FR2555593B1 - Matiere de charge pour resine d'encapsulation d'element electronique et composition de resine d'encapsulation d'element electronique la contenant - Google Patents

Matiere de charge pour resine d'encapsulation d'element electronique et composition de resine d'encapsulation d'element electronique la contenant

Info

Publication number
FR2555593B1
FR2555593B1 FR8418351A FR8418351A FR2555593B1 FR 2555593 B1 FR2555593 B1 FR 2555593B1 FR 8418351 A FR8418351 A FR 8418351A FR 8418351 A FR8418351 A FR 8418351A FR 2555593 B1 FR2555593 B1 FR 2555593B1
Authority
FR
France
Prior art keywords
electronic element
encapsulation resin
element encapsulation
filler
composition containing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8418351A
Other languages
English (en)
Other versions
FR2555593A1 (fr
Inventor
Akira Kobayashi
Ryoichi Ide
Hirotaka Koga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denki Kagaku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denki Kagaku Kogyo KK filed Critical Denki Kagaku Kogyo KK
Publication of FR2555593A1 publication Critical patent/FR2555593A1/fr
Application granted granted Critical
Publication of FR2555593B1 publication Critical patent/FR2555593B1/fr
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • C08K7/20—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L87/00—Compositions of unspecified macromolecular compounds, obtained otherwise than by polymerisation reactions only involving unsaturated carbon-to-carbon bonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/005—Constructional details common to different types of electric apparatus arrangements of circuit components without supporting structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/016—Additives defined by their aspect ratio
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
FR8418351A 1983-11-30 1984-11-30 Matiere de charge pour resine d'encapsulation d'element electronique et composition de resine d'encapsulation d'element electronique la contenant Expired FR2555593B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58226285A JPS60210643A (ja) 1983-11-30 1983-11-30 充填剤及びその組成物

Publications (2)

Publication Number Publication Date
FR2555593A1 FR2555593A1 (fr) 1985-05-31
FR2555593B1 true FR2555593B1 (fr) 1987-07-17

Family

ID=16842813

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8418351A Expired FR2555593B1 (fr) 1983-11-30 1984-11-30 Matiere de charge pour resine d'encapsulation d'element electronique et composition de resine d'encapsulation d'element electronique la contenant

Country Status (7)

