DE3168454D1 - Encapsulation of electronic device - Google Patents

Encapsulation of electronic device

Info

Publication number
DE3168454D1
DE3168454D1 DE8181302606T DE3168454T DE3168454D1 DE 3168454 D1 DE3168454 D1 DE 3168454D1 DE 8181302606 T DE8181302606 T DE 8181302606T DE 3168454 T DE3168454 T DE 3168454T DE 3168454 D1 DE3168454 D1 DE 3168454D1
Authority
DE
Germany
Prior art keywords
encapsulation
electronic device
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8181302606T
Other languages
English (en)
Inventor
Hiroshi Yanase
Fukuo Kanno
Takeshi Abe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AGC Inc
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Application granted granted Critical
Publication of DE3168454D1 publication Critical patent/DE3168454D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/12—Protection against corrosion
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
    • C08L81/02—Polythioethers; Polythioether-ethers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/065—Hermetically-sealed casings sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
DE8181302606T 1980-07-04 1981-06-11 Encapsulation of electronic device Expired DE3168454D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9071480A JPS5717153A (en) 1980-07-04 1980-07-04 Sealing method of electronic parts

Publications (1)

Publication Number Publication Date
DE3168454D1 true DE3168454D1 (en) 1985-03-07

Family

ID=14006198

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8181302606T Expired DE3168454D1 (en) 1980-07-04 1981-06-11 Encapsulation of electronic device

Country Status (4)

Country Link
US (1) US4370292A (de)
EP (1) EP0044136B1 (de)
JP (1) JPS5717153A (de)
DE (1) DE3168454D1 (de)

