JPS58141536A - 半導体ウエハ−の吸着ヘツド - Google Patents

半導体ウエハ−の吸着ヘツド

Info

Publication number
JPS58141536A
JPS58141536A JP2513082A JP2513082A JPS58141536A JP S58141536 A JPS58141536 A JP S58141536A JP 2513082 A JP2513082 A JP 2513082A JP 2513082 A JP2513082 A JP 2513082A JP S58141536 A JPS58141536 A JP S58141536A
Authority
JP
Japan
Prior art keywords
semiconductor wafer
hole
shutter
wafer
gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2513082A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6240853B2 (enrdf_load_stackoverflow
Inventor
Hideaki Shirokura
白倉　英明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Sanyo Denki Co Ltd
Original Assignee
Tokyo Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Sanyo Denki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Sanyo Electric Co Ltd, Sanyo Electric Co Ltd, Sanyo Denki Co Ltd filed Critical Tokyo Sanyo Electric Co Ltd
Priority to JP2513082A priority Critical patent/JPS58141536A/ja
Publication of JPS58141536A publication Critical patent/JPS58141536A/ja
Publication of JPS6240853B2 publication Critical patent/JPS6240853B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manipulator (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
JP2513082A 1982-02-17 1982-02-17 半導体ウエハ−の吸着ヘツド Granted JPS58141536A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2513082A JPS58141536A (ja) 1982-02-17 1982-02-17 半導体ウエハ−の吸着ヘツド

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2513082A JPS58141536A (ja) 1982-02-17 1982-02-17 半導体ウエハ−の吸着ヘツド

Publications (2)

Publication Number Publication Date
JPS58141536A true JPS58141536A (ja) 1983-08-22
JPS6240853B2 JPS6240853B2 (enrdf_load_stackoverflow) 1987-08-31

Family

ID=12157369

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2513082A Granted JPS58141536A (ja) 1982-02-17 1982-02-17 半導体ウエハ−の吸着ヘツド

Country Status (1)

Country Link
JP (1) JPS58141536A (enrdf_load_stackoverflow)

