JPS6240853B2 - - Google Patents

Info

Publication number
JPS6240853B2
JPS6240853B2 JP57025130A JP2513082A JPS6240853B2 JP S6240853 B2 JPS6240853 B2 JP S6240853B2 JP 57025130 A JP57025130 A JP 57025130A JP 2513082 A JP2513082 A JP 2513082A JP S6240853 B2 JPS6240853 B2 JP S6240853B2
Authority
JP
Japan
Prior art keywords
shutter
semiconductor wafer
suction
head
forced
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57025130A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58141536A (ja
Inventor
Hideaki Shirokura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Denki Co Ltd
Original Assignee
Sanyo Denki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Denki Co Ltd filed Critical Sanyo Denki Co Ltd
Priority to JP2513082A priority Critical patent/JPS58141536A/ja
Publication of JPS58141536A publication Critical patent/JPS58141536A/ja
Publication of JPS6240853B2 publication Critical patent/JPS6240853B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manipulator (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
JP2513082A 1982-02-17 1982-02-17 半導体ウエハ−の吸着ヘツド Granted JPS58141536A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2513082A JPS58141536A (ja) 1982-02-17 1982-02-17 半導体ウエハ−の吸着ヘツド

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2513082A JPS58141536A (ja) 1982-02-17 1982-02-17 半導体ウエハ−の吸着ヘツド

Publications (2)

Publication Number Publication Date
JPS58141536A JPS58141536A (ja) 1983-08-22
JPS6240853B2 true JPS6240853B2 (enrdf_load_stackoverflow) 1987-08-31

Family

ID=12157369

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2513082A Granted JPS58141536A (ja) 1982-02-17 1982-02-17 半導体ウエハ−の吸着ヘツド

Country Status (1)

Country Link
JP (1) JPS58141536A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010094786A (ja) * 2008-10-17 2010-04-30 Ngk Spark Plug Co Ltd 配線基板の非接触搬送装置及び方法、樹脂製配線基板の製造方法

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58189535U (ja) * 1982-06-11 1983-12-16 日本電気株式会社 ウエハ−ス吸着装置
US4474397A (en) * 1982-11-16 1984-10-02 International Business Machines Corporation Pick-up head utilizing aspirated air flow
JPS6080876A (ja) * 1983-10-11 1985-05-08 Fuji Xerox Co Ltd 非磁性一成分現像装置
JPS61140432A (ja) * 1984-12-11 1986-06-27 Shinko Denki Kk ウエハ−等の保持装置
EP0201240B1 (en) * 1985-05-04 1992-09-23 Kabushiki Kaisha Seibu Giken Apparatus for supporting and/or conveying a plate with fluid without physical contact
JPS6216924A (ja) * 1985-05-04 1987-01-26 Seibu Giken:Kk 流体によつて板状体を無接触状態で懸垂浮遊させる方法
JPH0753543B2 (ja) * 1986-04-25 1995-06-07 株式会社日立製作所 板状体の移送装置
JP2747518B2 (ja) * 1988-12-09 1998-05-06 住友シチックス株式会社 ウエーハのハンドリング装置
JP4249869B2 (ja) * 1999-12-22 2009-04-08 株式会社オーク製作所 基板搬送装置
KR100420983B1 (ko) * 2001-05-04 2004-03-02 주식회사 신성이엔지 웨이퍼 반송 로봇용 핸드
JP4043019B2 (ja) * 2002-04-26 2008-02-06 大日本スクリーン製造株式会社 基板処理装置
JP4538849B2 (ja) * 2005-05-31 2010-09-08 村田機械株式会社 非接触保持装置
JP4564022B2 (ja) * 2007-01-16 2010-10-20 東京エレクトロン株式会社 基板搬送装置及び縦型熱処理装置
JP4926932B2 (ja) * 2007-12-14 2012-05-09 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP4926931B2 (ja) * 2007-12-14 2012-05-09 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP5178495B2 (ja) * 2008-12-22 2013-04-10 株式会社日立ハイテクノロジーズ 試料搬送機構、及び試料搬送機構を備えた走査電子顕微鏡
ITUD20090042A1 (it) * 2009-02-23 2010-08-24 Applied Materials Inc Pinza di bernoulli
CN102332420B (zh) * 2011-05-25 2013-01-02 湖南红太阳光电科技有限公司 超薄伞流式非接触硅片吸盘
JP2013004845A (ja) * 2011-06-20 2013-01-07 Tokyo Electron Ltd 剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体
JP5951989B2 (ja) * 2011-12-28 2016-07-13 日本特殊陶業株式会社 非接触搬送装置、配線基板の製造方法
DE102012215798B4 (de) * 2012-09-06 2016-08-11 J. Schmalz Gmbh Flächensauggreifer
KR101403458B1 (ko) * 2012-11-13 2014-06-30 삼성디스플레이 주식회사 기판 이송 장치 및 기판 처리 장치
JP2014123501A (ja) * 2012-12-21 2014-07-03 Nissan Motor Co Ltd 燃料電池用セパレータの吸着装置
DE102017115738B4 (de) * 2017-07-13 2021-07-22 J. Schmalz Gmbh Bernoulli-Greifer
US11254014B2 (en) 2017-07-21 2022-02-22 Electro Scientific Industries, Inc. Non-contact handler and method of handling workpieces using the same
CN109461691A (zh) * 2017-09-06 2019-03-12 富士迈半导体精密工业（上海）有限公司 晶圆支撑装置
GB2584069B (en) * 2019-03-27 2023-11-08 Millitec Food Systems Ltd Flow gripper
CA3148531A1 (en) * 2019-09-10 2021-03-18 Cesar Carrsaco Suction unit and suction device
CN110697418B (zh) * 2019-10-29 2021-12-07 台州市永安机械有限公司 一种基于流体压强的非接触式吸盘
JP7219426B2 (ja) * 2020-02-19 2023-02-08 Smc株式会社 非接触搬送装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51112463U (enrdf_load_stackoverflow) * 1975-03-06 1976-09-11
JPS5638454U (enrdf_load_stackoverflow) * 1979-08-31 1981-04-11

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010094786A (ja) * 2008-10-17 2010-04-30 Ngk Spark Plug Co Ltd 配線基板の非接触搬送装置及び方法、樹脂製配線基板の製造方法

Also Published As

Publication number Publication date
JPS58141536A (ja) 1983-08-22

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