1982-07-10
JPS634701B2 true JPS634701B2 (en:Method) 1988-01-30

Family

ID=15957645

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55173287A Granted JPS57111034A (en) 1980-12-10 1980-12-10 Semiconductor device and its manufacture

Country Status (9)

Country Link
US (1) US4803543A (en:Method)
JP (1) JPS57111034A (en:Method)
KR (1) KR850001975B1 (en:Method)
DE (1) DE3148786A1 (en:Method)
FR (1) FR2496984B1 (en:Method)
GB (1) GB2089126B (en:Method)
IT (1) IT1172862B (en:Method)
MY (1) MY8600414A (en:Method)
SG (1) SG94185G (en:Method)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013135204A (ja) * 2011-12-27 2013-07-08 Sumitomo Bakelite Co Ltd 半導体装置
JPWO2012165273A1 (ja) * 2011-05-27 2015-02-23 住友ベークライト株式会社 半導体装置
JP2016048804A (ja) * 2015-12-04 2016-04-07 住友ベークライト株式会社 半導体装置

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JPS59195837A (ja) * 1983-04-21 1984-11-07 Sharp Corp Ｌｓｉチツプボンデイング方法
JPS62285429A (ja) * 1986-06-04 1987-12-11 Toshiba Chem Corp 半導体装置の製造方法
KR880014671A (ko) * 1987-05-27 1988-12-24 미다 가쓰시게 수지로 충진된 반도체 장치
US4888634A (en) * 1987-07-24 1989-12-19 Linear Technology Corporation High thermal resistance bonding material and semiconductor structures using same
US5031017A (en) * 1988-01-29 1991-07-09 Hewlett-Packard Company Composite optical shielding
US5045141A (en) * 1988-07-01 1991-09-03 Amoco Corporation Method of making solderable printed circuits formed without plating
US4976813A (en) * 1988-07-01 1990-12-11 Amoco Corporation Process for using a composition for a solder mask
EP0363936B1 (en) * 1988-10-12 1996-03-27 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing electric devices
US5001542A (en) * 1988-12-05 1991-03-19 Hitachi Chemical Company Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips
US5130780A (en) * 1989-02-07 1992-07-14 Fujitsu Limited Dual in-line packaging with improved moisture resistance
US5219795A (en) * 1989-02-07 1993-06-15 Fujitsu Limited Dual in-line packaging and method of producing the same
JP2833111B2 (ja) * 1989-03-09 1998-12-09 日立化成工業株式会社 回路の接続方法及びそれに用いる接着剤フィルム
FI105605B (fi) * 1989-04-27 2000-09-15 Siemens Ag Planarisoiva eriste
US5180523A (en) * 1989-11-14 1993-01-19 Poly-Flex Circuits, Inc. Electrically conductive cement containing agglomerate, flake and powder metal fillers
GB2239244B (en) * 1989-11-14 1994-06-01 David Durand Moisture resistant electrically conductive cements and methods for making and using same
US5183593A (en) * 1989-11-14 1993-02-02 Poly-Flex Circuits, Inc. Electrically conductive cement
JPH0724270B2 (ja) * 1989-12-14 1995-03-15 株式会社東芝 半導体装置及びその製造方法
JP2893782B2 (ja) * 1990-01-19 1999-05-24 日立化成工業株式会社 導電性接着剤および半導体装置
IT1238150B (it) * 1990-01-31 1993-07-09 Procedimento per l'accoppiamento a caldo di strutture sottili in materiale sintetico come tessuti, tessuti non tessuti, moquettes ed altro, a manufatti in materiale sintetico
US5853622A (en) * 1990-02-09 1998-12-29 Ormet Corporation Transient liquid phase sintering conductive adhesives
