JPS58180013A - プリント回路における厚膜コンデンサおよびその製造方法 - Google Patents

プリント回路における厚膜コンデンサおよびその製造方法

Info

Publication number
JPS58180013A
JPS58180013A JP57193539A JP19353982A JPS58180013A JP S58180013 A JPS58180013 A JP S58180013A JP 57193539 A JP57193539 A JP 57193539A JP 19353982 A JP19353982 A JP 19353982A JP S58180013 A JPS58180013 A JP S58180013A
Authority
JP
Japan
Prior art keywords
capacitor
dielectric
printed circuit
conductive path
thick film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57193539A
Other languages
English (en)
Japanese (ja)
Inventor
ギゼラ・ウエステルマイル
フリ−ドハルト・フエ−ル
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Preh GmbH
Original Assignee
Preh GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Preh GmbH filed Critical Preh GmbH
Publication of JPS58180013A publication Critical patent/JPS58180013A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/20—Dielectrics using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672—Superposed layout, i.e. in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0709—Catalytic ink or adhesive for electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
JP57193539A 1981-11-05 1982-11-05 プリント回路における厚膜コンデンサおよびその製造方法 Pending JPS58180013A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19813143995 DE3143995A1 (de) 1981-11-05 1981-11-05 Dickschichtkondensator in druckschaltungstechnik
DE31439950 1981-11-05

Publications (1)

Publication Number Publication Date
JPS58180013A true JPS58180013A (ja) 1983-10-21

Family

ID=6145715

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57193539A Pending JPS58180013A (ja) 1981-11-05 1982-11-05 プリント回路における厚膜コンデンサおよびその製造方法

Country Status (4)

Country Link
US (1) US4555745A (OSRAM)
EP (1) EP0078935B1 (OSRAM)
JP (1) JPS58180013A (OSRAM)
DE (1) DE3143995A1 (OSRAM)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05502313A (ja) * 1989-12-18 1993-04-22 ストレイジ　テクノロジー　コーポレイション データ記憶システム

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3143995A1 (de) * 1981-11-05 1983-05-19 Preh, Elektrofeinmechanische Werke, Jakob Preh, Nachf. Gmbh & Co, 8740 Bad Neustadt Dickschichtkondensator in druckschaltungstechnik
EP0260665A3 (de) * 1986-09-18 1989-03-29 Siemens Aktiengesellschaft Verfahren zur Herstellung eines schichtartig aufgebauten elektrischen Bauteils
FI904210A7 (fi) * 1988-12-24 1990-08-24 Tech Applications Company Limited Parannettu menetelmä painettujen piirien valmistamiseksi
US5711988A (en) * 1992-09-18 1998-01-27 Pinnacle Research Institute, Inc. Energy storage device and its methods of manufacture
US5384685A (en) * 1992-09-18 1995-01-24 Pinnacle Research Institute, Inc. Screen printing of microprotrusions for use as a space separator in an electrical storage device
US5867363A (en) * 1992-09-18 1999-02-02 Pinnacle Research Institute, Inc. Energy storage device
US5464453A (en) * 1992-09-18 1995-11-07 Pinnacle Research Institute, Inc. Method to fabricate a reliable electrical storage device and the device thereof
US5821033A (en) * 1992-09-18 1998-10-13 Pinnacle Research Institute, Inc. Photolithographic production of microprotrusions for use as a space separator in an electrical storage device
US5800857A (en) * 1992-09-18 1998-09-01 Pinnacle Research Institute, Inc. Energy storage device and methods of manufacture
EP0662248A4 (en) * 1992-09-18 2000-10-25 Pinnacle Research Inst Inc ENERGY ACCUMULATION DEVICE AND MANUFACTURING METHOD THEREOF
US5382928A (en) * 1993-01-22 1995-01-17 The Whitaker Corporation RF filter having composite dielectric layer and method of manufacture
US5980977A (en) * 1996-12-09 1999-11-09 Pinnacle Research Institute, Inc. Method of producing high surface area metal oxynitrides as substrates in electrical energy storage
US6935002B1 (en) * 1997-10-13 2005-08-30 Murata Manufacturing Co., Ltd. Method of manufacturing a nonreciprocal circuit device
US6618238B2 (en) * 1998-04-01 2003-09-09 Polyclad Laminates, Inc. Parallel plate buried capacitor
US6021050A (en) * 1998-12-02 2000-02-01 Bourns, Inc. Printed circuit boards with integrated passive components and method for making same
DE19902769A1 (de) * 1999-01-25 2000-07-27 Philips Corp Intellectual Pty Keramisches, passives Bauelement
DE19939483A1 (de) * 1999-08-20 2001-03-08 Philips Corp Intellectual Pty Passives Bauelement mit Verbundwerkstoff
US6661642B2 (en) * 2001-11-26 2003-12-09 Shipley Company, L.L.C. Dielectric structure
CN100380540C (zh) * 2001-11-26 2008-04-09 希普利公司 介电结构
US7056800B2 (en) * 2003-12-15 2006-06-06 Motorola, Inc. Printed circuit embedded capacitors
KR100586963B1 (ko) * 2004-05-04 2006-06-08 삼성전기주식회사 유전체 형성용 조성물, 이로 제조된 캐패시터층 및 이를포함하는 인쇄회로기판
EP3091821A1 (en) * 2015-05-08 2016-11-09 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Printed circuit board
DE102015113694B4 (de) * 2015-08-19 2021-09-09 Preh Gmbh Kapazitives Bedienelement mit verbesserter Störunanfälligkeit
KR102440363B1 (ko) * 2017-08-11 2022-09-05 삼성전자주식회사 필름 프레임, 디스플레이 기판 제조 시스템 및 디스플레이 기판 제조 방법

