JPS5717153A - Sealing method of electronic parts - Google Patents
Sealing method of electronic partsInfo
- Publication number
- JPS5717153A JPS5717153A JP9071480A JP9071480A JPS5717153A JP S5717153 A JPS5717153 A JP S5717153A JP 9071480 A JP9071480 A JP 9071480A JP 9071480 A JP9071480 A JP 9071480A JP S5717153 A JPS5717153 A JP S5717153A
- Authority
- JP
- Japan
- Prior art keywords
- sealing
- electronic parts
- ratio
- sealing method
- thermoplasticity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007789 sealing Methods 0.000 title abstract 5
- 238000000034 method Methods 0.000 title abstract 2
- 239000004734 Polyphenylene sulfide Substances 0.000 abstract 4
- 229920000069 polyphenylene sulfide Polymers 0.000 abstract 4
- 150000001875 compounds Chemical class 0.000 abstract 2
- 239000000945 filler Substances 0.000 abstract 2
- 238000009413 insulation Methods 0.000 abstract 2
- 238000000465 moulding Methods 0.000 abstract 2
- 229920000642 polymer Polymers 0.000 abstract 2
- 229920003002 synthetic resin Polymers 0.000 abstract 2
- 239000000057 synthetic resin Substances 0.000 abstract 2
- 239000004593 Epoxy Substances 0.000 abstract 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 238000001125 extrusion Methods 0.000 abstract 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/12—Protection against corrosion
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
- C08L81/02—Polythioethers; Polythioether-ethers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/065—Hermetically-sealed casings sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9071480A JPS5717153A (en) | 1980-07-04 | 1980-07-04 | Sealing method of electronic parts |
US06/270,233 US4370292A (en) | 1980-07-04 | 1981-06-04 | Encapsulation of electronic device |
EP81302606A EP0044136B1 (en) | 1980-07-04 | 1981-06-11 | Encapsulation of electronic device |
DE8181302606T DE3168454D1 (en) | 1980-07-04 | 1981-06-11 | Encapsulation of electronic device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9071480A JPS5717153A (en) | 1980-07-04 | 1980-07-04 | Sealing method of electronic parts |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5717153A true JPS5717153A (en) | 1982-01-28 |
JPS6311780B2 JPS6311780B2 (ja) | 1988-03-16 |
Family
ID=14006198
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9071480A Granted JPS5717153A (en) | 1980-07-04 | 1980-07-04 | Sealing method of electronic parts |
Country Status (4)
Country | Link |
---|---|
US (1) | US4370292A (ja) |
EP (1) | EP0044136B1 (ja) |
JP (1) | JPS5717153A (ja) |
DE (1) | DE3168454D1 (ja) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5721844A (en) * | 1980-07-16 | 1982-02-04 | Shin Etsu Chem Co Ltd | Resin composition for sealing electronic parts |
JPS59108332A (ja) * | 1982-12-14 | 1984-06-22 | Dainippon Ink & Chem Inc | 電子部品の封止方法 |
JPS59164360A (ja) * | 1983-03-10 | 1984-09-17 | Dainippon Ink & Chem Inc | 樹脂組成物 |
JPS6032848A (ja) * | 1983-08-01 | 1985-02-20 | Mitsui Toatsu Chem Inc | ポリフェニレンサルファイド樹脂成形物の製造方法 |
JPS6040163A (ja) * | 1983-07-27 | 1985-03-02 | ヘキスト・セラニーズ・コーポレーション | 電子部品の改良封入成形法 |
JPS62135516A (ja) * | 1985-12-09 | 1987-06-18 | Polyplastics Co | 電気部品封止剤 |
