JPS61239646A - 多層配線の形成方法 - Google Patents

多層配線の形成方法

Info

Publication number
JPS61239646A
JPS61239646A JP60080809A JP8080985A JPS61239646A JP S61239646 A JPS61239646 A JP S61239646A JP 60080809 A JP60080809 A JP 60080809A JP 8080985 A JP8080985 A JP 8080985A JP S61239646 A JPS61239646 A JP S61239646A
Authority
JP
Japan
Prior art keywords
wiring
forming
layer
insulating film
etching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60080809A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0587973B2 (enExample
Inventor
Fumihide Satou
佐藤　史英
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP60080809A priority Critical patent/JPS61239646A/ja
Publication of JPS61239646A publication Critical patent/JPS61239646A/ja
Publication of JPH0587973B2 publication Critical patent/JPH0587973B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP60080809A 1985-04-16 1985-04-16 多層配線の形成方法 Granted JPS61239646A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60080809A JPS61239646A (ja) 1985-04-16 1985-04-16 多層配線の形成方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60080809A JPS61239646A (ja) 1985-04-16 1985-04-16 多層配線の形成方法

Publications (2)

Publication Number Publication Date
JPS61239646A true JPS61239646A (ja) 1986-10-24
JPH0587973B2 JPH0587973B2 (enExample) 1993-12-20

Family

ID=13728792

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60080809A Granted JPS61239646A (ja) 1985-04-16 1985-04-16 多層配線の形成方法

Country Status (1)

Country Link
JP (1) JPS61239646A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63140634U (enExample) * 1987-03-05 1988-09-16
JPS6411346A (en) * 1987-07-03 1989-01-13 Matsushita Electric Industrial Co Ltd Manufacture of semiconductor device
JP2007194663A (ja) * 1998-12-28 2007-08-02 Samsung Electronics Co Ltd 半導体素子のボンディングパッド構造

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50123284A (enExample) * 1974-03-18 1975-09-27
JPS5828735A (ja) * 1981-08-13 1983-02-19 Toshiba Corp Ｘ線撮影装置におけるフイルム搬送装置
JPS5967649A (ja) * 1982-10-12 1984-04-17 Hitachi Ltd 多層配線の製造方法
JPS60100452A (ja) * 1983-11-07 1985-06-04 Oki Electric Ind Co Ltd 半導体装置の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50123284A (enExample) * 1974-03-18 1975-09-27
JPS5828735A (ja) * 1981-08-13 1983-02-19 Toshiba Corp Ｘ線撮影装置におけるフイルム搬送装置
JPS5967649A (ja) * 1982-10-12 1984-04-17 Hitachi Ltd 多層配線の製造方法
JPS60100452A (ja) * 1983-11-07 1985-06-04 Oki Electric Ind Co Ltd 半導体装置の製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63140634U (enExample) * 1987-03-05 1988-09-16
JPS6411346A (en) * 1987-07-03 1989-01-13 Matsushita Electric Industrial Co Ltd Manufacture of semiconductor device
JP2007194663A (ja) * 1998-12-28 2007-08-02 Samsung Electronics Co Ltd 半導体素子のボンディングパッド構造

Also Published As

Publication number Publication date
JPH0587973B2 (enExample) 1993-12-20

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