Country Link
US (1) US4615741A (fr)
JP (1) JPS60210643A (fr)
KR (1) KR860001117B1 (fr)
CA (1) CA1255049A (fr)
DE (1) DE3443821A1 (fr)
FR (1) FR2555593B1 (fr)
GB (1) GB2151600B (fr)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6164756A (ja) * 1984-09-05 1986-04-03 Nippon Steel Corp 無機充填熱硬化性樹脂組成物
JPS61145202A (ja) * 1984-12-18 1986-07-02 Aisin Seiki Co Ltd 紫外線硬化性樹脂組成物
JPS61190556A (ja) * 1985-02-12 1986-08-25 Rishiyou Kogyo Kk 電子部品封止用樹脂組成物
JP2593843B2 (ja) * 1985-02-19 1997-03-26 日東電工株式会社 半導体装置
JPS61268750A (ja) * 1985-05-22 1986-11-28 Shin Etsu Chem Co Ltd 半導体封止用エポキシ樹脂組成物
DE3533625A1 (de) * 1985-09-20 1987-04-02 Frenzelit Werke Gmbh & Co Kg Leichtwerkstoff und verfahren zu dessen herstellung
JP2572761B2 (ja) * 1986-12-23 1997-01-16 日東電工株式会社 半導体装置
US4816299A (en) * 1987-05-20 1989-03-28 Corning Glass Works Encapsulating compositions containing ultra-pure, fused-silica fillers
JPS6422967A (en) * 1987-07-17 1989-01-25 Shinetsu Chemical Co Curable liquid silicone rubber composition
JP2574364B2 (ja) * 1988-02-09 1997-01-22 日東電工株式会社 半導体装置
JPH0672202B2 (ja) * 1988-10-06 1994-09-14 東レ株式会社 半導体封止用エポキシ樹脂組成物
US5001174A (en) * 1988-12-08 1991-03-19 Sumitomo Bakelite Company Limited Epoxy resin composition for semiconductor sealing employing triphenylmethane based novolac epoxy resin
US5064881A (en) * 1989-01-18 1991-11-12 Mitsui Petrochemical Industries, Ltd. Epoxy resin composition and semiconductor sealing material comprising same based on spherical silica
US4925493A (en) * 1989-04-26 1990-05-15 Lamoreaux Michael A Soil mixture and method of making same
US4962151A (en) * 1989-06-22 1990-10-09 Dow Corning Corporation Silicone sealant compositions
TW225511B (fr) * 1989-12-14 1994-06-21 Nissan Chemical Ind Ltd
US5300459A (en) * 1989-12-28 1994-04-05 Sanken Electric Co., Ltd. Method for reducing thermal stress in an encapsulated integrated circuit package
US4999699A (en) * 1990-03-14 1991-03-12 International Business Machines Corporation Solder interconnection structure and process for making
CA2087911C (fr) * 1992-01-24 1999-06-29 Kiyoshi Abe Granules spheriques de silice ou de silicate poreux; methode de preparation et applications
AU6823594A (en) * 1993-04-29 1994-11-21 Lindsey Manufacturing Company Integrated electrical system
US6193795B1 (en) 1993-08-02 2001-02-27 Degussa Corporation Low structure pyrogenic hydrophilic and hydrophobic metallic oxides, production and use
JP3445707B2 (ja) * 1996-09-18 2003-09-08 電気化学工業株式会社 シリカ質フィラー及びその製法
US6407461B1 (en) * 1997-06-27 2002-06-18 International Business Machines Corporation Injection molded integrated circuit chip assembly
DE19813971B4 (de) * 1998-03-24 2005-12-01 Heraeus Quarzglas Gmbh & Co. Kg Verfahren für die Reinigung von SiO2-Körnung
KR100573230B1 (ko) * 1999-06-15 2006-04-24 스미또모 베이크라이트 가부시키가이샤 반도체 봉지용 에폭시 수지 성형 재료의 제조 방법, 이의성형 재료 및 이의 반도체 장치
DE19937861C2 (de) * 1999-08-13 2003-03-20 Heraeus Quarzglas Verfahren für die Herstellung dichter Quarzglas-Körnung
PL372762A1 (en) * 2002-05-30 2005-08-08 Dow Global Technologies, Inc. Halogen free ignition resistant thermoplastic resin compositions
MY135619A (en) * 2002-11-12 2008-05-30 Nitto Denko Corp Epoxy resin composition for semiconductor encapsulation, and semiconductor device using the same
US8642455B2 (en) * 2004-02-19 2014-02-04 Matthew R. Robinson High-throughput printing of semiconductor precursor layer from nanoflake particles
US20090032108A1 (en) * 2007-03-30 2009-02-05 Craig Leidholm Formation of photovoltaic absorber layers on foil substrates
EP1874101A4 (fr) * 2005-04-19 2009-11-04 Denki Kagaku Kogyo Kk Carte de circuit à base de métal, del et unité de source lumineuse à del
US8158450B1 (en) * 2006-05-05 2012-04-17 Nanosolar, Inc. Barrier films and high throughput manufacturing processes for photovoltaic devices
JP7237828B2 (ja) * 2017-06-09 2023-03-13 ナガセケムテックス株式会社 エポキシ樹脂組成物、電子部品実装構造体およびその製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3658750A (en) * 1969-02-13 1972-04-25 Hitachi Ltd Thermosetting resin composition and electrical appliances using the same
US3985842A (en) * 1972-07-03 1976-10-12 Norton Company Method of making electrical magnesia
JPS5137176B2 (fr) * 1973-02-24 1976-10-14
US3975757A (en) * 1974-05-31 1976-08-17 National Semiconductor Corporation Molded electrical device
JPS6031845B2 (ja) * 1977-06-21 1985-07-24 日本合成化学工業株式会社 品質の改善されたポリビニルアルコ−ルの製造方法
US4248920A (en) * 1978-04-26 1981-02-03 Tokyo Shibaura Denki Kabushiki Kaisha Resin-sealed semiconductor device
GB2028344B (en) * 1978-08-17 1982-09-22 Toray Silicone Co Heat-curable filled moulding composition
DE2929587C2 (de) * 1979-07-21 1981-08-27 Degussa Ag, 6000 Frankfurt Hydrophobe Füllstoff-Mischung, Verfahren zu deren Herstellung und deren Verwendung
JPS57187354A (en) * 1981-05-13 1982-11-18 Matsushita Electric Ind Co Ltd Resin composition
EP0073736A1 (fr) * 1981-08-27 1983-03-09 Ciba-Geigy Ag Procédé pour la fabrication de produits manufacturés sensibles à la pression, revêtus par une résine
JPS58138740A (ja) * 1982-02-15 1983-08-17 Denki Kagaku Kogyo Kk 樹脂組成物

Also Published As

Publication number Publication date
DE3443821A1 (de) 1985-06-05
KR850003552A (ko) 1985-06-20
US4615741A (en) 1986-10-07
DE3443821C2 (fr) 1987-02-05
JPH0375570B2 (fr) 1991-12-02
FR2555593A1 (fr) 1985-05-31
GB2151600B (en) 1987-08-19
GB2151600A (en) 1985-07-24
GB8428726D0 (en) 1984-12-27
CA1255049A (fr) 1989-05-30
JPS60210643A (ja) 1985-10-23
KR860001117B1 (ko) 1986-08-13

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Legal Events

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