Families Citing this family (56)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6028392B2 (ja) * 1980-07-16 1985-07-04 信越化学工業株式会社 電子部品封止用樹脂組成物
JPS597008A (ja) * 1982-07-03 1984-01-14 Toshiba Corp 高密度タブレツトおよびそれを使用した半導体樹脂封止方法
US4782195A (en) * 1982-07-16 1988-11-01 Phillips Petroleum Company Encapsulation of electronic components with poly(arylene sulfide) containing mercaptosilane
US4994514A (en) * 1982-07-16 1991-02-19 Phillips Petroleum Company Encapsulation of electronic components with poly(arylene sulfide) containing mercaptosilane
JPS6011063B2 (ja) * 1983-03-10 1985-03-22 大日本インキ化学工業株式会社 樹脂組成物
US4528346A (en) * 1982-09-17 1985-07-09 Dainippun Ink and Chemicals, Inc. Resin composition
JPS59108332A (ja) * 1982-12-14 1984-06-22 Dainippon Ink & Chem Inc 電子部品の封止方法
US4514588A (en) * 1982-12-28 1985-04-30 Phillips Petroleum Company Encapsulated electronic components and encapsulation compositions
US4659761A (en) * 1983-03-18 1987-04-21 Phillips Petroleum Company Zinc oxide in poly(arylene sulfide) compositions
GB2140323A (en) * 1983-05-26 1984-11-28 Standard Telephones Cables Ltd Encapsulation process
JPS6040163A (ja) * 1983-07-27 1985-03-02 ヘキスト・セラニーズ・コーポレーション 電子部品の改良封入成形法
US4632798A (en) * 1983-07-27 1986-12-30 Celanese Corporation Encapsulation of electronic components with anisotropic thermoplastic polymers
JPS6032848A (ja) * 1983-08-01 1985-02-20 Mitsui Toatsu Chem Inc ポリフェニレンサルファイド樹脂成形物の製造方法
US4581411A (en) * 1983-11-17 1986-04-08 Phillips Petroleum Company Rubbery compounds as modifiers for poly(arylene sulfide)
US4803028A (en) * 1984-04-02 1989-02-07 General Electric Company Conductor insulating method
US4798863A (en) * 1984-05-21 1989-01-17 Phillips Petroleum Company Zinc titanate in poly (arylene sulfide) compositions
CA1260174A (en) * 1984-06-29 1989-09-26 Kureha Chemical Ind Co Ltd PARA-PHENYLENE SULPHIDE COPOLYMERS; METHOD OF PREPARATION AND USE
JPS62135516A (ja) * 1985-12-09 1987-06-18 Polyplastics Co 電気部品封止剤
US4714576A (en) * 1985-12-16 1987-12-22 General Motors Corporation Method of manufacturing a polyphenylene sulfide potted pole and coil assembly
US4708983A (en) * 1986-06-18 1987-11-24 Phillips Petroleum Company Arylene sulfide polymers of improved impact strength
DE3622194A1 (de) * 1986-07-02 1988-01-07 Bayer Ag Verfahren zum verschaeumen von thermoplastischen polyphenylensulfiden
US4810590A (en) * 1987-02-19 1989-03-07 Phillips Petroleum Company Poly(arylene sulfide) encapsulation process and article
US4749598A (en) * 1987-02-19 1988-06-07 Phillips Petroleum Company Poly(arylene sulfide) composition and process
JPS63219145A (ja) * 1987-03-09 1988-09-12 Sumitomo Bakelite Co Ltd Ｐｐｓ封止電子部品
US4965925A (en) * 1987-03-27 1990-10-30 Monter John M Method of making an axial miniature fuse with plastic molded body
JP2684677B2 (ja) * 1988-05-25 1997-12-03 株式会社日立製作所 半導体装置の製造方法
US5219920A (en) * 1988-11-04 1993-06-15 Mitsubishi Rayon Co., Ltd. Polyarylene sulfide resin composition
JPH02229858A (ja) * 1988-11-12 1990-09-12 Kureha Chem Ind Co Ltd 電子部品封止用樹脂組成物および封止電子部品
DE69026461T2 (de) * 1989-10-26 1996-11-28 Idemitsu Petrochemical Co Polyarylensulfid-Mischungen
US5258442A (en) * 1989-10-31 1993-11-02 Tosoh Corporation Polyphenylene sulfide resin composition
US5160786A (en) * 1989-12-27 1992-11-03 Polyplastics Co. Ltd. Resin material for inserting lead frame and molded component thereof
JP3237757B2 (ja) * 1989-12-28 2001-12-10 呉羽化学工業株式会社 電子部品封止用樹脂組成物および封止電子部品
US4999699A (en) * 1990-03-14 1991-03-12 International Business Machines Corporation Solder interconnection structure and process for making
DE4008461A1 (de) * 1990-03-16 1991-09-19 Bayer Ag Mischungen aus polyarylensulfiden, epoxiden, glasfasern, gegebenenfalls saeureanhydridhaltigen polymeren und gegebenenfalls weiteren zusaetzen
DE4009179A1 (de) * 1990-03-22 1991-09-26 Bayer Ag Mischungen aus polyarylensulfiden, epoxiden, saeureanhydriden, glasfasern und gegebenenfalls weiteren fuellstoffen
DE4025782A1 (de) * 1990-08-15 1992-02-20 Bayer Ag Mischungen aus polyarylensulfiden, phenolharz-nitroarylaten, glasfasern und gegebenenfalls weiteren fuellstoffen
KR100364062B1 (ko) * 1994-03-17 2003-02-05 이데미쓰세끼유가가꾸가부시끼가이샤 폴리아릴렌설파이드수지조성물
JPH083538A (ja) * 1994-06-27 1996-01-09 Ntn Corp スクロール型コンプレッサのシール材組成物
NL9402233A (nl) * 1994-12-29 1996-08-01 3P Licensing Bv Werkwijze voor het omhullen van een elektronische component, een aldus omhulde elektronische component en daarvoor bestemd kunststofmateriaal.
DE19501891C1 (de) * 1995-01-23 1996-09-26 Degussa Verfahren zur Herstellung eines Trägerkatalysators und seine Verwendung für die Produktion von Vinylacetat
US5853643A (en) * 1996-07-19 1998-12-29 Bauer; Scott V. Method for constructing a liquid-impervious electric motor assembly
US6124579A (en) * 1997-10-06 2000-09-26 Watlow Electric Manufacturing Molded polymer composite heater
US5998876A (en) * 1997-12-30 1999-12-07 International Business Machines Corporation Reworkable thermoplastic hyper-branched encapsulant
US6111323A (en) * 1997-12-30 2000-08-29 International Business Machines Corporation Reworkable thermoplastic encapsulant
DE19841498C2 (de) * 1998-09-10 2002-02-21 Beru Ag Verfahren zum Herstellen eines Elektronikbauelementes, insbesondere eines Hallsensors
JP2000228467A (ja) * 1998-12-02 2000-08-15 Toshiba Corp 半導体封止用樹脂組成物及び半導体装置とその製造方法
JP4295848B2 (ja) * 1998-12-24 2009-07-15 出光興産株式会社 電子部品封止用ポリアリーレンスルフィド樹脂組成物
JP3956335B2 (ja) * 2000-03-06 2007-08-08 シャープ株式会社 樹脂注型用金型を用いた半導体装置の製造方法
US7140091B2 (en) * 2000-03-30 2006-11-28 Microspire S.A. Manufacturing process for an inductive component
US7452599B2 (en) * 2002-12-27 2008-11-18 Tokuyama Corporation Fine silica particles having specific fractal structure parameter
JP5433923B2 (ja) * 2006-06-30 2014-03-05 富士通株式会社 スティフナ付き基板およびその製造方法
WO2014113323A1 (en) * 2013-01-15 2014-07-24 Basf Se A method of encapsulating an electronic component
JP6241175B2 (ja) * 2013-09-27 2017-12-06 東レ株式会社 ポリフェニレンスルフィド樹脂組成物からなる成形品と金属箔を接合した複合成形品および複合成形品の製造方法
JP6690206B2 (ja) 2014-12-26 2020-04-28 株式会社デンソー 樹脂成形体およびその製造方法
KR102300453B1 (ko) * 2015-05-14 2021-09-09 에스케이케미칼 주식회사 금속과의 접착성이 우수한 폴리아릴렌 설파이드 조성물
DE102018105731A1 (de) 2018-03-13 2019-09-19 Infineon Technologies Ag Vernetztes thermoplastisches Dielektrium für Chip-Package