JPS63219145A (ja) * | 1987-03-09 | 1988-09-12 | Sumitomo Bakelite Co Ltd | Pps封止電子部品 |
US5223557A (en) * | 1989-12-28 | 1993-06-29 | Kureha Kagaku Kogyo K.K. | Electronic device sealing resin compositions and sealed electronic devices |
US5474828A (en) * | 1988-11-12 | 1995-12-12 | Kureha Kagaku Kogyo K.K. | Electronic device sealing resin compositions and sealed electronic devices |
JP2000186209A (ja) * | 1998-12-24 | 2000-07-04 | Idemitsu Petrochem Co Ltd | 電子部品封止用ポリアリ―レンスルフィド樹脂組成物 |
JP2015066735A (ja) * | 2013-09-27 | 2015-04-13 | 東レ株式会社 | ポリフェニレンスルフィド樹脂組成物からなる成形品と金属箔を接合した複合成形品および複合成形品の製造方法 |
JP2018514607A (ja) * | 2015-05-14 | 2018-06-07 | イニッツ・カンパニー・リミテッドInitz Co.,Ltd. | 金属と良好に接着するポリアリーレンスルフィド組成物 |
Families Citing this family (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS597008A (ja) * | 1982-07-03 | 1984-01-14 | Toshiba Corp | 高密度タブレツトおよびそれを使用した半導体樹脂封止方法 |
US4994514A (en) * | 1982-07-16 | 1991-02-19 | Phillips Petroleum Company | Encapsulation of electronic components with poly(arylene sulfide) containing mercaptosilane |
US4782195A (en) * | 1982-07-16 | 1988-11-01 | Phillips Petroleum Company | Encapsulation of electronic components with poly(arylene sulfide) containing mercaptosilane |
US4528346A (en) * | 1982-09-17 | 1985-07-09 | Dainippun Ink and Chemicals, Inc. | Resin composition |
US4514588A (en) * | 1982-12-28 | 1985-04-30 | Phillips Petroleum Company | Encapsulated electronic components and encapsulation compositions |
US4659761A (en) * | 1983-03-18 | 1987-04-21 | Phillips Petroleum Company | Zinc oxide in poly(arylene sulfide) compositions |
GB2140323A (en) * | 1983-05-26 | 1984-11-28 | Standard Telephones Cables Ltd | Encapsulation process |
US4632798A (en) * | 1983-07-27 | 1986-12-30 | Celanese Corporation | Encapsulation of electronic components with anisotropic thermoplastic polymers |
US4581411A (en) * | 1983-11-17 | 1986-04-08 | Phillips Petroleum Company | Rubbery compounds as modifiers for poly(arylene sulfide) |
US4803028A (en) * | 1984-04-02 | 1989-02-07 | General Electric Company | Conductor insulating method |
US4798863A (en) * | 1984-05-21 | 1989-01-17 | Phillips Petroleum Company | Zinc titanate in poly (arylene sulfide) compositions |
CA1260174A (en) * | 1984-06-29 | 1989-09-26 | Kureha Chemical Ind Co Ltd | PARA-PHENYLENE SULPHIDE COPOLYMERS; METHOD OF PREPARATION AND USE |
US4714576A (en) * | 1985-12-16 | 1987-12-22 | General Motors Corporation | Method of manufacturing a polyphenylene sulfide potted pole and coil assembly |
US4708983A (en) * | 1986-06-18 | 1987-11-24 | Phillips Petroleum Company | Arylene sulfide polymers of improved impact strength |
DE3622194A1 (de) * | 1986-07-02 | 1988-01-07 | Bayer Ag | Verfahren zum verschaeumen von thermoplastischen polyphenylensulfiden |
US4749598A (en) * | 1987-02-19 | 1988-06-07 | Phillips Petroleum Company | Poly(arylene sulfide) composition and process |
US4810590A (en) * | 1987-02-19 | 1989-03-07 | Phillips Petroleum Company | Poly(arylene sulfide) encapsulation process and article |
US4965925A (en) * | 1987-03-27 | 1990-10-30 | Monter John M | Method of making an axial miniature fuse with plastic molded body |