Cited By (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58189535U (ja) * 1982-06-11 1983-12-16 日本電気株式会社 ウエハ−ス吸着装置
JPS5992545A (ja) * 1982-11-16 1984-05-28 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション シ−ト状材料の引上げヘツド
JPS6080876A (ja) * 1983-10-11 1985-05-08 Fuji Xerox Co Ltd 非磁性一成分現像装置
JPS61140432A (ja) * 1984-12-11 1986-06-27 Shinko Denki Kk ウエハ−等の保持装置
JPS6216924A (ja) * 1985-05-04 1987-01-26 Seibu Giken:Kk 流体によつて板状体を無接触状態で懸垂浮遊させる方法
JPS62255335A (ja) * 1986-04-25 1987-11-07 Hitachi Ltd 板状体の移送装置
US4735449A (en) * 1985-05-04 1988-04-05 Kabushiki Kaisha Seibu Giken Method of supporting and/or conveying a plate with fluid without physical contact
JPH02156651A (ja) * 1988-12-09 1990-06-15 Kyushu Electron Metal Co Ltd ウエーハのハンドリング装置
US6379103B1 (en) * 1999-12-22 2002-04-30 Orc Manufacturing Co., Ltd. Substrate transfer apparatus
JP2003324090A (ja) * 2002-04-26 2003-11-14 Dainippon Screen Mfg Co Ltd 基板処理装置
KR100420983B1 (ko) * 2001-05-04 2004-03-02 주식회사 신성이엔지 웨이퍼 반송 로봇용 핸드
JP2006339234A (ja) * 2005-05-31 2006-12-14 Murata Mach Ltd 非接触保持装置
JP2008177239A (ja) * 2007-01-16 2008-07-31 Tokyo Electron Ltd 基板搬送装置及び縦型熱処理装置
JP2009147148A (ja) * 2007-12-14 2009-07-02 Tokyo Electron Ltd 基板処理装置および基板処理方法
JP2009147146A (ja) * 2007-12-14 2009-07-02 Tokyo Electron Ltd 基板処理装置および基板処理方法
JP2010146927A (ja) * 2008-12-22 2010-07-01 Hitachi High-Technologies Corp 試料搬送機構、及び試料搬送機構を備えた走査電子顕微鏡
ITUD20090042A1 (it) * 2009-02-23 2010-08-24 Applied Materials Inc Pinza di bernoulli
CN102332420A (zh) * 2011-05-25 2012-01-25 湖南红太阳光电科技有限公司 超薄伞流式非接触硅片吸盘
WO2012176629A1 (ja) * 2011-06-20 2012-12-27 東京エレクトロン株式会社 剥離システム、剥離方法、及びコンピュータ記憶媒体
JP2013136111A (ja) * 2011-12-28 2013-07-11 Ngk Spark Plug Co Ltd 非接触搬送装置、配線基板の製造方法
DE102012215798A1 (de) * 2012-09-06 2014-03-06 J. Schmalz Gmbh Flächensauggreifer
CN103811386A (zh) * 2012-11-13 2014-05-21 Ap系统股份有限公司 基底传送设备和基底加工设备
JP2014123501A (ja) * 2012-12-21 2014-07-03 Nissan Motor Co Ltd 燃料電池用セパレータの吸着装置
DE102017115738A1 (de) * 2017-07-13 2019-01-17 J. Schmalz Gmbh Bernoulli-Greifer
CN109461691A (zh) * 2017-09-06 2019-03-12 富士迈半导体精密工业（上海）有限公司 晶圆支撑装置
CN110697418A (zh) * 2019-10-29 2020-01-17 田韬 一种基于流体压强的非接触式吸盘
GB2584069A (en) * 2019-03-27 2020-11-25 Millitec Food Systems Ltd Flow gripper
WO2021048069A1 (de) * 2019-09-10 2021-03-18 A O Ideas Gmbh Saugeinheit und saugvorrichtung
EP3655352A4 (en) * 2017-07-21 2021-04-21 Electro Scientific Industries, Inc. NON-CONTACT MANIPULATOR AND PROCESS FOR HANDLING PARTS USING THE SAME
TWI859416B (zh) * 2020-02-19 2024-10-21 日商Ｓｍｃ股份有限公司 非接觸搬送裝置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4629765B2 (ja) * 2008-10-17 2011-02-09 日本特殊陶業株式会社 配線基板の非接触搬送装置及び方法、樹脂製配線基板の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51112463U (enrdf_load_stackoverflow) * 1975-03-06 1976-09-11
JPS5638454U (enrdf_load_stackoverflow) * 1979-08-31 1981-04-11

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51112463U (enrdf_load_stackoverflow) * 1975-03-06 1976-09-11
JPS5638454U (enrdf_load_stackoverflow) * 1979-08-31 1981-04-11