US5376403A (en) * 1990-02-09 1994-12-27 Capote; Miguel A. Electrically conductive compositions and methods for the preparation and use thereof
US5258139A (en) * 1990-04-20 1993-11-02 Hitachi Chemical Company, Ltd. Epoxy resin and adhesive composition containing the same
US5188767A (en) * 1990-04-27 1993-02-23 Hitachi Chemical Co., Ltd. Electroconductive resin paste containing mixed epoxy resin and electroconductive metal powder
JPH0521655A (ja) * 1990-11-28 1993-01-29 Mitsubishi Electric Corp 半導体装置および半導体装置用パツケージ
EP0543202B1 (en) * 1991-10-31 1996-08-21 Canon Kabushiki Kaisha Transfer-molding resin composition for use to manufacture ink jet recording head, and ink jet recording head manufactured by using the same
US5363080A (en) * 1991-12-27 1994-11-08 Avx Corporation High accuracy surface mount inductor
DE4238113A1 (de) * 1992-11-12 1994-05-19 Mikroelektronik Und Technologi Anordnung zur spannungsfreien Chipmontage
FR2713396B1 (fr) * 1993-11-30 1996-02-09 Giat Ind Sa Procédé d'encapsulation de composants ou de modules électroniques et composants ou modules électroniques encapsulés par ledit procédé.
TW324737B (en) * 1994-03-30 1998-01-11 Gould Wlectronics Inc Epoxy adhesive composition and copper foil and laminate using the same
US5969414A (en) * 1994-05-25 1999-10-19 Advanced Technology Interconnect Incorporated Semiconductor package with molded plastic body
JPH09155918A (ja) * 1995-12-07 1997-06-17 Matsushita Electric Ind Co Ltd 樹脂封止電子製品の製造方法
US6073339A (en) * 1996-09-20 2000-06-13 Tdk Corporation Of America Method of making low profile pin-less planar magnetic devices
JP3355122B2 (ja) 1998-01-08 2002-12-09 富士通株式会社 光モジュールの封止方法
EP1111667A4 (en) * 1998-07-28 2005-06-22 Hitachi Chemical Co Ltd SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
US6849806B2 (en) * 2001-11-16 2005-02-01 Texas Instruments Incorporated Electrical apparatus having resistance to atmospheric effects and method of manufacture therefor
US7152291B2 (en) * 2002-04-15 2006-12-26 Avx Corporation Method for forming plated terminations
US6835592B2 (en) * 2002-05-24 2004-12-28 Micron Technology, Inc. Methods for molding a semiconductor die package with enhanced thermal conductivity
US20060213685A1 (en) * 2002-06-27 2006-09-28 Wang Alan E Single or multi-layer printed circuit board with improved edge via design
EP1520454B1 (en) * 2002-06-27 2012-01-25 PPG Industries Ohio, Inc. Single or multi-layer printed circuit board with extended breakaway tabs and method of manufacture thereof
JP2007234800A (ja) * 2006-02-28 2007-09-13 Tdk Corp 電子部品及びその製造方法
JP5382484B2 (ja) * 2006-11-13 2014-01-08 住友ベークライト株式会社 接着剤層付き半導体素子の製造方法および半導体パッケージの製造方法
US7422707B2 (en) * 2007-01-10 2008-09-09 National Starch And Chemical Investment Holding Corporation Highly conductive composition for wafer coating
US9508622B2 (en) * 2011-04-28 2016-11-29 Freescale Semiconductor, Inc. Method for protecting copper wire bonds on aluminum pads of a semiconductor device from corrosion
JP7446125B2 (ja) * 2020-02-21 2024-03-08 エイブリック株式会社 半導体装置およびその製造方法

Family Cites Families (26)

