JPS5543120A - Preparation of improved resin composition - Google Patents
Preparation of improved resin compositionInfo
- Publication number
- JPS5543120A JPS5543120A JP11576978A JP11576978A JPS5543120A JP S5543120 A JPS5543120 A JP S5543120A JP 11576978 A JP11576978 A JP 11576978A JP 11576978 A JP11576978 A JP 11576978A JP S5543120 A JPS5543120 A JP S5543120A
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- preparation
- polysulfide
- kneading
- granular
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
PURPOSE: To prepare a resin composition capable of giving molded articles having improved mechanical strength and color at a high output, by kneading a powdery and a granular polysulfide resins, with glass or carbon fibers in an extruder under heating.
CONSTITUTION: (A) 10W90 Parts by wt of a powdery polysulfide resin having a particle size ≤0.7mm, preferably 0.1W0.7mm, is kneaded with (B) 90W10 parts by wt of a granular polysulfide resin having a grain size ≤2mm, preferably 2W 6mm, and (C) 3W70wt% of glass and/or carbon fibers in an extruder under heating. 5W25wt% of a fluororesin and/or 0.1W10wt% of a silicone may be added before or during the kneading.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11576978A JPS5543120A (en) | 1978-09-22 | 1978-09-22 | Preparation of improved resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11576978A JPS5543120A (en) | 1978-09-22 | 1978-09-22 | Preparation of improved resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5543120A true JPS5543120A (en) | 1980-03-26 |
Family
ID=14670587
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11576978A Pending JPS5543120A (en) | 1978-09-22 | 1978-09-22 | Preparation of improved resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5543120A (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5717153A (en) * | 1980-07-04 | 1982-01-28 | Asahi Glass Co Ltd | Sealing method of electronic parts |
JPS5721844A (en) * | 1980-07-16 | 1982-02-04 | Shin Etsu Chem Co Ltd | Resin composition for sealing electronic parts |
JPS5763355A (en) * | 1980-10-03 | 1982-04-16 | Dainippon Ink & Chem Inc | Mica reinforced polyallylene sulfide resin composition |
JPS5796588A (en) * | 1980-12-08 | 1982-06-15 | Toray Industries | Printed circuit board |
JPS5911357A (en) * | 1982-07-09 | 1984-01-20 | Asahi Glass Co Ltd | Polyphenylene sulfide resin molding material |
JPS62232457A (en) * | 1986-04-03 | 1987-10-12 | Dainippon Ink & Chem Inc | Polyphenylene sulfide resin composition |
JPS63213560A (en) * | 1987-02-28 | 1988-09-06 | Nok Corp | Polyphenylene sulfide resin composition |
JPH01190738A (en) * | 1988-01-26 | 1989-07-31 | Dainippon Ink & Chem Inc | Function-imparting agent for resin |
JPH02180962A (en) * | 1988-12-30 | 1990-07-13 | Toopuren:Kk | Polyphenylene sulfide resin composition |
JP2016540067A (en) * | 2013-11-21 | 2016-12-22 | エムス−パテント アクチエンゲゼルシャフト | Carbon fiber reinforced plastic molding material |
-
1978
- 1978-09-22 JP JP11576978A patent/JPS5543120A/en active Pending
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6311780B2 (en) * | 1980-07-04 | 1988-03-16 | Asahi Glass Co Ltd | |
JPS5717153A (en) * | 1980-07-04 | 1982-01-28 | Asahi Glass Co Ltd | Sealing method of electronic parts |
JPS6028392B2 (en) * | 1980-07-16 | 1985-07-04 | 信越化学工業株式会社 | Resin composition for encapsulating electronic components |
JPS5721844A (en) * | 1980-07-16 | 1982-02-04 | Shin Etsu Chem Co Ltd | Resin composition for sealing electronic parts |
JPS5763355A (en) * | 1980-10-03 | 1982-04-16 | Dainippon Ink & Chem Inc | Mica reinforced polyallylene sulfide resin composition |
JPS6052943B2 (en) * | 1980-12-08 | 1985-11-22 | 東レ株式会社 | printed wiring board |
JPS5796588A (en) * | 1980-12-08 | 1982-06-15 | Toray Industries | Printed circuit board |
JPS5911357A (en) * | 1982-07-09 | 1984-01-20 | Asahi Glass Co Ltd | Polyphenylene sulfide resin molding material |
JPS6367503B2 (en) * | 1982-07-09 | 1988-12-26 | Asahi Glass Co Ltd | |
JPS62232457A (en) * | 1986-04-03 | 1987-10-12 | Dainippon Ink & Chem Inc | Polyphenylene sulfide resin composition |
JPH07742B2 (en) * | 1986-04-03 | 1995-01-11 | 大日本インキ化学工業株式会社 | Polyphenylene sulfide resin composition |
JPS63213560A (en) * | 1987-02-28 | 1988-09-06 | Nok Corp | Polyphenylene sulfide resin composition |
JPH01190738A (en) * | 1988-01-26 | 1989-07-31 | Dainippon Ink & Chem Inc | Function-imparting agent for resin |
JPH02180962A (en) * | 1988-12-30 | 1990-07-13 | Toopuren:Kk | Polyphenylene sulfide resin composition |
JP2016540067A (en) * | 2013-11-21 | 2016-12-22 | エムス−パテント アクチエンゲゼルシャフト | Carbon fiber reinforced plastic molding material |
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