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3941751A (en) * 1969-07-18 1976-03-02 Hercules Incorporated Epoxy-azido compounds
US3839301A (en) * 1973-07-23 1974-10-01 Phillips Petroleum Co Poly(arylene sulfide) resin heat treatment and curing
US4001655A (en) * 1974-01-10 1977-01-04 P. R. Mallory & Co., Inc. Compressible intermediate layer for encapsulated electrical devices
JPS5313391B2 (de) * 1974-07-22 1978-05-10
US4021596A (en) * 1975-04-22 1977-05-03 Phillips Petroleum Company Polyarylene sulfide resin alloys
US3998767A (en) * 1975-09-02 1976-12-21 Phillips Petroleum Company Fast curing of arylene sulfide polymer using hexamethoxymethylmelamine
US4048356A (en) * 1975-12-15 1977-09-13 International Business Machines Corporation Hermetic topsealant coating and process for its formation
JPS6040188B2 (ja) * 1976-06-08 1985-09-10 旭硝子株式会社 電子部品の封止方法
CA1102107A (en) 1976-07-01 1981-06-02 Donald G. Needham Arc resistant composition
JPS5919290B2 (ja) * 1976-07-15 1984-05-04 ウエスト電気株式会社 デイジタル表示露出計
JPS5313391A (en) * 1976-07-22 1978-02-06 Agency Of Ind Science & Technol Composite superconductive body
JPS5322363A (en) * 1976-08-13 1978-03-01 Asahi Glass Co Ltd Method of sealing electronic parts
SE397818B (sv) * 1976-11-23 1977-11-21 Hegglund & Soner Ab Avkenningsanordning vid portalsvengkran
JPS5366565A (en) * 1976-11-26 1978-06-14 Asahi Glass Co Ltd Method of sealing electronic parts
JPS5485380A (en) * 1977-12-20 1979-07-06 Tokyo Shibaura Electric Co Substrate for electric wiring
JPS6010548B2 (ja) * 1978-04-14 1985-03-18 保土谷化学工業株式会社 ポリフエニレンサルフアイド樹脂組成物
JPS54155300A (en) * 1978-05-30 1979-12-07 Asahi Glass Co Ltd Injection molding material of polyphenylene sulfide
JPS5522816A (en) * 1978-08-04 1980-02-18 Hitachi Ltd Resin sealed electronic parts
JPS5543120A (en) * 1978-09-22 1980-03-26 Dainippon Ink & Chem Inc Preparation of improved resin composition
SU977080A1 (ru) * 1979-03-07 1982-11-30 Предприятие П/Я А-7697 Стан мокрого волочени проволоки без скольжени

Also Published As

Publication number Publication date
JPS6311780B2 (de) 1988-03-16
US4370292A (en) 1983-01-25
JPS5717153A (en) 1982-01-28
EP0044136B1 (de) 1985-01-23
EP0044136A1 (de) 1982-01-20

Similar Documents

Publication Publication Date Title
DE3168454D1 (en) Encapsulation of electronic device
GB2072433B (en) Electronic components connection device
JPS5710530A (en) Electronic device
JPS5739832A (en) Electronic hemadinamometer
GB8324765D0 (en) Electronic device
JPS56153919A (en) Electronic type tripping device
GB8311727D0 (en) Electronic device
GB2083000B (en) Package for electrical and/or electronic components
DE3176267D1 (en) Self-substrate-bias circuit device
JPS56124250A (en) Electronic device capsuled
GB2083001B (en) Package of electrical and/or electronic components
GB2073947B (en) Integrated circuit encapsulation
JPS5734355A (en) Integrated circuit device
JPS57103393A (en) Electronic device mounting structure
JPS5721026A (en) Electronic device
JPS56139039A (en) Small electronic device
JPS57113259A (en) Integrated circuit device
JPS5784199A (en) Electronic device
JPS56146175A (en) Electronic device
JPS56116699A (en) Electronic circuit device
JPS56121535A (en) Electronic hemadinamometer
JPS576636A (en) Electronic hemadinamometer
JPS56160093A (en) Electronic device
JPS56147171A (en) Electronic device
JPS56147170A (en) Electronic device

Legal Events

Date Code Title Description
8339 Ceased/non-payment of the annual fee