JPS59150444A - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法Info
- Publication number
- JPS59150444A JPS59150444A JP58015952A JP1595283A JPS59150444A JP S59150444 A JPS59150444 A JP S59150444A JP 58015952 A JP58015952 A JP 58015952A JP 1595283 A JP1595283 A JP 1595283A JP S59150444 A JPS59150444 A JP S59150444A
- Authority
- JP
- Japan
- Prior art keywords
- film
- polycrystalline silicon
- nitride film
- region
- element region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
- H10W10/01—Manufacture or treatment
- H10W10/011—Manufacture or treatment of isolation regions comprising dielectric materials
- H10W10/012—Manufacture or treatment of isolation regions comprising dielectric materials using local oxidation of silicon [LOCOS]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
- H10W10/10—Isolation regions comprising dielectric materials
- H10W10/13—Isolation regions comprising dielectric materials formed using local oxidation of silicon [LOCOS], e.g. sealed interface localised oxidation [SILO] or side-wall mask isolation [SWAMI]
Landscapes
- Element Separation (AREA)
- Local Oxidation Of Silicon (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58015952A JPS59150444A (ja) | 1983-02-02 | 1983-02-02 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58015952A JPS59150444A (ja) | 1983-02-02 | 1983-02-02 | 半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59150444A true JPS59150444A (ja) | 1984-08-28 |
| JPS6337502B2 JPS6337502B2 (enExample) | 1988-07-26 |
Family
ID=11903082
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58015952A Granted JPS59150444A (ja) | 1983-02-02 | 1983-02-02 | 半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59150444A (enExample) |
-
1983
- 1983-02-02 JP JP58015952A patent/JPS59150444A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6337502B2 (enExample) | 1988-07-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4363868A (en) | Process of producing semiconductor devices by forming a silicon oxynitride layer by a plasma CVD technique which is employed in a selective oxidation process | |
| JPS6359251B2 (enExample) | ||
| JPS59130446A (ja) | 半導体装置の製造方法 | |
| JPS63107119A (ja) | ステップ絶縁層を有する集積回路の製造方法 | |
| JPS59150444A (ja) | 半導体装置の製造方法 | |
| US6245643B1 (en) | Method of removing polysilicon residual in a LOCOS isolation process using an etching selectivity solution | |
| JPS6231492B2 (enExample) | ||
| JPS5931215B2 (ja) | 絶縁層の形成方法 | |
| KR940009578B1 (ko) | 반도체 장치 및 그 제조방법 | |
| KR930008845B1 (ko) | 반도체소자의 소자 격리방법 | |
| JPS599937A (ja) | 半導体装置の製造方法 | |
| KR19990006083A (ko) | 반도체 소자의 소자분리막 형성방법 | |
| JPS62112342A (ja) | 素子分離領域の形成方法 | |
| JPH0458538A (ja) | 半導体装置の製造方法 | |
| JPS61194827A (ja) | 拡散保護膜形成方法 | |
| JPS59175137A (ja) | 半導体装置の製造方法 | |
| JPH1050695A (ja) | 半導体装置の製造方法 | |
| JPH0817907A (ja) | 半導体装置の製造方法 | |
| JPH01265536A (ja) | 半導体集積回路における素子分離領域の形成方法 | |
| JPH0582514A (ja) | 半導体装置の製造方法 | |
| JPS60128635A (ja) | 素子分離領域の形成方法 | |
| JPS6239810B2 (enExample) | ||
| JPS59167032A (ja) | 半導体装置の製造方法 | |
| JPH0399421A (ja) | Soi構造の形成方法 | |
| JPS6135533A (ja) | 半導体装置の製造方法 |