FR2496984B1 - Dispositif a semiconducteur comprenant un element semiconducteur fixe a un element de support a l'aide d'un element organique; et son procede de fabrication - Google Patents

Dispositif a semiconducteur comprenant un element semiconducteur fixe a un element de support a l'aide d'un element organique; et son procede de fabrication

Info

Publication number
FR2496984B1
FR2496984B1 FR8123055A FR8123055A FR2496984B1 FR 2496984 B1 FR2496984 B1 FR 2496984B1 FR 8123055 A FR8123055 A FR 8123055A FR 8123055 A FR8123055 A FR 8123055A FR 2496984 B1 FR2496984 B1 FR 2496984B1
Authority
FR
France
Prior art keywords
semiconductor
semiconductor device
support
manufacturing
organic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8123055A
Other languages
English (en)
French (fr)
Other versions
FR2496984A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of FR2496984A1 publication Critical patent/FR2496984A1/fr
Application granted granted Critical
Publication of FR2496984B1 publication Critical patent/FR2496984B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H10W74/40—
    • H10W20/40—
    • H10W70/417—
    • H10W74/111—
    • H10W74/121—
    • H10W74/473—
    • H10W72/01515—
    • H10W72/073—
    • H10W72/07337—
    • H10W72/075—
    • H10W72/30—
    • H10W72/325—
    • H10W72/352—
    • H10W72/353—
    • H10W72/354—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5522—
    • H10W72/5524—
    • H10W72/884—
    • H10W74/00—
    • H10W90/736—
    • H10W90/756—

Landscapes

  • Die Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
FR8123055A 1980-12-10 1981-12-09 Dispositif a semiconducteur comprenant un element semiconducteur fixe a un element de support a l'aide d'un element organique; et son procede de fabrication Expired FR2496984B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55173287A JPS57111034A (en) 1980-12-10 1980-12-10 Semiconductor device and its manufacture

Publications (2)

Publication Number Publication Date
FR2496984A1 FR2496984A1 (fr) 1982-06-25
FR2496984B1 true FR2496984B1 (fr) 1985-11-08

Family

ID=15957645

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8123055A Expired FR2496984B1 (fr) 1980-12-10 1981-12-09 Dispositif a semiconducteur comprenant un element semiconducteur fixe a un element de support a l'aide d'un element organique; et son procede de fabrication

Country Status (9)

Country Link
US (1) US4803543A (en:Method)
JP (1) JPS57111034A (en:Method)
KR (1) KR850001975B1 (en:Method)
DE (1) DE3148786A1 (en:Method)
FR (1) FR2496984B1 (en:Method)
GB (1) GB2089126B (en:Method)
IT (1) IT1172862B (en:Method)
MY (1) MY8600414A (en:Method)
SG (1) SG94185G (en:Method)

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US5045141A (en) * 1988-07-01 1991-09-03 Amoco Corporation Method of making solderable printed circuits formed without plating
US4976813A (en) * 1988-07-01 1990-12-11 Amoco Corporation Process for using a composition for a solder mask
EP0363936B1 (en) * 1988-10-12 1996-03-27 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing electric devices
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US5130780A (en) * 1989-02-07 1992-07-14 Fujitsu Limited Dual in-line packaging with improved moisture resistance
US5219795A (en) * 1989-02-07 1993-06-15 Fujitsu Limited Dual in-line packaging and method of producing the same
JP2833111B2 (ja) * 1989-03-09 1998-12-09 日立化成工業株式会社 回路の接続方法及びそれに用いる接着剤フィルム
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US5180523A (en) * 1989-11-14 1993-01-19 Poly-Flex Circuits, Inc. Electrically conductive cement containing agglomerate, flake and powder metal fillers
GB2239244B (en) * 1989-11-14 1994-06-01 David Durand Moisture resistant electrically conductive cements and methods for making and using same
US5183593A (en) * 1989-11-14 1993-02-02 Poly-Flex Circuits, Inc. Electrically conductive cement
JPH0724270B2 (ja) * 1989-12-14 1995-03-15 株式会社東芝 半導体装置及びその製造方法
JP2893782B2 (ja) * 1990-01-19 1999-05-24 日立化成工業株式会社 導電性接着剤および半導体装置
IT1238150B (it) * 1990-01-31 1993-07-09 Procedimento per l'accoppiamento a caldo di strutture sottili in materiale sintetico come tessuti, tessuti non tessuti, moquettes ed altro, a manufatti in materiale sintetico
US5853622A (en) * 1990-02-09 1998-12-29 Ormet Corporation Transient liquid phase sintering conductive adhesives
US5376403A (en) * 1990-02-09 1994-12-27 Capote; Miguel A. Electrically conductive compositions and methods for the preparation and use thereof
US5258139A (en) * 1990-04-20 1993-11-02 Hitachi Chemical Company, Ltd. Epoxy resin and adhesive composition containing the same
US5188767A (en) * 1990-04-27 1993-02-23 Hitachi Chemical Co., Ltd. Electroconductive resin paste containing mixed epoxy resin and electroconductive metal powder
JPH0521655A (ja) * 1990-11-28 1993-01-29 Mitsubishi Electric Corp 半導体装置および半導体装置用パツケージ
EP0543202B1 (en) * 1991-10-31 1996-08-21 Canon Kabushiki Kaisha Transfer-molding resin composition for use to manufacture ink jet recording head, and ink jet recording head manufactured by using the same
US5363080A (en) * 1991-12-27 1994-11-08 Avx Corporation High accuracy surface mount inductor
DE4238113A1 (de) * 1992-11-12 1994-05-19 Mikroelektronik Und Technologi Anordnung zur spannungsfreien Chipmontage
FR2713396B1 (fr) * 1993-11-30 1996-02-09 Giat Ind Sa Procédé d'encapsulation de composants ou de modules électroniques et composants ou modules électroniques encapsulés par ledit procédé.
TW324737B (en) * 1994-03-30 1998-01-11 Gould Wlectronics Inc Epoxy adhesive composition and copper foil and laminate using the same
US5969414A (en) * 1994-05-25 1999-10-19 Advanced Technology Interconnect Incorporated Semiconductor package with molded plastic body
JPH09155918A (ja) * 1995-12-07 1997-06-17 Matsushita Electric Ind Co Ltd 樹脂封止電子製品の製造方法
US6073339A (en) * 1996-09-20 2000-06-13 Tdk Corporation Of America Method of making low profile pin-less planar magnetic devices
JP3355122B2 (ja) 1998-01-08 2002-12-09 富士通株式会社 光モジュールの封止方法
EP1111667A4 (en) * 1998-07-28 2005-06-22 Hitachi Chemical Co Ltd SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
US6849806B2 (en) * 2001-11-16 2005-02-01 Texas Instruments Incorporated Electrical apparatus having resistance to atmospheric effects and method of manufacture therefor
US7152291B2 (en) * 2002-04-15 2006-12-26 Avx Corporation Method for forming plated terminations
US6835592B2 (en) * 2002-05-24 2004-12-28 Micron Technology, Inc. Methods for molding a semiconductor die package with enhanced thermal conductivity
US20060213685A1 (en) * 2002-06-27 2006-09-28 Wang Alan E Single or multi-layer printed circuit board with improved edge via design
EP1520454B1 (en) * 2002-06-27 2012-01-25 PPG Industries Ohio, Inc. Single or multi-layer printed circuit board with extended breakaway tabs and method of manufacture thereof
JP2007234800A (ja) * 2006-02-28 2007-09-13 Tdk Corp 電子部品及びその製造方法
JP5382484B2 (ja) * 2006-11-13 2014-01-08 住友ベークライト株式会社 接着剤層付き半導体素子の製造方法および半導体パッケージの製造方法
US7422707B2 (en) * 2007-01-10 2008-09-09 National Starch And Chemical Investment Holding Corporation Highly conductive composition for wafer coating
US9508622B2 (en) * 2011-04-28 2016-11-29 Freescale Semiconductor, Inc. Method for protecting copper wire bonds on aluminum pads of a semiconductor device from corrosion
TWI569385B (zh) * 2011-05-27 2017-02-01 住友電木股份有限公司 半導體裝置之製造方法
JP6119094B2 (ja) * 2011-12-27 2017-04-26 住友ベークライト株式会社 半導体装置
JP6119832B2 (ja) * 2015-12-04 2017-04-26 住友ベークライト株式会社 半導体装置
JP7446125B2 (ja) * 2020-02-21 2024-03-08 エイブリック株式会社 半導体装置およびその製造方法

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US2779668A (en) * 1953-04-02 1957-01-29 Union Carbide & Carbon Corp Epoxy resin modified phenol resin abrasive
GB768125A (en) * 1953-09-03 1957-02-13 Shell Refining & Marketing Co Improvements in or relating to resinous compositions comprising a glycidyl polyetherand a phenol-formaldehyde resin
US3439235A (en) * 1966-11-14 1969-04-15 Gen Electric Epoxy encapsulated semiconductor device
GB1206759A (en) * 1967-07-20 1970-09-30 Standard Telephones Cables Ltd Semiconductor devices
US3566208A (en) * 1968-02-02 1971-02-23 Fairchild Camera Instr Co Pin socket
US3600246A (en) * 1968-05-17 1971-08-17 Rca Corp Method of making laminated semiconductor devices
US3849187A (en) * 1970-03-08 1974-11-19 Dexter Corp Encapsulant compositions for semiconductors
US4076869A (en) * 1970-10-23 1978-02-28 Ciba-Geigy Corporation Hardenable epoxy resin compositions and process for making the same
NL158025B (nl) * 1971-02-05 1978-09-15 Philips Nv Werkwijze voor het vervaardigen van een halfgeleiderinrichting en halfgeleiderinrichting, vervaardigd volgens deze werkwijze.
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JPS5141962A (en:Method) * 1974-10-07 1976-04-08 Nippon Electric Co
JPS52107036A (en) * 1976-03-04 1977-09-08 Shoei Chemical Ind Co Electrically conductive paint
JPS52144099A (en) * 1976-05-26 1977-12-01 Hitachi Ltd Epoxy resin compositions
JPS5321771A (en) * 1976-08-11 1978-02-28 Sharp Kk Electronic parts mounting structure
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US4297401A (en) * 1978-12-26 1981-10-27 Minnesota Mining & Manufacturing Company Liquid crystal display and photopolymerizable sealant therefor
JPS6015152B2 (ja) * 1980-01-09 1985-04-17 株式会社日立製作所 樹脂封止半導体メモリ装置

Also Published As

Publication number Publication date
JPS634701B2 (en:Method) 1988-01-30
JPS57111034A (en) 1982-07-10
KR850001975B1 (ko) 1985-12-31
DE3148786A1 (de) 1982-07-29
GB2089126A (en) 1982-06-16
US4803543A (en) 1989-02-07
FR2496984A1 (fr) 1982-06-25
GB2089126B (en) 1985-03-13
IT8168603A0 (it) 1981-12-09
KR830008396A (ko) 1983-11-18
IT1172862B (it) 1987-06-18
SG94185G (en) 1986-07-25
MY8600414A (en) 1986-12-31

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