JP2684677B2 (ja) * | 1988-05-25 | 1997-12-03 | 株式会社日立製作所 | 半導体装置の製造方法 |
US5219920A (en) * | 1988-11-04 | 1993-06-15 | Mitsubishi Rayon Co., Ltd. | Polyarylene sulfide resin composition |
CA2028574A1 (en) * | 1989-10-26 | 1991-04-27 | Shinobu Yamao | Polyarylene sulfide resin compositions |
US5258442A (en) * | 1989-10-31 | 1993-11-02 | Tosoh Corporation | Polyphenylene sulfide resin composition |
US5160786A (en) * | 1989-12-27 | 1992-11-03 | Polyplastics Co. Ltd. | Resin material for inserting lead frame and molded component thereof |
US4999699A (en) * | 1990-03-14 | 1991-03-12 | International Business Machines Corporation | Solder interconnection structure and process for making |
DE4008461A1 (de) * | 1990-03-16 | 1991-09-19 | Bayer Ag | Mischungen aus polyarylensulfiden, epoxiden, glasfasern, gegebenenfalls saeureanhydridhaltigen polymeren und gegebenenfalls weiteren zusaetzen |
DE4009179A1 (de) * | 1990-03-22 | 1991-09-26 | Bayer Ag | Mischungen aus polyarylensulfiden, epoxiden, saeureanhydriden, glasfasern und gegebenenfalls weiteren fuellstoffen |
DE4025782A1 (de) * | 1990-08-15 | 1992-02-20 | Bayer Ag | Mischungen aus polyarylensulfiden, phenolharz-nitroarylaten, glasfasern und gegebenenfalls weiteren fuellstoffen |
US5604287A (en) * | 1994-03-17 | 1997-02-18 | Idemitsu Petrochemical Co., Ltd. | Polyarylene sulfide resin composition |
JPH083538A (ja) * | 1994-06-27 | 1996-01-09 | Ntn Corp | スクロール型コンプレッサのシール材組成物 |
NL9402233A (nl) * | 1994-12-29 | 1996-08-01 | 3P Licensing Bv | Werkwijze voor het omhullen van een elektronische component, een aldus omhulde elektronische component en daarvoor bestemd kunststofmateriaal. |
DE19501891C1 (de) * | 1995-01-23 | 1996-09-26 | Degussa | Verfahren zur Herstellung eines Trägerkatalysators und seine Verwendung für die Produktion von Vinylacetat |
US5853643A (en) * | 1996-07-19 | 1998-12-29 | Bauer; Scott V. | Method for constructing a liquid-impervious electric motor assembly |
US6124579A (en) * | 1997-10-06 | 2000-09-26 | Watlow Electric Manufacturing | Molded polymer composite heater |
US6111323A (en) * | 1997-12-30 | 2000-08-29 | International Business Machines Corporation | Reworkable thermoplastic encapsulant |
US5998876A (en) * | 1997-12-30 | 1999-12-07 | International Business Machines Corporation | Reworkable thermoplastic hyper-branched encapsulant |
DE19841498C2 (de) * | 1998-09-10 | 2002-02-21 | Beru Ag | Verfahren zum Herstellen eines Elektronikbauelementes, insbesondere eines Hallsensors |
JP2000228467A (ja) * | 1998-12-02 | 2000-08-15 | Toshiba Corp | 半導体封止用樹脂組成物及び半導体装置とその製造方法 |
JP3956335B2 (ja) * | 2000-03-06 | 2007-08-08 | シャープ株式会社 | 樹脂注型用金型を用いた半導体装置の製造方法 |
US7140091B2 (en) * | 2000-03-30 | 2006-11-28 | Microspire S.A. | Manufacturing process for an inductive component |
WO2004060802A1 (ja) * | 2002-12-27 | 2004-07-22 | Tokuyama Corporation | シリカ微粒子 |
JP5433923B2 (ja) * | 2006-06-30 | 2014-03-05 | 富士通株式会社 | スティフナ付き基板およびその製造方法 |
WO2014113323A1 (en) * | 2013-01-15 | 2014-07-24 | Basf Se | A method of encapsulating an electronic component |
JP6690206B2 (ja) | 2014-12-26 | 2020-04-28 | 株式会社デンソー | 樹脂成形体およびその製造方法 |
DE102018105731A1 (de) | 2018-03-13 | 2019-09-19 | Infineon Technologies Ag | Vernetztes thermoplastisches Dielektrium für Chip-Package |
Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5111844A (ja) * | 1974-07-22 | 1976-01-30 | Mitsui Petrochemical Ind | |
JPS5273677A (en) * | 1975-12-15 | 1977-06-20 | Ibm | Method of forming hermetic upper surface sealing body for electronic circuit |
JPS52149348A (en) * | 1976-06-08 | 1977-12-12 | Asahi Glass Co Ltd | Method of sealing electronic parts |
JPS5310428A (en) * | 1976-07-15 | 1978-01-30 | West Electric Co | Digital display exposure meter |
JPS5313391A (en) * | 1976-07-22 | 1978-02-06 | Agency Of Ind Science & Technol | Composite superconductive body |
JPS5322363A (en) * | 1976-08-13 | 1978-03-01 | Asahi Glass Co Ltd | Method of sealing electronic parts |
JPS5366565A (en) * | 1976-11-26 | 1978-06-14 | Asahi Glass Co Ltd | Method of sealing electronic parts |
JPS5485380A (en) * | 1977-12-20 | 1979-07-06 | Tokyo Shibaura Electric Co | Substrate for electric wiring |
JPS54135845A (en) * | 1978-04-14 | 1979-10-22 | Hodogaya Chem Co Ltd | Polyphenylene sulfide resin composition |
JPS54155300A (en) * | 1978-05-30 | 1979-12-07 | Asahi Glass Co Ltd | Injection molding material of polyphenylene sulfide |
JPS5522816A (en) * | 1978-08-04 | 1980-02-18 | Hitachi Ltd | Resin sealed electronic parts |
JPS5543120A (en) * | 1978-09-22 | 1980-03-26 | Dainippon Ink & Chem Inc | Preparation of improved resin composition |
JPS569014A (en) * | 1979-03-07 | 1981-01-29 | Vni I Pk I Metarurugiichiesuko | Nonnslip type multiple stream line material rolling mill |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3941751A (en) * | 1969-07-18 | 1976-03-02 | Hercules Incorporated | Epoxy-azido compounds |
US3839301A (en) * | 1973-07-23 | 1974-10-01 | Phillips Petroleum Co | Poly(arylene sulfide) resin heat treatment and curing |
US4001655A (en) * | 1974-01-10 | 1977-01-04 | P. R. Mallory & Co., Inc. | Compressible intermediate layer for encapsulated electrical devices |
US4021596A (en) * | 1975-04-22 | 1977-05-03 | Phillips Petroleum Company | Polyarylene sulfide resin alloys |
US3998767A (en) * | 1975-09-02 | 1976-12-21 | Phillips Petroleum Company | Fast curing of arylene sulfide polymer using hexamethoxymethylmelamine |
CA1102107A (en) | 1976-07-01 | 1981-06-02 | Donald G. Needham | Arc resistant composition |
SE397818B (sv) * | 1976-11-23 | 1977-11-21 | Hegglund & Soner Ab | Avkenningsanordning vid portalsvengkran |
-
1980
- 1980-07-04 JP JP9071480A patent/JPS5717153A/ja active Granted
-
1981
- 1981-06-04 US US06/270,233 patent/US4370292A/en not_active Expired - Fee Related
- 1981-06-11 EP EP81302606A patent/EP0044136B1/en not_active Expired
- 1981-06-11 DE DE8181302606T patent/DE3168454D1/de not_active Expired
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5111844A (ja) * | 1974-07-22 | 1976-01-30 | Mitsui Petrochemical Ind | |
JPS5273677A (en) * | 1975-12-15 | 1977-06-20 | Ibm | Method of forming hermetic upper surface sealing body for electronic circuit |
JPS52149348A (en) * | 1976-06-08 | 1977-12-12 | Asahi Glass Co Ltd | Method of sealing electronic parts |
JPS5310428A (en) * | 1976-07-15 | 1978-01-30 | West Electric Co | Digital display exposure meter |