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49105151A (OSRAM) * 1973-02-13 1974-10-04
JPS52155363A (en) * 1976-06-18 1977-12-23 Tokyo Shibaura Electric Co Thick integrated circuit unit
JPS55130127A (en) * 1979-03-30 1980-10-08 Matsushita Electric Industrial Co Ltd Printed capacitor and method of fabricating same
JPS5664423A (en) * 1979-10-29 1981-06-01 Matsushita Electric Industrial Co Ltd Thick film capacitor and method of manufacturing same
JPS56124223A (en) * 1980-03-05 1981-09-29 Tdk Electronics Co Ltd Method of forming electrode for electronic part
JPS56130911A (en) * 1980-03-17 1981-10-14 Tdk Electronics Co Ltd Method of forming electrode of electronic component

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB706067A (OSRAM) * 1900-01-01
GB584672A (en) * 1944-01-14 1947-01-21 Erich Schaefer Improvements in or relating to electrical condensers having plastic film dielectrics
FR1051606A (fr) * 1951-02-07 1954-01-18 Csf Nouveau procédé de fabrication de matières isolantes à constante diélectrique élevée et leur application à la fabrication de condensateurs
US2934479A (en) * 1957-01-22 1960-04-26 Leon L Deer Process for masking printed circuits before plating
US3310432A (en) * 1963-07-11 1967-03-21 Corning Glass Works Method for applying electrical conductors on a smooth vitreous surface and article
US3481777A (en) * 1967-02-17 1969-12-02 Ibm Electroless coating method for making printed circuits
US3660328A (en) * 1970-07-27 1972-05-02 Pfizer Dielectric films
DE2132935C3 (de) * 1971-07-02 1978-07-20 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Elektrischer, im Siebdruckverfahren hergestellter Kondensator
DE2434390A1 (de) * 1973-07-17 1975-02-27 Alphameric Holdings Ltd Tastatur
DD114315A1 (OSRAM) * 1974-07-18 1975-07-20
US3996502A (en) * 1975-06-02 1976-12-07 Zenith Radio Corporation Thick film capacitors
US4090229A (en) * 1976-09-30 1978-05-16 Becton, Dickinson Electronics Company Capacitive key for keyboard
US4182781A (en) * 1977-09-21 1980-01-08 Texas Instruments Incorporated Low cost method for forming elevated metal bumps on integrated circuit bodies employing an aluminum/palladium metallization base for electroless plating
DE2841742A1 (de) * 1978-09-26 1980-04-03 Draloric Electronic Kapazitives netzwerk
US4327126A (en) * 1980-11-10 1982-04-27 Ralph Ogden Method of making printed circuit boards
DE3143995A1 (de) * 1981-11-05 1983-05-19 Preh, Elektrofeinmechanische Werke, Jakob Preh, Nachf. Gmbh & Co, 8740 Bad Neustadt Dickschichtkondensator in druckschaltungstechnik

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49105151A (OSRAM) * 1973-02-13 1974-10-04
JPS52155363A (en) * 1976-06-18 1977-12-23 Tokyo Shibaura Electric Co Thick integrated circuit unit
JPS55130127A (en) * 1979-03-30 1980-10-08 Matsushita Electric Industrial Co Ltd Printed capacitor and method of fabricating same
JPS5664423A (en) * 1979-10-29 1981-06-01 Matsushita Electric Industrial Co Ltd Thick film capacitor and method of manufacturing same
JPS56124223A (en) * 1980-03-05 1981-09-29 Tdk Electronics Co Ltd Method of forming electrode for electronic part
JPS56130911A (en) * 1980-03-17 1981-10-14 Tdk Electronics Co Ltd Method of forming electrode of electronic component

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05502313A (ja) * 1989-12-18 1993-04-22 ストレイジ　テクノロジー　コーポレイション データ記憶システム

Also Published As

Publication number Publication date
EP0078935B1 (de) 1989-01-11
EP0078935A2 (de) 1983-05-18
DE3143995A1 (de) 1983-05-19
EP0078935A3 (en) 1985-10-02
DE3143995C2 (OSRAM) 1992-08-20
US4555745A (en) 1985-11-26

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