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BE497999A (en:Method) * 1949-09-09
DE956987C (de) * 1951-06-20 1957-01-24 Hoechst Ag Verfahren zur Herstellung von selbsterhaertenden, gegen den Angriff chemischer Substanzen, besonders gegen Saeuren, bestaendige Bindungen ergebenden Massen
US2779668A (en) * 1953-04-02 1957-01-29 Union Carbide & Carbon Corp Epoxy resin modified phenol resin abrasive
GB768125A (en) * 1953-09-03 1957-02-13 Shell Refining & Marketing Co Improvements in or relating to resinous compositions comprising a glycidyl polyetherand a phenol-formaldehyde resin
US3439235A (en) * 1966-11-14 1969-04-15 Gen Electric Epoxy encapsulated semiconductor device
GB1206759A (en) * 1967-07-20 1970-09-30 Standard Telephones Cables Ltd Semiconductor devices
US3566208A (en) * 1968-02-02 1971-02-23 Fairchild Camera Instr Co Pin socket
US3600246A (en) * 1968-05-17 1971-08-17 Rca Corp Method of making laminated semiconductor devices
US3849187A (en) * 1970-03-08 1974-11-19 Dexter Corp Encapsulant compositions for semiconductors
US4076869A (en) * 1970-10-23 1978-02-28 Ciba-Geigy Corporation Hardenable epoxy resin compositions and process for making the same
NL158025B (nl) * 1971-02-05 1978-09-15 Philips Nv Werkwijze voor het vervaardigen van een halfgeleiderinrichting en halfgeleiderinrichting, vervaardigd volgens deze werkwijze.
US3975757A (en) * 1974-05-31 1976-08-17 National Semiconductor Corporation Molded electrical device
JPS5141962A (en:Method) * 1974-10-07 1976-04-08 Nippon Electric Co
JPS52107036A (en) * 1976-03-04 1977-09-08 Shoei Chemical Ind Co Electrically conductive paint
JPS52144099A (en) * 1976-05-26 1977-12-01 Hitachi Ltd Epoxy resin compositions
JPS5321771A (en) * 1976-08-11 1978-02-28 Sharp Kk Electronic parts mounting structure
JPS53132975A (en) * 1977-04-26 1978-11-20 Toshiba Corp Semiconductor device
JPS54111768A (en) * 1978-02-22 1979-09-01 Hitachi Ltd Semiconductor device of resin sealing type
JPS54141568A (en) * 1978-04-26 1979-11-02 Toshiba Corp Semiconductor device
JPS54141569A (en) * 1978-04-26 1979-11-02 Toshiba Corp Semiconductor device
US4248920A (en) * 1978-04-26 1981-02-03 Tokyo Shibaura Denki Kabushiki Kaisha Resin-sealed semiconductor device
GB2028828B (en) * 1978-08-04 1982-09-22 Western Electric Co Conductive adhesive system including a conductivity enhancer
US4356505A (en) * 1978-08-04 1982-10-26 Bell Telephone Laboratories, Incorporated Conductive adhesive system including a conductivity enhancer
US4210704A (en) * 1978-08-04 1980-07-01 Bell Telephone Laboratories, Incorporated Electrical devices employing a conductive epoxy resin formulation as a bonding medium
US4297401A (en) * 1978-12-26 1981-10-27 Minnesota Mining & Manufacturing Company Liquid crystal display and photopolymerizable sealant therefor
JPS6015152B2 (ja) * 1980-01-09 1985-04-17 株式会社日立製作所 樹脂封止半導体メモリ装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2012165273A1 (ja) * 2011-05-27 2015-02-23 住友ベークライト株式会社 半導体装置
JP2013135204A (ja) * 2011-12-27 2013-07-08 Sumitomo Bakelite Co Ltd 半導体装置
JP2016048804A (ja) * 2015-12-04 2016-04-07 住友ベークライト株式会社 半導体装置

Also Published As

Publication number Publication date
JPS57111034A (en) 1982-07-10
KR850001975B1 (ko) 1985-12-31
DE3148786A1 (de) 1982-07-29
GB2089126A (en) 1982-06-16
US4803543A (en) 1989-02-07
FR2496984A1 (fr) 1982-06-25
GB2089126B (en) 1985-03-13
IT8168603A0 (it) 1981-12-09
KR830008396A (ko) 1983-11-18
IT1172862B (it) 1987-06-18
SG94185G (en) 1986-07-25
FR2496984B1 (fr) 1985-11-08
MY8600414A (en) 1986-12-31

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