JPS5313391A (en) * | 1976-07-22 | 1978-02-06 | Agency Of Ind Science & Technol | Composite superconductive body |
JPS5322363A (en) * | 1976-08-13 | 1978-03-01 | Asahi Glass Co Ltd | Method of sealing electronic parts |
JPS5366565A (en) * | 1976-11-26 | 1978-06-14 | Asahi Glass Co Ltd | Method of sealing electronic parts |
JPS5485380A (en) * | 1977-12-20 | 1979-07-06 | Tokyo Shibaura Electric Co | Substrate for electric wiring |
JPS54135845A (en) * | 1978-04-14 | 1979-10-22 | Hodogaya Chem Co Ltd | Polyphenylene sulfide resin composition |
JPS54155300A (en) * | 1978-05-30 | 1979-12-07 | Asahi Glass Co Ltd | Injection molding material of polyphenylene sulfide |
JPS5522816A (en) * | 1978-08-04 | 1980-02-18 | Hitachi Ltd | Resin sealed electronic parts |
JPS5543120A (en) * | 1978-09-22 | 1980-03-26 | Dainippon Ink & Chem Inc | Preparation of improved resin composition |
JPS569014A (en) * | 1979-03-07 | 1981-01-29 | Vni I Pk I Metarurugiichiesuko | Nonnslip type multiple stream line material rolling mill |
Cited By (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6028392B2 (ja) * | 1980-07-16 | 1985-07-04 | 信越化学工業株式会社 | 電子部品封止用樹脂組成物 |
JPS5721844A (en) * | 1980-07-16 | 1982-02-04 | Shin Etsu Chem Co Ltd | Resin composition for sealing electronic parts |
JPS59108332A (ja) * | 1982-12-14 | 1984-06-22 | Dainippon Ink & Chem Inc | 電子部品の封止方法 |
JPH0415625B2 (ja) * | 1982-12-14 | 1992-03-18 | Dainippon Ink & Chemicals | |
JPS59164360A (ja) * | 1983-03-10 | 1984-09-17 | Dainippon Ink & Chem Inc | 樹脂組成物 |
JPS6011063B2 (ja) * | 1983-03-10 | 1985-03-22 | 大日本インキ化学工業株式会社 | 樹脂組成物 |
JPS6040163A (ja) * | 1983-07-27 | 1985-03-02 | ヘキスト・セラニーズ・コーポレーション | 電子部品の改良封入成形法 |
JPH0535189B2 (ja) * | 1983-07-27 | 1993-05-25 | Hoechst Celanese Corp | |
JPS6032848A (ja) * | 1983-08-01 | 1985-02-20 | Mitsui Toatsu Chem Inc | ポリフェニレンサルファイド樹脂成形物の製造方法 |
JPH0465866B2 (ja) * | 1983-08-01 | 1992-10-21 | Mitsui Toatsu Chemicals | |
JPH0582859B2 (ja) * | 1985-12-09 | 1993-11-22 | Polyplastics Kk | |
JPS62135516A (ja) * | 1985-12-09 | 1987-06-18 | Polyplastics Co | 電気部品封止剤 |
JPS63219145A (ja) * | 1987-03-09 | 1988-09-12 | Sumitomo Bakelite Co Ltd | Pps封止電子部品 |
US5474828A (en) * | 1988-11-12 | 1995-12-12 | Kureha Kagaku Kogyo K.K. | Electronic device sealing resin compositions and sealed electronic devices |
US5223557A (en) * | 1989-12-28 | 1993-06-29 | Kureha Kagaku Kogyo K.K. | Electronic device sealing resin compositions and sealed electronic devices |
JP2000186209A (ja) * | 1998-12-24 | 2000-07-04 | Idemitsu Petrochem Co Ltd | 電子部品封止用ポリアリ―レンスルフィド樹脂組成物 |
JP2015066735A (ja) * | 2013-09-27 | 2015-04-13 | 東レ株式会社 | ポリフェニレンスルフィド樹脂組成物からなる成形品と金属箔を接合した複合成形品および複合成形品の製造方法 |
JP2018514607A (ja) * | 2015-05-14 | 2018-06-07 | イニッツ・カンパニー・リミテッドInitz Co.,Ltd. | 金属と良好に接着するポリアリーレンスルフィド組成物 |
JP2021098864A (ja) * | 2015-05-14 | 2021-07-01 | エスケー ケミカルズ カンパニー リミテッド | 金属と良好に接着するポリアリーレンスルフィド組成物 |
Also Published As
Publication number | Publication date |
---|---|
EP0044136A1 (en) | 1982-01-20 |
JPS6311780B2 (ja) | 1988-03-16 |
EP0044136B1 (en) | 1985-01-23 |
US4370292A (en) | 1983-01-25 |
DE3168454D1 (en) | 1985-03-07 |
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