Cited By (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58189535U (ja) * 1982-06-11 1983-12-16 日本電気株式会社 ウエハ−ス吸着装置
JPS5992545A (ja) * 1982-11-16 1984-05-28 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション シ−ト状材料の引上げヘツド
JPS6080876A (ja) * 1983-10-11 1985-05-08 Fuji Xerox Co Ltd 非磁性一成分現像装置
JPS61140432A (ja) * 1984-12-11 1986-06-27 Shinko Denki Kk ウエハ−等の保持装置
JPS6216924A (ja) * 1985-05-04 1987-01-26 Seibu Giken:Kk 流体によつて板状体を無接触状態で懸垂浮遊させる方法
US4735449A (en) * 1985-05-04 1988-04-05 Kabushiki Kaisha Seibu Giken Method of supporting and/or conveying a plate with fluid without physical contact
JPS62255335A (ja) * 1986-04-25 1987-11-07 Hitachi Ltd 板状体の移送装置
JPH02156651A (ja) * 1988-12-09 1990-06-15 Kyushu Electron Metal Co Ltd ウエーハのハンドリング装置
US6379103B1 (en) * 1999-12-22 2002-04-30 Orc Manufacturing Co., Ltd. Substrate transfer apparatus
KR100420983B1 (ko) * 2001-05-04 2004-03-02 주식회사 신성이엔지 웨이퍼 반송 로봇용 핸드
JP2003324090A (ja) * 2002-04-26 2003-11-14 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2006339234A (ja) * 2005-05-31 2006-12-14 Murata Mach Ltd 非接触保持装置
JP2008177239A (ja) * 2007-01-16 2008-07-31 Tokyo Electron Ltd 基板搬送装置及び縦型熱処理装置
JP2009147148A (ja) * 2007-12-14 2009-07-02 Tokyo Electron Ltd 基板処理装置および基板処理方法
JP2009147146A (ja) * 2007-12-14 2009-07-02 Tokyo Electron Ltd 基板処理装置および基板処理方法
JP2010146927A (ja) * 2008-12-22 2010-07-01 Hitachi High-Technologies Corp 試料搬送機構、及び試料搬送機構を備えた走査電子顕微鏡
ITUD20090042A1 (it) * 2009-02-23 2010-08-24 Applied Materials Inc Pinza di bernoulli
WO2010094343A1 (en) * 2009-02-23 2010-08-26 Applied Materials, Inc. Bernoulli gripper
CN102332420A (zh) * 2011-05-25 2012-01-25 湖南红太阳光电科技有限公司 超薄伞流式非接触硅片吸盘
WO2012176629A1 (ja) * 2011-06-20 2012-12-27 東京エレクトロン株式会社 剥離システム、剥離方法、及びコンピュータ記憶媒体
JP2013004845A (ja) * 2011-06-20 2013-01-07 Tokyo Electron Ltd 剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体
JP2013136111A (ja) * 2011-12-28 2013-07-11 Ngk Spark Plug Co Ltd 非接触搬送装置、配線基板の製造方法
DE102012215798A1 (de) * 2012-09-06 2014-03-06 J. Schmalz Gmbh Flächensauggreifer
DE102012215798B4 (de) * 2012-09-06 2016-08-11 J. Schmalz Gmbh Flächensauggreifer
CN103811386A (zh) * 2012-11-13 2014-05-21 Ap系统股份有限公司 基底传送设备和基底加工设备
JP2014099607A (ja) * 2012-11-13 2014-05-29 Ap Systems Inc 基板搬送装置及び基板処理装置
JP2014123501A (ja) * 2012-12-21 2014-07-03 Nissan Motor Co Ltd 燃料電池用セパレータの吸着装置
DE102017115738A1 (de) * 2017-07-13 2019-01-17 J. Schmalz Gmbh Bernoulli-Greifer
DE102017115738B4 (de) 2017-07-13 2021-07-22 J. Schmalz Gmbh Bernoulli-Greifer
EP3655352A4 (en) * 2017-07-21 2021-04-21 Electro Scientific Industries, Inc. NON-CONTACT MANIPULATOR AND PROCESS FOR HANDLING PARTS USING THE SAME
US11254014B2 (en) 2017-07-21 2022-02-22 Electro Scientific Industries, Inc. Non-contact handler and method of handling workpieces using the same
CN109461691A (zh) * 2017-09-06 2019-03-12 富士迈半导体精密工业（上海）有限公司 晶圆支撑装置
GB2584069A (en) * 2019-03-27 2020-11-25 Millitec Food Systems Ltd Flow gripper
GB2584069B (en) * 2019-03-27 2023-11-08 Millitec Food Systems Ltd Flow gripper
EP4028344A1 (de) * 2019-09-10 2022-07-20 A O Formaflon Swiss AG Saugeinheit und saugvorrichtung
WO2021048069A1 (de) * 2019-09-10 2021-03-18 A O Ideas Gmbh Saugeinheit und saugvorrichtung
CN110697418A (zh) * 2019-10-29 2020-01-17 田韬 一种基于流体压强的非接触式吸盘
CN110697418B (zh) * 2019-10-29 2021-12-07 台州市永安机械有限公司 一种基于流体压强的非接触式吸盘
TWI859416B (zh) * 2020-02-19 2024-10-21 日商Ｓｍｃ股份有限公司 非接觸搬送裝置

Also Published As

Publication number Publication date
JPS6240853B2 (enrdf_load_stackoverflow) 1987-08-31

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