JPS60208886A - 電子部品の製造方法 - Google Patents

電子部品の製造方法

Info

Publication number
JPS60208886A
JPS60208886A JP59064747A JP6474784A JPS60208886A JP S60208886 A JPS60208886 A JP S60208886A JP 59064747 A JP59064747 A JP 59064747A JP 6474784 A JP6474784 A JP 6474784A JP S60208886 A JPS60208886 A JP S60208886A
Authority
JP
Japan
Prior art keywords
conductor
chip
thick film
layer
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59064747A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0210571B2 (enExample
Inventor
義孝 福岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP59064747A priority Critical patent/JPS60208886A/ja
Priority to EP85302138A priority patent/EP0157590B1/en
Priority to DE8585302138T priority patent/DE3580180D1/de
Priority to US06/716,980 priority patent/US4639830A/en
Publication of JPS60208886A publication Critical patent/JPS60208886A/ja
Publication of JPH0210571B2 publication Critical patent/JPH0210571B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/147—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being multilayered
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP59064747A 1984-03-31 1984-03-31 電子部品の製造方法 Granted JPS60208886A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP59064747A JPS60208886A (ja) 1984-03-31 1984-03-31 電子部品の製造方法
EP85302138A EP0157590B1 (en) 1984-03-31 1985-03-27 Packaged electronic device
DE8585302138T DE3580180D1 (de) 1984-03-31 1985-03-27 Verkapselte elektronische anordnung.
US06/716,980 US4639830A (en) 1984-03-31 1985-03-28 Packaged electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59064747A JPS60208886A (ja) 1984-03-31 1984-03-31 電子部品の製造方法

Publications (2)

Publication Number Publication Date
JPS60208886A true JPS60208886A (ja) 1985-10-21
JPH0210571B2 JPH0210571B2 (enExample) 1990-03-08

Family

ID=13267056

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59064747A Granted JPS60208886A (ja) 1984-03-31 1984-03-31 電子部品の製造方法

Country Status (4)

Country Link
US (1) US4639830A (enExample)
EP (1) EP0157590B1 (enExample)
JP (1) JPS60208886A (enExample)
DE (1) DE3580180D1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2593346B1 (fr) * 1986-01-17 1990-05-25 Nec Corp Substrat de cablage utilisant une ceramique comme isolant
JPH0545009Y2 (enExample) * 1987-04-06 1993-11-16
JPH0744320B2 (ja) * 1989-10-20 1995-05-15 松下電器産業株式会社 樹脂回路基板及びその製造方法
JP2821262B2 (ja) * 1990-11-26 1998-11-05 株式会社日立製作所 電子装置
JPH05207718A (ja) * 1992-01-24 1993-08-13 Nippon Densan Corp 直流モータ
US6888259B2 (en) * 2001-06-07 2005-05-03 Denso Corporation Potted hybrid integrated circuit
TWI574363B (zh) * 2011-07-05 2017-03-11 鴻海精密工業股份有限公司 晶片封裝體
TWI514524B (zh) * 2011-07-21 2015-12-21 鴻海精密工業股份有限公司 雙面電路板結構

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3317653A (en) * 1965-05-07 1967-05-02 Cts Corp Electrical component and method of making the same
US3909680A (en) * 1973-02-16 1975-09-30 Matsushita Electric Industrial Co Ltd Printed circuit board with silver migration prevention
GB1450689A (en) * 1973-09-27 1976-09-22 Int Standard Electric Corp Circuit ar'ngements
US3943621A (en) * 1974-03-25 1976-03-16 General Electric Company Semiconductor device and method of manufacture therefor
US4042550A (en) * 1975-11-28 1977-08-16 Allied Chemical Corporation Encapsulant compositions based on anhydride-hardened epoxy resins
JPS5328266A (en) * 1976-08-13 1978-03-16 Fujitsu Ltd Method of producing multilayer ceramic substrate
IN147578B (enExample) * 1977-02-24 1980-04-19 Rca Corp
US4147087A (en) * 1977-06-13 1979-04-03 Peters Jr Joseph Pitch change limiting device in conjunction with stringed musical instruments
US4318830A (en) * 1979-01-15 1982-03-09 E. I. Du Pont De Nemours And Company Thick film conductors having improved aged adhesion
US4221047A (en) * 1979-03-23 1980-09-09 International Business Machines Corporation Multilayered glass-ceramic substrate for mounting of semiconductor device
JPS5729185U (enExample) * 1980-07-28 1982-02-16
JPS5817651A (ja) * 1981-07-24 1983-02-01 Hitachi Ltd 多層回路板とその製造方法

Also Published As

Publication number Publication date
EP0157590A2 (en) 1985-10-09
EP0157590B1 (en) 1990-10-24
US4639830A (en) 1987-01-27
DE3580180D1 (de) 1990-11-29
EP0157590A3 (en) 1987-05-27
JPH0210571B2 (enExample) 1990-03-08

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees